TW200407201A - Substrate treatment apparatus and substrate washing method - Google Patents

Substrate treatment apparatus and substrate washing method Download PDF

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Publication number
TW200407201A
TW200407201A TW092115235A TW92115235A TW200407201A TW 200407201 A TW200407201 A TW 200407201A TW 092115235 A TW092115235 A TW 092115235A TW 92115235 A TW92115235 A TW 92115235A TW 200407201 A TW200407201 A TW 200407201A
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TW
Taiwan
Prior art keywords
substrate
storage container
opening
opening portion
aforementioned
Prior art date
Application number
TW092115235A
Other languages
Chinese (zh)
Other versions
TWI228058B (en
Inventor
Mitsuaki Yoshitani
Original Assignee
Dainippon Screen Mfg
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Publication date
Priority to JP2002189546A priority Critical patent/JP4091357B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200407201A publication Critical patent/TW200407201A/en
Application granted granted Critical
Publication of TWI228058B publication Critical patent/TWI228058B/en

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Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/02Structures consisting primarily of load-supporting, block-shaped, or slab-shaped elements
    • E04B1/08Structures consisting primarily of load-supporting, block-shaped, or slab-shaped elements the elements consisting of metal
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/18Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons
    • E04B1/24Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons the supporting parts consisting of metal
    • E04B2001/2481Details of wall panels
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/18Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons
    • E04B1/24Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons the supporting parts consisting of metal
    • E04B2001/249Structures with a sloping roof

Abstract

The present invention provides a substrate washing apparatus by high-pressure fluid discharge which prevents the re-adhesion of particles etc. A washing container has a double box structure of a first container 3 for washing by discharging washing fluids 11 and 12 at a high pressure and a second container 4 on the outside of the first container 3. In the opening parts 3a and 3b of the first container 3 hitting the conveyance route of the substrate W, pure water is discharged by a pipe shower 7 toward a gap formed between it and the substrate W to form a water seal 13 in the gap to control the leakage of the washing fluids 11 and 12. Since the atmosphere of the washing fluids 11 and 12, even when leaked from the first container 3, is discharged in the second container 4, particles etc., contained in the atmosphere are prevented from adhering again to the substrate etc.

Description

200407201 玖、發明說明: [發明所屬之技術領域] 本發明係關於一處理裝置,其係為了以濕式處理半導體 晶圓、液晶顯示與電漿顯示等之平面顯示器製造用之玻璃 基板、印刷基板等板狀基板。 [先前技術] 以濕式將半導體晶圓與平面顯示器製造用之玻璃基板、 印刷基板等板狀基板進行洗淨處理之處理裝置,為了提升 基板清潔度’例如:如特開平8-294679號公報所揭示,針對 基板提出由噴嘴排出高壓化流體之技術。 [發明所欲解決之問題] 然而’排出而壓化流體至基板之際,飛散之煙霧擴散至 處理槽全體,會產生再度附著於處理基板、基板受到污染 之問題。 像這樣的^形,於處理槽内基板以窄化出入之開口部之 $子覆蓋該喷嘴與基板之被洗淨部位,一般認為可防止煙 霧飛散至盒子外部’然而此一方法會有如以下之問題。 洗淨、除i 、由於在盒子内部洗淨液容易滯留於基板上 之塵埃容易再度附著於基板。 過度升高壓力則煙霧從開口部漏出。 假設極端窄化其4 ^ ^ 基板開口時,大型基板與薄板基板會因 曲舁輻运中之振動發生接觸。 另外,針搿如上述開 幕狀排出液體之噴嘴, 口部之煙霧漏出,於開口部設置帷 亦即也可視為以液體帷幕可遮蔽開200407201 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a processing device, which is a glass substrate or a printed substrate for manufacturing a flat panel display, such as wet processing of semiconductor wafers, liquid crystal displays, and plasma displays. And other plate-like substrates. [Prior art] A processing device for wet cleaning semiconductor wafers and plate substrates such as glass substrates and printed substrates used for flat panel display manufacturing, in order to improve the cleanliness of the substrates. For example, as disclosed in JP-A-8-294679 It is disclosed that a technique for discharging a high-pressure fluid from a nozzle is proposed for a substrate. [Problems to be Solved by the Invention] However, when the fluid is discharged and pressed to the substrate, the scattered smoke spreads to the entire processing tank, causing problems such as re-adhesion to the processing substrate and contamination of the substrate. In this shape, the substrate and the cleaned part of the nozzle and the substrate are covered with a narrowed opening in the processing tank. It is generally believed that the smoke can be prevented from flying to the outside of the box. However, this method will be as follows problem. Washing and removing i. Since the cleaning liquid inside the box is easy to stay on the substrate, the dust is easily attached to the substrate again. If the pressure is raised too much, smoke will leak from the opening. It is assumed that when the 4 ^ ^ substrate opening is extremely narrowed, large substrates and thin substrates will come into contact due to vibrations during curved transportation. In addition, the needles are like the above-mentioned nozzles that discharge liquid, and the smoke at the mouth leaks out. A curtain is set at the opening, which can also be considered as a liquid curtain that can be used to cover the opening.

85636.DOC 200407201 口邵’此一方法也會有如以下之問題。 盒子内部由於煙霧滯留,容易發生再度附著。 過度升高壓力則煙霧從開口部漏出。 本發明之目的係有鑑於上述問題,提供煙霧與塵埃不再 附著於基板之基板處理裝置。 [發明内容] 為解決上述問題,申請專利範圍第1項之發明之基板處理 裝置之特徵在於包含:第1收容容器部,其係包含於相對向 之側面包含第1開口部與第2開口部之至少一個之第1收容 容器者;第2收容容器,其係收容前述第1收容容器部,於 相對向側面包含第3開口邵與第4開口部者;輸送手段,其 係將基板從前述第3開口部送入前述第2收容容器,於前述 第1收I表益部依次從前述第1收容容器之前述第1開口部 送入前述基板而從前述第2開口部送出,通過前述第1收容 容器邵後從前述第4開口部將前述基板送出至前述第2收容 容咨外者;第1噴出手段,其係配置於前述第1收容容器部 之内部,並可向被輸送之前述基板噴出處理流體者;第1排 氣手段,其係將前述第1收容容器部之内部排氣者;及 第2排氣手段,其係將前述第2收容容器部之内部排氣者。 另外’申請專利範圍第2項之發明係如申請專利範圍第工 項之基板處理裝置,其中利用前述第2排氣手段之排氣速度 較利用前述第1排氣手段之排氣速度為大者。 另外’申請專利範圍第3項之發明係如申請專利範圍第^ 或2項之基板處理裝置’其中利用存在於前述第1收容容器85636.DOC 200407201 This method also has the following problems. Due to the stagnation of smoke inside the box, it is easy to reattach. If the pressure is raised too much, smoke will leak from the opening. An object of the present invention is to provide a substrate processing apparatus in which smoke and dust are no longer attached to a substrate in view of the above problems. [Summary of the Invention] In order to solve the above-mentioned problems, the substrate processing apparatus of the invention claimed in claim 1 includes a first storage container portion including a first opening portion and a second opening portion on opposite sides. At least one of the first storage container; the second storage container, which contains the first storage container portion, and includes a third opening and a fourth opening on opposite sides; and a conveying means, which removes the substrate from the foregoing. The third opening is sent into the second storage container, and the first receiving section is sequentially fed into the substrate from the first opening of the first storage container, and is sent out from the second opening through the first The first storage container sends out the substrate from the fourth opening to the second storage consultant; the first ejection means is disposed inside the first storage container and can be transported to the aforementioned A substrate ejecting a processing fluid; a first exhaust means for exhausting the inside of the first storage container section; and a second exhaust means for exhausting the inside of the second storage container section. In addition, the invention of the second scope of the patent application is a substrate processing device such as the first scope of the patent scope, in which the exhaust speed of the second exhaust means is higher than the exhaust speed of the first exhaust means. . In addition, the invention of the third scope of the patent application is the substrate processing apparatus of the first scope of the patent application, or the second scope of the patent scope, wherein the first storage container is used.

85636.DOC 200407201 部之前述基板之接收端,且作為前述第1開口部之開口部定 義第1最邊端開口部,利用存在於前述第1收容容器部之前 述基板之送出端,且作為前述第2開口部之開口部定義第2 最邊端開口部時,進一步包含:多數之第2噴出手段,其係 在前述第1收容容器部之外部,被配置於各前述第1及前述 第2最邊端開口部之附近,向前述第1最邊端開口部與前述 基板之第1間隙及前述第2最邊端開口部-與前述基板之第2 間隙,喷出第1液體者。 另外5申請專利範圍第4項之發明係如申請專利範圍第3 項之基板處理裝置,其中前述第1及前述第2最邊端開口部 各包含與通過前述第1及前述第2最邊端開口部之前述基板 約略平行而相對向之面者。 另外,申請專利範圍第5項之發明係如申請專利範圍第i 或2項之基板處理裝置’其中進一步包含:第3喷出手段, 其係在別述弟2收各谷益之内部,被配置於前述第$與第4開 口部中至少一個之附近,用於排出第2液體,而以關閉該第 3與第4開口部中至少一個之方式形成液體流者。 另外,申請專利範圍第6項之發明係如申請專利範圍第1 或2項之基板處理裝置,包含上部噴出手段與下部喑出手段 ’以作為前述第!噴出手段;前述上部及下部嘴出手段係二 置於被輸送至前述第1收容容器部之前诚就 1 < W迷基板之各自不同 面側者。 另外,申請專利範圍第7項之發明係如 甲凊專利範圍ί 項之基板處理裝置’其中前述上部及下部嘴出手段之至85636.DOC 200407201, the receiving end of the substrate, and the first opening is defined as the opening of the first opening, and the sending end of the substrate in the first storage container portion is used as the sending end of the substrate. When the opening portion of the second opening portion defines the second outermost opening portion, a plurality of second ejection means are further included outside the first storage container portion, and are disposed in each of the first and second portions. In the vicinity of the most extreme opening, the first liquid is ejected toward the first gap between the first most extreme opening and the substrate, and the second gap between the second most extreme opening and the substrate. In addition, the invention of claim 4 in the scope of patent application is a substrate processing device such as the scope of claim 3 in which the aforementioned first and second outermost openings each include and pass through the aforementioned first and second outermost ends. The aforementioned substrate of the opening portion is approximately parallel and faces the opposite side. In addition, the invention in the scope of patent application No. 5 is a substrate processing device such as the scope of patent application scope Nos. I or 2 which further includes: a third ejection means, which is inside the other two brothers who received each Gu Yi. It is arranged near at least one of the first and fourth openings, for discharging the second liquid, and forming a liquid flow so as to close at least one of the third and fourth openings. In addition, the invention of the sixth scope of the patent application is the substrate processing device of the first or second scope of the patent application, and includes the upper ejection means and the lower ejection means' as the aforementioned! Ejection means; the aforementioned upper and lower mouth ejection means The two are placed on different sides of the substrate 1 before being transported to the aforementioned first storage container section. In addition, the invention claimed in item 7 of the patent scope is the substrate processing device of item A in the scope of the patent, where the above-mentioned upper and lower mouth opening means

85636.DOC 200407201 一個係將氣體與第3液 出者。 體之混合物當作前述處 理流體而噴 另外’申清專利範、 容器,…」 發明其特徵在於包含: 容容器,其係於相姐a、 “穴竹做隹於at ·王收 者·於…丰、;、U <側面包含第1開口部與第2開口部 者’輪送手#又,其得將其4 、, 〜η 將基板μ述第1開口部送人前述主收 谷备态,而由前述第2開口部 配置於前述主收容容哭…者…貧出手段,其係 # 麟 # ^向被輸运之前述基板噴出 一,弟1排氣手段,其係將前述主收容容器之内部 排氣者’·及複數之第2噴出手段,其係配置於前述主收容容 Κ外邵且前述第丨及前述第2開口部之各自附近,可向由 前述第i及前述第2開口部與被輸送之前述基板所形成之間 隙,噴出第1液體者。 另外’中請專利範圍第9項之發明係、如中請專利範圍第δ 項之基板處理裝置,其中前述第β前述第2開口部係分別 包含與通過前述第1及前述第2開口部之前述基板約略平行 之面者。 另外,申請專利範圍第10項之發明係如申請專利範圍第8 或9項之基板處理裝置,其中包含上部噴出手段與下部噴出 手段,以作為前述第1噴出手段;前述上部及下部喷出手段 係配置於被輸送至前述主收容容器之前述基板之各自不、@ 面側者。 另外,申請專利範圍第11項之發明係如申請專利範圍第i 〇 項之基板處理裝置,其中前述上部及下部噴出手段之至少 一個係將氣體與第2液體之混合物當作前述處理流體而喷85636.DOC 200407201 A system that separates gas and third liquid. The mixture of the body is sprayed as the aforementioned processing fluid. In addition, the invention claims a patent, a container, and the like. The invention is characterized in that it includes: a container, which is attached to the sister a, ... ", and U < the side includes the first opening and the second opening, the" wheel delivery hand ", and it has to give 4 ,, ~ η to the substrate, said first opening to the main harvest valley. In the standby state, the second opening is placed in the main containment chamber. Those who ... Leakage means, it is # 林 # ^ Spraying out to the transported substrate, the brother 1 exhaust means, which is the aforementioned The internal exhauster of the main storage container and a plurality of second ejection means are arranged near the main storage container κ and the vicinity of each of the first and second openings, and can be transmitted to the first and second sections. The first liquid is ejected from the gap formed between the second opening and the substrate being conveyed. In addition, the invention of the ninth patent scope of the invention is a substrate processing device such as the sixth scope of the patent scope of the patent, wherein The second and the second openings are respectively included and passed through the first and the second The above-mentioned substrate of the mouth is approximately parallel. In addition, the invention of the tenth aspect of the patent application is a substrate processing device such as the eighth or nineth scope of the patent application, which includes an upper ejection means and a lower ejection means as the aforementioned first 1 Ejection means; the upper and lower ejection means are disposed on the respective sides of the substrate that is transported to the main storage container, @ 面面. In addition, the invention claimed in item 11 of the patent scope is the i-th patent scope. The substrate processing apparatus of item 〇, wherein at least one of the upper and lower spraying means is a method in which a mixture of a gas and a second liquid is sprayed as the processing fluid.

85636.DOC 200407201 出者。 另外,申請專利範圍第12項之發明係如申請專利範圍第8 或9項之基板處理裝置,其特徵在於進—步包含:副收容部 ,其係共有包含前述第1與第2開口部者;第2排氣手段,其 係將前述副收容部之内部進行排氣者;前述第2噴出手段係 配置於前述副收容部内,前述副收容部係在相對之側面包 過之第3開口部及第4開口部,前述輸送 手段係將前述基板由前述副收容部外經前述第3開口部,送 入前述主收容器後,由前述主收容器經前述第4開口部,送 出至前述副收容部外。 另外,申請專利範圍第13項之發明係如申請專利範圍第 1、2、8、9項中任一項之基板處理裝置,其中前述輸送手 段係向傾斜於前述基板之水平方向之方向,輸送前述基板 者。 另外,申請專利範圍第14項之發明之基板洗淨方法,其 特徵在於:收容在相對向之側面包含第丨開口部與第2開口 部之至少一個之第1收容容器之第丨收容容器部,在相對向 之側面包含第3開口部與第4開口部之第2收容容器之内部 洗淨基板者;且將前述基板由前述第3開口部送入前述第2 收容容器,在前述第1收容容器,逐次由前述第1收容容器 之前述第1開口部送入前述基板,由前述第2開口部送出, 通過前述第1收容容器部後,由前述第4開口部將前述基板 送出至前述第2收容容器外;在前述第1收容容器部之内部 ,向被輸送之前述基板噴出處理流體,並一面將前述第丨收 85636.DOC -10- 200407201 容容器部之内部排氣 氣者。 —面將前述第2收容容器部之内部排 、卜申μ專利範圍第i 5項之發明係如申請專利範圍第 基板/先淨方法,其中利用存在於前述第1收容容器部 之前述基板之接收被,π、上 严 且作為則述第1開口部之開口部定義 第1最邊端開口部,牙丨1 六士、人乂 、 利用存在於珂述第1收容容器部之前述 基板之出細;5曰4令Ί -ST ^ Ο 0E1 下為則述罘2開口部之開口部定義第2最 邊端開口部時,進一步白八奋 、,、 、乂包g ·貧出工序,其係向前述第1及 别述弟2最邊端開口却命a、+,使 4 W刖述基板所形成之間隙噴出第1液 者,利用則逑贺出工程,將通過前述第1及前述第2最邊 端開口部之前述基板、與前述第i及前述第2最邊端開口部 之端緣部之間隙施行水封者。 另外申明專利範圍第16項之發明係如申請專利範圍第 14或15項之基板洗淨方法,其中於前述第2收容容器之内部 ’在前述第3與第4開口部中至少一個之附近&quot;賣出第2液體 、形成液流,以前述液流關閉該第3開口部與第4開口部中 至少一個。 另外,申請專利範圍第17項之發明係如申請專利範圍第 14或15項之基板洗淨方法,纟中前述輸送工序係向傾斜於 前述基板之水平方向之方向,輸送前述基板者。 另外’申請專利範圍第丨8項之發明之基板處理裝置,其 特徵在於包含:第丨收容容器,、其係包含可使基板通過之開 口部者;第2收容容器,其係包含可使前述基板通過之開口 部,且收容前述第丨收容容器者;輸送手段,其係經由前述 85636.DOC -11 - 200407201 第2收容容器之前述開口部及前述第1收容容器之之前述開 口部,將前述基板由前述第2收容容器之外過前述第2收容 容器内之前述第1收容容器,再輸送至前述第2收容容器外 者;供給手段,其係於前述第1收容容器内,對前述基板供 給處理流體者;第1排氣手段,其係將前述第1收容容器之 内部排氣者;及第2排氣手段,其係將前述第2收容容器之 内部排氣者。 另外,申請專利範圍第19項之發明其特徵在於包含:收 容容器,其係包含可供基板通過之開口部者;輸送手段, 其係經由前述收容容器之前述開口部,將前述基板由前述 收容容器之外,經過前述收容容器内,再輸送至前述收容 容器外者;第1供給手段,其係於前述收容容器内,對前述 基板供給處理流體者;第2供給手段,其係朝前述第1收容 容器之開口部與前述基板之間隙,供給液體者;及排氣手 段,其係將前述收容容器内排氣者。 另外,申請專利範圍第20項之發明其特徵在於包含··主 收容容器,其係包含可供基板通過之第1開口部及第2開口 部者;副收容容器,其係為了共有包含前述第1開口部及第 2開口部側面之任一而設置,且包含可供前述基板通過之開 口部之至少一個者;輸送手段,其係經由前述副收容容器 之前述開口部及前述主收容容器之前述第1開口部與第2開 口部,輸送前述基板,使其通過前述副收容容器與主收容 容器者;供給手段,其係於前述主收容容器内,對前述基 板供給處理流體者;第1排氣手段,其係將前述主收容容器 85636.DOC -12- 200407201 之内部排氣者;及第2排氣手段,其係將前述副收容容器之 内部排氣者。 [實施方式] 〈第1實施型態〉 〈裝置構成〉 圖1係模式顯示關於本發明之第1實施型態之基板處理裝 置1之構成之一側剖面圖。基板處理裝置1係一基板洗淨裝 置’以圖中未顯示之驅動源所驅動之輸送滾筒2持續輸送例 如:半導體基板與平面顯示器製造用之矩形玻璃基板,或 是印刷配線基板等之基板w,於處理槽丨a實施洗淨處理,洗 淨該基板W。 基板處理裝置1之處理槽i a内,由基板之輸送方向上流側 依序配置包含排出純水之喷嘴5丨與滾筒刷5 2之第w先淨機 構53、與稍後敘述之第2洗淨機構54、以及包含以噴霧狀供 給純水之噴嘴5 5之第三洗淨機構5 6。圖2係顯示第2洗淨機 構54心模式方式側剖面圖,第2洗淨機構54包含一雙重盒構 造,係於其内部進行洗淨處理之第丨收容容器3進一步被收 答至第2收容容器4。作為對各收容容器之基板w之出入口, 在前者相互相對之2側面係第1開口部3a與第2開口部3b,在 後者相互相對之2側面係第3開口部4a與第4開口部4b,各自 位於同樣鬲度並且一直線上。基板w利用輸送滾筒2為依序 通過沒些開口部,依箭頭AR1所示之水平方向被輸送。圖2 中將前頭AR1所示基板w之輸送方向以X軸正方向、水平面 内入X軸方向垂直之方向以y軸方向、與W平面垂直之方向85636.DOC 200407201. In addition, the invention of the 12th patent application scope is the substrate processing apparatus of the 8th or 9th patent scope, which is characterized in that it further includes: a sub-containment unit, which includes the first and second openings The second exhaust means is for exhausting the inside of the sub-receiving section; the second ejecting means is disposed in the sub-receiving section, and the sub-receiving section is the third opening covered on the opposite side. And the fourth opening, the conveying means sends the substrate from the outside of the sub-receiving portion through the third opening to the main receiving container, and then the main receiving container passes through the fourth opening to the sub-container. Outside the containment department. In addition, the invention in the thirteenth patent application scope is the substrate processing apparatus in any one of the first, second, eighth, or ninth patent scope, in which the aforementioned conveying means conveys in a direction inclined to the horizontal direction of the aforementioned substrate. The aforementioned substrate. In addition, the method for cleaning a substrate of the invention claimed in claim 14 is characterized in that: the first storage container portion of the first storage container containing at least one of the first opening portion and the second opening portion on the opposite side is stored; A person who cleans the substrate inside the second storage container including the third opening and the fourth opening on the opposite side; and the substrate is sent from the third opening to the second storage container, and the first The storage container successively feeds the substrate through the first opening of the first storage container, and sends out the substrate through the second opening. After passing through the first storage container section, the substrate is sent out through the fourth opening to the substrate. Outside of the second storage container; inside the first storage container section, the processing fluid is ejected toward the substrate being conveyed, and the inside of the storage container section is exhausted while receiving the first 85636.DOC -10- 200407201. -The invention of the inner row of the aforementioned second storage container section and the item i 5 of the scope of the patent application μ is based on the patent application scope of the substrate / pre-clean method, in which the use of the aforementioned substrate existing in the aforementioned first storage container section is used. The receiving quilt, π, and the upper opening are defined as the opening portion of the first opening portion, and the first opening portion is defined as the first opening portion. The six sects and the person are used in the first substrate of the first storage container portion. The details are as follows: 5 orders and 4 orders -ST ^ Ο 0E1 The following is the opening part of the opening part of the 2nd part. When the second opening part is defined, it is further white ,,,, and g. It is the person who opens a, + at the extreme ends of the aforementioned first and other two brothers, and causes the first liquid to be ejected from the gap formed by the 4 W substrate, and then uses the congratulations project to pass the first and A water seal is applied to a gap between the substrate of the second outermost opening and the edge portion of the i and second outermost openings. In addition, the invention claimed in item 16 of the patent scope is a substrate cleaning method such as the item 14 or 15 in the scope of patent application, in which the inside of the aforementioned second storage container is near at least one of the aforementioned third and fourth openings & quot Sell the second liquid to form a liquid flow, and close at least one of the third opening portion and the fourth opening portion with the liquid flow. In addition, the invention claimed in item 17 of the patent application is a method for cleaning a substrate as described in item 14 or 15 of the patent application, and the aforementioned conveying process in the above is a method of conveying the substrate in a direction inclined to the horizontal direction of the substrate. In addition, the substrate processing device of the invention of claim No. 8 in the scope of the patent application includes: the first storage container, which includes an opening through which the substrate can pass; the second storage container, which includes the aforementioned The opening through which the substrate passes and accommodates the aforementioned first container; the conveying means passes through the aforementioned opening of the aforementioned 85236.DOC -11-200407201 second receiving container and the aforementioned opening of the first receiving container. The substrate is transported outside the second storage container through the first storage container in the second storage container, and then to the outside of the second storage container; the supply means is in the first storage container, and the The substrate is supplied with a processing fluid; the first exhaust means is to exhaust the inside of the first storage container; and the second exhaust means is to exhaust the inside of the second storage container. In addition, the invention of claim 19 is characterized in that it includes: a storage container including an opening through which the substrate can pass; and a conveying means that passes the substrate through the opening in the storage container to store the substrate from the storage. The first supply means is a person who supplies processing fluid to the substrate in the storage container, and passes the inside of the storage container to the outside of the storage container; the second supply means is toward the first 1 A person who supplies liquid between a gap between an opening of the storage container and the substrate; and an exhaust means for evacuating the inside of the storage container. In addition, the invention of claim 20 is characterized by including a main storage container including a first opening and a second opening through which a substrate can pass, and a sub-container including the aforementioned first section for sharing. One of the 1 opening portion and the 2nd opening portion side surface is provided, and includes at least one of the opening portions through which the substrate can pass; the conveying means passes through the opening portion of the auxiliary storage container and the main storage container. The first opening portion and the second opening portion convey the substrate to pass through the sub storage container and the main storage container; a supply means which is in the main storage container and supplies a processing fluid to the substrate; The exhaust means is to exhaust the inside of the main storage container 85636.DOC -12-200407201; and the second exhaust means is to exhaust the inside of the auxiliary storage container. [Embodiment] <First Embodiment Mode> <Apparatus Configuration> FIG. 1 is a side sectional view schematically showing a configuration of a substrate processing apparatus 1 according to a first embodiment mode of the present invention. The substrate processing device 1 is a substrate cleaning device 'continuously conveyed by a conveying roller 2 driven by a driving source not shown in the figure, for example, a rectangular glass substrate for manufacturing semiconductor substrates and flat panel displays, or a substrate such as a printed wiring substrate. A cleaning process is performed in the processing tank 丨 a to clean the substrate W. In the processing tank ia of the substrate processing apparatus 1, the w-th cleaning mechanism 53 including the nozzle 5 for discharging pure water and the roller brush 5 2 are arranged in order from the upstream side of the substrate in the conveying direction, and the second cleaning is described later. A mechanism 54 and a third cleaning mechanism 56 including a nozzle 55 for supplying pure water in a spray form. FIG. 2 is a side cross-sectional view showing the heart mode of the second cleaning mechanism 54. The second cleaning mechanism 54 includes a double box structure, and the first storage container 3 which is subjected to cleaning treatment inside the second cleaning mechanism 54 is further replied to the second Containment container 4. As the entrance and exit to the substrate w of each storage container, the first opening portion 3a and the second opening portion 3b are located on the two sides facing each other, and the third opening portion 4a and the fourth opening portion 4b are located on the two sides facing each other. , Each at the same degree and on a straight line. The substrate w is sequentially conveyed through the openings by the conveyance roller 2 in the horizontal direction shown by the arrow AR1. In FIG. 2, the transport direction of the substrate w shown in the front AR1 is the positive direction of the X-axis, the horizontal direction is perpendicular to the X-axis direction, the y-axis direction, and the direction perpendicular to the W-plane.

85636.DOC -13- 200407201 以z軸方向標示三度空間座標。另外,第1開口部3a、第2開 口邵3b、第3開口部4a以及第4開口部4b之末端3ae、3be、4ae 以及4be各自朝第1、第2收容容器3、4之内側成突出之烏嘴 形狀’其基板通過側之面形成與被輸送過來之基板W略平行 之平面。 基板W隔著通過區域與輸送滾筒2相對之位置配置壓住滾 筒9 ’其係以圖中未顯示之驅動源來驅動,壓住滾筒9係由 上側壓住隨輸送與洗淨而振動之基板W,扮演協助基板w輸 送之角色。另外,第1收容容器3内雖無驅動源,但具備作 為使基板W之輸送更安定化之引導功能之支援滾筒1 〇,透過 這些裝備,可持續抑制基板w因稍後敘述之高壓煙霧狀流體 碰撞所產生之振動而引起之位置偏移並輸送。 另外’第1收么客备3於基板w之通過位置上方配置了上部 賣出手段5,基板w之通過位置下方配置了下部噴出手段6 ’雨者係主要為洗淨基板w之表面;後者係主要為洗淨背面。 上邵噴出手段5以例如1〇〇 :丨程度之體積比混合空氣與純 水,如箭頭AR2對基板w之表面排出霧狀之混合流體也就是 所州一泥體噴嘴。在此,空氣由來自空氣供給源as、以空 氣閥AV持續調整、經過空氣供給路徑AL所供給。以泵?1向 純水供給源WS取水,利用閥v丨持續調整流量,經純水供給 路徑WL1供給純水。 下邵噴出手段6係為了將同樣由來自純水供給源ws,經純 水供給路徑WL4所供給之純水化為噴霧狀,如箭頭AR3排出 至基板W的背面。85636.DOC -13- 200407201 Three-dimensional space coordinates are indicated in the z-axis direction. In addition, the ends 3ae, 3be, 4ae, and 4be of the first opening portion 3a, the second opening portion 3b, the third opening portion 4a, and the fourth opening portion 4b protrude toward the inside of the first and second storage containers 3 and 4, respectively. The shape of the black mouth is such that the surface of the substrate passing side forms a plane slightly parallel to the substrate W being conveyed. The substrate W is arranged to hold the roller 9 ′ opposite to the conveying roller 2 through the passing area. It is driven by a driving source not shown in the figure, and the pressing roller 9 presses the substrate vibrating with transportation and cleaning from the upper side. W plays a role in assisting the transportation of the substrate w. In addition, although there is no driving source in the first storage container 3, the supporting roller 10 is provided as a guide function for stabilizing the conveyance of the substrate W. Through these devices, the substrate w can be continuously suppressed from the high-pressure smoke state described later. The position caused by the vibration caused by the fluid collision is shifted and conveyed. In addition, the first receiving device 3 is provided with an upper selling means 5 above the passing position of the substrate w, and a lower ejecting means 6 is disposed below the passing position of the substrate w. The rainer mainly cleans the surface of the substrate w; Department is mainly for washing the back. The upper spraying means 5 mixes air and pure water at a volume ratio of, for example, 100: 丨, and discharges a mist-like mixed fluid on the surface of the substrate w, such as arrow AR2, which is a mud nozzle in Suozhou. Here, air is supplied from the air supply source as, is continuously adjusted by the air valve AV, and is supplied through the air supply path AL. Taking a pump? 1 Take water from the pure water supply source WS, continuously adjust the flow rate with the valve v 丨, and supply pure water through the pure water supply path WL1. In order to convert the pure water supplied from the pure water supply source ws4 through the pure water supply path WL4 into a spray form, the lower spraying means 6 is discharged to the back surface of the substrate W as indicated by arrow AR3.

85636.DOC -14- 200407201 上邵噴出手段5與下部噴出手段6可利用眾所周知之噴霧 技術,而且在下部噴出手段6,排出空氣與混合流體之狀態 也無妨。另外,與上述相反,下部嘴出手段6排出混合流體 、上邵噴出手段5排出純水之狀態也可被接受。 另外,圖2中雖因故未圖示,但在關於本實施形態之基板 處理裝置1,僅以y軸方向所定之角度0將基板w傾斜,針對 基板W之輸送方向基板…以傾斜於左側之狀態輸送,圖3係 用於說明關於基板W之傾斜輸送之圖。如圖3所示,第丨開口 部3a開始之開口部也係配合基板之傾斜而形成。另外,於輸 送滾筒2設置與基板直接接觸之2個滾筒2&amp;與2b,於設置於傾 斜下方之滾筒2b裝有為防止基板滑落之突緣部。關於壓住 /袞同9與支援滾甸1 〇也同樣地設置與基板直接接觸之2個滾 筒9a與9b,以及l〇a與l〇b。 進一步’於第1收容容器3之外部、第1開口部3a與第2開口 部3b之附近,管式淋灑器7於各處隔著基板設置於上下。另 外,於第2收容容器4之内部、第3開口部4a與第4開口部4b 之附近’液刀8於各處隔著基板設置於上下。圖4係為說明 管式淋灑器7與液刀8之斜視圖,以模式方式顯示兩者之一 部份。 管式淋麗器7如圖4所示,沿yz平面内且基板W之傾斜之方 向配置。於管式淋灑器7,由來自純水供給源WS、經純水供 給路徑WL2所供給(供給路徑WL2於圖2僅圖示一部份)之純 水,以所定之間隔設置之複數排出口 7a,如圖2箭頭AR4所 示’朝第1開口邵3a與通過該開口邵中基板之間隙以及第2 85636.DOC -15- 200407201 開口部3b與通過該開口部中基板w之間隙排出。 另方面,液刀8如圖4所示,沿yz平面内且基板w之傾斜 之方向配置。方令液刀8,&amp; $自純水供給源、經純水供給 路徑WL3所供給(供給路徑WL3於圖2僅圖示一部份)之純水 以所定之間隔設置之複數排出口 8a,如圖2箭頭ar5所示 朝Μ基板W垂直父叉方向亦即如同形成液體帷幕般排出。 另外,液刀8因如同從上下隔著基板冒排出純水,也發揮了 抑制基板W的端部通過之際之基板w振動,順暢地輸送之引 導角色。而且液刀8备至少設置於第4開口部4b之附近,則 未必要設置於第3開口部4a之附近。例如:輸送路徑中不容 許洗淨流體外漏至下流側之第4開口部3 b側,若容許洗淨流 組外漏至上氣側之第3開口邵4a側時,第3開口部4a之附近並 不一定要設置液刀8。 另外,第1收容容器3内之空氣利用第1排氣手段v 1、經由 排氣路徑VL1排氣;第2收容容器4内之空氣利用第2排氣手 段V2、經由排氣路徑VL2排氣。這些排氣建議與來自上部喷 出手段5與下部噴出手段6之洗淨流體噴出連動、進行。只 有在洗淨流體被排出時,能夠藉由取得排氣被執行之狀態 ,防止外部之空氣流入未執行洗淨時之第丨收容容器3。另 外,也有助於減低公用設備之負荷。 由管式淋灑器7與液刀8供給至第1收容容器3與第2收容 容器4中之純水,以及成霧狀後再度液化之純水排出至排水 管DR 〇 另外,在第1收容容器3與第2收容容器4,排出為洗淨其85636.DOC -14- 200407201 The upper and lower spraying means 5 and the lower spraying means 6 can use well-known spraying techniques, and in the lower spraying means 6, the state of exhausting the air and the mixed fluid is not a problem. In addition, contrary to the above, the state where the lower nozzle discharge means 6 discharges the mixed fluid and the upper Shao discharge means 5 discharges pure water is acceptable. In addition, although not shown in FIG. 2, in the substrate processing apparatus 1 of the present embodiment, the substrate w is inclined only at an angle 0 set in the y-axis direction, and the substrate is conveyed in the conveyance direction of the substrate W.... FIG. 3 is a diagram for explaining the inclined conveyance of the substrate W. FIG. As shown in FIG. 3, the openings starting from the first opening 3a are also formed in accordance with the inclination of the substrate. In addition, two rollers 2 &amp; 2b which are in direct contact with the substrate are provided on the transmission roller 2, and a flange portion is provided on the roller 2b provided below the obliquely to prevent the substrate from slipping. Regarding the pressing / same as 9 and the supporting roller 1, the two rollers 9a and 9b, and 10a and 10b, which are in direct contact with the substrate, are also provided. Further, 'the pipe shower 7 is provided above and below the substrate across the substrate outside the first storage container 3 and near the first opening 3a and the second opening 3b. In addition, the liquid knife 8 is provided inside the second storage container 4 and near the third opening 4a and the fourth opening 4b. Fig. 4 is a perspective view illustrating the pipe sprinkler 7 and the liquid knife 8, and a part of the two is shown in a mode. As shown in Fig. 4, the tube shower apparatus 7 is arranged in the yz plane and the direction in which the substrate W is inclined. In the pipe-type shower 7, pure water supplied from the pure water supply source WS and supplied through the pure water supply path WL2 (the supply path WL2 is only partially shown in FIG. 2) is arranged in plural rows at predetermined intervals. At the exit 7a, as shown by arrow AR4 in FIG. 2, 'toward the gap between the first opening Shao 3a and the substrate passing through the opening and the second gap 85636.DOC -15- 200407201 is discharged through the gap between the opening 3b and the board w passing through the opening . On the other hand, as shown in FIG. 4, the liquid knife 8 is arranged along the yz plane and the direction in which the substrate w is inclined. Square order liquid knife 8, &amp; $ From the pure water supply source, the pure water supplied through the pure water supply path WL3 (the supply path WL3 is only a part shown in FIG. 2) is provided with a plurality of discharge outlets 8a at predetermined intervals. As shown by arrow ar5 in FIG. 2, it is discharged toward the vertical direction of the parent substrate W, that is, as if a liquid curtain is formed. In addition, since the liquid knife 8 discharges pure water through the substrate from above and below, it also plays a guiding role in suppressing the vibration of the substrate w when the end portion of the substrate W passes, and smoothly conveying it. Further, the liquid knife 8 is provided at least near the fourth opening 4b, but it is not necessary to be provided near the third opening 4a. For example, if the cleaning fluid is not allowed to leak to the fourth opening 3 b on the downstream side in the conveying path, if the cleaning fluid group is allowed to leak to the third opening 4 a on the upper air side, the third opening 4 a It is not necessary to set the liquid knife 8 nearby. In addition, the air in the first storage container 3 is exhausted by the first exhaust means v 1 through the exhaust path VL1; the air in the second storage container 4 is exhausted by the second exhaust means V2 through the exhaust path VL2. . These exhausts are recommended to be performed in conjunction with the discharge of the cleaning fluid from the upper discharge means 5 and the lower discharge means 6. Only when the cleaning fluid is discharged, it is possible to prevent the external air from flowing into the first storage container 3 when the cleaning is not performed by obtaining the state where the exhaust is performed. It also helps to reduce the load on utility equipment. The pure water supplied to the first storage container 3 and the second storage container 4 from the tube shower 7 and the liquid knife 8 and the pure water liquefied after being atomized are discharged to the drain pipe DR. In addition, in the first The storage container 3 and the second storage container 4 are discharged to wash them.

85636.DOC -16« 200407201 内部之洗淨液之洗淨用喷嘴1 5,舉例可適當地設置於容器 内部之四周等處。 〈基板洗淨處理〉 其次’針對於基板處理裝置1形成之基板洗淨處理進行說 明。由前工序運送過來之基板W—進入處理槽la後,首先被 第1洗淨機構53洗淨,接著基板w進入第2洗淨機構54之第2 收容容器4。關於此第2洗淨機構54,根據圖5進行說明,圖 5係以模式方式表示基板洗淨處理中之第1收容容器3與第2 收容容器4之内部的情形。 第1收容容器3中,針對各自由上部喷出手段5與下部喷出 手段6通過之基板W排出霧狀之高壓洗淨流體丨丨與純水之噴 務為12。利用使構成洗淨流體丨丨與純水之喷霧器丨2之微粒子 在基板W之表面或背面以高速產生碰撞,可除去附著於基板 W(塵埃等物。利用此碰撞所除去之塵埃與純水之霧狀物等 物會飛散至第1收容容器3内之空氣中,為了防止再度附著 於基板W,第1收容容器3内之空氣利用第丨排氣手段乂丨、透 過排氣路徑VL1排氣。 然而,洗淨流體11與純水之噴霧器12因高壓、高速且朝基 板W噴射之故,即使執行排氣手段v丨之排氣,那些物質與 基板W接觸後,沿基板w面水平方向前進,其多數非從排氣 路徑VL1、而是從第}開口部3a與第2開口部扑之基板w與開 口部之間隙排出至P收容容器3外。被除去之塵埃與霧狀 物等隨此流出後,還是會發生再度附著於基板w或附著在處 理槽la内面等基板處理裝置1内等問題。85636.DOC -16 «200407201 Cleaning nozzle 15 for cleaning liquid inside, for example, it can be appropriately set around the inside of the container. <Substrate cleaning process> Next, the substrate cleaning process formed in the substrate processing apparatus 1 will be described. After the substrate W transported from the previous step enters the processing tank la, it is first cleaned by the first cleaning mechanism 53, and then the substrate w enters the second storage container 4 of the second cleaning mechanism 54. This second cleaning mechanism 54 will be described with reference to Fig. 5, which schematically shows the inside of the first storage container 3 and the second storage container 4 in the substrate cleaning process. In the first storage container 3, the spraying of the high-pressure cleaning fluid 丨 and the pure water for the substrate W passing through the upper spraying means 5 and the lower spraying means 6 is 12 respectively. By making the particles constituting the cleaning fluid and the pure water sprayer 2 collide on the surface or the back surface of the substrate W at a high speed, it is possible to remove the dust attached to the substrate W (dust, etc.). The mist or the like of pure water will be scattered into the air in the first storage container 3. In order to prevent re-attachment to the substrate W, the air in the first storage container 3 uses the 丨 exhaust means 第 and passes through the exhaust path. VL1 is exhausted. However, the cleaning fluid 11 and the pure water sprayer 12 are sprayed toward the substrate W because of high pressure, high speed, and even if the exhaust means v 丨 is performed, those substances come into contact with the substrate W and then run along the substrate w Moving forward in the horizontal direction, most of them are discharged to the outside of the P storage container 3 from the clearance between the substrate w and the openings of the second opening 3a and the second opening 3a instead of the exhaust path VL1. The removed dust and mist After the objects and the like flow out, problems such as re-adhesion to the substrate w or to the substrate processing apparatus 1 such as the inner surface of the processing tank 1a may occur.

85636.DOC -17- 200407201 因此,關於本實施形態之基板處理裝置1對此間隙由管式 淋厲器7排出純水,以純水填滿此間隙亦即實現封住間隙狀 態’以下將產生此狀態之純水稱為水封13。第1開口部“與 第2開口部3b皆因其端部3“與3以之形狀與基板…形成約略 平行之平面且平坦之故,水封丨3容易被實現。水封丨3並無 法元全密封間隙,對洗淨流體丨丨與丨2而言,因減低其流速會 形成相當之阻力,可顯著抑制流出第1收容容器3之洗淨流 體11與噴霧器12之量與速度。而且,即使基板不存在之狀態 ,透過由管式淋灑器7排出純水可某種程度抑制洗淨流體i i 與噴霧器1 2流出至第1收容容器3之外部。 另外,第2收容容器4之内部也依舊會利用第2排氣手段V2 經排氣路徑VL2排氣。因水封13洗淨流體丨丨與^之流速顯著 地交弱,由第1收容容器3流出之空氣14可透過第2排氣手段 V2充分排氣。因利用第2排氣手段之排氣速度V2較第丨排氣 手段V1為大,其效果非常足夠,藉此可防止塵埃與霧狀物 再度附著於基板W。再者,於第2收容容器4設置了液刀8, 這是利用排出純水於基板W通過時,將此基板w與第3開口 部4a與第4開口部4b之間隙進行水封, ,另外,無基板W通過85636.DOC -17- 200407201 Therefore, regarding the substrate processing apparatus 1 of this embodiment, pure water is discharged from the tube shower device 7 for the gap, and filling the gap with pure water means that the gap is sealed. The pure water in this state is called water seal 13. The first opening portion "2" and the second opening portion 3b both have end portions "3" and "3" which are approximately parallel to the substrate and flat and flat, so that the water seal 3 is easily realized. Water seal 3 does not completely seal the gap. For cleaning fluids 丨 丨 and 丨 2, reducing the flow velocity will form a considerable resistance, which can significantly inhibit the cleaning fluid 11 and sprayer 12 flowing out of the first storage container 3 Amount and speed. Furthermore, even if the substrate is not present, the pure water discharged from the tube shower 7 can prevent the washing fluid i i and the sprayer 12 from flowing to the outside of the first storage container 3 to some extent. In addition, the inside of the second storage container 4 is still exhausted through the exhaust path VL2 by the second exhaust means V2. Since the flow velocity of the cleaning fluid 丨 丨 and ^ of the water seal 13 is significantly weak, the air 14 flowing out of the first storage container 3 can be fully exhausted through the second exhaust means V2. Since the exhaust speed V2 using the second exhaust means is larger than the exhaust means V1, the effect is sufficiently sufficient to prevent dust and mist from adhering to the substrate W again. In addition, the second storage container 4 is provided with a liquid knife 8. This is to seal the gap between the substrate w and the third opening 4a and the fourth opening 4b when the pure water is passed through the substrate W, In addition, no substrate W passes

85636.DOC -18- 200407201 沈疋說基板W〈表面以比較短之時間、新供給之純水來取代。 如以上況月,關於本實施形態之基板處理裝置1,在第2 洗淨機構54中收容容器具有雙重盒構造…&quot;&quot;3封住内 側之第1收容容哭3夕戸q ^如 , 、 备31開口邵、抑制高壓排出之洗淨流體1 1 /、1 2 W出之同時,外側之第2收容容器4也進行排氣,可以 洗淨抑制被除去之塵埃等之再附著。 如此第2洗净'機構54之洗淨完成後,其次基板界以第3 洗淨機構%進行噴霧洗淨,最後由處理槽“送出,輸送至進 行下一乾燥工程之乾燥裝置。 再者在本K施形態,利用從第1收容容器3之外側朝開 口部3a、3b排出液體’可堵住沿基板w、往外側之洗淨流體 11,藉此即使開口部3a、3b於較廣之狀態,可水封其開口部 ’對液霧狀物等之遮蔽也有效。 〈第2實施狀態〉 圖6係以模式方式表示關於本發明之第2實施形態之洗淨 機構101之構成。洗淨機構1〇1與關於第丨實施形態之第2洗 淨機構54相同,係基板洗淨裝置之一部份,其係用於洗淨 例如半導體基板與平面顯示器製造用玻璃基板,或是印刷 配線基板等之基板W,因為被同樣使用,對同樣之構成要素 與第2洗淨機構54之情形註記同樣之符號,以下省略其說明 。再者,圖6為簡略圖示,關於空氣與純水之供給路徑僅顯 示一部分。 基板處理裝置101於第2收容容器4之内部,包含由複數之 第ί收容容器所組成之第1收容容器部3〇,這一點與關於第^ 85636.DOC -19- 200407201 貫施形態之基板處理裝置1不同。在圖6舉例說明了第1收容 容器部30由2個第1收容容器31與32所構成之情形。 2個第1收收容容器3 1與3 2相互接近、連鎖性地串聯配置 以使基板W以此順序通過,於各自互相相對之2側面所形成 之開口邵3 1 a、3 1 b、32a、32b成直線排列,然後各配置有上 部喷出手段5(51、52)、下部噴出手段6(61、62)。另外,第2 排氣手段V 2同時負責2個第1收收容容器3 1與3 2之雙方的排 氣’接者相當於弟1收谷谷态部30兩端開口部之第1收容容 器31之第1開口部31a與第1收容容器32之第2開口部32b各自 包含與輸送過來之基板W約略平行之面、成鳥嘴狀之端部 3 1 ae 以及 3 2be。 接奢以位於第1收谷容器部3 0之基板w接收端之第1開口 部3 la定義「第1最邊端開口部」,以位於第1收容容器部3〇 之基板W送出端之第2開口部32b定義「第2最邊端開口部」 時’在第1收容容器部30之外部且第i與第2最邊端開口部 之3 la、32b之附近配置了複數之管式淋灑器7,其係用於朝 第1與第2最邊端開口部31a、3 2b與被輸送之基板w所形成之 間隙排出液體。再者’即使於弟1貫施形態(圖2)也可定義r 第1最邊端開口部」與「第2最邊端開口部」,此時因為第1 開口部3a只有一個’此第1開口部3a作為第1最邊端開口部發 揮其功能,同樣地因第2開口部3b只有一個,第2開口部% 作為第2最邊端開口部發揮其功能。 關於本實施形態之基板處理裝置101的情形,由管式淋灑 器7排出之純水於第1收容容器31之第!開口部31a與第i收容 85636.DOC -20- 200407201 容器32之第2開〇如。,, 4 32b形成水封13。此時,2個第1收容容 器間之開口邵未形士, y成水封,因藉由將兩者接近配置,抑制 空氣流出至外却 ^ ΛΙ , 可’其結果與第1實施形態相同,第1收容容 器邵3 0全體之命备、云 二乳^出被抑制在第2收容容器4可排氣之程 度内。 於是,如本會祐夕犯〜 ^ ^ ^ _ /、她义形怨,即使包含複數之洗淨處理之收 藉由於兩端之收容容器之開口部形成水封,可進 行塵埃等不再附著之洗淨處理。 〈變形例〉 云上1^說月’本發明藉形成水封以抑制高壓排出之洗淨 、广、&amp;為形成水封之開口部端部之形狀不限定於上 述之狀悲。圖7得矣+哲1 w 、 糸表不弟1收容容器3之端部3e之形狀之代表 變形例,也就是命,娃a 疋冗崎邵“可以如圖7(a)平坦部分突出於 ^收容容器3外側之構造,也可如圖7⑻冑出於兩側之構 圖7(c)甚&amp;為包含賴斜之才冓造亦可。或是如圖7⑷利 用構成收容容器3之容器之構件之厚度。 另外’在上述之實施形態’因供給高壓之洗淨流體U於3 板W之上面’建議儘可能將支撐基板之下面側之輸送滾旧 支撐浪筒設置於接近其供給部位之位置。在上述實施开” ,為了也對基板之下面側進行洗淨處理,於下面側供給^ 霧器12’於洗淨流體u與噴霧器12之供給中⑽置之前後+ 置支㈣筒U)’例如不須要對下面側進行洗淨處理時省巧 對下面之液體供給’於對應洗淨流體U供給中心之位置幻 支撐滾筒或輸送滾筒便可。再者,對基板之下面以高壓85636.DOC -18- 200407201 Shen Yan said that the surface of the substrate W <is replaced with pure water for a relatively short period of time. As described above, regarding the substrate processing apparatus 1 of this embodiment, the storage container in the second cleaning mechanism 54 has a double box structure ... &quot; &quot; 3 The first storage container that seals the inside 3 3q ^ 如At the same time, the cleaning fluid 1 1/1 and 1 2 W, which suppress high-pressure discharge, are also provided. At the same time, the second storage container 4 on the outer side is also exhausted, which can be cleaned to suppress the re-adhesion of the removed dust and the like. In this way, after the cleaning of the second cleaning mechanism 54 is completed, the substrate boundary is spray-cleaned by the third cleaning mechanism%, and finally “sent out from the processing tank and transported to the drying device for the next drying process. In this embodiment, the liquid 'from the outside of the first storage container 3 to the openings 3a, 3b can be used to block the cleaning fluid 11 along the substrate w and to the outside, thereby allowing the openings 3a, 3b to be wider. In a state, the opening portion can be water-sealed, which is effective for shielding liquid mist and the like. <Second Embodiment> Fig. 6 is a schematic view showing the structure of the cleaning mechanism 101 according to the second embodiment of the present invention. The cleaning mechanism 101 is the same as the second cleaning mechanism 54 related to the first embodiment, and is a part of a substrate cleaning device, which is used for cleaning, for example, semiconductor substrates and glass substrates for flat panel display manufacturing, or printing. Since the substrate W such as a wiring substrate is used in the same manner, the same components are denoted by the same symbols as those in the case of the second cleaning mechanism 54, and descriptions thereof are omitted below. In addition, FIG. 6 is a schematic illustration of air and pure components. Water supply path is only displayed The substrate processing apparatus 101 includes a first storage container section 30 composed of a plurality of first storage containers inside the second storage container 4, and this point is related to the ^ 85636.DOC -19- 200407201 The shape of the substrate processing apparatus 1 is different. FIG. 6 illustrates a case where the first storage container unit 30 is composed of two first storage containers 31 and 32. The two first storage containers 3 1 and 32 are close to each other, Chains are arranged in series so that the substrates W pass in this order, and the openings 3 1 a, 3 1 b, 32a, and 32b formed on the two sides opposite to each other are arranged in a straight line, and then each of the upper ejection means 5 is arranged. (51, 52), lower ejection means 6 (61, 62). In addition, the second exhaust means V 2 is also responsible for exhaust of the two first receiving containers 31 and 32 at the same time. 1 The first opening portion 31a of the first storage container 31 and the second opening portion 32b of the first storage container 32, which are open at both ends of the trough and valley portion 30, each include a surface approximately parallel to the substrate W transferred and a bird's beak. Shaped end portions 3 1 ae and 3 2be. It is received by the substrate w located in the first trough container portion 30. When the first opening portion 31a defines a "first outermost opening portion", and when the second opening portion 32b of the substrate W sending end of the first storage container portion 30 defines the "second outermost opening portion" A plurality of pipe showers 7 are arranged outside the first storage container portion 30 and near the 3a and 32b of the i-th and the second-most-end openings, and are used to face the first and second extreme sides. The liquid is discharged from the gap formed by the end openings 31a, 3 2b and the substrate w to be transported. Furthermore, 'the first opening edge portion of the first edge' and the "second opening edge portion of the second edge" can be defined even in the first embodiment (Fig. 2). At this time, there is only one opening portion 3a. The one opening portion 3a functions as the first outermost opening portion. Similarly, since there is only one second opening portion 3b, the second opening portion% functions as the second outermost opening portion. In the case of the substrate processing apparatus 101 of this embodiment, the pure water discharged from the tube shower 7 is placed in the first storage container 31! The opening 31a and the i-th accommodation 85636.DOC -20-200407201 The second opening of the container 32 is as shown. 4 32b forms a water seal 13. At this time, the opening between the two first storage containers is Shao Weishi, and y becomes a water seal. Because the two are arranged close to each other, air is prevented from flowing out, but the result is the same as the first embodiment. The first storage container Shao 30's whole life preparation and clouded milk are suppressed to the extent that the second storage container 4 can be exhausted. Therefore, if the council member Yu Xi commits it ~ ^ ^ ^ _ /, her righteous grievances, even if it includes multiple cleaning treatments due to the formation of water seals at the openings of the storage containers at both ends, dust and other matter can no longer be attached Washing treatment. <Modification Example> The above 1 ^ said month on the cloud ‘The present invention is not limited to the shape described above by forming a water seal to suppress high-pressure discharge. Fig. 7 shows a representative modification of the shape of the end 3e of the storage container 3 of the cousin 1 and the jewel 1w, that is, life, and the baby "a" can be highlighted in the flat part of Fig. 7 (a). ^ The structure on the outside of the storage container 3 can also be constructed as shown in Fig. 7 (from both sides). 7 (c) can even be built to include Lai Xie. Or the container constituting the storage container 3 can be used as shown in Fig. 7 The thickness of the component. In addition, in the above-mentioned embodiment, it is recommended that the old supporting support roller on the lower side of the supporting substrate be installed as close to its supply site as the supply of high-pressure cleaning fluid U on the three plates W. In order to perform the cleaning process on the lower side of the substrate, a mister 12 'is provided on the lower side to place the cleaning fluid u and the sprayer 12 in the supply of the cleaning fluid u and the supporter + the support cylinder U) 'For example, it is not necessary to supply the lower liquid when cleaning the lower side, and it is sufficient to support the drum or the transport roller at a position corresponding to the U supply center of the washing fluid. Furthermore, a high voltage is applied to the lower surface of the substrate.

85636.DOC -21 . 200407201 給洗淨流體,若對上面以低壓供給洗淨流體的話,即使基 板厚度薄的情形’可減輕基板因承受重力等因素而產生彎 曲,提高輸送安定性。 另外,在上述之實施形態雖僅由收容容器之上側排氣, 但也可由下側來排氣’而且若由上下兩方來排氣的話,可 更加有效率。另外,將第1收容容器3與第2收容容器4連接 至個別之排氣手段,作為這二個排氣手段也可設置一可兼 用之大容量排氣手段。 另外,在上述之實施形態,第2洗淨機構54係第2收容容 器4内含第1收容容器3之雙重容器構造,但不受限於此。例 如圖8所示,於主收容容器之第1收容容器3之外側,作為副 收容邵’設置第1副收容容器41以便共有包含開口部3 a之側 面,為共有包含開口部3b之側面設置第2副收容容器42之構 造也可以。 圖8中副收容容器41、42於輸送路徑之前後,分割並包含 上述之實施形態1之第2收容容器4擁有之構成要素與其功 能。也就是說,第3開口部4a形成於副收容容器41,第4開口 部4b形成於副收容容器42,另外,各副收容容器41、42係 連接於排氣手段V2。其次,第1收容容器3之開口部3a、3b 之外側亦即副收容容器41與42内,設置對開口部3a、3b供給 液體之管式淋灑器7,而且設置液刀8於第3與第4開口部附 近。 隨著構成之不同也可得到與上述實施形態大約同樣效果 ’不過,由開口部3a、补通過管式淋灑器7之水封,於第i85636.DOC -21. 200407201 If the cleaning fluid is supplied to the upper surface at a low pressure, even if the substrate is thin, it can reduce the bending of the substrate due to factors such as gravity, and improve the transportation stability. Further, in the above-mentioned embodiment, although the air is exhausted only from the upper side of the storage container, it can be exhausted from the lower side ', and it is more efficient if it is exhausted from both the upper and lower sides. In addition, the first storage container 3 and the second storage container 4 are connected to separate exhaust means. As the two exhaust means, a large-capacity exhaust means may also be provided. In the above embodiment, the second washing mechanism 54 has a dual container structure including the first storage container 3 in the second storage container 4, but it is not limited to this. For example, as shown in FIG. 8, a first sub-container 41 is provided as a sub-container outside the first container 3 of the main container to share a side including the opening 3 a and a side including the opening 3 b is shared. The structure of the second auxiliary storage container 42 may be used. In Fig. 8, the sub-container containers 41 and 42 are divided before the conveyance path and include the components and functions possessed by the second storage container 4 of the first embodiment described above. That is, the third opening portion 4a is formed in the sub storage container 41, the fourth opening portion 4b is formed in the sub storage container 42, and each of the sub storage containers 41 and 42 is connected to the exhaust means V2. Next, a tube shower 7 for supplying liquid to the openings 3a and 3b is provided on the outer side of the openings 3a and 3b of the first storage container 3, that is, in the auxiliary storage containers 41 and 42, and a liquid knife 8 is provided on the third And near the fourth opening. Depending on the structure, the same effect as that of the above embodiment can be obtained. ′ However, the opening 3a and the water seal through the pipe-type sprinkler 7 are used in the i-th section.

85636.DOC -22- 200407201 收容容器3之外側將洗淨流體11減速之效力會影響開口部3a 側與開口部3 b側,容易加大容積之先前所提之雙重容器構 造較為優異。而且,在此副收容容器未必要設置於第1收容 容器3之開口部3 a、3b之兩側,例如:從第1收容容器3來看 容許洗淨流體漏出至上流側之開口部3 a側,但不容許洗淨 流體漏出至下流側之開口部3 b側的情況下,至少設置開口 部3b侧之副收容容器42。 於上述實施形態係以純水進行洗淨之狀態,由上部噴出 手段5或下部噴出手段6排出之洗淨流體之組成則不限於 此,所定之處理液例如··顯像液、触刻液、剝離液等皆可 。另外,各噴出手段或供給至管式淋灑器、液刀之純水亦 可由不同之供給手段來處理。 另外,於上述實施形態,使用後之純水係排出至排水管 DR、廢棄,但不限於此,將處理液循環再使用亦可。例如 於第1之實施形態,各洗淨機構53、54、56分離純水、回收 ,接著將第3之洗淨機構56使用之純水供給第2之洗淨機構 54使用’也可將該純水進一步供給於第1之洗淨機構53使用。 另外,於第1收容容器内部設置複數之上部噴出手段與下 部噴出手段亦可。 [發明之功效] 如以上之說明,根據申請專利範圍第丨至7項以及申請專 利範圍第14至18項之發明,處理容器採雙重構造,因各自 進仃排氣,可使處理流體不漏出至收容容器之外部而排氣。 另外’根據申清專利範圍第2至4項以及申請專利範圍第85636.DOC -22- 200407201 The effectiveness of decelerating the washing fluid 11 on the outside of the storage container 3 will affect the opening 3a side and the opening 3b side, and it is easy to increase the volume of the previously mentioned dual container structure. In addition, the sub-container is not necessarily provided on both sides of the openings 3 a and 3 b of the first storage container 3. For example, when the first storage container 3 is viewed, the cleaning fluid is allowed to leak to the opening 3 a on the upstream side. If the cleaning fluid is not allowed to leak to the downstream side opening portion 3 b side, at least the auxiliary storage container 42 on the opening side 3 b side is provided. In the above-mentioned embodiment, the state of washing with pure water is not limited to the composition of the washing fluid discharged from the upper spraying means 5 or the lower spraying means 6, and the predetermined treatment liquid is, for example, a developing liquid, a touch-etching liquid , Peeling liquid and so on. In addition, each spraying means or pure water supplied to the pipe shower and liquid knife may be processed by different supplying means. In addition, in the above embodiment, the pure water after use is discharged to the drain pipe DR and discarded, but it is not limited to this, and the treatment liquid may be recycled and reused. For example, in the first embodiment, each washing mechanism 53, 54 and 56 separates and collects pure water, and then supplies the pure water used by the third washing mechanism 56 to the second washing mechanism 54 for use. Pure water is further supplied to the first washing mechanism 53 for use. Alternatively, a plurality of upper ejection means and lower ejection means may be provided inside the first storage container. [Effect of the invention] As explained above, according to the inventions in the scope of patent applications Nos. 丨 to 7 and the scope of patent applications Nos. 14 to 18, the processing container adopts a double structure, and the processing fluid does not leak out because of its respective inlet and exhaust. Vent to the outside of the container. In addition, according to claims 2 to 4

85636.DOC -23- 200407201 1 5至1 7項之於日日 斗片卜 又月,右弟1收容容器無法完全排 之處理流體時,可方^、 徘孔屋生漏出 理流體不漏c收谷容器完全排氣,其結果可使處 土收谷谷态之外部而排氣。 根據申清專利範圍第3、4、8項至巾^m, 12、15項,以总a δ -主申巧專利範圍第 路徑之開口部,mj範圍第19項之發明,於基板輸送 體漏出至外部。興基板之間隙形成水封可抑制處理流 成=:根據申請專利範圍第4與9項之發明可更確實地形 :夕卜根據申請專利範圍第5與“項之發明 遮斷處理容器内外之空氣之出入,可:用展: 與處理容器外部之混入。 4把又漏出 第=之=申請專利範圍第6、7、1〇項以及申請專利範圍 另:,㈣’於—個收容容器内可同時洗淨基板之兩面。 高清淨度之方面,可採且:t、:f《發明,對於要求更 洗淨基板。 切力之漏合物之處理流體 抑另^根據t請專利範圍第12與2()項之發明,因主處理 备之兩後也進行排氣之 排氣。 &amp;故,可使處理流體不漏出至外部而 、另外根據申請專利範圍第13與Π項之發明,因 之液體不會長時間滞留 、/ 、 著。 常田於基板表面,抑制了雜質等之再附 [圖式簡單說明]85636.DOC -23- 200407201 1 5 to 1 7 of the day and month, and the right brother 1 can not completely drain the treatment fluid when the container 1 cannot be completely drained. The trough container is completely vented, and as a result, the trough can be vented outside the trough. According to the third, fourth, and eighth patent claims to ^ m, 12, and 15, the total a δ-the opening of the main Shenqiao patent scope path, the 19th invention of the mj scope, in the substrate conveyor Leaked to the outside. The formation of a water seal in the gap between the substrates can inhibit the processing flow =: According to the inventions in the scope of patent application No. 4 and 9 can be more reliable terrain: Xi Bu According to the inventions in scope of patent application No. 5 and "block the air inside and outside the processing container The difference can be: use exhibition: mixed with the outside of the processing container. 4 and leaked out === the scope of patent applications 6, 7, and 10 and the scope of patent applications. In addition: 可 'can be in a storage container Wash both sides of the substrate at the same time. In terms of high-definition, you can use: t,: f "Invention, for the substrate that requires more cleaning. Shear force of the leakage of the treatment fluid is suppressed ^ According to t please patent scope 12 With the invention of item 2 (), the exhaust gas is also exhausted after two of the main treatment equipment. &Amp; Therefore, the treatment fluid can be prevented from leaking to the outside, and according to the invention of item 13 and Π of the scope of patent application, Because of this, the liquid will not stay for a long time, and it will remain on the surface of the substrate.

85636.DOC -24- 2UU4U72U1 圖1係以模式方式表示關於第 1之全體構成圖。 1實施形態之基板處理裝置 圖2係以模式方忒矣一 @ '、弟2洗淨機構54之詳細構成圖。 圖3係說明基板w之傾斜輸itB。 圖4係為說明管式淋麗器7與液刀8之立體圖。 圖5係以模式方式表示基板洗淨處理中之第1收容容器3 與第2收容容器4内部之情形圖。 圖6係以模式方式表示關於第2實施形態之基板處理裝置 1〇1之構成圖。 圖7(a)-(d)係表示第1收容容器3之端部3e形狀之代表變形 例之圖。 圖8係表示包含副收容容器之變形例之圖 [圖式代表符號說明] 卜 1 〇 1基板處理裝置 2 輸送滾筒 3 、 31 、 32 第1收容容器 4 第2收容容器 5 上部喷出手段 6 下部噴出手段 7 管式淋灑器 8 液刀 9 壓住滚筒 10 支撐滾筒 11、12 洗淨流體85636.DOC -24- 2UU4U72U1 Figure 1 is a diagram showing the overall structure of No. 1 in a schematic manner. Substrate Processing Apparatus of the First Embodiment FIG. 2 is a detailed configuration diagram of the cleaning mechanism 54 in the mode of the first and second mode. FIG. 3 illustrates the tilting input itB of the substrate w. FIG. 4 is a perspective view illustrating the tube shower device 7 and the liquid knife 8. FIG. 5 is a schematic diagram showing the inside of the first storage container 3 and the second storage container 4 in the substrate cleaning process. Fig. 6 is a schematic diagram showing a configuration of a substrate processing apparatus 100 according to a second embodiment. Figs. 7 (a)-(d) are views showing a representative modification example of the shape of the end portion 3e of the first storage container 3. Figs. FIG. 8 is a diagram showing a modified example including a sub-container. [Illustration of Symbols in the Drawings] [1] 〇1 Substrate processing device 2 Conveying rollers 3, 31, 32 First storage container 4 Second storage container 5 Upper ejection means 6 Lower spraying means 7 Pipe sprayer 8 Liquid knife 9 Pressing the drum 10 Supporting the drum 11, 12 Washing fluid

85636.DOC -25- 200407201 13 水封 52 滾筒刷 53 第1洗淨機構 54 第2洗淨機構 56 第3洗淨機構 VI 第1排氣手段 V2 第2排氣手段 W 基板 -2685636.DOC -25- 200407201 13 Water seal 52 Drum brush 53 First cleaning mechanism 54 Second cleaning mechanism 56 Third cleaning mechanism VI First exhaust means V2 Second exhaust means W Substrate -26

85636.DOC85636.DOC

Claims (1)

200407201 拾、申請專利範圍: 1. 一種基板處理裝置,其特徵在於包含: 第1收容容器部,其係包含於相對向之側面包含第1開口 部與第2開口部之至少一個之第1收容容器; 第2收容容器,其係收容前述第1收容容器部,且於相對 向之側面包含第3開口部與第4開口部; 輸送手段,其係將基板從前述第3開口部送入前述第2 收容容器,於前述第1收容容器部依次從前述第1收容容器 之前述第1開口邵送入前述基板而從前述第2開口部送出 ,通過前述第1收容容器部後,從前述第4開口部將前述基 板送出至前述第2收容容器外; 第1噴出手段,其係配置於前述第1收容容器部之内部, 並可向被輸送之前述基板喷出處理流體; 第1排氣手段,其係將前述第1收容容器部之内部排氣 •,及 第2排氣手段,其係將前述第2收容容器部之内部排氣 者。 2·如申請專利範圍第1項之基板處理裝置,其中 利用前述第2排氣手段之排氣速度較利用前述第1排氣 手段之排氣速度為大。 3.如申請專利範圍第1或2項之基板處理裝置,其中 利用存在於前述第1收容容器部之前述基板之接收端, 且作為前述第1開口部之開口部定義第1最邊端開口部, 利用存在於前述第1收容容器部之前述基板之送出端, 85636.DOC 200407201 且作為前述第2開口部之開口部定義第2最邊端開口部時 ’進一步包含: 多數之第2噴出手段,其係在前述第1收容容器部之外部 ’被配置於各前述第1及前述第2最邊端開口部之附近,向 前述第1最邊端開口部與前述基板之第1間隙及前述第2最 邊端開口部與前述基板之第2間隙,喷出第1液體者。 4·如申請專利範圍第3項之基板處理裝置,其中 前述第1及前述第2最邊端開口部各包含與通過前述第1 及前述第2最邊端開口部之前述基板約略平行而相對向之 面。 5·如申請專利範圍第1或2項之基板處理裝置,其中進_步包 含: 第3噴出手段,其係在前述第2收容容器之内部,被配置 於前述第3與第4開口部中至少一個之附近,用於排出第2 液體,而以關閉該第3與第4開口部中至少—個之方式形成 液體流。 / 6. 置,其中 以作為前述第1噴 如申請專利範圍第1或2項之基板處理裝 包含上邵噴出手段與下部喷出手段, 出手段; 丽述上部及下部噴出手段係 A社珂述第1收容容 部輸送之前述基板之各自不同面側 如申請專利範圍第6項之基板處理裝置,其中 别述上邵及下部噴出手段之至少一 減、A 亍杈(主y個係將氣體與第 ml混合物當作前述處理流體而噴出。 85636.DOC 200407201 8· —種基板處理裝置,其特徵在於包含: 主收各各器,其係於相對向之側面包含第丨開口部與第2 開口部者; 知送手段’其係將基板從前述第1開口部送入前述主收 各各备,而由前述第2開口部送出者; 第1噴出手段,其係配置於前述主收容容器之内部,向 被輸送之前述基板噴出處理流體者; 第1排氣手段’其係將前述主收容容器之内部排氣者;及 複數 &lt; 第2噴出手段,其係配置於前述主收容容器之外 部且㈤述第1及前述第2開口部之各自附近,可向由前述第 1及$逑第2開口部與被輸送之前述基板所形成之間隙,喷 出第1液體者。 9 ·如申凊專利範圍第8項之基板處理裝置,其中 前述第1及前述第2開口部係分別包含與通過前述第 前述第2開口部之前述基板約略平行之面。 10 ·如申凊專利範圍第8或9項之基板處理裝置,其中 包含上部噴出手段與下部喷出手段,以作為前述第^貧 出手段; 前述上部及下部噴出手段係配置於在前述主收容容器 輸送之前述基板之各自不同面側。 11·如申請專利範圍第10項之基板處理裝置,其中 前述上部及下部噴出手段之至少一個係將氣體與第2液 體之混合物當作前述處理流體而喷出。 12 ·如申凊專利範圍第8或9項之基板處理裝置,其中進—步勺 85636.DOC 200407201 含: 副收容部,其係共有包含前述第1與第2開口部者; 第2排氣手段,其係將前述副收容部之内部進行排氣者· 兩述第2噴出手段係配置於前述副收容部内, 前述副收容部係在相對之侧面包含前述基板所通過之 第3開口部及第4開口部, 岫述輸送手段係將前述基板由前述副收容部外經前述 第3開口部,送入前述主收容器後,由前述主收容器經前 述第4開口部,送出至前述副收容部外。 二… 13·如申請專利範圍第i、2、8、9項中任—項之基板處理 ,其中 前述輸送手段係向傾斜於前述基板之水平方向之方向 ,輸送前述基板。 14. 一種基板洗淨方法,其特徵在於:收容在相對向之側面包 含第1開口部與第2開口部之至少-個之第1收容容器之; 1收容容器部,在相對向之側面包含第3開口部與第4開口 邵之第2收容容器之内部洗淨基板者;且 將前述基板由前述第3開口部送入前述第2收容容器,在 前述第1收容容器,逐次由‘、七堃 —— 、人由則述弟1收谷苳器之前述 口部送入前述基板,由前签 … 、 W迷罘2開口邵迗出,通過前述 收容容器部後,由前述第4 ρε|如史a 、吊4開口邵將則逑基板送出至 第2收容容器外; 在前述第1收容容器部 ^ , 内邵,向被輸送之前述 出處理流體,並 、丞狹負 85636.DOC 200407201 :面將前述第1收容容器部之内部排氣, -面將前述第2收容容器部之内部排氣。 15.如請專利範圍第14項之基板洗淨方法,其中 利用存在於前述第1收容容器部之前述基板之接收端, 且作為前述第1開口部之開口部定義第旧邊端開口部, 用存在万;七述第丨收容容器邵之前述基板之送出端, 且作為前述第2開口部之開口部定義第2最邊端開口部時 ’進一步包含: 、噴出工序,其係向前述第1及前述第2最邊端開口部與前 述基板所形成之間隙噴出第1液體者; 利用前述噴出工程,將通過前述第〖及前述第2最邊端開 口部之前述基板、與前述第丨及前述第2最邊端開口部之端 緣部之間隙施行水封者。 16·如申請專利範圍第14或15項之基板洗淨方法,其中 於如述第2收容容器之内部’在前述第3與第4開口部中 至少一個之附近,噴出第2液體以形成液流,以前述液流 關閉該第3開口部與第4開口部中至少一個。 17·如申請專利範圍第14或15項之基板洗淨方法,其中 削述知送工序係向傾斜於前述基板之水平方向之方向 ,輸送前述基板。 18. —種基板處理裝置,其特徵在於包含: 第1收容容器,其係包含可使基板通過之開口部者; 第2收容容器,其係包含可使前述基板通過之開口部, 且收容前述第1收容容器者; 85636.DOC 200407201 輸送手段,其係經由前述第2收容容器之前述開口部及 前述第1收容容器之前述開口部,將前述基板由前述第2 收容容器之外,經過前述第2收容容器内之前述第1收容容 器,再輸送至前述第2收容容器外者; 供給手段,其係於前述第1收容容器内,對前述基板供 給處理流體者; 第1排氣手段,其係將前述第1收容容器之内部排氣者 ;及 第2排氣手段,其係將前述第2收容容器之内部排氣者。 19. 一種基板處理裝置,其特徵在於包含: 收容容器,其係包含可供基板通過之開口部者; 輸送手段,其係經由前述收容容器之前述開口部,將前 述基板由前述收容容器之外,經過前述收容容器内,再輸 送至前述收容容器外者; 第1供給手段,其係於前述收容容器内,對前述基板供 給處理流體者; 第2供給手段,其係朝前述第1收容容器之開口部與前述 墓板之間隙,供給液體者;及 排氣手段,其係將前述收容容器内排氣者。 20. —種基板處理裝置,其特徵在於包含: 主收容容器,其係包含可供基板通過之第1開口部及第2 開口部者; 副收容容器,其係以共有包含前述第1開口部及第2開口 部側面之任一之方式而設置,且包含可供前述基板通過之 85636.DOC 200407201 開口部之至少一個者; 輸送手段,其係經由前述副收容容器之前述開口部及前 述主收容容器之前述第1開口部與第2開口部,以通過前述 副收容容器與主收容容器之方式者輸送前述基板; 供給手段,其係於前述主收容容器内,對前述基板供給 處理流體者; 第1排氣手段,其係將前述主收容容器之内部排氣者 ;及 第2排氣手段,其係將前述副收容容器之内部排氣者。 85636.DOC200407201 Scope of patent application: 1. A substrate processing device, comprising: a first storage container portion, which includes a first storage container on the opposite side including at least one of a first opening portion and a second opening portion; Container; a second storage container that stores the first storage container portion and includes a third opening portion and a fourth opening portion on opposite sides; and a conveying means that conveys the substrate from the third opening portion to the foregoing The second storage container is sequentially fed into the substrate from the first opening of the first storage container in the first storage container section, and is sent out from the second opening. After passing through the first storage container section, 4 The opening portion sends the substrate out of the second storage container; the first ejection means is disposed inside the first storage container portion, and can eject the processing fluid toward the substrate being transported; the first exhaust Means for exhausting the inside of the first storage container section, and means for exhausting the inside of the second storage container section. 2. The substrate processing apparatus according to item 1 of the patent application scope, wherein the exhaust speed using the second exhaust means is higher than the exhaust speed using the first exhaust means. 3. The substrate processing apparatus according to item 1 or 2 of the scope of patent application, wherein the receiving end of the substrate existing in the first storage container portion is used, and the opening of the first opening portion is defined as the first edgemost opening. When using the sending-out end of the substrate existing in the first receiving container portion, 85636.DOC 200407201 and defining the second-most-end opening as the opening portion of the second opening portion further include: a majority of the second ejection Means, which is disposed outside the first storage container portion in the vicinity of each of the first and second outermost openings, and toward the first gap between the first outermost opening and the substrate and The second gap between the second outermost opening and the substrate ejects the first liquid. 4. The substrate processing apparatus according to item 3 of the scope of patent application, wherein each of the first and second outermost openings includes approximately parallel to the substrate passing through the first and second outermost openings. To face. 5. The substrate processing device according to item 1 or 2 of the patent application scope, wherein the step further includes: a third ejection means, which is located inside the aforementioned second storage container and is arranged in the aforementioned third and fourth openings In the vicinity of at least one, a second liquid is discharged, and a liquid flow is formed so as to close at least one of the third and fourth openings. / 6. The substrate processing equipment used as the aforementioned first spraying application scope item 1 or 2 includes the upper spraying means and the lower spraying means, and the discharging means; the upper and lower spraying means are A company Ke Each of the different substrates of the aforementioned substrates conveyed by the first storage container is the substrate processing device of the sixth scope of the patent application, in which at least one minus and minus A of the upper and lower spraying means (mainly y 85636.DOC 200407201 8 · — A substrate processing apparatus, which is characterized by comprising: main receiving units, which are located on opposite sides and include a first opening and a first opening; 2 openings; known delivery means' It is a substrate that is sent from the first opening to the main receiver and sent from the second opening; The first ejection means is arranged in the main storage The inside of the container ejects the processing fluid onto the substrate being transported; the first exhaust means' which exhausts the inside of the main storage container; and a plurality of &lt; the second ejection means, which is arranged The first liquid can be ejected to the gap formed by the first and second openings and the substrate to be conveyed outside the main storage container and near the respective first and second openings. 9. For example, the substrate processing apparatus of claim 8 in the patent scope, wherein each of the first and second openings includes a surface approximately parallel to the substrate passing through the second opening. 10 The substrate processing device of claim 8 or 9 includes an upper ejection means and a lower ejection means as the aforementioned lean exhaust means; the upper and lower ejection means are arranged in the main storage container for transportation. The substrates are at different sides. 11. The substrate processing apparatus according to item 10 of the patent application, wherein at least one of the upper and lower ejection means ejects a mixture of a gas and a second liquid as the aforementioned treatment fluid. 12 · For the substrate processing device according to the 8th or 9th of the patent scope of the application, the step-step spoon 85636.DOC 200407201 contains: a sub-containment unit, which contains the above-mentioned first And the second opening part; the second exhaust means for exhausting the inside of the sub-receiving part. The two-mentioned second ejection means are arranged in the sub-receiving part, and the sub-receiving part is on the opposite side. The conveying means includes the third opening portion and the fourth opening portion through which the substrate passes, and the conveyance means conveys the substrate from the outside of the sub accommodating portion through the third opening portion to the main receiving container, and then the main receiving container Through the aforementioned fourth opening, it is sent out of the aforementioned sub-container. II ... 13. · For substrate processing in any of the items i, 2, 8, and 9 of the scope of patent application, wherein the conveying means is inclined to the substrate The substrate is transported in a horizontal direction. 14. A substrate cleaning method, characterized in that: the first container containing at least one of the first opening portion and the second opening portion is contained on the opposite side; 1 containing container portion includes on the opposite side The substrates are cleaned inside the second storage container of the third opening and the fourth opening; and the substrate is sent from the third opening to the second storage container, and the first storage container is sequentially processed by the ',七 堃 —— , Renyou Zedi 1 received the aforementioned part of the gu 苳 device into the aforementioned board, and was signed by the front ... W, W 罘 2 opening Shao Yi, after passing through the aforementioned container section, from the aforementioned 4 ρε | As the history a, the opening 4 of Shao will send the substrate to the second storage container; in the aforementioned first storage container section ^, in the inside, the processing fluid will be sent to the aforementioned transportation, and the narrow minus 85636.DOC 200407201: The inside of the first storage container portion is exhausted, and the inside of the second storage container portion is exhausted. 15. For the substrate cleaning method according to item 14 of the patent, wherein the receiving end of the substrate existing in the first storage container portion is used, and the opening portion of the old side is defined as the opening portion of the first opening portion, In the case of the seventh aspect, the sending end of the aforementioned substrate of the storage container Shao, and when the second opening is defined as the opening portion of the second opening portion, further includes: a spraying process, which is directed to the first 1 and the first liquid is ejected from the gap formed by the second extreme edge opening portion and the substrate; using the ejection process, the substrate and the first and second second extreme opening portions through the aforementioned ejection process and the first And a water seal is applied to the gap between the edge portion of the second outermost opening portion. 16. The substrate cleaning method according to item 14 or 15 of the scope of patent application, wherein the second liquid is sprayed to form a liquid near the inside of the second storage container near at least one of the third and fourth openings. Flow, closing at least one of the third opening portion and the fourth opening portion by the liquid flow. 17. The substrate cleaning method according to item 14 or 15 of the scope of application for a patent, wherein the cutting and sending step conveys the substrate in a direction inclined to the horizontal direction of the substrate. 18. A substrate processing apparatus, comprising: a first storage container including an opening through which a substrate can pass; a second storage container including an opening through which the substrate can be passed, and containing the foregoing The first storage container; 85636.DOC 200407201 The conveying means is to pass the substrate from the second storage container through the opening of the second storage container and the opening of the first storage container through the aforementioned The first storage container in the second storage container is transported to the outside of the second storage container; a supply means is a person who supplies a processing fluid to the substrate in the first storage container; a first exhaust means, It is a person who exhausts the inside of the aforementioned first storage container; and a second exhaust means which exhausts the inside of the aforementioned second storage container. 19. A substrate processing apparatus, comprising: a storage container that includes an opening through which a substrate can pass; and a conveying means that passes the substrate out of the storage container through the opening in the storage container. The first supply means is a person who supplies processing fluid to the substrate in the storage container, and the second supply means is toward the first storage container. A person who supplies liquid between a gap between the opening portion of the grave board and the grave board, and a means for exhausting the gas, which exhausts the inside of the storage container. 20. A substrate processing apparatus, comprising: a main storage container including a first opening and a second opening through which a substrate can pass; and a sub storage container including a first opening in common. And second side of the second opening portion, and includes at least one of the 85636.DOC 200407201 opening portion through which the substrate can pass; the conveying means is through the opening portion of the auxiliary storage container and the main portion The first opening portion and the second opening portion of the storage container convey the substrate so as to pass through the sub storage container and the main storage container. A supply means is provided in the main storage container and supplies processing fluid to the substrate. The first exhaust means is to exhaust the inside of the main storage container; and the second exhaust means is to exhaust the inside of the secondary storage container. 85636.DOC
TW092115235A 2002-06-28 2003-06-05 Substrate treatment apparatus and substrate washing method TWI228058B (en)

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