JP2007109831A - 電子部品の樹脂封止成形方法 - Google Patents

電子部品の樹脂封止成形方法 Download PDF

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Publication number
JP2007109831A
JP2007109831A JP2005298262A JP2005298262A JP2007109831A JP 2007109831 A JP2007109831 A JP 2007109831A JP 2005298262 A JP2005298262 A JP 2005298262A JP 2005298262 A JP2005298262 A JP 2005298262A JP 2007109831 A JP2007109831 A JP 2007109831A
Authority
JP
Japan
Prior art keywords
mold
cavity
substrate
release film
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005298262A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007109831A5 (https=
Inventor
Yohei Onishi
洋平 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2005298262A priority Critical patent/JP2007109831A/ja
Priority to TW095135760A priority patent/TWI339418B/zh
Priority to KR1020060097494A priority patent/KR100822944B1/ko
Priority to US11/543,778 priority patent/US20070085237A1/en
Publication of JP2007109831A publication Critical patent/JP2007109831A/ja
Publication of JP2007109831A5 publication Critical patent/JP2007109831A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2005298262A 2005-10-13 2005-10-13 電子部品の樹脂封止成形方法 Pending JP2007109831A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005298262A JP2007109831A (ja) 2005-10-13 2005-10-13 電子部品の樹脂封止成形方法
TW095135760A TWI339418B (en) 2005-10-13 2006-09-27 Resin sealing and molding method of electronic component
KR1020060097494A KR100822944B1 (ko) 2005-10-13 2006-10-04 전자부품의 수지 밀봉 성형 방법
US11/543,778 US20070085237A1 (en) 2005-10-13 2006-10-06 Resin sealing and molding method of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005298262A JP2007109831A (ja) 2005-10-13 2005-10-13 電子部品の樹脂封止成形方法

Publications (2)

Publication Number Publication Date
JP2007109831A true JP2007109831A (ja) 2007-04-26
JP2007109831A5 JP2007109831A5 (https=) 2008-10-23

Family

ID=38001717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005298262A Pending JP2007109831A (ja) 2005-10-13 2005-10-13 電子部品の樹脂封止成形方法

Country Status (4)

Country Link
US (1) US20070085237A1 (https=)
JP (1) JP2007109831A (https=)
KR (1) KR100822944B1 (https=)
TW (1) TWI339418B (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007132611A1 (ja) * 2006-05-17 2007-11-22 Towa Corporation 電子部品の樹脂封止成形方法
JP2009032842A (ja) * 2007-07-26 2009-02-12 Renesas Technology Corp 半導体装置の製造方法
WO2009019745A1 (ja) * 2007-08-03 2009-02-12 Sumitomo Heavy Industries, Ltd. 被成形品の落下防止機構
JP2010089429A (ja) * 2008-10-09 2010-04-22 Sumitomo Heavy Ind Ltd 樹脂封止装置
WO2011105640A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형장치 및 압축 성형방법
WO2011105639A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형 장치 및 방법
JP2011249834A (ja) * 2011-08-01 2011-12-08 Renesas Electronics Corp 半導体装置およびその製造方法
JP2015082607A (ja) * 2013-10-23 2015-04-27 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
KR20160011602A (ko) * 2014-07-22 2016-02-01 아피쿠 야마다 가부시키가이샤 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법
TWI667119B (zh) * 2015-01-27 2019-08-01 日商東和股份有限公司 Resin sealing method and resin sealing device
JP2020108973A (ja) * 2016-04-19 2020-07-16 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
CN117283816A (zh) * 2023-10-16 2023-12-26 宁波吉海模具有限公司 一种无顶出易脱模的注塑模具及其注塑方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100934104B1 (ko) * 2007-12-18 2009-12-29 에스티에스반도체통신 주식회사 반도체 패키지 성형 금형 및 이를 이용한 반도체 패키지제조 방법
TWI416674B (zh) * 2008-11-05 2013-11-21 日月光半導體製造股份有限公司 封膠模具與封膠方法
EP2664446B1 (en) * 2012-05-16 2015-04-29 Airbus Operations GmbH Method for manufacturing a lining element, a lining element and a vehicle comprising a cabin and at least one such lining element
JP6115505B2 (ja) 2013-06-21 2017-04-19 株式会社デンソー 電子装置
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
TWI526295B (zh) * 2014-06-26 2016-03-21 三緯國際立體列印科技股份有限公司 成型機構及三維印表機
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
KR101833270B1 (ko) 2016-08-31 2018-03-02 주식회사 제이에스텍 인조석을 고무 몰드로부터 분리하기 위한 이형필름 부착 장치
JP6612723B2 (ja) * 2016-12-07 2019-11-27 株式会社東芝 基板装置
JPWO2018199254A1 (ja) * 2017-04-28 2020-03-12 日立化成株式会社 中空封止構造体
KR102169491B1 (ko) * 2018-06-18 2020-10-23 엘지전자 주식회사 인조 대리석 몰드 내 필름 접착 시스템 및 그 방법
WO2019245101A1 (ko) * 2018-06-18 2019-12-26 엘지전자 주식회사 인조 대리석 몰드 내 필름 접착 시스템 및 그 방법
JP7121705B2 (ja) * 2019-07-29 2022-08-18 アピックヤマダ株式会社 樹脂モールド金型
CN119408074A (zh) * 2025-01-07 2025-02-11 北京七星华创微电子有限责任公司 一种foplp封装加工用注塑模具结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299335A (ja) * 1998-07-10 2000-10-24 Apic Yamada Corp 半導体装置の製造方法および樹脂封止装置
JP2005161695A (ja) * 2003-12-03 2005-06-23 Towa Corp 樹脂封止装置及び樹脂封止方法
JP2005225133A (ja) * 2004-02-13 2005-08-25 Towa Corp 半導体チップの樹脂封止成形方法および樹脂封止成形用金型

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
KR100611519B1 (ko) * 1998-07-10 2006-08-11 아피쿠 야마다 가부시키가이샤 반도체 장치 제조 방법 및 수지 몰딩 장치
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
SG92685A1 (en) * 1999-03-10 2002-11-19 Towa Corp Method of coating semiconductor wafer with resin and mold used therefor
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP3423912B2 (ja) * 2000-02-10 2003-07-07 Ｔｏｗａ株式会社 電子部品、電子部品の樹脂封止方法、及び樹脂封止装置
JP3956335B2 (ja) * 2000-03-06 2007-08-08 シャープ株式会社 樹脂注型用金型を用いた半導体装置の製造方法
JP4268389B2 (ja) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299335A (ja) * 1998-07-10 2000-10-24 Apic Yamada Corp 半導体装置の製造方法および樹脂封止装置
JP2005161695A (ja) * 2003-12-03 2005-06-23 Towa Corp 樹脂封止装置及び樹脂封止方法
JP2005225133A (ja) * 2004-02-13 2005-08-25 Towa Corp 半導体チップの樹脂封止成形方法および樹脂封止成形用金型

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007132611A1 (ja) * 2006-05-17 2007-11-22 Towa Corporation 電子部品の樹脂封止成形方法
JP2007307766A (ja) * 2006-05-17 2007-11-29 Towa Corp 電子部品の樹脂封止成形方法
JP2009032842A (ja) * 2007-07-26 2009-02-12 Renesas Technology Corp 半導体装置の製造方法
WO2009019745A1 (ja) * 2007-08-03 2009-02-12 Sumitomo Heavy Industries, Ltd. 被成形品の落下防止機構
JP2010089429A (ja) * 2008-10-09 2010-04-22 Sumitomo Heavy Ind Ltd 樹脂封止装置
WO2011105639A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형 장치 및 방법
WO2011105640A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형장치 및 압축 성형방법
JP2011249834A (ja) * 2011-08-01 2011-12-08 Renesas Electronics Corp 半導体装置およびその製造方法
JP2015082607A (ja) * 2013-10-23 2015-04-27 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
KR20160011602A (ko) * 2014-07-22 2016-02-01 아피쿠 야마다 가부시키가이샤 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법
KR102455987B1 (ko) 2014-07-22 2022-10-18 아피쿠 야마다 가부시키가이샤 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법
TWI667119B (zh) * 2015-01-27 2019-08-01 日商東和股份有限公司 Resin sealing method and resin sealing device
JP2020108973A (ja) * 2016-04-19 2020-07-16 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
CN117283816A (zh) * 2023-10-16 2023-12-26 宁波吉海模具有限公司 一种无顶出易脱模的注塑模具及其注塑方法

Also Published As

Publication number Publication date
KR100822944B1 (ko) 2008-04-17
TWI339418B (en) 2011-03-21
KR20070041337A (ko) 2007-04-18
TW200746322A (en) 2007-12-16
US20070085237A1 (en) 2007-04-19

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