JP2014069126A - Substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of properly treating a reverse surface of a substrate, while preventing infiltration of a cleaning liquid for the reverse surface to a surface of the substrate, with a simple constitution.SOLUTION: A reverse surface cleaning part 4 comprises: a nozzle body 43 which is arranged in a direction orthogonal to a conveyance direction of a glass substrate 100 and in which a large number of discharge ports 45 for discharging the cleaning liquid are arranged in a row in the direction orthogonal to the conveyance direction of the glass substrate 100; a cleaning liquid supply pipe 44 for supplying the cleaning liquid to the nozzle body 43; a pair of support parts 41 arranged on both sides of the discharge ports 45 at a predetermined interval with respect to the conveyance direction of the glass substrate 100 in an upper part of the nozzle body 43; and a pair of flange parts 42 connected to these support parts 41 respectively and projecting to the upstream side and the downstream side in the conveyance direction of the glass substrate 100 respectively by a conveyance roller 9 from the pair of support parts 41.

Description

  The present invention relates to a glass substrate for FPD (flat panel display) such as LCD (liquid crystal display) and PDP (plasma display), a glass substrate for organic EL, a glass substrate for photomask, a substrate for optical disk, a semiconductor wafer, a solar cell, and The present invention relates to a substrate processing apparatus that processes a substrate such as a film substrate for electronic paper with a processing liquid, and more particularly to a substrate processing apparatus that supplies a different processing liquid to the front and back surfaces of the substrate to process the substrate.

  For example, in the case where an oxide film formed on the surface of the silicon layer is etched before laser annealing is performed on the glass substrate 100 on which the amorphous silicon layer is formed, the surface of the substrate is used as an etching solution. Hydrofluoric acid (hydrofluoric acid / HF) is supplied. On the other hand, pure water as a cleaning liquid is supplied to the back surface of the substrate.

  As described above, when different processing liquids are supplied to the front surface and the back surface of the substrate, when the processing liquid is ejected by the spray nozzle to the back surface of the substrate transported by the transport roller, the processing liquid for the back surface is used. Around the surface of the substrate, the processing of the surface of the substrate becomes non-uniform, and processing defects occur. Further, when processing is performed by forming a paddle of the processing liquid on the surface of the substrate, the processing liquid paddle for the front surface is collapsed by the processing liquid for the back surface, and in this case, a processing failure occurs.

  Further, when the processing liquid is ejected from the spray nozzle, it is necessary to eject the processing liquid from the spray nozzle in advance before supplying the processing liquid to the substrate for the purpose of stabilizing the ejection amount. . In such a case, the processing liquid is ejected from the spray nozzle in the absence of the substrate, and this processing liquid adheres to the ceiling of the chamber and the processing liquid drops on the surface of the substrate being processed. This causes a processing failure.

  In Patent Document 1, a substrate is transported in a substrate processing chamber in a horizontal direction with its main surface horizontal, and a processing liquid discharge port facing downward extends in a direction crossing the substrate transport direction. And a treatment liquid discharge nozzle disposed at a position where the distance between the treatment liquid discharge port and the surface of the substrate is in a liquid-tight state by a liquid film of the treatment liquid discharged from the treatment liquid discharge port. The processing liquid holding surface that holds the processing liquid pool is provided at a position facing the processing liquid discharge port, and the distance between the processing liquid discharge port and the processing liquid holding surface forms a processing liquid pool therebetween. A substrate processing apparatus including a liquid pool holding member disposed at a position where it can be disclosed is disclosed. In the substrate processing apparatus described in Patent Document 1, a back surface cleaning unit that supplies cleaning liquid to the back surface of the substrate is disposed downstream of the processing liquid discharge nozzle and the liquid pool holding member in the substrate transport direction. Yes. The back surface cleaning unit includes a cleaning liquid holding surface that holds a liquid pool of the cleaning liquid on an upper surface thereof, and has a configuration in which the back surface of the substrate is cleaned using the liquid pool of the cleaning liquid.

JP 2011-71385 A

  According to the substrate processing apparatus described in Patent Document 1 described above, the processing liquid for the back surface does not go around to the front surface side and can properly process both surfaces of the substrate, but the processing efficiency of the back surface of the substrate is poor. There is a problem. That is, for example, when the back surface of the substrate is cleaned, the cleaning efficiency is not high. Therefore, in order to obtain a predetermined cleaning effect, it is necessary to install a plurality of back surface cleaning units, and the cost and use of the apparatus are increased. The problem is that the cost of the cleaning liquid increases.

  The present invention has been made to solve the above-mentioned problems, and it is possible to appropriately process the back surface of the substrate while preventing the back surface cleaning liquid from entering the surface of the substrate while having a simple configuration. An object of the present invention is to provide a simple substrate processing apparatus.

  According to the first aspect of the present invention, there is provided a substrate processing chamber, a transport mechanism that transports the substrate in a horizontal direction with the main surface thereof being horizontal, and a substrate transported by the transport mechanism. A surface treatment liquid supply unit configured to supply a first treatment liquid to the front surface to treat the surface of the substrate; and disposed below the substrate transported by the transport mechanism; A backside processing liquid supply unit for processing the backside of the substrate by supplying a different second processing liquid, wherein the backside processing liquid supply unit transports the substrate by the transport mechanism. A nozzle body disposed in a direction intersecting the direction, and having a discharge section for discharging the second processing liquid formed in a direction intersecting the substrate transport direction by the transport mechanism, and attached to an upper portion of the nozzle body. ,Previous A treatment liquid contact portion that causes the second treatment liquid discharged from the discharge portion to come into contact with the back surface of the substrate conveyed by the conveyance mechanism and then flow down. The flow amount of the second processing liquid from the liquid contact part is configured to be larger on the upstream side in the substrate transport direction by the transport mechanism than on the downstream side in the substrate transport direction by the transport mechanism.

  According to a second aspect of the present invention, in the first aspect of the present invention, the distance between the processing liquid contact portion and the back surface of the substrate transported by the transport mechanism is downstream in the substrate transport direction by the transport mechanism. The upstream side of the substrate transport direction by the transport mechanism is larger than the side.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the treatment liquid contact portion is spaced apart from the discharge portion by a predetermined interval with respect to the substrate transport direction by the transport mechanism. A pair of support portions disposed on both sides of the substrate and a pair of flange portions respectively connected to the pair of support portions and projecting from the pair of support portions to the upstream side and the downstream side in the substrate transport direction by the transport mechanism With.

  According to a fourth aspect of the present invention, in the third aspect of the present invention, the pair of support portions constituting the treatment liquid contact portion have the same height, and the pair of flange portions are the pair of support portions. And the pair of flanges are inclined in the downward direction toward the upstream side in the transport direction with respect to the back surface of the substrate transported by the transport mechanism. Inclined.

  The invention according to claim 5 is the invention according to claim 3 or claim 4, wherein the intersection angle between the surface of the pair of flanges and the back surface of the substrate conveyed by the conveyance mechanism is 0.5. Degrees to 2 degrees.

  According to a sixth aspect of the present invention, in the first or second aspect of the present invention, the processing liquid contact portion is spaced apart from the discharge portion by a predetermined interval with respect to the substrate transport direction by the transport mechanism. A pair of bottom surface members disposed on both sides of the substrate and a pair of wall members connected to the pair of bottom surface members and erected from the pair of bottom surface members toward the back surface side of the substrate transported by the transport mechanism With.

  According to a seventh aspect of the present invention, in the sixth aspect of the invention, the pair of wall members constituting the processing liquid contact portion have the same height, and the pair of wall members are the pair of bottom surfaces. The entire back surface treatment liquid supply unit is disposed in a direction orthogonal to the members, and the pair of bottom surface members are inclined downward toward the upstream side in the transport direction with respect to the back surface of the substrate transported by the transport mechanism. Inclined.

  The invention according to claim 8 is the invention according to any one of claims 1 to 7, wherein the first processing liquid is a chemical liquid for chemical processing a substrate, and the second processing liquid is A cleaning liquid for cleaning the substrate.

  According to the first to eighth aspects of the present invention, the second treatment liquid is formed by the action of the treatment liquid contact portion without adversely affecting the surface treatment of the substrate by the first treatment liquid. The back surface of the substrate can be appropriately processed with the second processing liquid. At this time, since the flow amount of the second processing liquid from the processing liquid wetted part is configured to be larger on the upstream side than the downstream side in the substrate transport direction, the processing effect by the processing liquid is enhanced. And the back surface of the substrate can be sufficiently processed.

  According to the second aspect of the present invention, due to the difference in distance between the treatment liquid contact portion and the back surface of the substrate, the flow amount of the second treatment liquid from the treatment liquid contact portion is reduced downstream in the substrate transport direction. It is possible to increase the size on the upstream side in the substrate transport direction from the side.

  According to the third aspect of the present invention, the second treatment liquid discharged from the discharge portion can be brought into contact with the back surface of the substrate and caused to flow down by the action of the pair of flange portions.

  According to the fourth aspect of the present invention, the entire amount of the second processing liquid flowing from the processing liquid wetted part can be reduced by arranging the entire back surface processing liquid supply part having a simple configuration in an inclined manner. It is possible to make the size larger on the upstream side in the transport direction of the substrate than on the downstream side in the transport direction.

  According to the fifth aspect of the present invention, the flow amount of the second processing liquid from the downstream side in the substrate transport direction and the flow amount of the second processing liquid from the upstream side in the substrate transport direction are appropriately set. It becomes possible.

  According to the sixth aspect of the present invention, the second treatment liquid discharged from the discharge portion can be brought into contact with the back surface of the substrate and caused to flow down by the action of the pair of bottom surface members and the pair of wall members. Become.

  According to the seventh aspect of the present invention, the entire amount of the second processing liquid flowing from the processing liquid wetted part can be reduced by arranging the entire back surface processing liquid supply part having a simple configuration in an inclined manner. It is possible to make the size larger on the upstream side in the transport direction of the substrate than on the downstream side in the transport direction.

  According to the eighth aspect of the present invention, it is possible to perform the chemical liquid treatment on the surface of the substrate with the chemical liquid and to perform the cleaning treatment on the back surface of the substrate with the cleaning liquid.

It is a side surface schematic diagram of the substrate processing apparatus concerning this invention. It is a side view which expands and shows the process and washing | cleaning unit. It is a schematic diagram of the back surface washing | cleaning part 4. FIG. It is a side surface schematic diagram which shows the arrangement | positioning relationship between the back surface washing | cleaning part 4 and the glass substrate 100 conveyed by the some conveyance roller 9. FIG. It is explanatory drawing which shows the washing | cleaning processing operation | movement of the back surface of the glass substrate 100 by the back surface washing | cleaning part 4 which concerns on this invention. It is explanatory drawing which shows the washing | cleaning processing operation | movement of the back surface of the glass substrate 100 at the time of arrange | positioning the back surface washing | cleaning part 4 in a horizontal direction. 6 is a table showing a difference between cleaning processing results when a pair of flange portions 42 are arranged so as to be inclined with respect to the back surface of the glass substrate 100 and when they are arranged in parallel with the back surface of the glass substrate 100. It is a schematic diagram of the back surface washing | cleaning part 4 which concerns on 2nd Embodiment. It is a schematic diagram of the back surface washing | cleaning part 4 which concerns on 3rd Embodiment. It is a schematic diagram of the back surface washing | cleaning part 4 which concerns on 4th Embodiment. It is a schematic diagram of the back surface washing | cleaning part 4 which concerns on 5th Embodiment. It is a schematic diagram of the back surface washing | cleaning part 4 which concerns on 6th Embodiment. It is a schematic diagram of the substrate processing apparatus concerning other embodiments. It is a schematic diagram of the substrate processing apparatus concerning other embodiments.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view of a substrate processing apparatus according to the present invention. FIG. 2 is an enlarged side view showing the processing / cleaning unit 1.

  This substrate processing apparatus is for etching an oxide film formed on the surface of a silicon layer before performing laser annealing on the glass substrate 100 on which the amorphous silicon layer is formed. The substrate processing apparatus supports the glass substrate 100 in a state where the main surface thereof is in the horizontal direction in the processing chamber 10, and includes a plurality of transfer rollers 9 that transfer the glass substrate 100 in the horizontal direction, and four pieces of transfer rollers 9. Processing / cleaning units 1a, 1b, 1c, and 1d (when collectively referred to simply as “processing / cleaning unit 1”) are provided.

  Each processing / cleaning unit 1 includes a processing liquid discharge nozzle 2 for supplying a processing liquid to the surface of the glass substrate 100 transported by a plurality of transport rollers 9 and a processing liquid discharging nozzle 2 between the processing liquid discharge nozzles 2. A liquid pool holding member 3 for forming a liquid pool and a back surface cleaning unit 4 which is a characteristic part of the present invention for cleaning the back surface of the glass substrate 100 are provided. With the action of the four processing / cleaning units 1a, 1b, 1c, and 1d, the processing liquid is sequentially supplied to the front surface and the cleaning liquid is supplied to the back surface of the glass substrate 100 transported by the transport roller 9. Are executed.

  From the processing liquid discharge nozzles 2 in the four processing / cleaning units 1a, 1b, 1c, and 1d described above, an etching liquid that is a chemical liquid is supplied as a processing liquid. As such an etchant, for example, hydrofluoric acid (hydrofluoric acid / HF) is used. In order to intentionally form a uniform oxide film on the surface of the glass substrate 100, from the processing liquid discharge nozzle 2 in the processing / cleaning unit 1a, from the processing liquid discharge nozzle 2 in the processing / cleaning unit 1d, or Ozone water may be supplied as the processing liquid from the processing liquid discharge nozzle 2 in the processing / cleaning units 1a and 1d. The processing liquid supplied from the processing liquid discharge nozzle functions as the first processing liquid according to the present invention.

  A cleaning liquid for cleaning the back surface of the glass substrate 100 is supplied from the back surface cleaning unit 4 in the four processing / cleaning units 1a, 1b, 1c, and 1d described above. As such a cleaning liquid, for example, pure water is used. This cleaning liquid functions as the second processing liquid according to the present invention.

  The treatment liquid discharge nozzle 2 has a configuration in which a large number of treatment liquid discharge ports 21 are formed on the lower surface facing the glass substrate 100 conveyed by the conveyance roller 9. These treatment liquid discharge ports 21 are arranged in a direction orthogonal to the transport direction of the glass substrate 100 transported by the transport roller 9. The processing liquid discharge port 21 has a diameter of about 0.5 mm, for example, and is 5 mm in the longitudinal direction of the processing liquid discharge nozzle 2 (a direction orthogonal to the transport direction of the glass substrate 100 transported by the transport roller 9). It is formed with a pitch of about 10 mm. The processing liquid discharge port 21 is provided over the entire width direction of the glass substrate 100 (direction orthogonal to the transport direction of the glass substrate 100 transported by the transport roller 9). As a material of the treatment liquid discharge nozzle 2, it is preferable to employ, for example, a fluororesin material that does not elute metal ions or the like and can ensure the cleanliness of the treatment.

  When processing the glass substrate 100, the processing liquid is discharged from the processing liquid discharge port 21 and supplied to the surface of the glass substrate 100. At this time, the distance between the processing liquid discharge port 21 and the surface of the glass substrate 100 transferred by the transfer roller 9 is in a liquid-tight state due to the liquid film of the processing liquid discharged from the processing liquid discharge port 21 between them. As such, it is set to a small distance.

  The liquid pool holding member 3 is for forming a liquid pool of processing liquid between the processing liquid discharge nozzles 2. The liquid pool holding member 3 includes a processing liquid holding surface 31 that holds a liquid pool of processing liquid at a position facing the processing liquid discharge port 21 of the processing liquid discharge nozzle 2. The treatment liquid holding surface 31 is provided with a recess 32 for holding a treatment liquid pool.

  The recess 32 is used to hold a liquid pool of the processing liquid in the processing liquid holding surface 31 suitably. That is, as the material of the liquid pool holding member 3, it is preferable to adopt a material made of, for example, a fluororesin, which is similar to the processing liquid discharge nozzle 2 and can ensure the cleanliness of the processing. Here, the fluororesin has strong liquid repellency that repels the treatment liquid. For this reason, it becomes easy for the processing liquid to flow down from the processing liquid holding surface 31 in the liquid pool holding member 3. In order to prevent such a flow-down, a recess 32 is formed in the treatment liquid holding surface 31. In addition, when using resin, such as a vinyl chloride, as the material of the liquid pool holding member 3, this recessed part 32 may be abbreviate | omitted.

  The recess 32 has a shape extending in the longitudinal direction of the liquid pool holding member 3 (a direction orthogonal to the transport direction of the glass substrate 100 transported by the transport roller 9). The recess 32 is formed over the entire width direction of the glass substrate 100 (direction perpendicular to the transport direction of the glass substrate 100 transported by the transport roller 9).

  The back surface cleaning section 4 functions as a back surface processing liquid supply section according to the present invention for supplying a cleaning liquid to the back surface of the glass substrate 100 and cleaning the back surface of the glass substrate 100. The configuration of the back surface cleaning unit 4 will be described in detail later.

  When a substrate is processed by this substrate processing apparatus, the processing liquid discharged from the processing liquid discharge nozzle 2 before the tip of the glass substrate 100 transported in the horizontal direction by the plurality of transport rollers 9 reaches the processing / cleaning unit 1. A small amount of processing liquid is discharged from the discharge port 21, and a liquid pool of processing liquid is formed in advance between the processing liquid discharge port 21 in the processing liquid discharge nozzle 2 and the processing liquid holding surface 31 in the liquid pool holding member 3. Keep it. In this state, when the conveyance of the glass substrate 100 is further continued by the conveyance roller 9, the front end of the glass substrate 100 is in the treatment liquid pool formed between the treatment liquid discharge nozzle 2 and the liquid pool holding member 3. enter in. When the tip of the glass substrate 100 reaches the liquid pool of the processing liquid, the processing liquid is discharged from the processing liquid discharge nozzle 2.

  When the glass substrate 100 is further transported in the horizontal direction in this state, a liquid film of the processing liquid is formed between the processing liquid discharge nozzle 2 and the surface of the glass substrate 100, and the processing liquid discharge nozzle 2 and the glass substrate are formed. Between the surface of 100, it becomes a liquid-tight state by the liquid film of a process liquid. Then, the glass substrate 100 is conveyed in the horizontal direction while being liquid-tight between the processing liquid discharge nozzle 2 and the glass substrate 100 by the liquid film of the processing liquid, whereby the processing liquid discharge nozzle 2 and the glass substrate are conveyed. The processing liquid is supplied to the entire surface of the glass substrate 100 while being in a liquid-tight state between the surfaces of the glass substrate 100 and the liquid film of the processing liquid.

  When the front end of the glass substrate 100 enters the processing liquid pool formed between the processing liquid discharge nozzle 2 and the liquid pool holding member 3, the processing liquid reaches the back side of the glass substrate 100. . As will be described later, this processing liquid is cleaned by the cleaning liquid supplied to the back surface of the glass substrate 100 by the back surface cleaning unit 4.

  The glass substrate 100 transported in the horizontal direction by the plurality of transport rollers 9 is supplied with processing liquid on its surface sequentially by repeating the above-described operation in the four processing / cleaning units 1a, 1b, 1c and 1d. The surface is etched, and the back surface is cleaned by supplying a cleaning liquid to the back surface.

  Next, the configuration of the back surface cleaning unit 4 as the back surface processing liquid supply unit of the present invention for supplying the cleaning liquid to the back surface of the glass substrate 100 and cleaning the back surface of the glass substrate 100 will be described. FIG. 3 is a schematic view of the back surface cleaning unit 4. 3A is a cross-sectional view of the back surface cleaning unit 4, and FIG. 3B is a partial plan view. FIG. 4 is a schematic side view showing the positional relationship between the back surface cleaning unit 4 and the glass substrate 100 transported by the plurality of transport rollers 9.

  The back surface cleaning unit 4 is disposed in a direction perpendicular to the conveyance direction of the glass substrate 100 by the conveyance roller 9, and a large number of discharge ports 45 for discharging the cleaning liquid are arranged in a direction orthogonal to the conveyance direction of the glass substrate 100. A nozzle body 43 provided, a cleaning liquid supply pipe 44 for supplying a cleaning liquid to the nozzle body 43, and a predetermined interval with respect to the transport direction of the glass substrate 100 by the transport roller 9 at the upper portion of the nozzle body 43. A pair of support portions 41 disposed on both sides of the discharge port 45, and connected to the support portions 41, respectively, and upstream and downstream in the transport direction of the glass substrate 100 by the transport roller 9 from the pair of support portions 41. A pair of flanges 42 projecting from each other.

  The pair of support portions 41 and the pair of flange portions 42 are attached to the upper portion of the nozzle main body 43 and contact the cleaning liquid discharged from the discharge port 45 on the back surface of the glass substrate 100 conveyed by the conveyance roller 9. It functions as a processing liquid wetted part according to the present invention for allowing it to flow down.

  As illustrated in FIG. 3B, a lid member 51 is disposed on the side of the pair of support portions 41. The back surface cleaning unit 4 is supported by a pair of left and right support members 52.

  The pair of support portions 41 have the same height, and the pair of flange portions 42 are arranged in directions orthogonal to the pair of support portions 41. And as shown in FIG. 4, a pair of collar part 42 is inclined and arrange | positioned toward the upstream of the conveyance direction of the glass substrate 100 with respect to the back surface of the glass substrate 100 conveyed by the conveyance roller 9. As shown in FIG. As described above, the entire back surface cleaning unit 4 is supported by the support member 52 in an inclined state. For this reason, the distance between the pair of flange portions 42 constituting the processing liquid contact portion according to the present invention and the back surface of the glass substrate 100 conveyed by the conveying roller 9 is downstream in the conveying direction of the glass substrate 100 by the conveying roller 9. The upstream side (left side in FIG. 4) of the conveyance direction of the glass substrate 100 by the conveyance roller 9 is larger than the side (right side shown in FIG. 4).

  In this way, the distance between the pair of flanges 42 and the back surface of the glass substrate 100 conveyed by the conveying roller 9 is set so that the distance between the conveying roller 9 and the glass substrate 100 in the conveying direction is lower than the glass substrate 100 conveyed by the conveying roller 9. By setting the upstream side in the transport direction larger, as will be described later, the amount of the cleaning liquid flowing down from the pair of flanges 42 is greater than the transport roller 9 from the downstream side in the transport direction of the glass substrate 100 by the transport roller 9. Is increased on the upstream side in the conveyance direction of the glass substrate 100.

  Next, the cleaning process operation of the back surface of the glass substrate 100 by the back surface cleaning unit 4 configured as described above will be described. FIG. 5 is an explanatory view showing the operation of cleaning the back surface of the glass substrate 100 by the back surface cleaning unit 4 according to the present invention.

  When the back surface of the glass substrate 100 is cleaned, the cleaning liquid is discharged from the discharge port 45 formed in the nozzle body 43 before the glass substrate 100 transported by the transport roller 9 reaches the back surface cleaning unit 4, and a pair of soot A cleaning liquid reservoir 101 is formed on the upper surface of the portion 42. In this case, the discharge of the cleaning liquid from the discharge port 45 may be continued, or the discharge of the cleaning liquid from the discharge port 45 may be stopped when the liquid pool 101 is formed.

  In a state where the glass substrate 100 has reached the back surface cleaning unit 4, the contact of the cleaning liquid discharged from the discharge port 45 with the back surface of the glass substrate 100 transported by the transport roller 9 by the action of the pair of flanges 42. It becomes a state. Then, the cleaning liquid flows down from the pair of collar portions 42. At this time, the cleaning liquid is continuously discharged from the discharge port 45.

  In this state, the pair of flange portions 42 are arranged so as to be inclined downward toward the upstream side in the transport direction of the glass substrate 100 with respect to the back surface of the glass substrate 100 transported by the transport roller 9. As shown in FIG. 5, the distance between the pair of flange portions 42 and the back surface of the glass substrate 100 is upstream of the conveyance direction of the glass substrate 100 by the conveyance roller 9 from the downstream side of the conveyance direction of the glass substrate 100 by the conveyance roller 9. As a result, the flow amount of the cleaning liquid becomes larger on the upstream side in the conveyance direction of the glass substrate 100 by the conveyance roller 9 than on the downstream side in the conveyance direction of the glass substrate 100 by the conveyance roller 9. Therefore, the contaminated cleaning liquid discharged from the discharge port 45 and used for cleaning the back surface of the glass substrate 100 moves from the downstream side to the upstream side in the transport direction on the back surface of the glass substrate 100, and then mainly on the glass substrate 100. It flows down from the upstream collar 42 in the transport direction. Accordingly, the cleaning effect of the cleaning liquid can be enhanced, and the back surface of the glass substrate 100 can be sufficiently cleaned.

  For comparison with FIG. 5, FIG. 6 is an explanatory diagram illustrating the cleaning processing operation of the back surface of the glass substrate 100 when the back surface cleaning unit 4 is arranged in the horizontal direction.

  As shown in this figure, in the case where the pair of flange portions 42 are arranged in parallel with the back surface of the glass substrate 100 conveyed by the conveying roller 9, the cleaning liquid moves in the direction of conveyance of the glass substrate 100 as the glass substrate 100 moves. The amount of the cleaning liquid flowing down from the pair of flanges 42 is larger on the downstream side in the conveyance direction of the glass substrate 100 by the conveyance roller 9 than on the upstream side in the conveyance direction of the glass substrate 100 by the conveyance roller 9. Become. For this reason, the cleaning liquid discharged from the discharge port 45 flows down from the pair of flange portions 42 after moving from the upstream side to the downstream side in the transport direction on the back surface of the glass substrate 100. Therefore, after the cleaning liquid used in the cleaning process comes into contact with the lower surface of the glass substrate 100, the cleaning liquid mainly flows down from the flange 42 on the downstream side in the transport direction of the glass substrate 100, and the back surface of the glass substrate 100 is used for cleaning. It will be contaminated by the washed liquid.

  FIG. 7 shows a case where the pair of flange portions 42 are arranged so as to be inclined downward toward the upstream side in the transport direction of the glass substrate 100 with respect to the rear surface of the glass substrate 100 and parallel to the rear surface of the glass substrate 100. It is a table | surface which shows the difference in the cleaning process result at the time of arrange | positioning.

  7A shows the case where the flow rate of the cleaning liquid from the back surface cleaning unit 4 is 10 liters per minute, and FIG. 7B shows the case where the flow rate of the cleaning liquid from the back surface cleaning unit 4 is 20 liters per minute. Shows the case. Further, in this table, mS / cm (milli Siemens per centimeter) is adopted as a unit of conductivity of the cleaning liquid that adheres to the glass substrate 100 after the cleaning process. As the electrical conductivity is higher, the components of the treatment liquid remain as ions in the cleaning liquid adhering to the glass substrate 100, indicating that the cleaning effect of the glass substrate 100 is lower. Moreover, when this electrical conductivity is low, the cleaning liquid adhering to the glass substrate 100 is close to pure water, which indicates that the cleaning effect of the glass substrate 100 is high.

  As shown in this table, when the distance between the collar part 42 and the back surface of the glass substrate 100 is the same on the upstream side and the downstream side in the transport direction of the glass substrate 100, the collar part 42 and the back surface of the glass substrate 100. There is no significant difference in the cleaning effect even if the distance to the is changed. On the other hand, when the pair of flange portions 42 are disposed so as to be inclined downward toward the upstream side in the transport direction of the glass substrate 100 with respect to the back surface of the glass substrate 100, the cleaning effect is dramatically improved. To do. When the flow rate of the cleaning liquid is 10 liters per minute as shown in FIG. 7A, the cleaning effect is about 2.7 times, and the flow rate of the cleaning liquid is 20 liters per minute as shown in FIG. In this case, the cleaning effect is about 4.4 times.

  In order to increase the distance between the pair of flange portions 42 and the back surface of the glass substrate 100 conveyed by the conveyance roller 9 on the upstream side from the downstream side in the conveyance direction of the glass substrate 100, the pair of flange portions 42 are formed on the glass substrate 100. When inclining downward toward the upstream side in the transport direction of the glass substrate 100 with respect to the back surface, the crossing angle between the surface of the pair of flange portions 42 and the back surface of the glass substrate 100 transported by the transport roller 9 is 0. It is preferable that the angle is 5 degrees to 2 degrees. By arranging the pair of collar portions 42 in this manner, the cleaning effect by the back surface cleaning unit 4 can be enhanced.

  Note that the amount of flow of the cleaning liquid from the pair of flanges 42 is larger on the upstream side in the transport direction of the glass substrate 100 by the transport roller 9 than on the downstream side in the transport direction of the glass substrate 100 by the transport roller 9. 9 is a concept including that the cleaning liquid does not flow down on the downstream side in the transport direction of the glass substrate 100 by 9 and the cleaning liquid flows down only on the upstream side in the transport direction of the glass substrate 100 by the transport roller 9.

  Hereinafter, other embodiments of the back surface cleaning unit 4 will be described. FIG. 8 is a schematic diagram of the back surface cleaning unit 4 according to the second embodiment. In the following description, the same members as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the first embodiment described above, the collar portion 42 is attached in a direction orthogonal to the support portion 41 having the same height, and the pair of collar portions 42 are formed on the glass substrate 100 with respect to the back surface of the glass substrate 100. The entire back surface cleaning unit 4 is inclined so as to be inclined downward toward the upstream side in the transport direction. On the other hand, in the second embodiment, the height of the pair of support portions 41 is set to be low on the upstream side in the conveyance direction of the glass substrate 100 and high on the downstream side, so that the flange portion 42 and the glass substrate are set. The distance from the rear surface of the glass substrate 100 is set to be larger on the upstream side than on the downstream side in the conveyance direction of the glass substrate 100.

  FIG. 9 is a schematic diagram of the back surface cleaning unit 4 according to the third embodiment.

  In the third embodiment, the pair of support portions 41 are provided with a pair of flange portions 42 inclined downward toward the upstream side in the transport direction of the glass substrate 100, so that the flange portions 42 and the glass are disposed. The distance from the back surface of the substrate 100 is set to be larger on the upstream side than on the downstream side in the transport direction of the glass substrate 100.

  FIG. 10 is a schematic diagram of the back surface cleaning unit 4 according to the fourth embodiment.

  In the back surface cleaning unit 4 according to the first to third embodiments described above, each is connected to the pair of support units 41 and these support units 41, and the glass substrate by the transport roller 9 from the pair of support units 41. A pair of flange portions 42 projecting upstream and downstream in the transport direction 100 are provided, and the support portion 41 and the flange portion 42 constitute a processing liquid contact portion according to the present invention. On the other hand, in the back surface cleaning section 4 according to the fourth embodiment, the pair of bottom surface members 46 and the pair of wall members 47 constitute the processing liquid contact section according to the present invention.

  That is, the back surface cleaning unit 4 according to the fourth embodiment is a pair of nozzles disposed on both sides of the discharge port 45 at a predetermined interval with respect to the transport direction of the glass substrate 100 by the transport roller 9 in the upper part of the nozzle body 43. Bottom surface members 46 and a pair of wall members 47 that are respectively connected to these bottom surface members 46 and are erected from the pair of bottom surface members 46 toward the back surface side of the glass substrate 100 conveyed by the conveying roller 9. I have.

  In the back surface cleaning unit 4, the pair of wall members 47 have the same height, the pair of wall members 47 are arranged in a direction orthogonal to the pair of bottom surface members 46, and the pair of bottom surface members 46 are the glass substrates. The support member 52 shown in FIG. 3 (b) in a state where the entire back surface cleaning unit 4 is inclined so as to be inclined downward toward the upstream side in the transport direction of the glass substrate 100 with respect to the back surface of 100. Is supported by For this reason, the distance between the pair of wall members 47 and the back surface of the glass substrate 100 conveyed by the conveying roller 9 is smaller than the conveying roller 9 from the downstream side (right side shown in FIG. 10) in the conveying direction of the glass substrate 100. 9 is larger on the upstream side (left side in FIG. 10) in the conveyance direction of the glass substrate 100.

  Also in the back surface cleaning unit 4 according to the fourth embodiment, the flow amount of the cleaning liquid from the pair of wall members 47 is the direction in which the glass substrate 100 is transported by the transport roller 9 as in the back surface cleaning unit 4 according to the first embodiment. Is larger on the upstream side in the transport direction of the glass substrate 100 by the transport roller 9 than on the downstream side. Therefore, the contaminated cleaning liquid discharged from the discharge port 45 and used for cleaning the back surface of the glass substrate 100 moves from the downstream side to the upstream side in the transport direction on the back surface of the glass substrate 100, and then mainly on the glass substrate 100. It flows down from the wall member 47 on the upstream side in the transport direction. Accordingly, the cleaning effect of the cleaning liquid can be enhanced, and the back surface of the glass substrate 100 can be sufficiently cleaned.

  FIG. 11 is a schematic diagram of the back surface cleaning unit 4 according to the fifth embodiment.

  In the fourth embodiment described above, the height of the pair of wall members 47 is the same, and the pair of bottom surface members 46 are inclined downward toward the upstream side in the transport direction of the glass substrate 100 with respect to the back surface of the glass substrate 100. Thus, the entire back surface cleaning unit 4 is inclined. In contrast, in the fifth embodiment, the height of the pair of wall members 47 is set lower on the upstream side in the conveyance direction of the glass substrate 100 and higher on the downstream side, whereby the wall member 47 and the glass substrate are set. The distance from the rear surface of the glass substrate 100 is set to be larger on the upstream side than on the downstream side in the conveyance direction of the glass substrate 100.

  FIG. 12 is a schematic diagram of the back surface cleaning unit 4 according to the sixth embodiment.

  In the sixth embodiment, the wall member 47 and the glass substrate 100 are provided by attaching the pair of bottom surface members 46 to the nozzle body 43 in a state of being inclined downward toward the upstream side in the conveyance direction of the glass substrate 100. The distance from the back surface of the glass substrate 100 is made larger on the upstream side than on the downstream side in the conveyance direction of the glass substrate 100.

  Next, another embodiment of the substrate processing apparatus will be described. FIG. 13 is a schematic diagram of a substrate processing apparatus according to another embodiment. In the following embodiments, the processing forms for the surface of the glass substrate 100 are different.

  That is, in the embodiment shown in FIGS. 1 and 2, the treatment liquid discharge nozzle 2 for supplying the treatment liquid to the surface of the glass substrate 100 conveyed by the plurality of conveyance rollers 9, and the treatment liquid discharge nozzle 2 In the meantime, the surface of the glass substrate 100 is processed using the liquid pool holding member 3 for forming a liquid pool of the processing liquid. On the other hand, in the embodiment shown in FIG. 13, the processing liquid is supplied to the surface of the glass substrate 100 conveyed by the plurality of conveying rollers 9 by the plurality of spray nozzles 61, thereby It has the structure which processes the surface. The processing liquid supplied from the spray nozzle 61 is removed by an air knife 62 arranged on the upstream side of the back surface cleaning unit 4. Then, the back surface of the glass substrate 100 is cleaned by the back surface cleaning unit 4.

  FIG. 14 is a schematic view of a substrate processing apparatus according to still another embodiment.

  In the embodiment shown in FIG. 14, the processing liquid is supplied from the nozzle 64 to the surface of the glass substrate 100 conveyed by the plurality of conveying rollers 9, and the surface of the glass substrate 100 is rubbed with the brush 63. Thus, the surface of the glass substrate 100 is processed. The processing liquid supplied from the nozzle 64 via the brush 63 is removed by the air knife 62 arranged on the upstream side of the back surface cleaning unit 4. Then, the back surface of the glass substrate 100 is cleaned by the back surface cleaning unit 4.

  In the above-described embodiment, hydrofluoric acid or the like as an etchant is supplied to the surface of the glass substrate 100, but the present invention is not limited to this. For example, the present invention may be applied to a substrate processing apparatus that performs development processing by supplying a developing solution to the glass substrate 100. In the above-described embodiment, pure water as a cleaning liquid is supplied to the back surface of the glass substrate 100, but a cleaning liquid other than pure water may be used. Furthermore, the present invention can be applied to a substrate processing apparatus that supplies other processing liquids to the front surface and the back surface of a substrate other than the glass substrate 100, respectively.

DESCRIPTION OF SYMBOLS 1 Processing and washing | cleaning unit 2 Processing liquid discharge nozzle 3 Liquid pool holding member 4 Back surface washing | cleaning part 9 Conveyance roller 10 Processing chamber 21 Processing liquid discharge port 31 Processing liquid holding surface 32 Recessed part 41 Supporting part 42 ridge part 43 Nozzle body 44 Cleaning liquid supply pipe 45 Discharge port 46 Bottom member 47 Wall member 61 Spray nozzle 62 Air knife 63 Brush 64 Nozzle 100 Glass substrate 101 Liquid reservoir for cleaning liquid

Claims (8)

A substrate processing chamber;
In the substrate processing chamber, a transport mechanism for transporting the substrate in a horizontal direction with its main surface being horizontal,
A surface treatment liquid supply unit for treating the surface of the substrate by supplying a first treatment liquid to the surface of the substrate conveyed by the conveyance mechanism;
A back surface processing liquid supply that is disposed below the substrate transported by the transport mechanism and processes the back surface of the substrate by supplying a second processing liquid different from the first processing liquid to the back surface of the substrate. And
In a substrate processing apparatus comprising:
The back surface treatment liquid supply unit is
A nozzle body disposed in a direction intersecting with the substrate transport direction by the transport mechanism, and a discharge section for discharging the second processing liquid formed in a direction intersecting with the substrate transport direction by the transport mechanism;
A treatment liquid contact part attached to the upper part of the nozzle body and flowing down after the second treatment liquid discharged from the discharge part is brought into contact with the back surface of the substrate transported by the transport mechanism;
With
The processing liquid wetted part is configured to reduce the amount of the second processing liquid flowing from the processing liquid wetted part upstream of the substrate transport direction by the transport mechanism from the downstream side of the substrate transport direction by the transport mechanism. A substrate processing apparatus configured to be large. The substrate processing apparatus according to claim 1,
The distance between the processing liquid contact portion and the back surface of the substrate transported by the transport mechanism is larger on the upstream side in the substrate transport direction by the transport mechanism than on the downstream side in the substrate transport direction by the transport mechanism. Substrate processing equipment. In the substrate processing apparatus of Claim 1 or Claim 2,
The treatment liquid wetted part is
A pair of support portions disposed on both sides of the discharge portion at a predetermined interval with respect to the transport direction of the substrate by the transport mechanism;
A pair of flanges respectively connected to the pair of support portions and projecting from the pair of support portions to the upstream side and the downstream side in the substrate transport direction by the transport mechanism;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 3,
The pair of support parts constituting the treatment liquid contact part have the same height, and the pair of collar parts are arranged in directions orthogonal to the pair of support parts,
Substrate processing apparatus in which the entire back surface processing liquid supply unit is inclined and disposed so that the pair of flanges are inclined downward toward the upstream side in the transport direction with respect to the back surface of the substrate transported by the transport mechanism. . In the substrate processing apparatus of Claim 3 or Claim 4,
The substrate processing apparatus, wherein an intersection angle between the front surface of the pair of flanges and the back surface of the substrate transported by the transport mechanism is 0.5 to 2 degrees. In the substrate processing apparatus of Claim 1 or Claim 2,
The treatment liquid wetted part is
A pair of bottom surface members disposed on both sides of the discharge unit at a predetermined interval with respect to the substrate transport direction by the transport mechanism;
A pair of wall members respectively connected to the pair of bottom surface members and erected from the pair of bottom surface members toward the back surface side of the substrate conveyed by the conveyance mechanism;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 6,
The pair of wall members constituting the treatment liquid contact portion have the same height, and the pair of wall members are arranged in a direction orthogonal to the pair of bottom surface members,
A substrate processing apparatus in which the entire back surface processing liquid supply unit is inclined so that the pair of bottom surface members are inclined downward toward the upstream side in the transport direction with respect to the back surface of the substrate transported by the transport mechanism. . In the substrate processing apparatus in any one of Claims 1-7,
The substrate processing apparatus, wherein the first processing liquid is a chemical liquid for chemical processing a substrate, and the second processing liquid is a cleaning liquid for cleaning the substrate.

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