CN101295089A - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
- Publication number
- CN101295089A CN101295089A CNA2008100957101A CN200810095710A CN101295089A CN 101295089 A CN101295089 A CN 101295089A CN A2008100957101 A CNA2008100957101 A CN A2008100957101A CN 200810095710 A CN200810095710 A CN 200810095710A CN 101295089 A CN101295089 A CN 101295089A
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- China
- Prior art keywords
- substrate
- treating fluid
- container body
- along
- processing fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Liquid Crystal (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention provides a substrate processing device to incline the substrate along the width direction to convey, and process the whole upper surface uniformly by the processing fluid. The substrate processing device processes the upper surface of the substrate which is inclined by a prescribed angle and conveyed along the direction crossing with the inclining direction through the processing fluid supplied by a processing fluid supply device (31), wherein the processing fluid supply device includes: a container body (32), configured along the inclining direction of the substrate, supplying the processing fluid and storing internally; a nozzle hole (40), wherein the opening is formed below the container body, and the processing fluid supplied and stored internally flows out in a straight line shape along the direction crossing with the conveying direction of the substrate; a guiding component (42), arranged below the container body, provided with an inclined plane (45) inclined a little lower towards the downstream of the conveying direction of the substrate, and the lower end edge (45a) of the inclined plane is formed obliquely, to leave away contraposition from the inclined upper surface of the conveyed substrate in parallel, and the processing fluid flown out from the nozzle hole and borne by the inclined plane is supplied to the upper surface of the substrate from the lower end edge of the inclined plane.
Description
Technical field
The present invention relates to for example handle with treating fluid the substrate board treatment of this substrate while the substrate of display panels that transmits big molded dimension etc.
Background technology
Be formed with circuit pattern on the substrate of the glass of in display panels, using.Adopt photoetching process in order on substrate, to form circuit pattern.Photoetching process applies resist on described substrate as known, across the mask that is formed with circuit pattern to this resist irradiates light.
Then, the part of the part that does not have illuminated light of resist or illuminated light is removed, the part of having removed resist is carried out etching.Then, by repeatedly repeating after etching, to remove the series of processes of resist, on described substrate, form circuit pattern from substrate.
In such photoetching process, need on the described substrate by developer solution, etching solution or in the operation of the treating fluid treatment substrate of the stripper of after the etching resist being removed etc., the operation of utilizing cleaning fluid to clean after the processing at treating fluid again.
Under the situation of the treating fluid treatment substrate that utilizes described developer solution, etching solution or stripper etc., for the whole plate face to substrate carries out this processing equably, the infiltration (prewetting) when requiring substrate supply treating fluid becomes even.
For example, from injections such as nozzles, then treating fluid becomes granular and disperses if treating fluid is pressurizeed, so sometimes unevenly attached to substrate.That is, prewetting for the treatment of fluid fails to carry out equably.Its result utilizes the processing of the substrate that treating fluid carries out to carry out equably sometimes.
So, shown in patent documentation 1, will the treating fluid feedway that is formed with slot-shaped outflow portion on the lower surface along the direction of intersecting with direction of transfer promptly the Width of this substrate be configured in the substrate that is transmitted above, pressure by water-head makes treating fluid that described treating fluid feedway is supplied with flow out from described outflow portion, and the Width of substrate is supplied with treating fluid equably.
But the substrate of the glass of using in liquid crystal indicator recently has the trend of maximization and slimming.Therefore, if with the substrate horizontal transmission, then the bending deformation at the weight effect infrabasal plate of the treating fluid that substrate is supplied with is big, the situation that has the transmission of substrate not carry out smoothly.And,,, become a reason that causes operating cost to rise so under the situation with the treating fluid recycling, the consumption quantitative change for the treatment of fluid is many owing to be under the residual state that a large amount for the treatment of fluids arranged substrate being sent from handling part on the upper surface of substrate.
In order to solve such problem, recently, following technology is practicability, this technology transmits with the angle tilt of regulation by making substrate, treating fluid on the plate face that supplies to substrate is flowed out smoothly, reduce the deflection of substrate, or the amount of the treating fluid taken out of from handling part with substrate of minimizing.
In patent documentation 2, show following technology, promptly under the situation about transmitting in that substrate is tilted, after spraying with pipe along the direction of transfer configuration of substrate in the upper end side of its vergence direction, will accepting with the liquid bearing plate with the treating fluid of managing outflow, mobile and handle the technology of the upper surface of described substrate from the vergence direction upper end side of substrate along lower end side from this injections.
Patent documentation 1: the Japanese documentation spy opens the 2006-297274 communique;
Patent documentation 2: the Japanese documentation spy opens the 2004-153033 communique.
Shown in patent documentation 2, upper end side at the vergence direction of the substrate that tilts, spray with pipe along the direction of transfer configuration of substrate, if will supply to the vergence direction upper end side of the substrate that is tilted transmission via the liquid bearing plate from the treating fluid that this pipe flows out, then treating fluid not only flows to the vergence direction below of substrate, according to the transfer rate of substrate, also relatively mobile towards direction of transfer upstream side (rear end side of direction of transfer) at the upper surface of this substrate.
Therefore, at the leading section of the direction of transfer of substrate, the treating fluid that is fed into the vergence direction upper end side of substrate is difficult to flow to the situation of vergence direction below, so situation about can not the entire upper surface of substrate be handled equably by treating fluid is arranged.Particularly, if accelerate the transfer rate of substrate sometimes in order to improve treatment effeciency, then this trend can become remarkable.
Summary of the invention
The purpose of this invention is to provide a kind of substrate board treatment, this substrate board treatment is by making it possible to the direction of intersecting with direction of transfer of the upper surface of the substrate that tilt to transmit treating fluid equably and with identical pressure feed, equably the entire upper surface of treatment substrate.
The present invention is a kind of substrate board treatment, will it is characterized in that along the treating fluid processing of upper surface by supplying with of the substrate that transmits with the angle tilt of regulation and along the direction of intersecting with its vergence direction from the treating fluid feed mechanism,
Described treating fluid feed mechanism possesses:
Container body along the vergence direction configuration of described substrate, is stored in described treating fluid supply in the inside;
Outflow portion, opening was formed on this container body following, made to be supplied to be stored into the treating fluid that is formed with in the container body and to flow out with linearity along the direction that the direction of transfer with described substrate intersects;
Guiding part, be located at the following side of described container body, has the dip plane that tilts than the lowland towards the direction of transfer downstream of described substrate, and the following ora terminalis of this dip plane is formed obliquely, so that its upper surface with the inclination of the described substrate that is transmitted leaves opposed abreast, accept the treating fluid that flows out from described outflow portion by described dip plane, supply to the upper surface of described substrate from the following ora terminalis of this dip plane.
According to the present invention, accept the treating fluid that the direction of intersecting from the outflow portion of container body along the vergence direction with the substrate that is tilted transmission flows out with linearity with guiding part.This guiding part tilts than the lowland towards the direction of transfer downstream of substrate, and down ora terminalis tilts, so that the upper surface of itself and substrate leaves opposed abreast.
Therefore, by guiding part be fed on the substrate treating fluid the total length that spreads all over the direction of intersecting with the direction of transfer of substrate by equably and the following ora terminalis whole audience that leaves opposed guiding part from upper surface abreast with substrate to the upper surface of substrate with identical pressure feed, so can spread all over the processing of the upper surface of the whole substrate that is tilted transmission equably.
Description of drawings
Fig. 1 be will the expression one embodiment of the present invention the figure that cuts open of the treating apparatus direction of intersecting along direction of transfer with substrate.
Fig. 2 is a longitudinal section of the substrate that is transmitted being supplied with the treating fluid feedway for the treatment of fluid.
Fig. 3 is the front elevation for the treatment of fluid feedway.
Fig. 4 is the vertical view for the treatment of fluid feedway.
Embodiment
Below, with reference to the description of drawings one embodiment of the present invention.
Fig. 1 is the summary construction diagram of substrate board treatment, and this treating apparatus has chamber 1.On an end of the length direction of this chamber 1, flatly be formed with in the figure with what dot-and-dash line was represented and send into mouthfuls 2, on the other end to be formed with the not shown mouth of sending with the described mouthfuls 2 identical height of sending into.
In described chamber 1, be provided with connecting gear 4.This connecting gear 4 has rectangular box-like framework 5.Be located at Width one end in the described chamber 1 and the parts 6 of accepting on the other end and support these frameworks 5.Accept to be provided with on the parts 6 at one and highly regulate parts 7.Thus, described framework 5 is with respect to the angle tilt of Width to stipulate of chamber 1.
On described framework 5, be provided with predetermined distance at the length direction of chamber 1 and make a plurality of transmission shafts 11 (only illustrate 1) of axis along the Width of chamber 1.Rotatably support the two ends of each transmission shaft 11 by the bearing 12 on the Width two ends that are located at described framework 5, this transmission shaft 11 tilts with the Width of identical angle with respect to chamber 1 with described framework 5.In addition, transmission shaft 11 is formed by the metal material of the treating fluid corrosion that can not be developed liquid, stripper or etching solution etc.
And then, on each transmission shaft 11, be provided with a plurality of transfer rollers 13 with predetermined distance vertically.Usually, described transmission shaft 11 is formed by the metal material of stainless steel that possesses corrosion resistance for treating fluid etc., and described transfer roller 13 is formed by the synthetic resin of vinyl chloride that possesses corrosion resistance equally etc.
Side foreign side on the short transverse of described framework 5 is provided with transmitter shaft 14 along the length direction of chamber 1.Middle part at this transmitter shaft 14 is provided with follower gear 15.On this follower gear 15, be engaged with driven wheel 16.This driven wheel 16 is inlaid on the output shaft 18 of drive source 17 of the outside of being located at chamber 1.
Though detailed icon is not provided with the 1st bevel gear on an end of described transmitter shaft 14 sides of being positioned at of described transmission shaft 11.Meshing the 2nd bevel gear that is located on the described transmission shaft 11 on the 1st bevel gear.Thereby, if described drive source 17 running, by described driven wheel 16 and follower gear 15 and 14 rotations of described transmitter shaft then drive described transmission shaft 11 by described the 1st, the 2nd bevel gear rotation.Thus, the described substrate W that sends into display panels that mouthfuls 2 transfer rollers 13 of supplying with and be transmitted axle 11 to chamber 1 in support etc., quilt is sent to sending oral instructions.
In addition, be transmitted that roller 13 supports and transverse bearing 19 that the Width two ends of the substrate W that transmits are arranged on the described framework 5 supports.Thus, substrate W is not transmitted on respect to the Width of chamber 1 circuitously.
In described chamber 1, be provided with the Width that the upper surface by the substrate W that is located at transfer roller 13 transmission on the described transmission shaft 11 is intersected along the direction of transfer with substrate W is supplied with the treating fluid L (shown in Figure 2) of described developer solution, stripper or etching solution etc. with linearity treating fluid feedway 31 as the treating fluid feed mechanism.
Described treating fluid feedway 31 to shown in Figure 4, has container body 32 as Fig. 2.This container body 32 form along the Width of described substrate W, promptly the Width along chamber 1 elongated, above the box shape of opening.The width dimensions of this container body 32 is set at longer than the width dimensions of described substrate W, inner as shown in Figure 2 by along the spacer body 33 of the length direction setting of container body 32 with the direction of this length direction quadrature on be divided into inflow portion 34 and liquid storing part 35.In this embodiment, described inflow portion 34 is arranged in the upstream side of the direction of transfer of the substrate W shown in Fig. 2 and Fig. 4 arrow, and liquid storing part 35 is positioned at the downstream.
In the bottom of the sidewall 34a of described inflow portion 34, along the Width of this sidewall 34a, in the longitudinal direction uniformly-spaced to be provided with a plurality of supply port bodies 36 (in Fig. 2, only illustrating 1).An end that on each supply port body 36, is connecting the feeding pipe 37 for the treatment of fluid L.The other end of feeding pipe 37 is communicated to the supply unit for the treatment of fluid L.Thus, to the inflow portion 34 of described container body 32, supply with treating fluid with the pressure of regulation from the bottom of described sidewall 34a.
In described inflow portion 34, spread all over container body 32 length direction, be the Width total length, be provided with and will be divided into the 1st Room 38a that is positioned at described supply port body 36 sides and the impact walls 39 that is positioned at the 2nd Room 38b of described liquid storing part 35 sides in this inflow portion 34.
The height setting of described impact walls 39 must be lower than the height of described spacer body 33.Thus, while be fed into treating fluid L the 1st Room 38a from described supply port body 36 and collide impact walls 39 and the impetus is weakened accumulate among the 1st Room 38a and liquid level is risen.And, if liquid level rises to the height roughly the same with impact walls 39, then shown in arrow among Fig. 2 like that overflow cross this impact walls 39 and flow among the 2nd Room 38b.
Treating fluid L is involved in air by flowing into fiercely the 1st Room 38a from supply port body 36, and this becomes the reason that bubble produces.But, flowing into treating fluid L the 1st Room 38a in impact walls 39 collision and the impetus is weakened from supply port body 36, overflow is crossed impact walls 39 and is flow among the 2nd Room 38b.
That is, the impetus for the treatment of fluid L when flowing among the 1st Room 38a produces turbulent flow, causes the generation of bubble, but does not undisturbedly flow among the 2nd Room 38b because do not produce turbulent flow, so can cause the generation of bubble this moment hardly.
If treating fluid L spills among the 2nd Room 38b, the liquid level of inflow portion 34 becomes the height roughly the same with the upper end of spacer body 33, then treating fluid L shown in arrow among Fig. 2 like that overflow cross spacer body 33 and in flowing into.At this moment, because treating fluid L does not become turbulent flow yet, undisturbedly flows into this liquid storing part 35, so can not cause the generation of turbulent flow by overflow.
On the diapire 35a of described liquid storing part 35, as shown in Figure 4, along be partitioned into a plurality of nozzle bores 40 that a row landform materialize become outflow portion of Width to stipulate of container body 32.In this embodiment, the aperture of described nozzle bore 40 is 0.5mm, and spacing is set at 0.7mm.
Thus, treating fluid L be stored in container body 32 in the corresponding pressure of height under flow out from described nozzle bore 40.The treating fluid L that flows out from the adjacent nozzles hole 40 that forms with the spacing of 0.7mm becomes a straight line continuously and is fed into the upper surface of substrate W.That is, even form outflow portion by a plurality of nozzle bores 40, treating fluid L can not separate according to each nozzle bore 40 yet, and is supplied to continuously with linearity along the Width of substrate W.
In addition, the container body 32 for the treatment of fluid feedway 31 flatly is configured in the described chamber 1.Thus, the height that is stored in the liquid level of the treating fluid L in the container body 32 becomes identical in the total length of the Width of container body 32, so the outflow pressure that the water-head of the treating fluid L that each spray-hole 40 from the diapire 35a that is formed on liquid storing part 35 flows out forms becomes identical.That is, spread all over total length with the continuous treating fluid L of linearity and become roughly pressure uniformly from each nozzle bore 40 outflow.
In addition, become than sidewall 34a height if be fed into the height of the liquid level of the treating fluid L in the container body 32, then overflow is crossed this sidewall 34a and is flow in the discharge portion 41, discharges by not shown discharging tube.Thus, the liquid level of the treating fluid L in the container body 32 always is maintained certain height.
On the diapire 35a of described liquid storing part 35, be provided with the guiding part 42 that the treating fluid L that will flow out from described nozzle bore 40 directs into the upper surface of the described substrate W that transmits obliquely.This guiding part 42 as shown in Figure 2, the kink 43 that is formed on the upper end is installed on the described diapire 35a by screw 44.This guiding part 42 has the dip plane 45 that tilts than the lowland towards the direction of transfer downstream of described substrate W, and the following ora terminalis 45a of this dip plane 45 leaves opposed with the upper surface of the substrate W that tilts to transmit as shown in Figure 3 abreast.
Under the situation that container body 32 is flatly disposed, for the following ora terminalis 45a that makes described guiding part 42 and the upper surface of substrate W leave opposed abreast, ora terminalis 45a not only with respect to the horizontal plane tilts with angle θ 1 from the Width of top view with respect to substrate W as shown in Figure 3 under it, also observes the angle (rotation in the horizontal direction) with respect to the straight line H cant angle theta 2 parallel with the Width of container body 32 as shown in Figure 4 from the top.
And, described container body 32 disposes with angle θ 2 rotations in the horizontal direction, so that the straight line that the following ora terminalis 45a that tilts with angle θ 2 in the horizontal direction from the top observation of described guiding part 42 is become is with respect to the direction of transfer quadrature of the substrate W shown in the arrow X Fig. 4.
Treating apparatus according to such structure, make substrate W along as and the Width of the direction of transfer direction of intersecting tilt with predetermined angular and transmit, treating fluid L is spreaded all over the total length supply of the Width that the direction of transfer with substrate W intersects by treating fluid feedway 31.
In the container body 32 for the treatment of fluid feedway 31, on the diapire 35a that supplies with the liquid storing part 35 that stores treating fluid L, be provided with guiding part 42.This guiding part 42 has the dip plane 45 of accepting the treating fluid L that flows out with linearity from a plurality of nozzle bore 40a that are located on the described diapire 35a.
Described dip plane 45 tilts than the lowland towards the direction of transfer downstream of substrate W, and following ora terminalis 45a is with the angle tilt of θ 1, so that its Width total length with respect to the upper surface of the substrate W that tilts is left opposed abreast.That is, the lower limb 45a of dip plane 45 is in the Width total length of the upper surface that spreads all over substrate, leaves opposed with the upper surface of same interval and this substrate W.
Thereby, flow out to Width total length that treating fluid L on the dip plane 45 of described guide member 42 spreads all over substrate W supplies to substrate W from the following ora terminalis 45a of this dip plane 45 with identical pressure upper surface from described nozzle bore 40a.
And described container body 32 flatly disposes with respect to the substrate W that tilts.Therefore, the height that is supplied to the liquid level of the treating fluid L in the liquid storing part 35 that is stored into container body 32 becomes identical in the Width total length of container body 32.In a word, the treating fluid L that supplies with linearity of liquid storing part 35 total length that spreads all over its straight line has identical pressure.Thereby,, the Width total length of the substrate W treating fluid L by uniform pressure can be handled equably by these measures.
The straight line that the following ora terminalis 45a of the dip plane 45 of described guiding part 42 is become when overlooking with respect to the angle tilt of the straight line H parallel with θ 2 with the Width of container body 32.And the container body 32 that described guide member 42 is installed is configured to make the following ora terminalis 45a of dip plane 45 of described guide member 42 and the direction of transfer quadrature of substrate W.That is, with container body 32 with respect to the direction of the direction of transfer quadrature of substrate W in the horizontal direction with the rotation of θ 2 angles and dispose.
Therefore, from the following ora terminalis 45a of the dip plane 45 of guiding part 42 shown in arrow S Fig. 4 like that to supplying with treating fluid L simultaneously with the Width total length of the direction of transfer quadrature of substrate W.Thereby, by with substrate W in chamber 1 along transmitting with the direction of its Width quadrature, treating fluid L is had on whole that does not supply to substrate W equably with leaking equably whole of treatment substrate W thus.
In a word and since can to the substrate W that tilt to transmit, to as and the total length of the Width of the vergence direction of direction of transfer quadrature supply with treating fluid simultaneously, so the entire upper surface of treatment substrate W equably.
In said embodiment, formed the outflow portion for the treatment of fluid by a plurality of nozzle bores, but also can on the diapire of liquid storing part, form slit (not shown), treating fluid is flowed out with linearity from this slit.
In addition, with the container body that is provided with guiding part in the horizontal direction with the angle rotation of θ 2 configuration so that the following ora terminalis of the dip plane of guiding part along with the Width of the direction of transfer quadrature of substrate, be not with the angle of direction of transfer quadrature but with the angle tilt of regulation but the following ora terminalis of described guiding part also can not be a Width with respect to substrate.In a word, just passable as long as the Width total length that can intersect to the direction of transfer with substrate is supplied with treating fluid simultaneously.
Claims (3)
1, a kind of substrate board treatment utilizes the treating fluid of supplying with from the treating fluid feed mechanism, to handling, it is characterized in that with the angle tilt of regulation and along the upper surface of the substrate of the direction transmission that intersects with this vergence direction,
Described treating fluid feed mechanism possesses:
Container body along the vergence direction configuration of described substrate, is stored in described treating fluid supply in the inside;
Outflow portion, opening be formed on this container body below, the treating fluid that supply is stored in the container body flows out with linearity along the direction that the direction of transfer with described substrate intersects;
Guide member, be located at the following side of described container body, the dip plane that has towards the direction of transfer downstream of described substrate, tilts than the lowland, and the following ora terminalis of this dip plane is formed obliquely and leaves opposed abreast for the upper surface with the inclination of the described substrate that is transmitted, accept the treating fluid that flows out from described outflow portion with described dip plane, and supply to the upper surface of described substrate from the following ora terminalis of this dip plane.
2, substrate board treatment as claimed in claim 1 is characterized in that, the following ora terminalis of the dip plane of described guide member is with respect to the direction of transfer quadrature of described substrate.
3, substrate board treatment as claimed in claim 1 is characterized in that, described container body flatly disposes, and becomes identical height so that be supplied to the liquid level that is stored in the treating fluid in the inside along the vergence direction of described substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007119496A JP2008277556A (en) | 2007-04-27 | 2007-04-27 | Processing apparatus for substrate |
| JP119496/2007 | 2007-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101295089A true CN101295089A (en) | 2008-10-29 |
Family
ID=40055162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100957101A Pending CN101295089A (en) | 2007-04-27 | 2008-04-24 | Substrate processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008277556A (en) |
| KR (1) | KR20080096452A (en) |
| CN (1) | CN101295089A (en) |
| TW (1) | TW200918988A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207543A (en) * | 2013-04-19 | 2013-07-17 | 京东方科技集团股份有限公司 | Developing method |
| CN106773559A (en) * | 2017-01-05 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of transmitting device, toning system and developing method |
| CN111326453A (en) * | 2018-12-14 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Liquid supply assembly, method and wafer processing system |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200469191Y1 (en) * | 2008-12-30 | 2013-09-26 | 주식회사 케이씨텍 | Puddle knife for cleaning large-area substrate |
| CN106997860B (en) * | 2016-01-22 | 2020-09-04 | 芝浦机械电子株式会社 | Substrate processing apparatus |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3384666B2 (en) * | 1995-12-04 | 2003-03-10 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP4301596B2 (en) * | 1998-06-12 | 2009-07-22 | 三菱電機株式会社 | Manufacturing method of electronic device and slit dropping nozzle used in the manufacturing method |
| JP3923676B2 (en) * | 1999-04-21 | 2007-06-06 | 株式会社東芝 | Substrate processing method |
| JP2001338864A (en) * | 2000-05-30 | 2001-12-07 | Dainippon Screen Mfg Co Ltd | Apparatus and method for treatment of substrate |
| JP2002015983A (en) * | 2000-06-30 | 2002-01-18 | Minolta Co Ltd | Wet processing method for film board, and film board holding device used for wet processing |
| JP4421956B2 (en) * | 2003-07-18 | 2010-02-24 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and processing method |
| CN101615576B (en) * | 2004-07-19 | 2012-07-04 | 三星电子株式会社 | Substrate treating apparatus and substrate treating method using the same |
| JP4557872B2 (en) * | 2005-11-28 | 2010-10-06 | 株式会社日立ハイテクノロジーズ | Substrate processing apparatus, substrate processing method, and substrate manufacturing method |
| JP4472630B2 (en) * | 2005-12-28 | 2010-06-02 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
-
2007
- 2007-04-27 JP JP2007119496A patent/JP2008277556A/en active Pending
-
2008
- 2008-04-09 TW TW097112826A patent/TW200918988A/en unknown
- 2008-04-24 CN CNA2008100957101A patent/CN101295089A/en active Pending
- 2008-04-25 KR KR1020080038672A patent/KR20080096452A/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207543A (en) * | 2013-04-19 | 2013-07-17 | 京东方科技集团股份有限公司 | Developing method |
| CN106773559A (en) * | 2017-01-05 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of transmitting device, toning system and developing method |
| CN111326453A (en) * | 2018-12-14 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Liquid supply assembly, method and wafer processing system |
| CN111326453B (en) * | 2018-12-14 | 2023-05-26 | 夏泰鑫半导体(青岛)有限公司 | Liquid supply assembly and wafer processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008277556A (en) | 2008-11-13 |
| KR20080096452A (en) | 2008-10-30 |
| TW200918988A (en) | 2009-05-01 |
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Application publication date: 20081029 |