KR100779319B1 - 박막 반도체 장치 및 화상 표시 장치 - Google Patents

박막 반도체 장치 및 화상 표시 장치 Download PDF

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Publication number
KR100779319B1
KR100779319B1 KR1020010010416A KR20010010416A KR100779319B1 KR 100779319 B1 KR100779319 B1 KR 100779319B1 KR 1020010010416 A KR1020010010416 A KR 1020010010416A KR 20010010416 A KR20010010416 A KR 20010010416A KR 100779319 B1 KR100779319 B1 KR 100779319B1
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South Korea
Prior art keywords
film
semiconductor film
semiconductor
channel region
thin film
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Expired - Fee Related
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English (en)
Korean (ko)
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KR20020063472A (ko
Inventor
하따노무쯔꼬
야마구찌신야
기무라요시노부
박성기
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가부시키가이샤 히타치세이사쿠쇼
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686Pulsed laser beam
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6731Top-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0221Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
    • H10D86/0223Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
    • H10D86/0227Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials using structural arrangements to control crystal growth, e.g. placement of grain filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0221Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
    • H10D86/0223Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
    • H10D86/0229Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials characterised by control of the annealing or irradiation parameters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0251Manufacture or treatment of multiple TFTs characterised by increasing the uniformity of device parameters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02691Scanning of a beam

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)
KR1020010010416A 2001-01-29 2001-02-28 박막 반도체 장치 및 화상 표시 장치 Expired - Fee Related KR100779319B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-019570 2001-01-29
JP2001019570A JP4744700B2 (ja) 2001-01-29 2001-01-29 薄膜半導体装置及び薄膜半導体装置を含む画像表示装置
US09/791,853 US6756614B2 (en) 2001-01-29 2001-02-26 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020060019461A Division KR100821813B1 (ko) 2001-01-29 2006-02-28 반도체 박막 장치를 이용한 화상 표시 장치의 제조 방법
KR1020060019457A Division KR100779318B1 (ko) 2001-01-29 2006-02-28 박막 반도체 장치를 이용한 화상 표시 장치의 제조 방법

Publications (2)

Publication Number Publication Date
KR20020063472A KR20020063472A (ko) 2002-08-03
KR100779319B1 true KR100779319B1 (ko) 2007-11-23

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KR1020010010416A Expired - Fee Related KR100779319B1 (ko) 2001-01-29 2001-02-28 박막 반도체 장치 및 화상 표시 장치
KR1020060019457A Expired - Fee Related KR100779318B1 (ko) 2001-01-29 2006-02-28 박막 반도체 장치를 이용한 화상 표시 장치의 제조 방법
KR1020060019461A Expired - Fee Related KR100821813B1 (ko) 2001-01-29 2006-02-28 반도체 박막 장치를 이용한 화상 표시 장치의 제조 방법

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KR1020060019461A Expired - Fee Related KR100821813B1 (ko) 2001-01-29 2006-02-28 반도체 박막 장치를 이용한 화상 표시 장치의 제조 방법

Country Status (5)

Country Link
US (5) US6756614B2 (enExample)
EP (1) EP1227516A2 (enExample)
JP (1) JP4744700B2 (enExample)
KR (3) KR100779319B1 (enExample)
TW (1) TW480730B (enExample)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854803A (en) * 1995-01-12 1998-12-29 Semiconductor Energy Laboratory Co., Ltd. Laser illumination system
US6555449B1 (en) 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
US6830993B1 (en) 2000-03-21 2004-12-14 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
MXPA02005590A (es) 2000-10-10 2002-09-30 Univ Columbia Metodo y aparato para procesar capas de metal delgadas.
JP4744700B2 (ja) * 2001-01-29 2011-08-10 株式会社日立製作所 薄膜半導体装置及び薄膜半導体装置を含む画像表示装置
US20020117718A1 (en) * 2001-02-28 2002-08-29 Apostolos Voutsas Method of forming predominantly <100> polycrystalline silicon thin film transistors
JP3903761B2 (ja) 2001-10-10 2007-04-11 株式会社日立製作所 レ−ザアニ−ル方法およびレ−ザアニ−ル装置
US7050878B2 (en) 2001-11-22 2006-05-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductror fabricating apparatus
US7133737B2 (en) 2001-11-30 2006-11-07 Semiconductor Energy Laboratory Co., Ltd. Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer
KR100967824B1 (ko) 2001-11-30 2010-07-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제작방법
JP2003168645A (ja) * 2001-12-03 2003-06-13 Hitachi Ltd 半導体薄膜装置、その製造方法及び画像表示装置
US7214573B2 (en) * 2001-12-11 2007-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device that includes patterning sub-islands
JP4011344B2 (ja) * 2001-12-28 2007-11-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP1326273B1 (en) 2001-12-28 2012-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US6933527B2 (en) 2001-12-28 2005-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and semiconductor device production system
US6841797B2 (en) * 2002-01-17 2005-01-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device formed over a surface with a drepession portion and a projection portion
US6847050B2 (en) 2002-03-15 2005-01-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and semiconductor device comprising the same
JP2003282438A (ja) * 2002-03-27 2003-10-03 Seiko Epson Corp 半導体装置の製造方法及び半導体装置、電気光学装置、電子機器
JP3873811B2 (ja) * 2002-05-15 2007-01-31 日本電気株式会社 半導体装置の製造方法
JP2003332350A (ja) 2002-05-17 2003-11-21 Hitachi Ltd 薄膜半導体装置
TWI378307B (en) 2002-08-19 2012-12-01 Univ Columbia Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions
AU2003258289A1 (en) 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York A single-shot semiconductor processing system and method having various irradiation patterns
JP2004087535A (ja) * 2002-08-22 2004-03-18 Sony Corp 結晶質半導体材料の製造方法および半導体装置の製造方法
JP4474108B2 (ja) 2002-09-02 2010-06-02 株式会社 日立ディスプレイズ 表示装置とその製造方法および製造装置
JP2004103628A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd レーザアニール装置及びtft基板のレーザアニール方法
FR2844920B1 (fr) * 2002-09-24 2005-08-26 Corning Inc Transistor a couche mince de silicium et son procede de fabrication
US7405114B2 (en) * 2002-10-16 2008-07-29 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method of manufacturing semiconductor device
US7473621B2 (en) * 2002-11-27 2009-01-06 Canon Kabushiki Kaisha Producing method for crystalline thin film
JP5164378B2 (ja) 2003-02-19 2013-03-21 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 逐次的横方向結晶化技術を用いて結晶化させた複数の半導体薄膜フィルムを処理するシステム及びプロセス
JP4116465B2 (ja) 2003-02-20 2008-07-09 株式会社日立製作所 パネル型表示装置とその製造方法および製造装置
JP4583004B2 (ja) * 2003-05-21 2010-11-17 株式会社 日立ディスプレイズ アクティブ・マトリクス基板の製造方法
JP2004363241A (ja) * 2003-06-03 2004-12-24 Advanced Lcd Technologies Development Center Co Ltd 結晶化半導体層の形成方法及び形成装置ならびに半導体装置の製造方法
TWI344706B (en) * 2003-06-04 2011-07-01 Myung Cheol Yoo Method of fabricating vertical structure compound semiconductor devices
JP2005045209A (ja) * 2003-07-09 2005-02-17 Mitsubishi Electric Corp レーザアニール方法
WO2005029546A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
WO2005029551A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
US7318866B2 (en) 2003-09-16 2008-01-15 The Trustees Of Columbia University In The City Of New York Systems and methods for inducing crystallization of thin films using multiple optical paths
US7164152B2 (en) 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
WO2005029548A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York System and process for providing multiple beam sequential lateral solidification
WO2005029549A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for facilitating bi-directional growth
US7364952B2 (en) * 2003-09-16 2008-04-29 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
WO2005029547A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Enhancing the width of polycrystalline grains with mask
WO2005034193A2 (en) 2003-09-19 2005-04-14 The Trustees Of Columbia University In The City Ofnew York Single scan irradiation for crystallization of thin films
JP4413569B2 (ja) * 2003-09-25 2010-02-10 株式会社 日立ディスプレイズ 表示パネルの製造方法及び表示パネル
JP2005217209A (ja) * 2004-01-30 2005-08-11 Hitachi Ltd レーザアニール方法およびレーザアニール装置
WO2005104780A2 (en) * 2004-04-28 2005-11-10 Verticle, Inc Vertical structure semiconductor devices
TWI433343B (zh) * 2004-06-22 2014-04-01 維帝克股份有限公司 具有改良光輸出的垂直構造半導體裝置
JP2006024735A (ja) * 2004-07-08 2006-01-26 Seiko Instruments Inc 半導体膜の結晶化方法、及び、表示装置の製造方法
TWI389334B (zh) * 2004-11-15 2013-03-11 Verticle Inc 製造及分離半導體裝置之方法
US7645337B2 (en) 2004-11-18 2010-01-12 The Trustees Of Columbia University In The City Of New York Systems and methods for creating crystallographic-orientation controlled poly-silicon films
JP2006278532A (ja) * 2005-03-28 2006-10-12 Toshiba Corp 熱処理方法及び半導体装置の製造方法
US8221544B2 (en) 2005-04-06 2012-07-17 The Trustees Of Columbia University In The City Of New York Line scan sequential lateral solidification of thin films
TWI389316B (zh) * 2005-09-08 2013-03-11 Sharp Kk 薄膜電晶體、半導體裝置、顯示器、結晶化方法及製造薄膜電晶體方法
JP4855745B2 (ja) 2005-09-27 2012-01-18 株式会社 日立ディスプレイズ 表示装置の製造方法
JP5128767B2 (ja) * 2005-11-14 2013-01-23 株式会社ジャパンディスプレイイースト 表示装置とその製造方法
US7829909B2 (en) * 2005-11-15 2010-11-09 Verticle, Inc. Light emitting diodes and fabrication methods thereof
JP2007142027A (ja) * 2005-11-16 2007-06-07 Hitachi Displays Ltd 表示装置の製造方法
JP2007142167A (ja) * 2005-11-18 2007-06-07 Hitachi Displays Ltd 表示装置およびその製造方法
US20070117287A1 (en) * 2005-11-23 2007-05-24 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
WO2007067541A2 (en) 2005-12-05 2007-06-14 The Trustees Of Columbia University In The City Of New York Systems and methods for processing a film, and thin films
JP2008004666A (ja) * 2006-06-21 2008-01-10 Ftl:Kk 3次元半導体デバイスの製造方法
JP2008053396A (ja) * 2006-08-24 2008-03-06 Hitachi Displays Ltd 表示装置の製造方法
TWI479660B (zh) * 2006-08-31 2015-04-01 Semiconductor Energy Lab 薄膜電晶體,其製造方法,及半導體裝置
US20080070423A1 (en) * 2006-09-15 2008-03-20 Crowder Mark A Buried seed one-shot interlevel crystallization
JP5005302B2 (ja) 2006-09-19 2012-08-22 株式会社ジャパンディスプレイイースト 表示装置の製造方法
JP2008085053A (ja) * 2006-09-27 2008-04-10 Hitachi Displays Ltd 表示装置の製造方法および表示装置
KR101397567B1 (ko) * 2007-01-24 2014-05-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체막의 결정화 방법 및 반도체장치의 제작방법
JP4411331B2 (ja) * 2007-03-19 2010-02-10 信越化学工業株式会社 磁気記録媒体用シリコン基板およびその製造方法
US8441018B2 (en) 2007-08-16 2013-05-14 The Trustees Of Columbia University In The City Of New York Direct bandgap substrates and methods of making and using
JP2009070861A (ja) * 2007-09-11 2009-04-02 Hitachi Displays Ltd 表示装置
TW200942935A (en) 2007-09-21 2009-10-16 Univ Columbia Collections of laterally crystallized semiconductor islands for use in thin film transistors and systems and methods for making same
WO2009042784A1 (en) 2007-09-25 2009-04-02 The Trustees Of Columbia University In The City Of New York Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
EP2212913A4 (en) 2007-11-21 2013-10-30 Univ Columbia SYSTEMS AND METHOD FOR PRODUCING EPITACTIC STRUCTURED THICK FILMS
US8012861B2 (en) 2007-11-21 2011-09-06 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
WO2009111340A2 (en) 2008-02-29 2009-09-11 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
AU2008352028B2 (en) * 2008-03-06 2014-01-09 Amit Goyal Semiconductor-based, large-area, flexible, electronic devices on {110}less than100greater than oriented substrates
KR20110094022A (ko) 2008-11-14 2011-08-19 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 박막 결정화를 위한 시스템 및 방법
EP2239084A1 (en) * 2009-04-07 2010-10-13 Excico France Method of and apparatus for irradiating a semiconductor material surface by laser energy
TW201037769A (en) * 2009-04-09 2010-10-16 Chunghwa Picture Tubes Ltd Thin film transistor and manufacturing method thereof
FR2946335B1 (fr) * 2009-06-05 2011-09-02 Saint Gobain Procede de depot de couche mince et produit obtenu.
US9087696B2 (en) 2009-11-03 2015-07-21 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse partial melt film processing
US8440581B2 (en) 2009-11-24 2013-05-14 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse sequential lateral solidification
US9646831B2 (en) 2009-11-03 2017-05-09 The Trustees Of Columbia University In The City Of New York Advanced excimer laser annealing for thin films
WO2013031198A1 (ja) 2011-08-30 2013-03-07 パナソニック株式会社 薄膜形成基板の製造方法、薄膜素子基板の製造方法、薄膜基板及び薄膜素子基板
US9111803B2 (en) 2011-10-03 2015-08-18 Joled Inc. Thin-film device, thin-film device array, and method of manufacturing thin-film device
CN113056821B (zh) * 2018-11-20 2025-03-25 美光科技公司 具有半导体氧化物沟道材料的集成组合件和形成集成组合件的方法
KR102688603B1 (ko) 2019-07-30 2024-07-25 삼성디스플레이 주식회사 레이저 결정화 장치 및 이를 이용한 폴리실리콘층을 갖는 기판 제조방법
EP4010930A4 (en) 2019-08-09 2023-03-01 Micron Technology, Inc. Transistor and methods of forming transistors
US11024736B2 (en) 2019-08-09 2021-06-01 Micron Technology, Inc. Transistor and methods of forming integrated circuitry
US10964811B2 (en) 2019-08-09 2021-03-30 Micron Technology, Inc. Transistor and methods of forming transistors
KR20210070417A (ko) 2019-12-04 2021-06-15 삼성디스플레이 주식회사 표시 장치
US11637175B2 (en) * 2020-12-09 2023-04-25 Micron Technology, Inc. Vertical transistors

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187730A (ja) * 1997-09-03 1999-03-30 Asahi Glass Co Ltd 多結晶半導体薄膜、その形成方法、多結晶半導体tft、およびtft基板

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US40981A (en) * 1863-12-15 Improvement in lever-jacks
JPS5717174A (en) * 1980-07-03 1982-01-28 Hitachi Ltd Semiconductor device
JPS6091622A (ja) * 1983-10-26 1985-05-23 Hitachi Ltd 半導体基板の製造方法
JPS6450569A (en) * 1987-08-21 1989-02-27 Nec Corp Manufacture of polycrystalline silicon thin film transistor
JPS6459807A (en) * 1987-08-29 1989-03-07 Ricoh Kk Material for thin-film transistor
JPH0368167A (ja) * 1989-08-07 1991-03-25 Hitachi Ltd 半導体装置の製造方法およびそれによって得られる半導体装置
NZ234877A (en) 1989-08-28 1994-01-26 Squibb & Sons Inc Faceplate, for an ostomy device, having a convex upper surface portion
US5405454A (en) * 1992-03-19 1995-04-11 Matsushita Electric Industrial Co., Ltd. Electrically insulated silicon structure and producing method therefor
US5889298A (en) * 1993-04-30 1999-03-30 Texas Instruments Incorporated Vertical JFET field effect transistor
US5818076A (en) * 1993-05-26 1998-10-06 Semiconductor Energy Laboratory Co., Ltd. Transistor and semiconductor device
US6730549B1 (en) * 1993-06-25 2004-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for its preparation
US6884698B1 (en) * 1994-02-23 2005-04-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with crystallization of amorphous silicon
TW305063B (enExample) * 1995-02-02 1997-05-11 Handotai Energy Kenkyusho Kk
US6524977B1 (en) * 1995-07-25 2003-02-25 Semiconductor Energy Laboratory Co., Ltd. Method of laser annealing using linear beam having quasi-trapezoidal energy profile for increased depth of focus
JP3301054B2 (ja) * 1996-02-13 2002-07-15 株式会社半導体エネルギー研究所 レーザー照射装置及びレーザー照射方法
JP3204986B2 (ja) 1996-05-28 2001-09-04 ザ トラスティース オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上の半導体膜領域の結晶化処理及びこの方法により製造されたデバイス
JP2716036B2 (ja) * 1996-10-18 1998-02-18 株式会社日立製作所 薄膜半導体装置の製造方法
JP4017706B2 (ja) * 1997-07-14 2007-12-05 株式会社半導体エネルギー研究所 半導体装置
TW408351B (en) * 1997-10-17 2000-10-11 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
JP2000174282A (ja) * 1998-12-03 2000-06-23 Semiconductor Energy Lab Co Ltd 半導体装置
JP2001053020A (ja) * 1999-08-06 2001-02-23 Sony Corp 半導体薄膜の結晶化方法及び薄膜半導体装置の製造方法
US6573531B1 (en) * 1999-09-03 2003-06-03 The Trustees Of Columbia University In The City Of New York Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
US6872607B2 (en) * 2000-03-21 2005-03-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US6451631B1 (en) * 2000-08-10 2002-09-17 Hitachi America, Ltd. Thin film crystal growth by laser annealing
US6737672B2 (en) * 2000-08-25 2004-05-18 Fujitsu Limited Semiconductor device, manufacturing method thereof, and semiconductor manufacturing apparatus
JP4744700B2 (ja) * 2001-01-29 2011-08-10 株式会社日立製作所 薄膜半導体装置及び薄膜半導体装置を含む画像表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187730A (ja) * 1997-09-03 1999-03-30 Asahi Glass Co Ltd 多結晶半導体薄膜、その形成方法、多結晶半導体tft、およびtft基板

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