JP2003289036A - Substrate treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device capable of preventing a carriage roller or the internal wall face of a treatment tank from being contaminated by a treatment solution containing solidification components at the time of treating a substrate by carrying the substrate in the treatment tank, and supplying the treatment solution to the substrate. <P>SOLUTION: A solution storage bat 12 is disposed immediately under a carriage roller 10 brought into contact with the lower face side of a substrate 1 for supporting and carrying the substrate, a developing solution is supplied to the solution storage bat, the solution storage bat is constantly filled with the developing solution 14, and a part of the peripheral face of the carriage roller is immersed in the developing solution filled in the solution storage bat. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display glass substrate, a semiconductor wafer, a printed circuit board, and other substrates, each of which is supported and conveyed by a plurality of conveying rollers arranged in parallel. Wash against
The present invention relates to a substrate processing apparatus that performs processing such as development, etching, and film peeling.

[0002]

2. Description of the Related Art For example, in the process of forming a wiring pattern on a substrate, when developing a photoresist film formed on the surface of the substrate, the substrates are horizontally placed one by one and are developed on the substrate while being conveyed by a conveying roller. A roller-conveying type development processing apparatus is used in which the liquid is filled and the development reaction is stopped after a predetermined time has passed since the liquid was filled. FIG. 8 schematically shows an example of a schematic configuration of this developing processing apparatus.

The development processing apparatus shown in FIG. 8 includes a processing tank 2 having an inlet side opening 3a and an outlet side opening 3b, and inside the processing tank 2, a plurality of conveying rollers 4a, 4b, 4c.
Are arranged in parallel. Then, the substrate 1 is carried into the processing tank 2 through the entrance side opening 3a, and the carrying roller 4
It is supported by a to 4c and conveyed in the horizontal direction, carried out from the inside of the treatment tank 2 through the outlet side opening 3b, and sent to the next washing treatment tank (not shown). A developing solution discharge nozzle 5 is arranged near the inlet side opening 3 a inside the processing tank 2. Further, in the vicinity of the outlet side opening 3b inside the processing tank 2, the upper surface side of the substrate 1 supported and transported by the transport roller 4c is contacted so as to face the transport roller 4c immediately above the transport roller 4c. A liquid draining roller 6 is provided.

In the developing processing apparatus having such a structure,
Substrate 1 having an exposed photoresist film formed on its surface
Is the amount of the developer 7 discharged from the slit-shaped discharge port on the lower end surface of the developer discharge nozzle 5 when passing through the position directly below the developer discharge nozzle 5 arranged near the inlet side opening 3a of the processing tank 2. It is laid on the surface. The development reaction of the photoresist film proceeds while the liquid-filled substrate 1 is being conveyed by the conveying rollers 4a and 4b. When the substrate 1 is conveyed to the vicinity of the outlet-side opening 3b of the processing tank 2, the developer 7 is removed from the substrate 1 by the liquid draining roller 6, and then, is discharged from the processing tank 2. Then, the substrate 1 is sent to the next water washing treatment tank to completely stop the development reaction of the photoresist film.

[0005]

In the development processing apparatus as described above, when the developing solution 7, especially the developing solution 7 containing the resist, spills from the surface of the substrate 1, the developing solution is transported by the conveying rollers 4a-4c. Will adhere to the peripheral surface of the substrate, the inner wall surface of the processing tank 2, and the like. The peripheral surface of the liquid draining roller 6 is
The developer 7 containing the resist is always attached. When the developer adhering to these members dries, the resist component solidifies and the members are contaminated. For this reason, there arises a problem that particles are generated to contaminate the substrate 1 or cause malfunction of equipment such as a sensor. On the other hand, in order to prevent these problems from occurring, it is necessary to frequently clean the inside of the processing tank 2, but this leads to a decrease in processing efficiency and complexity of the work.

A method different from the above method, that is, a developing method in which a spray nozzle is installed in the processing tank and a developing solution or the like is sprayed from the spray nozzle in the form of a mist so as to diffuse into the entire inside of the processing tank. In this case, since the surfaces of the conveying roller, the inner wall surface of the processing tank, the sensor, and the like are always wet with the developing solution or the like, contamination by the solidified resist is less likely to occur, and the above problems are less likely to occur.
However, when the transport roller or the like is installed at a place where the mist of the developer or the like is difficult to reach, the transport roller or the like is also contaminated by the developer containing the resist. Further, this method cannot be basically adopted in a process that needs to suppress mist generation.

The present invention has been made in view of the above circumstances, and when a substrate is transported in a processing tank and a processing liquid is supplied to the substrate to process the substrate,
To provide a substrate processing apparatus capable of preventing the transfer roller, the inner wall surface of a processing tank, and the like from being contaminated by a processing liquid containing a solidified component, and preventing contamination of a substrate, malfunction of equipment, and the like. To aim.

[0008]

The invention according to claim 1 is
In a substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in a processing tank, a liquid storage container is arranged immediately below a transport roller that contacts the lower surface of the substrate and supports and transports the substrate. A liquid supply means is provided for supplying a wetting liquid into the storage container to constantly fill the liquid storage container with the wetting liquid, and one of the peripheral surfaces of the conveying rollers is filled with the wetting liquid filled in the liquid storage container. It is characterized in that the part is immersed.

According to a second aspect of the present invention, in a substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in a processing tank, the substrate is in contact with a lower surface side of the substrate and is close to a transportation roller for supporting and transporting the substrate. Liquid discharge means is disposed below the height position of the substrate supported by the transport roller so that the discharge port faces the transport roller, and liquid supply means for supplying the wetting liquid to the liquid discharge means is provided. It is characterized by having.

According to a third aspect of the present invention, in a substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in a processing tank, the vicinity of a transportation roller that contacts the lower surface of the substrate and supports and transports the substrate. Is disposed below the height position of the substrate supported by the transport roller, directly above the transport roller so as to face the transport roller, and is in contact with the upper surface side of the substrate supported and transported by the transport roller. The liquid ejecting means is arranged so that the upper roller and the ejection opening face each other, and the liquid ejecting means is provided with a liquid supplying means for supplying the wetting liquid.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the carrying roller and the upper roller are movably supported between an upper position and a lower position,
The liquid discharging means is arranged so as to be located below the height position of the substrate supported by the carrying roller when the carrying roller and the upper roller are located above, and the carrying roller and the upper roller are located below. In this case, the carrying roller is positioned at the same height as another carrying roller arranged upstream of the carrying roller in the carrying direction, and is controlled so that the board does not come into contact with the carrying roller and the upper roller. It is characterized by

According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the conveying roller and the upper roller are swung within a vertical plane about a point on an extension of the axis line of the conveying roller. It is supported so that it is moved between an upper position which is an inclined posture and a lower position which is a horizontal posture.

According to a sixth aspect of the present invention, in the substrate processing apparatus according to the fourth or fifth aspect, the conveying roller and the upper roller are liquid draining rollers, and the liquid draining roller and the another transporting roller. And a plurality of transport rollers that are supported so as to move integrally between the liquid draining roller and an upper position and a lower position and contact the lower surface side of the substrate to support and transport the substrate. Is characterized by.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to any one of the second to sixth aspects, the liquid supply means is for wetting and is discharged from the discharge port toward the transport roller. It is characterized in that the wetting liquid is supplied to the liquid discharging means at a low pressure such that the liquid does not scatter due to splashing of the liquid.

According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the second to seventh aspects, during the period in which the substrate is being transported and the substrate is being processed, the transport roller is the substrate. Do not discharge the wetting liquid from the discharge port of the liquid discharge means when not in contact with the lower surface side, and do not discharge the wetting liquid from the discharge port of the liquid discharge means when the transport roller is in contact with the lower surface side of the substrate. In addition, the wetting liquid is intermittently supplied from the liquid supply unit to the liquid discharge unit.

According to a ninth aspect of the present invention, in the substrate processing apparatus according to any one of the second to eighth aspects, during the period in which the substrate is not being transported, the liquid is constantly supplied from the liquid supply means to the liquid discharge means. It is characterized in that the wetting liquid is intermittently supplied every time.

According to a tenth aspect of the present invention, in a substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in the processing tank, a liquid discharge for discharging a wetting liquid onto an inclined inner bottom surface of the processing tank. The means is disposed above the inner bottom surface in the direction of inclination, and liquid supply means for supplying the wetting liquid to the liquid discharge means is provided.

In the substrate processing apparatus according to the first aspect of the present invention, the wetting liquid is supplied from the liquid supply means into the liquid reservoir and the liquid reservoir is constantly filled with the wetting liquid. A part of the peripheral surface of the conveying roller is immersed in the wetting liquid filled therein. As a result, the peripheral surface of the transport roller is always wet with the wetting liquid. For this reason, even if a processing solution, for example, a developing solution containing a resist spills from the surface of the substrate and adheres to the peripheral surface of the conveying roller, the developing solution does not dry, so that the resist component does not solidify. Therefore, it is possible to prevent the transport roller from being contaminated by the solidified resist. Further, since the conveying roller is only immersed in the wetting liquid filled in the liquid reservoir, there is no fear of liquid splashing. Therefore, for example, even when the developer containing the resist is circulated and reused as the wetting liquid, the resist-containing developer adheres to the substrate due to liquid splashing to contaminate the substrate, There is no possibility that the developing solution adheres to devices such as sensors and causes malfunction.

In the substrate processing apparatus according to the second aspect of the present invention, the wetting liquid is discharged from the discharge port of the liquid discharging means toward the conveying roller, so that the conveying roller is always wet with the wetting liquid. Become. Therefore, even if the processing liquid, for example, the developing liquid containing the resist spills from the surface of the substrate and adheres to the conveying roller, the developing liquid does not dry, and the resist component does not solidify. Therefore, it is possible to prevent the transport roller from being contaminated by the solidified resist. Further, since the liquid ejecting means is arranged in the vicinity of the conveying roller, liquid splashing is unlikely to occur, and the wetting liquid does not scatter in a wide range. Therefore, for example, even when the developer containing the resist is circulated and reused as the wetting liquid, the resist-containing developer adheres to the substrate due to liquid splashing to contaminate the substrate, There is no possibility that the developing solution adheres to devices such as sensors and causes malfunction. Further, since the liquid ejecting means is disposed below the height position of the substrate, even if the resist-containing developing solution spills from the ejection port of the liquid ejecting means, the developing solution does not adhere to the substrate. Absent.

In the substrate processing apparatus according to the third aspect of the present invention, the wetting liquid is discharged from the discharge port of the liquid discharge means toward the upper roller arranged immediately above the carrying roller, whereby the upper roller is While being constantly wet with the wetting liquid, the wetting liquid flows down along the peripheral surface of the upper roller to the peripheral surface of the conveying roller, so that the conveying roller is also constantly wet with the wetting liquid. Therefore, even if the processing solution, for example, the developing solution containing the resist adheres to the upper roller contacting the upper surface side of the substrate, or the developing solution spills from the surface of the substrate and adheres to the transport roller, Since the liquid does not dry, the resist does not solidify.
Therefore, it is possible to prevent the upper roller and the transport roller from being contaminated by the solidified resist. Further, since the liquid ejecting means is arranged in the vicinity of the conveying roller, liquid splash does not easily occur and the wetting liquid does not scatter in a wide range. Therefore, for example, even when the developer containing the resist is circulated and reused as the wetting liquid, the resist-containing developer adheres to the substrate due to liquid splashing to contaminate the substrate, There is no possibility that the developing solution adheres to devices such as sensors and causes malfunction. Further, since the liquid ejecting means is arranged below the height position of the substrate, even if the resist-containing developing solution spills from the ejection port of the liquid ejecting means,
The developing solution does not adhere to the substrate.

In the substrate processing apparatus of the invention according to claim 4,
When the transport roller and upper roller are located above,
Since the liquid discharge means is located below the height position of the substrate,
Even if the processing solution, for example, the developing solution containing the resist drops out from the ejection port of the liquid ejecting means, the developing solution does not adhere to the substrate. On the other hand, when the transport roller and the upper roller are located below, the substrate does not come into contact with the transport roller and the upper roller. Therefore, even if the resist-containing developer spills from the discharge port of the liquid discharge means, the developer remains on the substrate. No need to worry about sticking to.

In the substrate processing apparatus of the invention according to claim 5,
The transport roller and the upper roller move between the upper position and the lower position by swinging in the vertical plane about a point on the extension line of the axis line of the transport roller. And
Since the transport roller and the upper roller are inclined at the upper position, the substrate supported by the transport roller is also inclined, so that the processing liquid flows down from the surface of the substrate.

In the substrate processing apparatus of the invention according to claim 6,
The liquid removing roller removes the processing liquid, for example, the developing solution containing the resist from the substrate supported and conveyed by the conveying roller, and the resist-containing developing solution adheres to the peripheral surface of the liquid removing roller at that time, Since the liquid draining roller is kept wet with the wetting liquid at all times, the developing liquid does not dry, so that the resist component does not solidify on the peripheral surface of the liquid draining roller.

In the substrate processing apparatus of the invention according to claim 7,
Since the wetting liquid is supplied from the liquid supply means to the liquid discharge means at a low pressure such that the wetting liquid discharged from the discharge port of the liquid discharge means toward the transport roller is not scattered by the liquid splash, the liquid splash does not occur. It is less likely to occur and the wetting liquid does not scatter in a wide range.

In the substrate processing apparatus of the invention according to claim 8,
During the period in which the substrate is transported and the substrate is processed, the wetting liquid is discharged from the discharge port of the liquid discharging means when the transport roller is not in contact with the lower surface side of the substrate, and the transport roller is the lower surface side of the substrate. Since the wetting liquid is not discharged from the discharge port of the liquid discharge means when it is in contact with the liquid discharge device, the discharge port of the liquid discharge means is used, for example, when the developer containing the resist is circulated and reused as the wetting liquid. There is no concern that the resist-containing developing solution discharged from the substrate adheres to the substrate and contaminates the substrate.

In the substrate processing apparatus of the invention according to claim 9,
While the substrate is not being transported, the wetting liquid is intermittently supplied from the liquid supplying means to the liquid discharging means at regular intervals, so that the transport roller or the upper roller and the transport roller are wet with the wetting liquid. The amount of the wetting liquid used is reduced.

In the substrate processing apparatus of the tenth aspect of the present invention, the wetting liquid is discharged from the liquid discharging means to the upper portion of the inner bottom surface of the processing tank in the inclined direction, and the discharged wetting liquid is inclined to the inner bottom surface. Since it flows down along the inner bottom surface, the entire inner bottom surface is always wet with the wetting liquid. Therefore, even if a processing solution, for example, a developing solution containing a resist spills on the inner bottom surface from the surface of the substrate, the developing solution does not dry, so that the resist component does not solidify. Therefore, it can be avoided that the inner bottom surface of the processing tank is contaminated by the solidified resist.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows an example of an embodiment of the first invention, which is one of the components of a substrate processing apparatus, for example, a development processing apparatus.
It is a side view which shows one of the conveyance rollers which are two in a partial cross section. The overall configuration of the development processing apparatus has been described above with reference to FIG. 8, and thus description thereof will be omitted. However, the conveyance roller 10 illustrated in FIG. 1 includes the plurality of conveyance rollers 4a to 4a of the development processing apparatus illustrated in FIG. 4c, which corresponds to the transport roller 4b arranged near the middle of the processing tank 2.

The conveying roller 10 has a cylindrical shape whose peripheral surface is in contact with the entire lower surface of the substrate 1 in the width direction. The transport roller 10 has a function of supporting and transporting the substrate 1, and rotating the substrate 1 while contacting the entire lower surface of the substrate 1 in the width direction to clean the lower surface of the substrate. A liquid reservoir vat 12 is disposed immediately below the transport roller 10. In the liquid reservoir vat 12, a wetting liquid supplied from a liquid supply source, for example, flows down from the surface of the substrate 1 to the bottom of the processing tank, is collected in a recovery tank (not shown), and is sent from the recovery tank. A developer 14 is contained. The developer is continuously supplied into the liquid reservoir vat 12, and the liquid reservoir vat 12 is always filled with the developer 14, and the developer overflowing from the upper part of the liquid reservoir vat 12 is It is collected and reused. Then, a part of the peripheral surface of the transport roller 10 is immersed in the developer 14 filled in the liquid reservoir vat 12.

In the apparatus having the structure shown in FIG. 1, since a part of the peripheral surface of the carrying roller 10 is immersed in the developer 14 filled in the liquid reservoir vat 12, the carrying roller 1
The peripheral surface of 0 is always wet with the developer 14. Therefore, even if the developer containing the resist spills from the surface of the substrate 1 and adheres to the peripheral surface of the transport roller 10, the developer is dried on the peripheral surface of the transport roller 10 and the resist is solidified.
There is no such thing. Therefore, there is no fear of the transport roller 10 being contaminated by the solidified resist. Further, since the transport roller 10 is only immersed in the developer 14 filled in the liquid reservoir vat 12, there is no risk of liquid splashing. Therefore, the liquid splash does not cause the developer containing the resist to adhere to the substrate 1 to contaminate the substrate 1 or the developer containing the resist to adhere to devices such as sensors to cause malfunction. .

Next, FIG. 2 shows a first embodiment of the second invention.
FIG. 3 is a side view showing an example and one of the transport rollers that is one of the components of the development processing apparatus. The carrying roller 16 shown in FIG. 2 is, among the plurality of carrying rollers 4a to 4c of the developing processing apparatus shown in FIG. 8, a carrying roller 4b disposed near the middle of the processing tank 2 and near the outlet side opening 3b, respectively.
It corresponds to most of the transport rollers 4a except 4c.

The conveying rollers 16 are disc-shaped and are fixed to each end of the rotary support shaft 18 as a pair, or the rotary support shaft 1
A plurality of them, for example, three are fixed to both ends and the center of the rotary support shaft 18. The liquid discharge nozzle 20 is arranged at a position close to the transport roller 16 and below the height position of the substrate 1 supported by the transport roller 16 so that the discharge port 22 faces the transport roller 16. It is set up. To the liquid discharge nozzle 20, for example, the developer that has flowed down from the surface of the substrate 1 to the bottom of the processing tank and is collected in the collection tank is supplied from the collection tank. At this time, the pressure for supplying the developing solution to the solution discharge nozzle 20 is set to a low pressure such that the developing solution 14 discharged from the discharge port 22 toward the transport roller 16 does not scatter due to splashing of the liquid.

The discharge of the developing solution 14 from the discharge port 22 of the liquid discharge nozzle 20 toward the conveying roller 16 is performed while the substrate 1 is being conveyed and processed.
Is not in contact with the lower surface side of the substrate 1 and the substrate 1 is not present in the vicinity of the transport roller 16 either, and when the transport roller 16 is in contact with the lower surface side of the substrate 1. When the substrate 1 is present in the vicinity, the developing solution is not ejected from the ejection port 22 of the liquid ejection nozzle 20.
By intermittently discharging the developing solution in this manner, when the developing solution containing the resist is circulated and reused, the resist-containing developing solution discharged from the discharge port 22 of the solution discharge nozzle 20 or It is possible to eliminate the risk that the droplets adhere to the substrate 1 and contaminate the substrate 1. On the other hand, while the substrate 1 is not being transported, the liquid discharge nozzle 2
Developing solution 1 from the discharge port 22 of 0 toward the conveying roller 16
The discharge of No. 4 is intermittently performed at regular intervals.
By intermittently discharging the developing solution at regular intervals in this manner, it is possible to prevent the solidification of the resist by keeping the transport roller 16 in a wet state even when the substrate 1 is not processed. The amount of developer used can be reduced.

In the apparatus having the structure shown in FIG. 2, the developing solution 14 is discharged from the discharge port 22 of the liquid discharge nozzle 20 toward the conveying roller 16, whereby the conveying roller 16 is discharged.
Is always wet with the developer 14. For this reason, even if, for example, a developer containing a resist spills from the surface of the substrate 1 and adheres to the transport roller 16, the developer does not dry, and the resist does not solidify. Therefore, it is possible to prevent the transport roller 16 from being contaminated by the solidified resist. Further, the developing solution 14 is discharged from the discharge port 22 of the liquid discharge nozzle 20 at a low pressure,
Moreover, since the developing solution 14 is ejected from the position close to the carrying roller 16 toward the carrying roller 16, liquid splash hardly occurs and the developing solution 14 does not spread over a wide range. Therefore, even when the developer containing resist is circulated and reused, the developer containing resist may contaminate the substrate 1 due to splashing of liquid or adhere to devices such as sensors to cause malfunction. There is no such thing. Further, since the liquid discharge nozzle 20 is arranged below the height position of the substrate 1, even if the resist-containing developer is dropped from the discharge port 22, the developer adheres to the substrate 1. Don't worry.

FIG. 3 is a side view of the carrying roller showing another embodiment of the second invention. In the embodiment shown in FIG. 3, the ejection port 22 of the liquid ejection nozzle 20 is installed obliquely downward. As in the embodiment shown in FIG.
If the liquid discharge nozzle 20 is arranged so that the discharge port 22 faces upward, there is no fear of the liquid dripping from the discharge port 22 when the liquid discharge from the discharge port 22 is stopped. In another embodiment, the liquid may drop from the discharge port 22. However, the liquid discharge nozzle 20
Is disposed below the height position of the substrate 1 indicated by the chain double-dashed line L, there is no concern that the resist-containing developer spilled from the ejection port 22 will adhere to the substrate 1.

Next, FIG. 4 shows a first embodiment of the third invention.
FIG. 3 is a side view showing an example and shows a transport roller and a liquid draining roller that are one of the components of the development processing apparatus. This Figure 4
8 corresponds to the transport roller 4c arranged near the outlet side opening 3b of the processing tank 2 among the plurality of transport rollers 4a to 4c of the developing processing apparatus shown in FIG.

The draining roller 26, which is arranged immediately above the transport roller 24 so as to face the transport roller 24, has a cylindrical shape whose peripheral surface is in contact with the entire upper surface of the substrate 1 in the width direction. It has a function of removing the used developing solution accumulated on the substrate 1 from the substrate 1 by rotating while contacting over the entire width direction on the upper surface side of the substrate 1 which is supported and conveyed by the conveying roller 24. ing. The liquid draining roller 26 and the discharge port 30 are provided below the height position (indicated by a chain double-dashed line L in FIG. 4) of the substrate 1 which is supported and transported by the transport roller 24 in the vicinity of the transport roller 24. Liquid discharge nozzles 28 are arranged so as to face each other. As in the case of the liquid discharge nozzle 20 shown in FIG. 2, for example, the developer discharged from the surface of the substrate 1 to the bottom of the processing tank and collected in the recovery tank is supplied to the liquid discharge nozzle 28 from the recovery tank. There is. At this time, the liquid discharge nozzle 2
The pressure for supplying the developing solution to the developing solution 8 is set to such a low pressure that the developing solution 14 discharged from the discharge port 30 toward the draining roller 26 does not scatter due to splashing of the liquid.

The discharge of the developing solution 14 from the discharge port 30 of the liquid discharge nozzle 28 toward the conveying roller 16 is the same as the case of the liquid discharge nozzle 20 shown in FIG. The operation is performed when the transport roller 24 and the liquid draining roller 26 are not in contact with the substrate 1 and the substrate 1 is not present near the transport roller 16 as well. The developing solution is prevented from being ejected from the ejection port 30 of the liquid ejection nozzle 28 when 26 is in contact with the substrate 1 or when the substrate 1 is present in the vicinity thereof. Further, during the period in which the substrate 1 is not transported, the developing solution 14 is ejected from the ejection port 30 of the liquid ejection nozzle 28 toward the liquid draining roller 26 intermittently at regular intervals.

In the apparatus having the structure shown in FIG. 4, the developer 14 is discharged from the discharge port 30 of the liquid discharge nozzle 28 toward the drain roller 26, so that the drain roller 26 is always filled with the developer. Get wet. Further, the developer 14 discharged onto the peripheral surface of the liquid draining roller 26 flows along the peripheral surface of the liquid draining roller 26 and flows down to the peripheral surface of the conveying roller 24 below, so that the conveying roller 24 is also a developer. It will always be wet. Therefore, for example, the developing solution containing the resist adheres to the liquid draining roller 26 contacting the upper surface side of the substrate 1, and the resist-containing developing solution spilled from the surface of the substrate 1 adheres to the transport roller 24. However, since the developer does not dry, the resist does not solidify. Therefore, the draining roller 26 and the transport roller 24 are prevented from being contaminated by the solidified resist. Further, since the developing solution 14 is ejected from the ejection port 30 of the liquid ejecting nozzle 28 at a low pressure and the developing solution 14 is ejected from a position near the transport roller 24 toward the liquid draining roller 26, liquid splashing occurs. It is difficult and the developer 14 does not scatter in a wide range. Therefore, even when the developer containing the resist is circulated and reused, the developer containing the resist may contaminate the substrate 1 due to splashing of the liquid or attach to a device such as a sensor to cause a malfunction. There is no such thing. In addition, the liquid discharge nozzle 28
Is disposed below the height position of the substrate 1,
Even if the resist-containing developer spills from the ejection port 30, there is no concern that the developer will adhere to the substrate 1.

FIGS. 5 and 6 show a modified example of the third invention, and FIG. 5 is a side sectional view showing a conveying roller and a liquid draining roller which are one of the components of the developing processing apparatus.
FIG. 6 is a front view of the same. The conveyance roller 60 and the liquid draining rollers 52 and 54 shown in FIGS.
The conveyance roller 4c arranged near the outlet side opening 3b of the processing tank 2 of the developing treatment apparatus shown in FIG.

In the developing processing apparatus according to this modification, the substrate 1 is conveyed in a horizontal posture in most of the area within the processing tank 2.
The substrate 1 is inclined in the vicinity of the downstream side of the processing tank 2 and is carried out to the next step. Therefore, in the region excluding the vicinity of the downstream side of the processing tank 2 (that is, the position close to the outlet side opening 3b), the substrate 1 is transported by the transport roller 6 fixed in the processing tank 2.
2 is conveyed in a horizontal posture. Further, in the other region, that is, in the region near the outlet side opening 3b, the substrate 1
Is transported by the transport roller 60 and the draining rollers 52 and 54. The liquid draining rollers 52 and 54 are provided so as to form a minute gap so that the substrate 1 can pass between them. Transport roller 60 and draining roller 5
2, 54 are attached to roller attachment members 64, 66. The roller mounting members 64 and 66 are, as shown in FIG.
A drive source (not shown) is centered around a straight line passing through the point O on the extension line of the rotation shaft 68 of the liquid draining roller 52 and parallel to the substrate transport direction (a straight line passing through the point O in FIG. 6 and perpendicular to the paper surface). It is provided so that it can be swung up and down by a predetermined angle (the angle formed by the alternate long and short dash lines A and A ') by driving.

When the roller mounting members 64 and 66 are at the lowermost position, as shown by the solid line in FIG. 5A and FIG. 6, the conveying roller 60 and the draining rollers 52 and 5 are shown.
4 is a horizontal position. The substrate 1 is placed between the liquid draining roller 52 in the horizontal position and the adjacent transport roller 60.
A pendulum 72 of the detection device 70 for detecting that the paper has been conveyed onto the conveyance roller 60 is provided. Pendulum 7
A liquid discharge nozzle 74 that discharges the developing liquid to the liquid draining roller 54 in the horizontal position is provided on the downstream side of 2. The liquid discharge nozzle 74 is provided at the horizontal position with the liquid draining roller 54
The nozzle tube 75 provided so as to be substantially parallel to
Multiple rows are provided in the depth direction of the paper. Detector 70
The nozzle tube 75 is fixedly provided in the processing tank 2. Further, the most upstream one of the conveyance rollers 60 attached to the roller attachment members 64 and 66 and the conveyance roller 6
A detection device 76 that detects the substrate 1 is also provided between the two.

When the roller mounting members 64 and 66 are at the uppermost position, as shown by the chain double-dashed line in FIG. 5B and FIG.
2, 54 are inclined so that the side of the point O is low, and the conveyance roller 60 and the draining roller 52,
The lowest position of 54 is higher than the nozzle tube 75. In addition, in FIG. 5B, the inclination of the roller in the depth direction is not taken into consideration.

The operation of this developing processing apparatus is as follows. In the development processing apparatus, the substrate 1 is loaded horizontally from the opening (not shown in FIG. 5) of the processing tank 2 and the developing solution discharged from the developing solution discharge nozzle 5 is transferred to the substrate 1.
The liquid is piled up, and while being developed in that state, it is conveyed toward the downstream side in a horizontal posture by the conveyance roller 62. At this time, the roller mounting members 64 and 66 are at the lowest position, and the transport roller 60 and the liquid draining roller 5 are
2, 54 are horizontal positions. Further, at this time, the developing solution is being ejected from the solution ejecting nozzle 74, the ejected developing solution is applied to the solution draining roller 54, and the solution draining roller 54 is kept wet with the developing solution. The liquid draining roller 52 below the liquid draining roller 54 is also kept wet with the developer flowing down from the liquid draining roller 54.
Therefore, the liquid removing rollers 52 and 54 are not dried and the resist portion is not solidified.

When the substrate 1 is conveyed and the pendulum 78 of the detection device 76 is moved, the discharge of the developing solution from the solution discharge nozzle 74 is stopped. This is because the substrate 1 has approached the liquid discharge nozzle 74, and therefore, when the discharge of the developing liquid from the liquid discharge nozzle 74 is continued, droplets of the discharged developing liquid may impinge on the substrate 1 and cause inconveniences such as uneven processing. Because there is a nature. Then, when the substrate 1 is further transported and the pendulum 72 of the detection device 70 is moved, the transport roller 60
The rotation driving of the substrate 1 is stopped, and the substrate 1 stops on the transport roller 60. Then, after that, the drive source is driven to raise the roller mounting members 64 and 66, and the conveying roller 60 is inclined so that the point O side is lowered, and the substrate 1 placed thereon is also in an inclined posture. As a result, most of the developing solution deposited on the substrate 1 flows down and is roughly drained. Then, when most of the liquid flows down, the transport roller 60 and the liquid draining rollers 52 and 54 are driven to rotate again, and the substrate 1 is transported toward the downstream side while maintaining the tilted posture, and the substrate 1 is adjusted to the position of this tilted posture. It is carried out from the formed outlet side opening 3b and carried to the next step. At this time, since the roller mounting members 64 and 66 are raised, the liquid discharge nozzle 74 and the pendulum 72 of the detection device 70 are
Since it is located below the transport roller 60, it does not hinder the transport of the substrate 1, and even if the liquid accidentally leaks from the liquid discharge nozzle 74, it may adhere to the substrate 1. Absent. When the substrate 1 is carried out from the outlet side opening 3b, the roller mounting members 64 and 66 descend and wait for the next substrate.

FIG. 7 shows the first embodiment of the fourth invention.
FIG. 3 is a cross-sectional view showing an example and showing a bottom portion of a processing tank which is a component of the development processing apparatus. In the apparatus shown in FIG. 7, the processing tank 3
The discharge port 38 is provided above the inclined inner bottom surface 34 of FIG.
A liquid discharge nozzle 36 is disposed so as to face the inner bottom surface 34. To the liquid discharge nozzle 36, for example, the developer that has flowed down from the surface of the substrate 1 to the bottom of the processing tank and is collected in the collection tank is supplied from the collection tank.

In the apparatus having the structure shown in FIG. 7, the discharge port 38 of the liquid discharge nozzle 36 to the inner bottom surface 34 of the processing bath 32 is discharged.
The developing solution 14 is discharged to the upper part in the inclined direction, and the discharged developing solution 14 flows down on the inner bottom surface 34 along the inclination of the inner bottom surface 34. Therefore, the entire inner bottom surface 34 is entirely covered with the developer 14.
Will always be wet. Therefore, even if the developer containing the resist spills from the surface of the substrate 1 onto the inner bottom surface 34, the developer does not dry, so that the resist does not solidify, and the solidified resist prevents the processing tank 32 from being solidified. It is possible to prevent the inner bottom surface 34 from being contaminated.

Although the development processing apparatus has been described in the above description, the present invention can also be applied to a substrate processing apparatus that performs processing such as cleaning, etching, and film removal.

[0050]

When the substrate processing apparatus according to each of the first to third aspects of the present invention is used, when the substrate is processed in the processing bath by supplying the processing liquid to the substrate while transporting the substrate, It is possible to prevent the carrying roller or the upper roller and the carrying roller from being contaminated by a processing solution containing a solidifying component such as a developing solution containing a resist, and it is possible to prevent substrate contamination and equipment malfunction. . Further, since it is not necessary to frequently clean the inside of the processing tank, the processing efficiency is not lowered and the work is not complicated.

In the substrate processing apparatus of the invention according to claim 4,
Regardless of whether the transport roller and the upper roller are located above or below, the treatment liquid is discharged from the discharge port of the liquid discharge means,
For example, even if the developer containing the resist drops out, there is no concern that the developer will adhere to the substrate.

In the substrate processing apparatus of the invention according to claim 5,
The carrier roller and the upper roller move between the upper position and the lower position by swinging in the vertical plane, and at the upper position, the substrate supported by the carrier roller is inclined, so that the process is performed from the surface of the substrate. A part of the liquid flows down and is removed.

In the substrate processing apparatus of the invention according to claim 6,
Even if the resist-containing developer adheres to the peripheral surface of the liquid draining roller when the processing liquid, for example, the developer containing resist, is removed from the substrate by the liquid draining roller, the resist component solidifies on the peripheral surface of the liquid draining roller. Can be prevented.

In the substrate processing apparatus of the invention according to claim 7,
Liquid splashing is less likely to occur, and scattering of the wetting liquid can be suppressed more effectively.

In the substrate processing apparatus of the invention according to claim 8,
For example, when a developer containing a resist is circulated and reused as a wetting liquid, it is possible to eliminate the concern that the substrate is contaminated by the resist-containing developer discharged from the discharge port of the liquid discharge means. .

In the substrate processing apparatus of the invention according to claim 9,
It is possible to reduce the amount of the wetting liquid used while preventing the carrying roller or the upper roller and the carrying roller from being contaminated.

According to the substrate processing apparatus of the tenth aspect of the present invention, when the substrate is processed by supplying the processing liquid to the substrate while transporting the substrate in the processing tank, the developing solution containing the resist is used. As described above, it is possible to prevent the inner bottom surface of the processing tank from being contaminated by the processing liquid containing the solidifying component, and it is possible to prevent the substrate from being contaminated and the malfunction of the device. Further, since it is not necessary to frequently clean the inside of the processing tank, the processing efficiency is not lowered and the work is not complicated.

[Brief description of drawings]

FIG. 1 is a side view showing an example of an embodiment of the first invention and showing in partial cross section one of the transport rollers that is one of the components of the development processing apparatus.

FIG. 2 is a side view showing an example of an embodiment of the second invention and showing one of the conveying rollers which is one of the constituent elements of the development processing apparatus.

FIG. 3 is a side view of a transport roller showing another embodiment of the second invention.

FIG. 4 is a side view showing an example of an embodiment of the third invention and showing a transport roller and a liquid draining roller, which are one of the components of the development processing apparatus.

FIG. 5 is a side sectional view showing a modified example of the third invention and showing a transport roller and a liquid draining roller, which are one of the components of the development processing apparatus.

FIG. 6 is a front view of the liquid draining roller shown in FIG.

FIG. 7 is a cross-sectional view showing an example of an embodiment of the fourth invention and showing a bottom portion of a processing tank which is a constituent element of a development processing apparatus.

FIG. 8 is a schematic diagram showing an example of a schematic configuration of a development processing apparatus.

[Explanation of symbols] 1 substrate 2, 32 treatment tanks 10, 16, 24, 60, 62 Conveyor rollers 12 Liquid Reservoir Vat 14 Developer 20, 28, 36 liquid discharge nozzle 22, 30, 38 Discharge port of liquid discharge nozzle 26 Draining roller 34 Inner bottom of processing tank 52, 54 Draining roller 64, 66 Roller mounting member 70,76 Detector 74 Liquid discharge nozzle 75 nozzle tube

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Nobuo Yanagisawa             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company (72) Inventor Koji Toyota             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F term (reference) 2H096 AA26 AA27 AA28 GA21 GA23                       GA24                 3B201 AA47 AB53 BB01 BB21 CD24                 5F046 LA11 LA14

Claims (10)

[Claims] 1. A substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in a processing tank, and arranging a liquid storage container just below a transportation roller which is in contact with the lower surface side of the substrate and supports and transports the substrate. And a liquid supply means for supplying a wetting liquid into the liquid storage container to constantly fill the liquid storage container with the wetting liquid, and the conveying roller in the wetting liquid filled in the liquid storage container. A substrate processing apparatus, wherein a part of the peripheral surface of the substrate is immersed. 2. In a substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in a processing tank, the substrate processing apparatus is in contact with a lower surface side of the substrate and is adjacent to a transportation roller for supporting and transporting the substrate, and is supported by the transportation roller. Liquid ejection means is provided below the height position of the substrate to be ejected so that the ejection port faces the transport roller, and liquid supply means for supplying the wetting liquid to the liquid ejection means is provided. Substrate processing equipment. 3. A substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in a processing tank, in the vicinity of a transport roller which is in contact with a lower surface side of the substrate and supports and transports the substrate by a transport roller. Below the height position of the substrate to be supported, there are an upper roller and an ejection port which are disposed directly above the transport roller so as to face the transport roller and are in contact with the upper surface side of the substrate which is supported and transported by the transport roller. A substrate processing apparatus, comprising liquid discharge means arranged so as to face each other, and liquid supply means for supplying a wetting liquid to the liquid discharge means. 4. The transport roller and the upper roller are movably supported between an upper position and a lower position, and the liquid ejecting means is configured by the transport roller when the transport roller and the upper roller are positioned above. When the carrying roller and the upper roller are located below the height position of the substrate to be supported and the carrying roller and the upper roller are located below, the carrying roller is located upstream of the carrying roller in the carrying direction. The substrate processing apparatus according to claim 3, wherein the substrate processing apparatus is positioned at the same height as another transport roller and is controlled so that the substrate does not contact the transport roller and the upper roller. 5. An upper position and a horizontal position in which the carrying roller and the upper roller are supported so as to swing in a vertical plane about a point on an extension line of the axis of the carrying roller as a center, and are inclined. The substrate processing apparatus according to claim 4, wherein the substrate processing apparatus moves between a lower position and a lower position. 6. The conveying roller and the upper roller are liquid draining rollers, and between the liquid draining roller and the other transporting roller, between the liquid draining roller and an upper position and a lower position. 6. The substrate processing apparatus according to claim 4 or 5, further comprising a plurality of transport rollers that are supported so as to move and contact the lower surface side of the substrate to support and transport the substrate. 7. The liquid supply means supplies the wetting liquid to the liquid discharge means at a low pressure such that the wetting liquid discharged from the discharge port toward the transport roller does not scatter due to splashing of the liquid. The substrate processing apparatus according to claim 2. 8. The wetting liquid is discharged from the discharge port of the liquid discharge means and is transferred when the transfer roller is not in contact with the lower surface side of the substrate during the period in which the substrate is transferred and processed. When the roller is in contact with the lower surface side of the substrate, do not discharge the wetting liquid from the discharge port of the liquid discharge means,
8. The substrate processing apparatus according to claim 2, wherein the wetting liquid is intermittently supplied from the liquid supply unit to the liquid discharge unit. 9. During the period when the substrate is not transported,
9. The substrate processing apparatus according to claim 2, wherein the wetting liquid is intermittently supplied from the liquid supply unit to the liquid discharge unit at regular intervals. 10. A substrate processing apparatus for processing a substrate with a processing liquid while transporting the substrate in the processing tank, wherein a liquid discharging means for discharging a wetting liquid onto the inclined inner bottom surface of the processing tank is provided on the inner bottom surface. A substrate processing apparatus, characterized in that the substrate processing apparatus is provided at an upper part in an inclined direction and has a liquid supply means for supplying a wetting liquid to the liquid discharge means.