TW201802877A - Apparatus for treating substrate - Google Patents

Abstract

An apparatus for treating substrate of this invention includes a second ejection unit disposed at a position lower than an inner surface of a substrate transported by a transporting unit, which ejects a cleaning liquid for cleaning the inner surface of the substrate, to the inner surface of the substrate onto which a chemical is being ejected.

Description

Substrate processing device

The present invention relates to a substrate processing apparatus.

Conventionally, a substrate processing apparatus has been known. Such a substrate processing apparatus is disclosed, for example, in Japanese Laid-Open Patent Publication No. 2012-245503. The substrate processing apparatus disclosed in Japanese Laid-Open Patent Publication No. 2012-245503 includes a substrate moving mechanism that moves the substrate, and a chemical liquid nozzle that discharges the chemical liquid to the substrate that is moved by the substrate moving mechanism. In the substrate processing apparatus, the substrate is moved in the horizontal direction by the substrate moving mechanism. Further, the chemical liquid nozzle is disposed above the substrate. Further, the chemical liquid is discharged from the chemical liquid nozzle toward the lower substrate.

In the conventional substrate processing apparatus described in Japanese Laid-Open Patent Publication No. 2012-245503, since the chemical liquid is discharged on the surface of the substrate, the chemical liquid discharged on the surface of the substrate may enter the back surface of the substrate. Bad situation. Further, there is a case where the chemical liquid discharged from the chemical liquid nozzle or the chemical liquid that has entered the back surface of the substrate adheres to the substrate moving mechanism. Therefore, there is a problem that the back surface of the substrate is treated by the chemical liquid entering the back surface or the chemical liquid attached to the substrate moving mechanism.

The present invention has been completed in order to solve the above problems. An object of the invention is to provide a substrate processing apparatus capable of suppressing the back surface of a substrate from being processed by a chemical liquid.

In order to achieve the above object, a substrate processing apparatus according to an aspect of the present invention includes a transport unit that transports a substrate, and a first discharge unit that is disposed above the transport unit and that discharges the medicine onto a surface of the substrate transported by the transport unit. The liquid and the second discharge unit are disposed below the back surface of the substrate conveyed by the transport unit, and discharge the cleaning liquid for cleaning the back surface of the substrate to the back surface of the substrate in which the chemical liquid is discharged.

In the substrate processing apparatus according to the aspect of the invention, the second discharge unit is disposed below the back surface of the substrate conveyed by the transport unit, and is discharged to the rear surface of the substrate in a state in which the chemical liquid is discharged. A cleaning solution for cleaning the back side of the substrate. Thereby, since the cleaning liquid is discharged to the back surface of the substrate, it is possible to suppress the chemical liquid from entering the back surface from the surface of the substrate by the cleaning liquid discharged from the back surface of the substrate. In addition, even when the chemical solution adheres to the transport unit of the transport substrate, the cleaning liquid discharged from the second discharge unit can clean the back surface of the chemical solution adhering to the transport unit and the substrate to which the chemical liquid adheres from the transport unit. . As a result, it is possible to suppress the back surface of the substrate from being processed by the chemical liquid.

For example, when the treatment based on the chemical liquid is etching and the etching rate is relatively high, the back surface of the substrate is etched by entering the chemical liquid on the back surface of the substrate in a state where the chemical liquid is discharged. Therefore, as described above, the cleaning liquid for discharging the back surface of the substrate in which the chemical liquid is discharged is discharged, and in the various processes performed on the substrate, the back surface of the substrate is cleaned at a relatively early stage, and the back surface of the substrate can be suppressed. Etching is especially effective at this point.

In the substrate processing apparatus according to the above aspect, the conveying unit includes a plurality of roller portions, and the second discharging portion is preferably configured to discharge the cleaning liquid from the gap between the adjacent roller portions to the back surface of the substrate. According to this configuration, it is possible to easily suppress the discharge of the cleaning liquid from being hindered by the roller portion.

In this case, it is preferable that the second discharge portion is configured to discharge the cleaning liquid from the gap between the adjacent roller portions toward the obliquely upward direction and in front of the conveyance direction of the substrate. According to this configuration, the distance between the second discharge portion and the portion on which the cleaning liquid is discharged from the second discharge portion is longer than when the cleaning liquid is discharged vertically on the back surface of the substrate. Thereby, when the cleaning liquid is diffused and discharged from the second discharge portion toward the back surface of the substrate, the area of the portion on the back surface of the substrate on which the cleaning liquid is discharged becomes large. That is, the cleaning liquid can be discharged in a wide range.

In the substrate processing apparatus that discharges the cleaning liquid from the gap between the adjacent roller portions, the second discharge portion is configured to extend the discharge direction of the cleaning liquid discharged from the gap between the adjacent roller portions. After the passage of the line, it is preferred to start the discharge of the cleaning liquid. According to this configuration, since the cleaning liquid is accurately discharged to the back surface of the substrate, it is possible to easily suppress the discharge of the cleaning liquid above the conveying unit.

In the substrate processing apparatus according to the above aspect, the second discharge unit is configured to stop the discharge of the cleaning liquid and to stop the discharge of the cleaning liquid when the discharge of the chemical liquid onto the surface of the substrate is completed. According to this configuration, unlike the case where the cleaning liquid is continuously discharged from the second discharge unit, the amount of the cleaning liquid used can be reduced.

In the substrate processing apparatus according to the above aspect, the first discharge unit is configured to discharge the chemical liquid toward the vertical lower side, and the second discharge unit is configured to It is preferable to stop the discharge of the cleaning liquid after the rear end of the substrate passes right below the first discharge portion. According to this configuration, it is possible to accurately stop the discharge of the cleaning liquid from the second discharge unit at the time of ending the discharge of the chemical liquid to the substrate.

In the substrate processing apparatus according to the above aspect, the first discharge unit includes a slit nozzle, and the width of the slit nozzle in the direction orthogonal to the transport direction of the transport substrate is greater than or equal to the width in the direction orthogonal to the transport direction of the substrate. good. According to this configuration, the chemical liquid can be discharged from one end to the other end in the direction orthogonal to the transport direction of the substrate. Thereby, the discharge amount of the chemical liquid discharged on the surface of the substrate can be made substantially uniform. As a result, the processing of the substrate based on the chemical liquid can be made substantially uniform. Further, the slit nozzle is easier to control the discharge amount than the other nozzles that discharge the chemical liquid in a large amount, such as a shower nozzle. Thereby, since the discharge amount of the chemical liquid discharged on the surface of the substrate can be made substantially uniform, the processing of the substrate based on the chemical liquid can be further made uniform.

For example, when the treatment based on the chemical solution is etching and the etching rate is relatively high, the uniformity of etching on the substrate is required. Therefore, in the above-described one aspect, the first discharge portion includes the slit nozzle, and when the etching rate is relatively high, the discharge amount of the chemical liquid is substantially uniform, and the uniformity of etching of the entire substrate can be ensured, which is particularly effective in this point. .

In the substrate processing apparatus according to the above aspect, the second discharge unit includes a plurality of flat nozzles that discharge the cleaning liquid in a fan shape, and the conveying direction of the fan-shaped cleaning liquid discharged from each of the plurality of flat nozzles and the conveying substrate is positive. It is preferable that the total width in the direction of intersection is more than the width in the direction orthogonal to the conveyance direction of the substrate. If you do this, you can easily The cleaning liquid is discharged from one end to the other end in a direction orthogonal to the conveying direction of the substrate. As a result, it is possible to effectively suppress the chemical solution entering from the surface of the substrate and adhering to the transfer portion from adhering to the back surface of the substrate.

In the substrate processing apparatus according to the above aspect, the third discharge unit is further provided, and the third discharge unit is disposed on the downstream side of the substrate in the transport direction of the substrate, and is transported by the transport unit. The back surface is further downward, and the cleaning liquid is discharged to the back surface of the substrate after the discharge of the chemical solution to the surface of the substrate is completed. According to this configuration, it is possible to suppress the liquid chemical from the surface of the substrate by the cleaning liquid discharged from the third discharge portion while the surface of the substrate is being processed by the chemical liquid after the discharge of the chemical solution onto the surface of the substrate is completed. Go to the back.

In this case, the transport unit includes a plurality of roller portions, and the third discharge portion is provided in plural in the transport direction of the substrate, and the plurality of third discharge portions are configured to extend from the gap between the adjacent roller portions toward the back surface of the substrate. It is preferred to discharge the cleaning liquid. According to this configuration, it is possible to easily suppress the discharge of the cleaning liquid from being hindered by the roller portion. Further, since a plurality of third discharge portions are provided, it is possible to perform a relatively wide range of cleaning of the back surface of the substrate even in a state in which the transfer of the substrate is stopped.

In the substrate processing apparatus including the third discharge unit, the third discharge unit is preferably configured to start the discharge of the cleaning liquid after the substrate is transported to the upper side of the third discharge unit. According to this configuration, since the substrate is transported to the upper side of the third discharge unit, it is possible to easily suppress the discharge of the cleaning liquid above the transfer unit.

In the substrate processing apparatus including the third discharge unit, (3) The discharge unit includes a shower nozzle for the peripheral portion, and discharges the cleaning liquid to the vicinity of the peripheral portion of the back surface of the substrate; and a shower nozzle for the center portion discharges the cleaning liquid toward the center portion of the back surface of the substrate, and sprays the shower portion from the peripheral portion. The discharge amount of the cleaning liquid discharged from the nozzle is preferably smaller than the discharge amount of the cleaning liquid discharged from the shower nozzle at the center portion. In the case where only the shower nozzle for the center portion is disposed without the shower nozzle for the peripheral portion, the discharge amount of the cleaning liquid to the peripheral portion of the back surface of the substrate may be insufficient. Therefore, by providing the shower nozzle for the peripheral portion, it is possible to suppress the shortage of the discharge amount of the cleaning liquid to the peripheral portion of the back surface of the substrate. Moreover, the cleaning liquid discharged from the peripheral portion of the back surface of the substrate easily enters the surface of the substrate. Therefore, the discharge amount of the cleaning liquid discharged from the peripheral portion shower nozzle can be made smaller than the discharge amount of the cleaning liquid discharged from the shower nozzle at the center portion, whereby the cleaning liquid can be prevented from entering the surface of the substrate.

In the substrate processing apparatus including the third discharge unit, it is preferable to further include a cleaning liquid recovery unit that is disposed below the third discharge unit and collects the cleaning liquid that has been dropped from the back surface of the substrate. According to this configuration, since the cleaning liquid dripped from the back surface of the substrate can be reused, the amount of the cleaning liquid used can be reduced.

In the substrate processing apparatus according to the above aspect, the conveying unit includes a plurality of roller portions, and the first discharging portion is configured to discharge the chemical liquid between the adjacent roller portions toward the vertical lower side, and the substrate processing device further includes the chemical liquid recovery The first discharge portion is disposed to face the first discharge portion that discharges the chemical liquid vertically downward, and the chemical liquid discharged from the first discharge portion is collected, and the second discharge portion is disposed downstream of the transfer direction of the substrate than the chemical solution recovery portion. It is better. If so According to this configuration, the chemical solution recovered by the chemical solution recovery unit can be reused, so that the amount of the chemical solution used can be reduced. In the state where the substrate is not present between the first discharge unit and the chemical solution recovery unit, the chemical solution discharged from the first discharge unit is directly collected by the chemical solution recovery unit without contacting the substrate, so that the substrate can be contacted without being in contact with the substrate. Unused liquid is reused. In addition, there is a case where the chemical liquid that has come into contact with the substrate or the chemical liquid that has dripped from the surface of the substrate that has passed over the chemical solution recovery portion is shortly after the substrate enters between the first discharge portion and the chemical solution recovery portion. The liquid is recovered by the chemical recovery unit. That is, the treatment waste liquid may be mixed in the unused chemical solution. On the other hand, since the mixed waste liquid is relatively small, the influence on the reuse of the chemical liquid is small.

In addition, since the second discharge unit is disposed on the downstream side in the transport direction of the substrate in the liquid-collecting portion that is disposed to face the vertical direction of the first discharge unit, the second discharge unit is disposed downstream of the first discharge unit. . Thereby, the cleaning liquid can be accurately discharged to the portion on the back surface corresponding to the portion on the surface on which the liquid crystal substrate is discharged.

In the substrate processing apparatus according to the above aspect, the substrate processing apparatus includes a chemical solution tank for discharging the chemical liquid to the substrate, a cleaning tank for cleaning the substrate, and a drying tank for drying the substrate, and the first discharge unit and the second discharge unit are disposed. It is preferred to use a liquid tank. According to this configuration, in the substrate treated by the chemical solution in the chemical solution tank, the chemical solution can be prevented from entering the back surface of the substrate.

According to the present invention, it is possible to suppress the back surface of the substrate from being treated by the chemical liquid as described above.

1‧‧‧ drug tank

2‧‧‧cleaning tank

3‧‧‧Dry tank

10‧‧‧Transportation Department

11‧‧‧ Rolls

12‧‧‧ gap

13‧‧‧ gap

20‧‧‧Slit nozzle

21‧‧‧Drug Recycling Department

30‧‧‧flat nozzle

40‧‧‧Control Department

50‧‧‧Spray nozzle

51‧‧‧Spray nozzle

52‧‧‧Spray nozzle

52a‧‧‧Spray nozzle

52b‧‧‧Spray nozzle

60‧‧‧ sensor

100‧‧‧Substrate processing unit

200‧‧‧Substrate

200a‧‧‧ surface

200b‧‧‧back

A‧‧‧ direction

W1‧‧‧Width

W2‧‧‧Width

W3‧‧‧Width

W4‧‧‧ total width

Fig. 1 is a side view of a substrate processing apparatus according to an embodiment of the present invention.

Fig. 2 is a side view of a chemical solution tank of a substrate processing apparatus according to an embodiment of the present invention.

Fig. 3 is a view of the slit nozzle viewed from above.

Fig. 4 is a view of the flat nozzle viewed from above.

Fig. 5 is a side view of the chemical solution tank in a state in which the chemical liquid is discharged from the slit nozzle to the substrate.

Fig. 6 is a side view of the chemical solution tank in a state in which the cleaning liquid is discharged from the shower nozzle to the substrate.

Fig. 7 is a view of the shower nozzle viewed from above.

Fig. 8 is a view for explaining the cleaning liquid discharged from the shower nozzle.

Fig. 9 is a side view of a substrate processing apparatus according to a first modification of the embodiment of the present invention.

Fig. 10 is a side view of a substrate processing apparatus according to a second modification of the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Structure of substrate processing apparatus)

The configuration of the substrate processing apparatus 100 of the present embodiment will be described with reference to Figs. 1 to 8 . The substrate processing apparatus 100 is configured to discharge a chemical liquid (etching liquid) onto the substrate 200 and form the surface 200a of the substrate 200. The film is etched. Further, the etching by the substrate processing apparatus 100 is performed in order to flatten the thin film formed on the surface 200a of the substrate 200. Further, the film is, for example, SiO (antimony oxide) or the like. Further, the chemical solution is, for example, HF (hydrogen fluoride) or the like.

As shown in FIG. 1, the substrate processing apparatus 100 includes a chemical solution tank 1 for discharging a chemical liquid onto the substrate 200, a cleaning tank 2 for cleaning the substrate 200, and a drying tank 3 for drying the substrate 200. In addition, in the first drawing, the slit nozzle 20 and the like which will be described later are omitted.

Further, the substrate processing apparatus 100 includes a transport unit 10 that transports the substrate 200. The conveying unit 10 is provided throughout the chemical tank 1, the washing tank 2, and the drying tank 3. The substrate 200 is sequentially transferred to the chemical solution tank 1, the cleaning tank 2, and the drying tank 3 by the conveying unit 10. Further, the substrate 200 is conveyed in the horizontal direction (X direction).

Further, the conveying unit 10 is composed of a plurality of roller portions 11. The roller portion 11 extends in the Y direction orthogonal to the transport direction (X direction) of the substrate 200. Further, the roller portion 11 is configured to rotate about a rotation axis along the Y direction. Further, the plurality of roller portions 11 are configured to be rotated by a drive unit (not shown). Thereby, the friction between the back surface 200b of the substrate 200 and the roller portion 11 is reduced, so that scratches on the back surface 200b of the substrate 200 can be suppressed.

Further, as shown in FIG. 2, the chemical solution tank 1 of the substrate processing apparatus 100 is provided with a slit nozzle 20 which is disposed above the transport unit 10 (in the Z1 direction) and is transported to the transport unit 10 The surface 200a of the substrate 200 to be conveyed discharges the chemical liquid. The slit nozzle 20 has a slit-like discharge port that extends in the Y direction orthogonal to the transport direction (X direction) of the substrate 200. Thereby, the curtain-shaped chemical liquid is discharged from the slit nozzle 20 to the substrate 200. Further, the slit nozzle 20 is an example of the "first discharge portion" in the patent application range.

In the present embodiment, as shown in FIG. 3, the width W1 of the slit nozzle 20 in the Y direction orthogonal to the transport direction (X direction) of the transport substrate 200 is the Y direction orthogonal to the transport direction of the substrate 200. The width is W2 or more. Specifically, in the substrate processing apparatus 100 , the width W1 of the slit nozzle 20 in the Y direction is larger than the width W2 of the substrate 200 .

Further, as shown in Fig. 2, the slit nozzle 20 is configured to discharge the chemical liquid between the adjacent roller portions 11 in the vertically downward direction (Z2 direction). Further, the chemical liquid recovery unit 21 that recovers the chemical liquid discharged from the slit nozzle 20 is disposed so as to face the slit nozzle 20 that discharges the chemical liquid vertically downward.

As shown in FIG. 3, the width W3 of the chemical liquid recovery portion 21 in the Y direction is larger than the width W2 of the substrate 200 and larger than the width W1 of the slit nozzle 20.

Further, the discharge of the chemical liquid from the slit nozzle 20 is continued. In other words, when the substrate 200 passes under the slit nozzle 20 (see FIG. 5), the chemical liquid dropped from the substrate 200 and the liquid medicine discharged to the outside of both ends of the substrate 200 in the Y direction are used. The chemical solution recovery unit 21 is recovered. When the substrate 200 does not pass under the slit nozzle 20 (see FIGS. 2 and 6 ), the chemical liquid discharged from the slit nozzle 20 is directly collected by the chemical solution collecting unit 21 . The chemical solution recovered by the chemical solution recovery unit 21 is reused. That is, the chemical liquid recovered by the chemical solution recovery unit 21 is again discharged to the substrate 200.

Here, in the present embodiment, as shown in FIG. 2, the substrate is The chemical tank 1 of the processing apparatus 100 is provided with a flat nozzle 30 which is disposed below the back surface 200b of the substrate 200 conveyed by the transport unit 10 (on the Z2 direction side) and is discharged to the liquid medicine. The back surface 200b of the substrate 200 discharges the cleaning liquid for cleaning the back surface 200b of the substrate 200. Specifically, the flat nozzles 30 are disposed between the roller portions 11 adjacent in the X direction. Further, as shown in Fig. 4, the flat nozzle 30 is configured to discharge the cleaning liquid in a fan shape. Further, the cleaning liquid is, for example, pure water. Moreover, the flat nozzle 30 is an example of the "second discharge part" of the patent application range.

Further, as shown in Fig. 5, the flat nozzle 30 is configured to discharge the cleaning liquid onto the back surface 200b of the substrate 200 on which the chemical solution is being discharged. That is, the substrate 200 on which the chemical solution is discharged and the substrate 200 on which the cleaning liquid is discharged on the back surface 200b are the same substrate 200.

Further, in the conveyance direction (X direction), there is no other nozzle between the slit nozzle 20 and the flat nozzle 30. For example, the substrate processing apparatus 100 may be provided with a nozzle for removing an air knife for removing the chemical liquid remaining on the substrate 200 in the vicinity of the outlet of the chemical solution tank 1 (on the X2 direction side) or may be discharged to the surface 200a of the substrate 200. Liquid nozzle. In the substrate processing apparatus 100, a nozzle for generating an air knife or a nozzle for discharging a cleaning liquid to the surface 200a of the substrate 200 is not provided between the slit nozzle 20 and the flat nozzle 30.

Moreover, as shown in FIG. 5, the flat nozzle 30 is configured to discharge the cleaning liquid from the gap 12 between the adjacent roller portions 11 to the back surface 200b of the substrate 200. Specifically, the flat nozzles 30 are configured to discharge the cleaning liquid from the gap 12 between the adjacent roller portions 11 toward the obliquely upward (A direction) and in front of the conveying direction of the substrate 200 (X2 direction).

Further, the slit nozzle 20 is placed on one side (the X1 direction side) of the substrate 200 into the chemical solution tank 1. Further, the flat nozzle 30 is disposed on the downstream side (X2 direction side) of the slit nozzle 20 in the transport direction (X direction) and in the vicinity of the slit nozzle 20. In other words, the slit nozzle 20 and the flat nozzle 30 are disposed on the X1 direction side from the central portion of the chemical solution tank 1 in the X direction.

Further, as shown in Fig. 4, the flat nozzles 30 are provided in plural numbers. In addition, the total width W4 of the fan-shaped cleaning liquid discharged from each of the plurality of flat nozzles 30 in the Y direction orthogonal to the conveying direction (X direction) of the conveying substrate 200 is Y which is orthogonal to the conveying direction of the substrate 200. The width of the direction is W2 or more. Specifically, in the substrate processing apparatus 100, the total width W4 of the cleaning liquid is substantially equal to the width W2 of the substrate 200.

Further, as shown in FIG. 5, the cleaning liquid is discharged from the flat nozzle 30 at the timing when the cleaning liquid discharged from the flat nozzle 30 does not enter the surface 200a of the substrate 200. Specifically, the flat nozzle 30 is configured such that the front end 200c of the substrate 200 passes through an extension line of the discharge direction (A direction) of the cleaning liquid discharged from the gap 12 between the adjacent roller portions 11, and then the discharge of the cleaning liquid is started. Whether or not the front end 200c of the substrate 200 passes through an extension or the like in a discharge direction (A direction) of the cleaning liquid is detected by a sensor or the like (not shown). Moreover, the start control of the discharge of the cleaning liquid from the flat nozzles 30 is performed by the control unit 40 provided in the substrate processing apparatus 100.

Further, depending on the transport speed of the substrate 200, the viscosity of the cleaning liquid, the wettability of the cleaning liquid on the surface 200a of the substrate 200, etc., there is a possibility that the cleaning liquid enters the surface 200a of the substrate 200, and therefore the front end 200c of the substrate 200 is present. Cleaning starts after the extension line of the discharge direction The discharge of the liquid is preferred. Further, when the discharge of the cleaning liquid is delayed, the chemical liquid enters the back surface 200b from the surface 200a of the substrate 200. Therefore, the cleaning is started immediately after the passage of the front end 200c of the substrate 200 in the discharge direction extension line or immediately after the passage. The discharge of the liquid is preferred.

Moreover, the flat nozzle 30 is configured to stop the discharge of the cleaning liquid when the discharge of the chemical liquid to the surface 200a of the substrate 200 is completed and the conveyance of the substrate 200 is stopped. Specifically, after the discharge of the chemical solution on the surface 200 a of the substrate 200 is completed, the substrate 200 is stopped above the shower nozzle 50 to be described later. Moreover, the control for stopping the discharge of the cleaning liquid from the flat nozzles 30 is performed by the control unit 40 provided in the substrate processing apparatus 100.

In the present embodiment, the shower nozzle 50 is disposed below the flat nozzle 30 on the downstream side (X2 direction side) of the substrate 200 and on the lower surface 200b of the substrate 200 transported by the transport unit 10. The shower nozzle 50 discharges the cleaning liquid to the rear surface 200b of the substrate 200 after the discharge of the chemical solution on the surface 200a of the substrate 200 is completed. Specifically, the shower nozzles 50 are disposed between the roller portions 11 adjacent in the X direction. Further, the shower nozzle 50 is configured to discharge the cleaning liquid in a conical shape. Further, the shower nozzles 50 are provided in plural in the transport direction (X direction) of the substrate 200. Further, the shower nozzle 50 is configured to discharge the cleaning liquid from the gap 13 between the adjacent roller portions 11 to the back surface 200b of the substrate 200. Further, the shower nozzle 50 is configured to discharge the cleaning liquid toward the vertical upper side (Z1 direction). Further, as shown in FIG. 7, the shower nozzle 50 is also provided in plural in the Y direction orthogonal to the transport direction (X direction) of the substrate 200. Moreover, the shower nozzle 50 is an example of the "third discharge part" of the patent application range.

Further, as shown in FIG. 6, the shower nozzle 50 is configured to start the discharge of the cleaning liquid after the substrate 200 is transported to the upper side of the shower nozzle 50. Specifically, in the plan view, the transfer of the substrate 200 is stopped at a position where all of the shower nozzles 50 overlap on the substrate 200. The determination as to whether or not the substrate 200 is stopped at a position overlapping all of the shower nozzles 50 is detected by the sensor 60 disposed below the substrate 200. Moreover, the start control of the discharge of the cleaning liquid from the shower nozzle 50 is performed by the control unit 40 provided in the substrate processing apparatus 100.

Moreover, the discharge of the cleaning liquid from the shower nozzle 50 is stopped after the etching of the surface 200a of the substrate 200 by the chemical liquid is completed. Specifically, the discharge of the cleaning liquid is stopped for a predetermined period of time (for example, n seconds before) before the cleaning tank 2 of the substrate 200 is conveyed by the conveying unit 10 .

Further, as shown in Fig. 7, the shower nozzle 50 includes a shower nozzle 51 that discharges the cleaning liquid toward the vicinity of the peripheral edge portion of the back surface 200b of the substrate 200, and a shower nozzle 52 that faces the center portion of the rear surface 200b of the substrate 200. Drain the cleaning solution. Specifically, the shower nozzle 51 is configured to discharge the cleaning liquid to the vicinity of the four corners of the substantially rectangular substrate 200. Further, the shower nozzle 52 is configured to discharge the cleaning liquid to a region inside the four corners of the substrate 200. In addition, each of the shower nozzle 51 and the shower nozzle 52 is an example of the "spray nozzle for the peripheral portion" and the "spray nozzle for the center portion" in the patent application range.

Further, as shown in Fig. 8, the cleaning liquid discharged from the shower nozzle 52 overlaps each other. Further, the cleaning liquid discharged from the shower nozzle 51 overlaps with the cleaning liquid discharged from the shower nozzle 52. Moreover, it is discharged from the shower nozzle 51 The discharge amount of the cleaning liquid is smaller than the discharge amount of the cleaning liquid discharged from the shower nozzle 52. That is, the area of the cleaning liquid discharged from the shower nozzle 51 to the back surface 200b of the substrate 200 is smaller than the area of the cleaning liquid discharged from the shower nozzle 52 to the back surface 200b of the substrate 200.

Further, the area of the cleaning liquid discharged from the plurality of shower nozzles 52 is slightly smaller than the back surface 200b of the substrate 200. Specifically, in the plurality of shower nozzles 52, the discharge amount of the shower nozzles 52 (52a) disposed outside is adjusted by the flow rate and the pressure so that the cleaning liquid cannot enter the surface 200a of the substrate 200. Then, the cleaning liquid discharged from the shower nozzle 52a is diffused to the end of the substrate 200, and then dripped downward. Further, the discharge amount of the shower nozzle 52b disposed inside the shower nozzle 52a is adjusted by the flow rate and the pressure so that the cleaning liquid discharged from each of the shower nozzles 52b is covered by the shower nozzle 52a disposed outside. A substantially entire area of the area surrounded by the discharged cleaning liquid.

Next, the operation of the substrate processing apparatus 100 will be described with reference to FIGS. 2, 5, and 6. Further, the control of the operation of the substrate processing apparatus 100 is performed by the control unit 40.

First, as shown in FIG. 2, the chemical liquid is discharged from the slit nozzle 20 toward the chemical solution recovery unit 21.

Next, as shown in FIG. 5, the substrate 200 is carried into the chemical solution tank 1. Thereby, the chemical solution is applied to the surface 200a of the substrate 200. Further, since the transport speed of the substrate 200 is substantially constant, the chemical liquid is applied to the surface 200a of the substrate 200 substantially uniformly. Moreover, the chemical liquid discharged to the outside of the substrate 200 is recovered by the chemical liquid recovery unit 21.

Next, after the leading end 200c of the substrate 200 passes through the extension line of the cleaning liquid discharge direction (A direction), the cleaning liquid is discharged from the flat nozzle 30 to the back surface 200b of the substrate 200.

Next, as shown in FIG. 6, after the conveyance of the substrate 200 is stopped above the shower nozzle 50, the discharge of the cleaning liquid from the flat nozzle 30 is stopped. Thereafter, the cleaning liquid is discharged from the shower nozzle 50 to the back surface 200b of the substrate 200.

Next, after the etching of the surface 200a of the substrate 200 by the chemical liquid is completed, the discharge of the cleaning liquid from the shower nozzle 50 to the back surface 200b of the substrate 200 is stopped.

Then, the substrate 200 is transported to the cleaning tank 2 and washed, and then transferred to the drying tank 3 for drying.

(Effect of this embodiment)

In the present embodiment, the following effects can be obtained.

In the present embodiment, as described above, the flat nozzle 30 is disposed below the back surface 200b of the substrate 200 conveyed by the transport unit 10, and is discharged to the rear surface 200b of the substrate 200 in a state in which the chemical liquid is discharged. The cleaning liquid on the back surface 200b of the substrate 200 is cleaned. Thereby, since the cleaning liquid is discharged to the back surface 200b of the substrate 200, the chemical liquid can be prevented from entering the back surface 200b from the surface 200a of the substrate 200 by the cleaning liquid discharged to the back surface 200b of the substrate 200. In addition, even when the chemical liquid adheres to the transport unit 10 of the transport substrate 200, the chemical liquid adhering to the transport unit 10 can be washed by the cleaning liquid discharged from the flat nozzle 30, and the chemical liquid can be attached from the transport unit 10. The back surface 200b of the substrate 200. As a result, the base can be suppressed The back surface 200b of the board 200 is processed by a chemical liquid.

For example, when the treatment of the chemical liquid is etching and the etching rate is relatively high, the back surface 200b of the substrate 200 is etched by entering the chemical liquid on the back surface 200b of the substrate 200 in a state where the chemical liquid is discharged. Therefore, in the present embodiment, the cleaning liquid for discharging the back surface 200b of the substrate 200 in the state in which the chemical liquid is discharged is cleaned, and the back surface 200b of the substrate 200 is cleaned at an early stage in various processes performed on the substrate 200. It is particularly effective in that etching of the back surface 200b of the substrate 200 can be suppressed.

Further, in the present embodiment, as described above, the flat nozzles 30 discharge the cleaning liquid from the gap 12 between the adjacent roller portions 11 to the back surface 200b of the substrate 200. Thereby, it is possible to easily suppress the discharge of the cleaning liquid from being hindered by the roller portion 11.

Further, in the present embodiment, as described above, the flat nozzles 30 discharge the cleaning liquid from the gap 12 between the adjacent roller portions 11 toward the obliquely upward direction and in front of the conveyance direction of the substrate 200. Thereby, the distance from the flat nozzle 30 to the portion of the back surface 200b of the substrate 200 from which the cleaning liquid is discharged becomes longer than when the cleaning liquid is discharged perpendicularly to the back surface 200b of the substrate 200. As a result, the area of the portion of the back surface 200b of the substrate 200 from which the cleaning liquid is discharged from the flat nozzle 30 becomes large. That is, the cleaning liquid can be discharged in a wide range.

Further, in the present embodiment, as described above, the flat nozzle 30 starts the cleaning liquid after the leading end 200c of the substrate 200 passes through the extension line of the discharge direction of the cleaning liquid discharged from the gap 12 between the adjacent roller portions 11. discharge. Thereby, the cleaning liquid is accurately discharged to the back surface of the substrate 200. Since 200b is provided, it is possible to easily suppress the discharge of the cleaning liquid above the conveying unit 10.

In the present embodiment, as described above, the flat nozzle 30 stops the discharge of the cleaning liquid when the discharge of the chemical solution on the surface 200a of the substrate 200 is completed and the conveyance of the substrate 200 is stopped. Thereby, unlike the case where the cleaning liquid is continuously discharged from the flat nozzle 30, the amount of the cleaning liquid used can be reduced.

In the present embodiment, the width W1 of the slit nozzle 20 in the Y direction orthogonal to the conveyance direction of the conveyance substrate 200 is equal to or larger than the width W2 of the Y direction orthogonal to the conveyance direction of the substrate 200. Thereby, the chemical liquid can be discharged from one end in the Y direction orthogonal to the conveyance direction of the substrate 200 over the other end. Thereby, the discharge amount of the chemical liquid discharged onto the surface 200a of the substrate 200 can be made substantially uniform. As a result, the processing of the chemical liquid-based substrate 200 can be made substantially uniform. Further, the slit nozzle 20 is relatively easy to control the discharge amount as compared with other nozzles that discharge a large amount of the chemical liquid as in a shower nozzle or the like. Thereby, the discharge amount of the chemical liquid discharged onto the surface 200a of the substrate 200 can be made substantially uniform, so that the processing of the chemical liquid-based substrate 200 can be further made uniform.

For example, when the treatment based on the chemical liquid is etching and the etching rate is relatively high, uniformity of etching to the substrate 200 is required. Therefore, in the present embodiment, the chemical liquid is discharged from the slit nozzle 20, and when the etching rate is relatively high, the discharge amount of the chemical liquid is substantially uniform, and the uniformity of etching of the entire substrate 200 can be ensured. This is especially effective at this point.

Further, in the present embodiment, as described above, from a plurality of flats The total width W4 of the fan-shaped cleaning liquid discharged from the respective nozzles of the flat nozzles 30 in the Y direction orthogonal to the conveying direction of the conveying substrate 200 is equal to or larger than the width W2 in the Y direction orthogonal to the conveying direction of the substrate 200. Thereby, it is possible to easily discharge the cleaning liquid from one end in the Y direction orthogonal to the conveying direction of the substrate 200 to the other end. As a result, it is possible to effectively suppress the chemical solution entering and adhering to the transport unit 10 from the surface 200a of the substrate 200 from adhering to the back surface 200b of the substrate 200.

Further, in the present embodiment, the shower nozzle 50 is disposed as described above in the downstream side of the flat nozzle 30 in the transport direction of the substrate 200 and below the rear surface 200b of the substrate 200 transported by the transport unit 10. The cleaning liquid is discharged to the back surface 200b of the substrate 200 after the discharge of the chemical solution to the surface 200a of the substrate 200 is completed. By this, it is possible to suppress the chemical liquid from the cleaning liquid discharged from the shower nozzle 50 while the surface 200a of the substrate 200 is being processed by the chemical liquid after the discharge of the chemical solution on the surface 200a of the substrate 200 is completed. The surface 200a of the substrate 200 enters the back surface 200b.

Further, in the present embodiment, as described above, the shower nozzles 50 are provided in plural in the transport direction of the substrate 200, and the plurality of shower nozzles 50 are respectively directed from the gaps 13 between the adjacent roller portions 11 toward the back surface of the substrate 200. 200b discharges the cleaning solution. Thereby, it is possible to easily suppress the discharge of the cleaning liquid from being hindered by the roller portion 11. Moreover, since a plurality of shower nozzles 50 are provided, it is possible to perform a relatively wide range of cleaning of the back surface 200b of the substrate 200 even in the state in which the substrate 200 is stopped.

Further, in the present embodiment, the shower nozzle 50 is as described above. After the substrate 200 is transported to the upper side of the shower nozzle 50, the discharge of the cleaning liquid is started. Thereby, since the substrate 200 is conveyed to the upper side of the shower nozzle 50, it is possible to easily suppress the discharge of the cleaning liquid above the conveying unit 10.

In the present embodiment, the discharge amount of the cleaning liquid discharged from the shower nozzle 51 that discharges the cleaning liquid in the vicinity of the peripheral edge portion of the back surface 200b of the substrate 200 is less than that discharged from the center portion side of the back surface 200b of the substrate 200. The discharge amount of the cleaning liquid discharged from the shower nozzle 52 of the cleaning liquid. When only the shower nozzle 52 is disposed without the shower nozzle 51 being disposed, the discharge amount of the cleaning liquid to the peripheral edge portion of the back surface 200b of the substrate 200 may be insufficient. Therefore, by providing the shower nozzle 51, it is possible to suppress the shortage of the discharge amount of the cleaning liquid to the peripheral edge portion of the back surface 200b of the substrate 200. Moreover, the cleaning liquid discharged from the peripheral portion of the back surface 200b of the substrate 200 easily enters the surface 200a of the substrate 200. Therefore, by causing the discharge amount of the cleaning liquid discharged from the shower nozzle 51 to be smaller than the discharge amount of the cleaning liquid discharged from the shower nozzle 52, it is possible to prevent the cleaning liquid from entering the surface 200a of the substrate 200.

Further, in the present embodiment, the chemical solution recovery unit 21 is disposed as described above, and is disposed to face the slit nozzle 20 that discharges the chemical liquid vertically downward, and collects the chemical liquid discharged from the slit nozzle 20. Further, the flat nozzle 30 is disposed on the downstream side of the transfer direction of the substrate 200 from the chemical solution recovery unit 21. Thereby, the chemical solution recovered by the chemical solution recovery unit 21 can be reused, so that the amount of the chemical solution used can be reduced. In the state where the substrate 200 is not present between the slit nozzle 20 and the chemical solution collecting unit 21, the chemical liquid discharged from the slit nozzle 20 is directly collected by the chemical liquid collecting unit 21 without contacting the substrate 200. An unused chemical solution that is not in contact with the substrate 200 Reuse. In addition, the chemical solution that is in contact with the substrate 200 or the surface 200a of the substrate 200 that passes over the chemical solution recovery unit 21 may be dropped shortly after the substrate 200 enters between the slit nozzle 20 and the chemical solution recovery unit 21. The treatment waste liquid such as the chemical liquid is recovered by the chemical liquid recovery unit 21. That is, the treatment waste liquid may be mixed into the unused chemical solution. On the other hand, since the mixed waste liquid is relatively small, the influence on the reuse of the chemical liquid is small.

In addition, since the flat nozzles 30 are disposed on the downstream side of the transport direction of the substrate 200 in the chemical liquid recovery portion 21 disposed opposite to the vertically downward direction of the slit nozzles 20, the flat nozzles 30 are disposed downstream of the slit nozzles 20 . Thereby, the cleaning liquid can be accurately discharged to the portion of the back surface 200b corresponding to the portion of the surface 200a of the substrate 200 on which the chemical liquid is discharged.

Further, in the present embodiment, the slit nozzle 20 and the flat nozzle 30 are disposed in the chemical solution tank 1 as described above. Thereby, in the substrate 200 treated by the chemical solution in the chemical solution tank 1, the chemical solution can be prevented from entering the back surface 200b of the substrate 200.

[Modification]

In addition, it should be understood that the embodiments and examples disclosed herein are illustrative in all respects and are not limited in any way. The scope of the present invention is defined by the scope of the claims and the scope of the invention, and all modifications (modifications) within the meaning and scope of the claims are included.

For example, in the above embodiment, an example in which the etching liquid is discharged from the slit nozzle is shown, but the present invention is not limited thereto. For example, a chemical liquid other than the etching liquid may be discharged from the slit nozzle.

Further, in the above embodiment, an example in which pure water is discharged to the back surface of the substrate is shown, but the present invention is not limited thereto. For example, a cleaning liquid other than pure water may be discharged to the back surface of the substrate.

In the above-described embodiment, the cleaning liquid is discharged from the flat nozzle toward the obliquely upward direction and the front side of the substrate is conveyed. However, the present invention is not limited thereto. For example, the cleaning liquid may be discharged from the flat nozzle to the vertical upper side.

Moreover, in the above-described embodiment, an example is described in which the cleaning liquid is discharged from the flat nozzle after the leading end of the substrate passes through the extension line of the discharged cleaning liquid in the discharge direction, but the present invention is not limited thereto. For example, the discharge of the cleaning liquid from the flat nozzle can be performed at all times.

Further, in the above embodiment, an example in which the chemical liquid is discharged from the slit nozzle is shown, but the present invention is not limited thereto. For example, the liquid medicine can be discharged from a nozzle other than the slit nozzle.

Further, in the above embodiment, an example in which the cleaning liquid is discharged from the flat nozzle and the shower nozzle is shown, but the present invention is not limited thereto. For example, the cleaning liquid can be discharged from nozzles other than the flat nozzle and the shower nozzle.

In the above-described embodiment, the example in which the discharge of the chemical liquid on the surface of the substrate is terminated and the discharge of the substrate is stopped is stopped. However, the present invention is not limited thereto. For example, as in the substrate processing apparatus 110 according to the first modification of the ninth modification, the cleaning from the flat nozzle 30 can be stopped after the rear end 200d of the substrate 200 passes immediately below the slit nozzle 20 that discharges the chemical liquid vertically downward. Discharge of liquid. Thereby, it is possible to accurately stop the flattening at the point of ending the discharge of the chemical solution to the substrate 200. The discharge of the cleaning liquid of the nozzle 30.

Further, although the above embodiment shows an example in which the cleaning liquid discharged from the flat nozzle and the shower nozzle is not collected, the present invention is not limited thereto. For example, as in the substrate processing apparatus 120 according to the second modification of the tenth modification, the cleaning liquid recovery unit 121 that collects the cleaning liquid dripped from the back surface 200b of the substrate 200 may be provided below the shower nozzle 50, and may be borrowed. The cleaning liquid recovered by the cleaning liquid recovery unit 121 is again discharged from the flat nozzle 30 and the shower nozzle 50 to the back surface 200b of the substrate 200. Thereby, the cleaning liquid dripped from the back surface 200b of the substrate 200 can be reused, so that the amount of the cleaning liquid used can be reduced.

Further, in the above embodiment, the example in which the width of the slit nozzle is larger than the width of the substrate is shown, but the present invention is not limited thereto. For example, the width of the slit nozzle can be approximately equal to the width of the substrate.

Moreover, in the above-described embodiment, the total width in the Y direction of the fan-shaped cleaning liquid discharged from each of the plurality of flat nozzles is substantially equal to the width of the substrate, but the present invention is not limited thereto. For example, the total width of the fan-shaped cleaning liquid discharged from each of the plurality of flat nozzles in the Y direction may be larger than the width of the substrate.

Further, in the above-described embodiment, an example in which shower nozzles having different discharge amounts are provided is shown, but the present invention is not limited thereto. For example, as long as the cleaning liquid can be discharged to substantially the entire area of the back surface of the substrate, the discharge amounts of the plurality of shower nozzles can be made substantially equal to each other.

1‧‧‧ drug tank

10‧‧‧Transportation Department

11‧‧‧ Rolls

12‧‧‧ gap

13‧‧‧ gap

20‧‧‧Slit nozzle

21‧‧‧Drug Recycling Department

30‧‧‧flat nozzle

40‧‧‧Control Department

50‧‧‧Spray nozzle

60‧‧‧ sensor

100‧‧‧Substrate processing unit

200‧‧‧Substrate

200a‧‧‧ surface

200b‧‧‧back

Claims (15)

A substrate processing apparatus includes: a transport unit that transports a substrate; a first discharge unit that is disposed above the transport unit and that discharges a chemical solution to a surface of the substrate that is transported by the transport unit; and a second discharge unit The cleaning liquid for cleaning the back surface of the substrate is discharged to the back surface of the substrate in a state where the chemical liquid is discharged, lower than the back surface of the substrate conveyed by the transfer unit. The substrate processing apparatus according to claim 1, wherein the conveying unit includes a plurality of roller portions, and the second discharging portion is configured to discharge the cleaning liquid from the gap between the adjacent roller portions to the aforementioned The back side of the substrate. The substrate processing apparatus according to the second aspect of the invention, wherein the second discharge unit is configured to discharge the cleaning liquid from a gap between the adjacent roller portions toward an obliquely upward direction and in front of a conveyance direction of the substrate. The substrate processing apparatus according to the second or third aspect of the invention, wherein the second discharge unit is configured to discharge a front end of the substrate in a discharge direction of the cleaning liquid discharged from a gap between the adjacent roller portions After the passage of the extension line, the discharge of the aforementioned cleaning liquid is started. The substrate processing apparatus according to any one of claims 1 to 4, wherein The second discharge unit is configured to stop the discharge of the cleaning liquid when the discharge of the chemical liquid onto the surface of the substrate is completed and the transfer of the substrate is stopped. The substrate processing apparatus according to any one of claims 1 to 4, wherein the first discharge unit is configured to discharge the chemical liquid toward a vertical lower side, and the second discharge unit is configured to: After the rear end passes right below the first discharge portion, the discharge of the cleaning liquid is stopped. The substrate processing apparatus according to any one of claims 1 to 6, wherein the first discharge unit includes a slit nozzle, and a width of the slit nozzle in a direction orthogonal to a conveyance direction of the substrate is The width is equal to or larger than the width of the substrate in the direction orthogonal to the transport direction. The substrate processing apparatus according to any one of claims 1 to 7, wherein the second discharge unit includes a plurality of flat nozzles that discharge the cleaning liquid in a fan shape, and a fan that is discharged from each of the plurality of flat nozzles The total width of the cleaning liquid in the direction orthogonal to the conveying direction of the substrate to be conveyed is equal to or larger than the width in the direction orthogonal to the conveying direction of the substrate. The substrate processing apparatus according to any one of claims 1 to 8, further comprising: a third discharge unit disposed on a downstream side of the substrate in a transport direction of the second discharge unit and higher than The back surface of the substrate conveyed by the transport unit is further downward, and the cleaning liquid is discharged to the back surface of the substrate after the discharge of the chemical liquid on the surface of the substrate is completed. The substrate processing apparatus according to claim 9, wherein the transport unit includes a plurality of roller portions, and the third discharge portion is provided in plural in a transport direction of the substrate, and the plurality of third discharge units are configured to The cleaning liquid is discharged from the gap between the adjacent roller portions toward the back surface of the substrate. The substrate processing apparatus according to the ninth or tenth aspect, wherein the third discharge unit is configured to start the discharge of the cleaning liquid after the substrate is transported to the upper side of the third discharge unit. The substrate processing apparatus according to any one of the preceding claims, wherein the third discharge unit includes a shower nozzle for a peripheral portion, and discharges the cleaning liquid toward a vicinity of a peripheral portion of a back surface of the substrate; And the central portion discharges the cleaning liquid toward the central portion side of the back surface of the substrate by a shower nozzle. The discharge amount of the cleaning liquid discharged from the shower nozzle by the peripheral portion is smaller than the discharge amount of the cleaning liquid discharged from the shower nozzle at the center portion. The substrate processing apparatus according to any one of claims 9 to 12, further comprising: a cleaning liquid that is disposed below the third discharge unit and that collects the cleaning liquid that has been dripped from the back surface of the substrate unit. The substrate processing apparatus according to any one of claims 1 to 13, wherein the conveying unit includes a plurality of roller portions, and the first discharging portion is configured to face vertically under the adjacent roller portions. The substrate processing apparatus further includes a chemical solution recovery unit that is disposed to face the first discharge unit that discharges the chemical liquid vertically downward, and collects the chemical liquid discharged from the first discharge unit. The second discharge unit is disposed on the downstream side of the transfer direction of the substrate from the chemical solution recovery unit. The substrate processing apparatus according to any one of claims 1 to 14, wherein the substrate processing apparatus includes a chemical liquid tank that discharges the chemical liquid onto the substrate, a cleaning tank that performs cleaning of the substrate, and a substrate that performs the substrate In the drying drying tank, the first discharge unit and the second discharge unit are disposed in the chemical solution tank.