TWI339418B - Resin sealing and molding method of electronic component - Google Patents

Resin sealing and molding method of electronic component Download PDF

Info

Publication number
TWI339418B
TWI339418B TW095135760A TW95135760A TWI339418B TW I339418 B TWI339418 B TW I339418B TW 095135760 A TW095135760 A TW 095135760A TW 95135760 A TW95135760 A TW 95135760A TW I339418 B TWI339418 B TW I339418B
Authority
TW
Taiwan
Prior art keywords
mold
cavity
substrate
resin
state
Prior art date
Application number
TW095135760A
Other languages
English (en)
Chinese (zh)
Other versions
TW200746322A (en
Inventor
Yohei Onishi
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200746322A publication Critical patent/TW200746322A/zh
Application granted granted Critical
Publication of TWI339418B publication Critical patent/TWI339418B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW095135760A 2005-10-13 2006-09-27 Resin sealing and molding method of electronic component TWI339418B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005298262A JP2007109831A (ja) 2005-10-13 2005-10-13 電子部品の樹脂封止成形方法

Publications (2)

Publication Number Publication Date
TW200746322A TW200746322A (en) 2007-12-16
TWI339418B true TWI339418B (en) 2011-03-21

Family

ID=38001717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135760A TWI339418B (en) 2005-10-13 2006-09-27 Resin sealing and molding method of electronic component

Country Status (4)

Country Link
US (1) US20070085237A1 (https=)
JP (1) JP2007109831A (https=)
KR (1) KR100822944B1 (https=)
TW (1) TWI339418B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105826212A (zh) * 2015-01-27 2016-08-03 东和株式会社 树脂封装方法及树脂封装装置
TWI756415B (zh) * 2017-04-28 2022-03-01 日商昭和電工材料股份有限公司 中空密封結構體

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4836661B2 (ja) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び樹脂封止成形用金型
JP4926869B2 (ja) * 2007-07-26 2012-05-09 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR101132136B1 (ko) * 2007-08-03 2012-04-03 스미도모쥬기가이고교 가부시키가이샤 피성형품의 낙하 방지 기구
KR100934104B1 (ko) * 2007-12-18 2009-12-29 에스티에스반도체통신 주식회사 반도체 패키지 성형 금형 및 이를 이용한 반도체 패키지제조 방법
JP5074341B2 (ja) * 2008-10-09 2012-11-14 住友重機械工業株式会社 樹脂封止装置
TWI416674B (zh) * 2008-11-05 2013-11-21 日月光半導體製造股份有限公司 封膠模具與封膠方法
WO2011105640A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형장치 및 압축 성형방법
WO2011105639A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형 장치 및 방법
JP5419230B2 (ja) * 2011-08-01 2014-02-19 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
EP2664446B1 (en) * 2012-05-16 2015-04-29 Airbus Operations GmbH Method for manufacturing a lining element, a lining element and a vehicle comprising a cabin and at least one such lining element
JP6115505B2 (ja) 2013-06-21 2017-04-19 株式会社デンソー 電子装置
JP5786918B2 (ja) * 2013-10-23 2015-09-30 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
TWI526295B (zh) * 2014-06-26 2016-03-21 三緯國際立體列印科技股份有限公司 成型機構及三維印表機
TWI689396B (zh) * 2014-07-22 2020-04-01 日商山田尖端科技股份有限公司 成形模具、成形裝置及成形品的製造方法
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
JP6901604B2 (ja) * 2016-04-19 2021-07-14 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
KR101833270B1 (ko) 2016-08-31 2018-03-02 주식회사 제이에스텍 인조석을 고무 몰드로부터 분리하기 위한 이형필름 부착 장치
JP6612723B2 (ja) * 2016-12-07 2019-11-27 株式会社東芝 基板装置
KR102169491B1 (ko) * 2018-06-18 2020-10-23 엘지전자 주식회사 인조 대리석 몰드 내 필름 접착 시스템 및 그 방법
WO2019245101A1 (ko) * 2018-06-18 2019-12-26 엘지전자 주식회사 인조 대리석 몰드 내 필름 접착 시스템 및 그 방법
JP7121705B2 (ja) * 2019-07-29 2022-08-18 アピックヤマダ株式会社 樹脂モールド金型
CN117283816B (zh) * 2023-10-16 2025-03-14 宁波吉海模具有限公司 一种无顶出易脱模的注塑模具及其注塑方法
CN119408074A (zh) * 2025-01-07 2025-02-11 北京七星华创微电子有限责任公司 一种foplp封装加工用注塑模具结构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
KR100611519B1 (ko) * 1998-07-10 2006-08-11 아피쿠 야마다 가부시키가이샤 반도체 장치 제조 방법 및 수지 몰딩 장치
JP3207837B2 (ja) * 1998-07-10 2001-09-10 アピックヤマダ株式会社 半導体装置の製造方法および樹脂封止装置
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
SG92685A1 (en) * 1999-03-10 2002-11-19 Towa Corp Method of coating semiconductor wafer with resin and mold used therefor
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP3423912B2 (ja) * 2000-02-10 2003-07-07 Ｔｏｗａ株式会社 電子部品、電子部品の樹脂封止方法、及び樹脂封止装置
JP3956335B2 (ja) * 2000-03-06 2007-08-08 シャープ株式会社 樹脂注型用金型を用いた半導体装置の製造方法
JP4268389B2 (ja) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2005161695A (ja) * 2003-12-03 2005-06-23 Towa Corp 樹脂封止装置及び樹脂封止方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105826212A (zh) * 2015-01-27 2016-08-03 东和株式会社 树脂封装方法及树脂封装装置
CN105826212B (zh) * 2015-01-27 2019-03-05 东和株式会社 树脂封装方法及树脂封装装置
TWI756415B (zh) * 2017-04-28 2022-03-01 日商昭和電工材料股份有限公司 中空密封結構體

Also Published As

Publication number Publication date
KR100822944B1 (ko) 2008-04-17
JP2007109831A (ja) 2007-04-26
KR20070041337A (ko) 2007-04-18
TW200746322A (en) 2007-12-16
US20070085237A1 (en) 2007-04-19

Similar Documents

Publication Publication Date Title
TWI339418B (en) Resin sealing and molding method of electronic component
EP1396323B1 (en) Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
KR100844668B1 (ko) 전자 부품의 수지 밀봉 방법 및 그것에 이용되는 금형
JP2007109831A5 (https=)
US7969026B2 (en) Flexible carrier for high volume electronic package fabrication
KR100993086B1 (ko) 전자 부품의 수지 밀봉 성형 방법
JP2007307766A5 (https=)
CN110871538B (zh) 树脂成型装置、脱模膜的剥离方法、树脂成型品的制造方法
JP2007251094A (ja) 半導体チップの樹脂封止成形装置
JP6557428B2 (ja) 樹脂封止装置及び樹脂封止方法
JP2002036270A (ja) 樹脂封止方法及び樹脂封止装置
JP2007242924A5 (https=)
CN100539092C (zh) 半导体器件及其制造方法
JP2005324341A (ja) 樹脂モールド方法および樹脂モールド装置
JP4206241B2 (ja) 樹脂モールド金型および樹脂モールド装置
TW201832892A (zh) 樹脂密封裝置及樹脂密封方法
JP2006007506A5 (https=)
JP2005225067A (ja) 樹脂モールド方法および樹脂モールド装置
JP2000252310A (ja) モールド方法および装置ならびにそれを用いた半導体装置の製造方法
JP4075986B2 (ja) 樹脂封止装置及び金型
JP3012643B1 (ja) 半導体装置の製造方法
JP5027451B2 (ja) 半導体チップの樹脂封止成形方法
TW201236215A (en) Substrate carrier for molding electronic devices
JP2007005675A (ja) 樹脂封止金型および半導体装置
JP2009283955A (ja) 半導体装置の製造方法