JP4409901B2 - Residual liquid removal device - Google Patents

Description

  The present invention relates to a residual liquid removing apparatus that removes a processing liquid remaining on the surface of a substrate at an exit portion of a processing zone in which a specific processing liquid is used in a substrate transfer type substrate processing facility called a flat flow type.

  In the manufacture of a liquid crystal panel, an integrated circuit is formed on the substrate surface by repeatedly performing resist coating, development, etching, and resist stripping on the surface of a large-area glass substrate that is a material. One of the typical processing methods is a substrate transfer method called flat flow, in which various treatments are performed on the surface of the substrate while transferring the substrate in the horizontal direction.

  For example, in the flat-flow resist stripping process, the stripping solution is supplied to the surface of the substrate that is transported horizontally in a horizontal posture, and then the surface is cleaned with pure water. As the stripping solution, organic stripping solutions that exhibit strong alkalinity when mixed with water, such as amine-based ones, are frequently used. When the surface of the substrate treated with such a stripping solution is washed directly with water, a strong alkaline solution is generated, which causes a stain or the like on the substrate surface. For this reason, it is a common practice to perform substitution cleaning on the substrate surface with an organic solvent not containing an amine such as dimethyl sulfoxide (DMSO) called a substitution solution between the treatment with the stripping solution and the water washing treatment.

  In order to prevent each processing solution from entering the next zone at each outlet of the peeling zone and the replacement zone, the processing solution remaining on the surface is removed to such an extent that the surface of the substrate is not dried. ing. And as this removal apparatus, the air knife type removal apparatus using the slit nozzle which ejects air in the shape of a curtain is used (refer patent document 1).

JP 2003-92284 A

  However, in the air knife type residual liquid removing apparatus, the air pressure cannot be increased because the surface of the substrate is not dried, and there is a problem that the resist appears in the washing zone and reattaches to the surface of the substrate. This is presumably because the stripping solution used in the stripping zone remains on the substrate and is taken out downstream, and the resist dissolved in the stripping solution appears in the washing zone and reattaches to the surface of the substrate.

  An object of the present invention is to provide a residual liquid removing device that can prevent the outflow of foreign matters downstream due to the treatment liquid remaining on the surface of the substrate to be transported without drying the surface.

In order to achieve the above object, the residual liquid removing apparatus of the present invention is a transport type substrate processing facility for supplying a resist stripping solution, a substitution solution or a developing solution as a processing liquid to the surface of a substrate to be transported and performing each processing. A first liquid draining device for removing the processing liquid remaining on the surface of the substrate, the first liquid draining means for removing the processing liquid remaining on the surface of the substrate with an air knife; A new liquid supply means disposed on the downstream side of the means to supply a new liquid of the processing liquid to the surface of the substrate in a curtain form and placed in a paddle state; and a substrate disposed further downstream of the new liquid supply means. And a second liquid draining means for removing the treatment liquid remaining on the surface of the substrate with an air knife.

  In the residual liquid removing apparatus of the present invention, the processing liquid on the substrate is removed by the first liquid draining means, but the processing liquid cannot be completely eliminated in order to prevent drying of the substrate. Since this treatment liquid is an old liquid after use, it contains a large amount of foreign matter. For this reason, a foreign material is conveyed downstream with the process liquid which remains on a board | substrate. However, the new liquid is supplied to the surface of the substrate by the new liquid supply means on the downstream side, and is replaced with the old liquid. Then, on the further downstream side, the processing liquid on the substrate is removed by the second liquid draining means. This liquid removal cannot be completely performed to prevent drying, and the processing liquid remains on the substrate even after the liquid is removed. However, since the processing liquid is substantially a new liquid, a small amount of processing is performed downstream. Although the outflow of liquid is accompanied, the outflow of foreign substances accompanying the outflow is prevented.

  Therefore, for example, in the resist stripping equipment, by providing the residual liquid removing device of the present invention at the exit of the stripping zone or each of the stripping zone and the replacement zone, drying of the substrate surface is avoided, while in the washing zone. Resist development and re-adhesion are prevented.

  The apparatus for removing residual liquid according to the present invention is based on the fact that the processing liquid remains on the surface of the substrate being transported without drying the surface of the substrate being transported by the two-stage air knife sandwiching the supply of new liquid. Foreign matter outflow to the side can be prevented.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a structural explanatory view of a substrate processing facility showing an embodiment of the present invention, and FIG. 2 is a functional explanatory view of a residual liquid removing apparatus in the same embodiment.

  The residual liquid removing apparatus of this embodiment is provided in a resist stripping facility for manufacturing a liquid crystal panel. This resist stripping equipment is configured such that a glass substrate 40 that is transported horizontally in a horizontal posture passes through the stripping zone 10, the replacement zone 20, and the water washing zone 30 in order. The substrate transport mechanism transports the glass substrate 40 while supporting the glass substrate 40 from below by a large number of transport rollers 50 arranged in the substrate transport direction.

  The stripping zone 10 has a shower unit 11 for spraying the stripping solution in order to supply the stripping solution to the surface of the substrate 10. The replacement zone 20 includes a shower unit 21 for spraying the replacement liquid to supply the replacement liquid to the surface of the substrate 10. The water washing zone 30 includes a shower unit 31 for supplying cleaning water to the surface of the substrate 10, an air knife type double-sided drying device 32, and the like.

  In the present embodiment, the residual liquid removing device is provided at the outlet of the peeling zone 10 and the outlet of the replacement zone 20 in such a resist stripping facility. The residual liquid removing device 12 provided in the peeling zone 10 has a configuration in which a first liquid draining means 12a, a new liquid supplying means 12b, and a second liquid draining means 12c are arranged in order along the substrate transport direction. Yes.

The first liquid draining means 12a includes a pair of upper and lower slit nozzles that sandwich the substrate transport line. Each slit nozzle discharges air toward the front surface (or back surface) in a curtain shape (thin film shape) continuous in the plate width direction in order to remove the peeling liquid remaining on the front surface (or back surface) of the substrate 40. To do. The new liquid supply unit 12b includes a plurality of flat nozzles provided above the substrate transfer line. The plurality of flat nozzles is a mountain-shaped flat nozzle that discharges liquid in a triangular thin film, and is arranged in a direction perpendicular to the substrate transport direction to form a curtain-like liquid film continuous in the plate width direction. ing. Then, the new liquid supply means 12b gently puts the new liquid on the surface of the substrate 40 so as to realize a so-called paddle state in which the peeling liquid, in particular, an unused new liquid is held by the surface tension on the surface of the substrate 40. To discharge. The second liquid draining means 12c is a slit nozzle that is disposed above the substrate transport line and perpendicular to the substrate transport direction, and air is directed toward the surface in order to remove the stripper remaining on the surface of the substrate 40. Is discharged in a curtain shape (thin film shape) continuous in the plate width direction.

The slit nozzles in the first liquid draining means 12a and the second liquid draining means 12c are provided so as to be inclined in a so-called counter direction facing the substrate transport direction in order to increase the liquid removal efficiency. On the other hand, the plurality of crest-shaped flat nozzles in the new liquid supply means 12b on which the liquid is placed discharges the liquid vertically from top to bottom.

  The residual liquid removing device 22 provided in the replacement zone 20 has substantially the same configuration as the residual liquid removing device 12 provided in the peeling zone 10, and includes a first liquid draining means 12a, a new liquid supplying means 12b, and a first liquid removing means 12. Each of the two liquid draining means 12c includes a first liquid draining means 22a, a new liquid supply means 22b, and a second liquid draining means 22c.

  Next, the function of the resist stripping equipment equipped with the residual liquid removing device of this embodiment will be described.

  While the glass substrate 40 passes through the peeling zone 10, a large amount of peeling liquid is supplied to the surface of the substrate 40 from the shower unit 11 or the like. Thereby, the resist adhering to the surface of the substrate 40 is dissolved and removed. When the substrate 40 reaches the outlet of the peeling zone 10, the peeling liquid remaining on the surface of the substrate 10 is removed by the residual liquid removing device 12.

  More specifically, first, the used stripping solution (old solution) remaining on both surfaces of the substrate 10 leaves a slight stripping solution (old solution) on the surface by the air knife by the first liquid draining means 12a. Removed. Next, when the substrate 40 passes through the liquid film formed by the new liquid supply means 12b, a small amount of unused stripping liquid (new liquid) is supplied onto the surface of the substrate 40 so as to be in a paddle state. . Finally, the stripping solution (new solution) placed on the surface of the substrate 40 is removed by the air knife by the second liquid draining means 12c leaving a slight stripping solution (new solution) on the surface.

  If only the residual liquid is removed by the first liquid draining means 12 a, the stripping liquid (old liquid) that remains slightly on the surface of the substrate 40 is sent to the next replacement zone 20. The problem of alkalinization due to the stripping solution being taken downstream is eliminated in the replacement zone 20. However, it is inevitable that the resist contained in the stripping solution enters the substitution zone 20 and eventually enters the washing zone 30 as the stripping solution is taken out.

  However, in this embodiment, after the residual liquid is removed by the first liquid draining means 12a, an unused stripping liquid (new liquid) is supplied to the surface of the substrate 40 by the new liquid supply means 12b. Thereby, the used stripping solution (old solution) remaining on the surface of the substrate 40 is replaced with an unused stripping solution (new solution). Thereafter, the unused liquid remover (new liquid) remaining on the surface of the substrate 40 is removed by the second liquid draining means 12c leaving a slight amount for preventing drying. This residual liquid is taken downstream, but does not substantially contain resist. For this reason, the carry-out of the resist to the downstream side does not substantially occur.

  The substrate 40 that has passed through the peeling zone 10 enters the substitution zone 20, and the peeling liquid remaining on the surface of the substrate 10 is replaced with the substitution liquid, and then enters the water washing zone 30, thereby preventing the problem of strong alkalinization. Is done. Even at the outlet of the replacement zone 20, the residual liquid removal device 22 drains the liquid with a two-stage air knife sandwiching the new liquid supply, so that the old liquid enters the washing zone 30 and the resist enters accordingly. Is more effectively prevented.

  Thus, in this embodiment, entry of the resist into the water washing zone 30 is prevented. For this reason, reattachment of the resist in the water washing zone 30 is prevented. Further, since the stripping solution is not completely removed from the surface of the substrate 40, drying of the surface is prevented. Furthermore, the amount of the chemical solution taken to the downstream side is small, and the amount of new solution used in the new solution supply means 12b and 22b is slightly suppressed.

  The amount of the chemical solution left on the substrate surface after the residual liquid removal by the first liquid draining means 12a, 22a and the second liquid draining means 12c, 22c is 0.05 to 0.2 mm as the liquid film thickness on the substrate. Is preferred. If the amount is too small, the surface of the substrate 40 may be dried. On the other hand, when the amount is too large, the amount of the chemical solution to be taken out and the amount of the chemical solution to be used in the new liquid supply means 12b and 22b increase, resulting in an increase in the chemical cost. The first liquid draining means 12a and 22a and the second liquid draining means 12c and 22c are designed so that these are satisfied.

  Moreover, as a chemical | medical solution supply amount in the new liquid supply means 12b and 22b, 1.5-3 L / min per 100 mm of substrate widths is preferable. If the amount is too small, the replacement effect with the new solution is insufficient. On the other hand, when the amount is too large, the cost of the chemical solution is increased.

  The above embodiment is an example of application to a resist stripping facility, but can be applied to a developing device other than this.

  Moreover, although the residual liquid removal apparatus was provided in each exit part of the peeling zone 10 and the substitution zone 20 in the resist peeling equipment, you may provide only in the exit part of the peeling zone 10. FIG. In short, it is effective to use it at the end of the processing zone where a specific processing liquid is used (where the processing liquid changes), so that the specific processing liquid used on the upstream side Further, it is possible to avoid a situation in which the processing liquid is taken out to a processing zone that uses a different processing liquid on the downstream side, and a foreign matter outflow such as a resist accompanying this. As a configuration of the new liquid supply means, a slit nozzle can be used in addition to a combination of flat nozzles.

It is structure explanatory drawing of the substrate processing equipment which shows one Embodiment of this invention. It is function explanatory drawing of the residual liquid removal apparatus in the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Separation zone 11 Shower unit 12 Residual liquid removal means 12a First liquid draining means 12b New liquid supply means 12c Second liquid draining means 20 Replacement zone 21 Shower unit 22 Residual liquid removal means 22a First liquid draining means 22b New Liquid supply means 22c Second liquid draining means 30 Flushing zone 31 Shower unit 32 Drying device

Claims (2)

It is used in a transport-type substrate processing facility that supplies a resist stripping solution, a replacement solution or a developer as a processing solution to the surface of the substrate to be transported and performs the respective processing, and a residue for removing the processing solution remaining on the surface of the substrate. A liquid removal apparatus, which is disposed on the downstream side of the first liquid draining means for removing a processing liquid remaining on the surface of the substrate with an air knife, and a new liquid of the processing liquid is disposed on the substrate. A new liquid supply means for supplying a curtain on the surface and placing it in a paddle state, and a second liquid cutting means arranged on the further downstream side of the new liquid supply means for removing the processing liquid remaining on the surface of the substrate with an air knife A residual liquid removing apparatus comprising:   The residual liquid removing apparatus according to claim 1, wherein the residual liquid removing apparatus is provided at an outlet of a processing zone in which a specific processing liquid is used.

Images