KR100822944B1 - 전자부품의 수지 밀봉 성형 방법 - Google Patents

전자부품의 수지 밀봉 성형 방법 Download PDF

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Publication number
KR100822944B1
KR100822944B1 KR1020060097494A KR20060097494A KR100822944B1 KR 100822944 B1 KR100822944 B1 KR 100822944B1 KR 1020060097494 A KR1020060097494 A KR 1020060097494A KR 20060097494 A KR20060097494 A KR 20060097494A KR 100822944 B1 KR100822944 B1 KR 100822944B1
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KR
South Korea
Prior art keywords
cavity
substrate
release film
mold
frame
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KR1020060097494A
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English (en)
Korean (ko)
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KR20070041337A (ko
Inventor
요헤이 오니시
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토와 가부시기가이샤
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Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020060097494A 2005-10-13 2006-10-04 전자부품의 수지 밀봉 성형 방법 Active KR100822944B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00298262 2005-10-13
JP2005298262A JP2007109831A (ja) 2005-10-13 2005-10-13 電子部品の樹脂封止成形方法

Publications (2)

Publication Number Publication Date
KR20070041337A KR20070041337A (ko) 2007-04-18
KR100822944B1 true KR100822944B1 (ko) 2008-04-17

Family

ID=38001717

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060097494A Active KR100822944B1 (ko) 2005-10-13 2006-10-04 전자부품의 수지 밀봉 성형 방법

Country Status (4)

Country Link
US (1) US20070085237A1 (https=)
JP (1) JP2007109831A (https=)
KR (1) KR100822944B1 (https=)
TW (1) TWI339418B (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4836661B2 (ja) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び樹脂封止成形用金型
JP4926869B2 (ja) * 2007-07-26 2012-05-09 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR101132136B1 (ko) * 2007-08-03 2012-04-03 스미도모쥬기가이고교 가부시키가이샤 피성형품의 낙하 방지 기구
KR100934104B1 (ko) * 2007-12-18 2009-12-29 에스티에스반도체통신 주식회사 반도체 패키지 성형 금형 및 이를 이용한 반도체 패키지제조 방법
JP5074341B2 (ja) * 2008-10-09 2012-11-14 住友重機械工業株式会社 樹脂封止装置
TWI416674B (zh) * 2008-11-05 2013-11-21 日月光半導體製造股份有限公司 封膠模具與封膠方法
WO2011105640A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형장치 및 압축 성형방법
WO2011105639A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형 장치 및 방법
JP5419230B2 (ja) * 2011-08-01 2014-02-19 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
EP2664446B1 (en) * 2012-05-16 2015-04-29 Airbus Operations GmbH Method for manufacturing a lining element, a lining element and a vehicle comprising a cabin and at least one such lining element
JP6115505B2 (ja) 2013-06-21 2017-04-19 株式会社デンソー 電子装置
JP5786918B2 (ja) * 2013-10-23 2015-09-30 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
TWI526295B (zh) * 2014-06-26 2016-03-21 三緯國際立體列印科技股份有限公司 成型機構及三維印表機
TWI689396B (zh) * 2014-07-22 2020-04-01 日商山田尖端科技股份有限公司 成形模具、成形裝置及成形品的製造方法
JP6560498B2 (ja) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
JP6901604B2 (ja) * 2016-04-19 2021-07-14 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
KR101833270B1 (ko) 2016-08-31 2018-03-02 주식회사 제이에스텍 인조석을 고무 몰드로부터 분리하기 위한 이형필름 부착 장치
JP6612723B2 (ja) * 2016-12-07 2019-11-27 株式会社東芝 基板装置
JPWO2018199254A1 (ja) * 2017-04-28 2020-03-12 日立化成株式会社 中空封止構造体
KR102169491B1 (ko) * 2018-06-18 2020-10-23 엘지전자 주식회사 인조 대리석 몰드 내 필름 접착 시스템 및 그 방법
WO2019245101A1 (ko) * 2018-06-18 2019-12-26 엘지전자 주식회사 인조 대리석 몰드 내 필름 접착 시스템 및 그 방법
JP7121705B2 (ja) * 2019-07-29 2022-08-18 アピックヤマダ株式会社 樹脂モールド金型
CN117283816B (zh) * 2023-10-16 2025-03-14 宁波吉海模具有限公司 一种无顶出易脱模的注塑模具及其注塑方法
CN119408074A (zh) * 2025-01-07 2025-02-11 北京七星华创微电子有限责任公司 一种foplp封装加工用注塑模具结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100335675B1 (ko) * 1998-01-23 2002-05-08 나까자와 모또요시 반도체 장치용 수지 실링 방법 및 장치
KR100357362B1 (ko) * 1999-03-10 2002-10-19 토와 가부시기가이샤 반도체 웨이퍼의 수지 피복 방법 및 이에 사용되는 금형
KR100419356B1 (ko) * 2000-02-10 2004-02-19 토와 가부시기가이샤 전자 부품, 전자 부품의 수지 밀봉 방법 및 장치
KR100611519B1 (ko) * 1998-07-10 2006-08-11 아피쿠 야마다 가부시키가이샤 반도체 장치 제조 방법 및 수지 몰딩 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207837B2 (ja) * 1998-07-10 2001-09-10 アピックヤマダ株式会社 半導体装置の製造方法および樹脂封止装置
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP3956335B2 (ja) * 2000-03-06 2007-08-08 シャープ株式会社 樹脂注型用金型を用いた半導体装置の製造方法
JP4268389B2 (ja) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2005161695A (ja) * 2003-12-03 2005-06-23 Towa Corp 樹脂封止装置及び樹脂封止方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100335675B1 (ko) * 1998-01-23 2002-05-08 나까자와 모또요시 반도체 장치용 수지 실링 방법 및 장치
KR100611519B1 (ko) * 1998-07-10 2006-08-11 아피쿠 야마다 가부시키가이샤 반도체 장치 제조 방법 및 수지 몰딩 장치
KR100357362B1 (ko) * 1999-03-10 2002-10-19 토와 가부시기가이샤 반도체 웨이퍼의 수지 피복 방법 및 이에 사용되는 금형
KR100419356B1 (ko) * 2000-02-10 2004-02-19 토와 가부시기가이샤 전자 부품, 전자 부품의 수지 밀봉 방법 및 장치

Also Published As

Publication number Publication date
TWI339418B (en) 2011-03-21
JP2007109831A (ja) 2007-04-26
KR20070041337A (ko) 2007-04-18
TW200746322A (en) 2007-12-16
US20070085237A1 (en) 2007-04-19

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