KR100577947B1 - 이방 도전성 커넥터 및 그 제조 방법 및 프로우브 부재 - Google Patents

이방 도전성 커넥터 및 그 제조 방법 및 프로우브 부재 Download PDF

Info

Publication number
KR100577947B1
KR100577947B1 KR1020037010446A KR20037010446A KR100577947B1 KR 100577947 B1 KR100577947 B1 KR 100577947B1 KR 1020037010446 A KR1020037010446 A KR 1020037010446A KR 20037010446 A KR20037010446 A KR 20037010446A KR 100577947 B1 KR100577947 B1 KR 100577947B1
Authority
KR
South Korea
Prior art keywords
wafer
anisotropic conductive
conductive film
integrated circuit
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020037010446A
Other languages
English (en)
Korean (ko)
Other versions
KR20030083710A (ko
Inventor
데루까즈 고꾸보
고오지 세노
마사야 나오이
가즈오 이노우에
Original Assignee
제이에스알 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이에스알 가부시끼가이샤 filed Critical 제이에스알 가부시끼가이샤
Publication of KR20030083710A publication Critical patent/KR20030083710A/ko
Application granted granted Critical
Publication of KR100577947B1 publication Critical patent/KR100577947B1/ko
Assigned to 주식회사 아이에스시 reassignment 주식회사 아이에스시 권리의 전부이전등록 Assignors: 제이에스알 가부시끼가이샤
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Laminated Bodies (AREA)
KR1020037010446A 2001-02-09 2002-02-06 이방 도전성 커넥터 및 그 제조 방법 및 프로우브 부재 Expired - Lifetime KR100577947B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001033908 2001-02-09
JPJP-P-2001-00033908 2001-02-09
PCT/JP2002/000959 WO2002065588A1 (en) 2001-02-09 2002-02-06 Anisotropic conductive connector, its manufacture method and probe member

Publications (2)

Publication Number Publication Date
KR20030083710A KR20030083710A (ko) 2003-10-30
KR100577947B1 true KR100577947B1 (ko) 2006-05-10

Family

ID=18897592

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037010446A Expired - Lifetime KR100577947B1 (ko) 2001-02-09 2002-02-06 이방 도전성 커넥터 및 그 제조 방법 및 프로우브 부재

Country Status (9)

Country Link
US (2) US6969622B1 (https=)
EP (1) EP1365479B1 (https=)
JP (3) JP3804542B2 (https=)
KR (1) KR100577947B1 (https=)
CN (1) CN1246932C (https=)
AT (1) ATE494645T1 (https=)
DE (1) DE60238824D1 (https=)
TW (1) TW533624B (https=)
WO (1) WO2002065588A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101284210B1 (ko) 2011-09-30 2013-07-09 주식회사 아이에스시 검사용 커넥터, 검사용 소켓, 검사용 커넥터의 제조방법 및 검사용 소켓의 제조방법

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002065588A1 (en) 2001-02-09 2002-08-22 Jsr Corporation Anisotropic conductive connector, its manufacture method and probe member
JP3573120B2 (ja) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品
ATE367650T1 (de) * 2002-08-09 2007-08-15 Jsr Corp Prüfverbinder mit anisotroper leitfähigkeit
JP2004172588A (ja) * 2002-10-28 2004-06-17 Jsr Corp シート状コネクターおよびその製造方法並びにプローブ装置
WO2004066449A1 (ja) * 2003-01-17 2004-08-05 Jsr Corporation 異方導電性コネクターおよびその製造方法並びに回路装置の検査装置
CN100359659C (zh) * 2003-02-18 2008-01-02 Jsr株式会社 各向异性导电连接器、探测部件和晶片检测设备以及晶片检测方法
EP1608040A4 (en) * 2003-03-26 2007-11-14 Jsr Corp ANISOTROPER CONDUCTIVE CONNECTOR, CONDUCTIVE PASTE COMPOSITION, SONDER, WAFER INSPECTION DEVICE AND WAFER SEARCH METHOD
TWI239684B (en) 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
JP2005026672A (ja) * 2003-06-09 2005-01-27 Jsr Corp 異方導電性コネクターおよびウエハ検査装置
CN1806178A (zh) * 2003-06-09 2006-07-19 Jsr株式会社 各向异性导电性连接器以及晶片检测装置
US7309244B2 (en) * 2003-06-12 2007-12-18 Jsr Corporation Anisotropic conductive connector device and production method therefor and circuit device inspection device
US20050046016A1 (en) * 2003-09-03 2005-03-03 Ken Gilleo Electronic package with insert conductor array
US20070040245A1 (en) * 2003-11-17 2007-02-22 Jsr Corporation Anisotropic conductive sheet, manufacturing method thereof, and product using the same
US20060177971A1 (en) * 2004-01-13 2006-08-10 Jsr Corporation Anisotropically conductive connector, production process thereof and application product thereof
WO2005103730A1 (ja) * 2004-04-27 2005-11-03 Jsr Corporation シート状プローブおよびその製造方法並びにその応用
EP1750136A1 (en) * 2004-05-19 2007-02-07 JSR Corporation Sheet-like probe, method of producing the probe, and application of the probe
CN100582798C (zh) * 2004-06-03 2010-01-20 国际整流器公司 包含各向异性导电膜的用于测试功率模块的测试装置
CN1989606A (zh) * 2004-08-31 2007-06-27 Jsr株式会社 晶片检验用各向异性导电性连接器及其制造方法和其应用
WO2006043631A1 (ja) * 2004-10-22 2006-04-27 Jsr Corporation ウエハ検査用異方導電性コネクターおよびその製造方法、ウエハ検査用プローブカードおよびその製造方法並びにウエハ検査装置
WO2006046650A1 (ja) * 2004-10-29 2006-05-04 Jsr Corporation ウエハ検査用探針部材、ウエハ検査用プローブカードおよびウエハ検査装置
US20070268032A1 (en) * 2004-11-12 2007-11-22 Jsr Corporation Probe Member for Wafer Inspection, Probe Card for Wafer Inspection and Wafer Inspection Apparatus
US20060132167A1 (en) * 2004-12-22 2006-06-22 Jian Chen Contactless wafer level burn-in
JP2006216502A (ja) * 2005-02-07 2006-08-17 Jsr Corp 異方導電性コネクター、プローブカード並びにウエハ検査装置およびウエハ検査方法
JP2006349671A (ja) * 2005-05-19 2006-12-28 Jsr Corp ウエハ検査用シート状プローブおよびその応用
JP4472593B2 (ja) * 2005-07-12 2010-06-02 東京エレクトロン株式会社 プローブカード
JP4604893B2 (ja) * 2005-07-19 2011-01-05 住友電気工業株式会社 複合多孔質樹脂基材及びその製造方法
JP2007071699A (ja) * 2005-09-07 2007-03-22 Rika Denshi Co Ltd 垂直型プローブカード
US20070054512A1 (en) * 2005-09-08 2007-03-08 International Business Machines Corporation Topography compensating land grid array interposer
JPWO2007043350A1 (ja) * 2005-10-11 2009-04-16 Jsr株式会社 異方導電性コネクター装置および回路装置の検査装置
TWI403723B (zh) * 2005-12-21 2013-08-01 Jsr股份有限公司 Manufacturing method of foreign - shaped conductive connector
US7821283B2 (en) 2005-12-22 2010-10-26 Jsr Corporation Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus
WO2007116826A1 (ja) * 2006-04-11 2007-10-18 Jsr Corporation 異方導電性コネクターおよび異方導電性コネクター装置
JP4902867B2 (ja) * 2006-04-19 2012-03-21 パナソニック株式会社 電子部品の接続方法及び突起電極の形成方法、並びに電子部品実装体及び突起電極の製造装置
DE102006059429A1 (de) * 2006-12-15 2008-06-26 Atg Luther & Maelzer Gmbh Modul für eine Prüfvorrichtung zum Testen von Leiterplatten
JP2010133706A (ja) * 2007-03-19 2010-06-17 Jsr Corp 異方導電性コネクターおよび導電接続構造体
KR101402144B1 (ko) * 2007-03-30 2014-06-03 주식회사 아이에스시 이방 도전성 커넥터, 프로브 부재 및 웨이퍼 검사 장치
DE102007017641A1 (de) * 2007-04-13 2008-10-16 Infineon Technologies Ag Aushärtung von Schichten am Halbleitermodul mittels elektromagnetischer Felder
US7750651B2 (en) * 2008-03-07 2010-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer level test probe card
JP5424675B2 (ja) * 2008-03-18 2014-02-26 キヤノン株式会社 半導体装置の製造方法及び半導体装置
US20120249375A1 (en) 2008-05-23 2012-10-04 Nokia Corporation Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications
CN102484327B (zh) * 2009-09-02 2015-07-29 保力马科技(日本)株式会社 各向异性导电体及各向异性导电体的制造方法、以及各向异性导电体阵列片
US9442133B1 (en) * 2011-08-21 2016-09-13 Bruker Nano Inc. Edge electrode for characterization of semiconductor wafers
US9176167B1 (en) * 2011-08-21 2015-11-03 Bruker Nano Inc. Probe and method of manufacture for semiconductor wafer characterization
JP6079425B2 (ja) * 2012-05-16 2017-02-15 日立化成株式会社 導電粒子、異方性導電接着剤フィルム及び接続構造体
US9678109B2 (en) * 2014-01-09 2017-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Probe card
KR101573450B1 (ko) * 2014-07-17 2015-12-11 주식회사 아이에스시 테스트용 소켓
TWI862897B (zh) * 2014-11-17 2024-11-21 日商迪睿合股份有限公司 異向性導電膜及連接構造體
KR101833009B1 (ko) 2016-03-18 2018-02-27 주식회사 오킨스전자 도전성 파티클이 자화된 도전 와이어에 의하여 자성 배열되는 테스트 소켓 및 그 제조 방법
JP6935702B2 (ja) * 2016-10-24 2021-09-15 デクセリアルズ株式会社 異方性導電フィルム
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
KR102361639B1 (ko) 2017-07-10 2022-02-10 삼성전자주식회사 유니버설 테스트 소켓, 반도체 테스트 장비, 및 반도체 장치의 테스트 방법
CN107479274A (zh) * 2017-07-11 2017-12-15 武汉华星光电半导体显示技术有限公司 显示面板与外接电路的邦定方法及显示装置
CN108538792A (zh) 2018-05-16 2018-09-14 武汉华星光电半导体显示技术有限公司 导电物质分布状态可控的异方性导电胶及其制备方法
CN109188790B (zh) * 2018-09-13 2022-04-15 京东方科技集团股份有限公司 基板及其制作方法、显示装置
JP7405337B2 (ja) * 2018-10-11 2023-12-26 積水ポリマテック株式会社 電気接続シート、及び端子付きガラス板構造
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102063763B1 (ko) * 2019-01-08 2020-01-08 (주)티에스이 신호 전송 커넥터 및 그 제조방법
CN110767348A (zh) * 2019-11-12 2020-02-07 业成科技（成都）有限公司 异方性导电膜及其制作方法
JP2021085701A (ja) 2019-11-26 2021-06-03 デクセリアルズ株式会社 プローブシート及びプローブシートの製造方法
TWI750578B (zh) * 2020-02-04 2021-12-21 吳在淑 信號傳輸連接器及其製造方法
KR102732569B1 (ko) * 2022-07-13 2024-11-20 주식회사 아이에스시 도전성 입자, 도전성 입자의 제조방법 및 검사용 커넥터
KR102734442B1 (ko) * 2022-09-01 2024-11-26 주식회사 티에스이 신호 전송 커넥터

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014419A (en) 1987-05-21 1991-05-14 Cray Computer Corporation Twisted wire jumper electrical interconnector and method of making
JPH02269978A (ja) * 1989-04-12 1990-11-05 Toppan Printing Co Ltd 回路配線板検査方法及び検査位置変換装置用回路配線板
JPH02293674A (ja) * 1989-05-09 1990-12-04 Nippon Telegr & Teleph Corp <Ntt> ベアボード試験方法とそれに用いられる試験治具
US5298686A (en) * 1990-10-23 1994-03-29 Westinghouse Electric Corp. System and method for implementing wiring changes in a solderless printed wiring board module
US5109320A (en) * 1990-12-24 1992-04-28 Westinghouse Electric Corp. System for connecting integrated circuit dies to a printed wiring board
EP0558855A3 (en) 1992-03-02 1996-05-01 American Telephone & Telegraph Circuit board stack with novel cross-over cells
JP2828410B2 (ja) 1993-12-21 1998-11-25 松下電器産業株式会社 プローブカード及び半導体チップの検査方法
JP2925964B2 (ja) 1994-04-21 1999-07-28 松下電器産業株式会社 半導体ウェハ収納器及び半導体集積回路の検査方法
JP2908747B2 (ja) * 1996-01-10 1999-06-21 三菱電機株式会社 Ｉｃソケット
JPH09223860A (ja) * 1996-02-16 1997-08-26 Japan Synthetic Rubber Co Ltd 検査用回路基板装置
JP3172760B2 (ja) * 1997-03-07 2001-06-04 東京エレクトロン株式会社 バキュームコンタクタ
JPH1140224A (ja) 1997-07-11 1999-02-12 Jsr Corp 異方導電性シート
JPH11160356A (ja) 1997-11-25 1999-06-18 Matsushita Electric Ind Co Ltd ウェハ一括型測定検査用プローブカードおよびセラミック多層配線基板ならびにそれらの製造方法
JPH11204177A (ja) * 1998-01-07 1999-07-30 Jsr Corp シート状コネクター
JP3557887B2 (ja) * 1998-01-14 2004-08-25 日立ハイテク電子エンジニアリング株式会社 Ｉｃデバイスのコンタクト装置
JP2000131341A (ja) * 1998-10-29 2000-05-12 Micronics Japan Co Ltd プローブカード
JP3737899B2 (ja) * 1999-01-29 2006-01-25 日東電工株式会社 半導体素子の検査方法およびそのための異方導電性フィルム
JP2000241485A (ja) * 1999-02-24 2000-09-08 Jsr Corp 回路基板の電気抵抗測定装置および方法
JP2000331538A (ja) * 1999-05-17 2000-11-30 Nitto Denko Corp 異方導電性フィルムおよびその製造方法
JP4099905B2 (ja) 1999-06-08 2008-06-11 Ｊｓｒ株式会社 異方導電性シート用支持体および支持体付異方導電性シート
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
JP4240724B2 (ja) * 2000-01-26 2009-03-18 Ｊｓｒ株式会社 異方導電性シートおよびコネクター
EP1195860B1 (en) * 2000-09-25 2004-12-01 JSR Corporation Anisotropically conductive sheet, production process thereof and applied product thereof
US6663799B2 (en) * 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
KR20030078870A (ko) * 2000-12-08 2003-10-08 제이에스알 가부시끼가이샤 이방 도전성 시트 및 웨이퍼 검사 장치
WO2002065588A1 (en) 2001-02-09 2002-08-22 Jsr Corporation Anisotropic conductive connector, its manufacture method and probe member
JP3573120B2 (ja) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101284210B1 (ko) 2011-09-30 2013-07-09 주식회사 아이에스시 검사용 커넥터, 검사용 소켓, 검사용 커넥터의 제조방법 및 검사용 소켓의 제조방법

Also Published As

Publication number Publication date
KR20030083710A (ko) 2003-10-30
JP3788361B2 (ja) 2006-06-21
JP2002324600A (ja) 2002-11-08
JP3804542B2 (ja) 2006-08-02
WO2002065588A1 (en) 2002-08-22
DE60238824D1 (de) 2011-02-17
US6969622B1 (en) 2005-11-29
CN1246932C (zh) 2006-03-22
EP1365479A4 (en) 2007-12-26
JP2005056860A (ja) 2005-03-03
EP1365479A1 (en) 2003-11-26
CN1496597A (zh) 2004-05-12
EP1365479B1 (en) 2011-01-05
US20060033100A1 (en) 2006-02-16
ATE494645T1 (de) 2011-01-15
US7323712B2 (en) 2008-01-29
TW533624B (en) 2003-05-21
JP3807432B2 (ja) 2006-08-09
JP2002334732A (ja) 2002-11-22

Similar Documents

Publication Publication Date Title
KR100577947B1 (ko) 이방 도전성 커넥터 및 그 제조 방법 및 프로우브 부재
JP3543765B2 (ja) ウエハ検査用プローブ装置
KR100756707B1 (ko) 이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치
KR100844627B1 (ko) 이방 도전성 시트, 그의 제조 방법 및 그의 응용
KR100684221B1 (ko) 이방 도전성 커넥터 및 웨이퍼 검사 장치
KR101057517B1 (ko) 시트형 프로브, 및 그 제조 방법과 응용
KR100715751B1 (ko) 이방 도전성 커넥터 및 프로우브 부재 및 웨이퍼 검사장치 및 웨이퍼 검사 방법
JP3788258B2 (ja) 異方導電性コネクターおよびその応用製品
JP3573120B2 (ja) 異方導電性コネクターおよびその製造方法並びにその応用製品
JP2003077559A (ja) 異方導電性コネクターおよびその製造方法並びにその応用製品
JP4479477B2 (ja) 異方導電性シートおよびその製造方法並びにその応用製品
JP3726839B2 (ja) プローブ装置およびこのプローブ装置を具えたウエハ検査装置並びにウエハ検査方法
JP4470316B2 (ja) 異方導電性シートおよび回路装置の電気的検査装置
JP3928607B2 (ja) 異方導電性シート、その製造方法およびその応用
JP3906068B2 (ja) 異方導電性シート、コネクターおよびウエハ検査装置
JP4273982B2 (ja) 異方導電性シートの製造方法および異方導電性コネクターの製造方法
JP3879464B2 (ja) 回路装置検査用異方導電性シートおよびその製造方法並びにその応用製品
JP4099905B2 (ja) 異方導電性シート用支持体および支持体付異方導電性シート
JP3938117B2 (ja) 異方導電性コネクターおよびプローブ部材並びにウエハ検査装置およびウエハ検査方法
JP2006284418A (ja) ウエハ検査用プローブカードおよびウエハ検査装置
JP3874084B2 (ja) 異方導電性コネクターおよびそれを有する検査装置並びに異方導電性コネクターの製造方法
JP2002025351A (ja) 異方導電性シートおよびその製造方法並びに回路装置の電気的検査装置
JP2006105851A (ja) シート状プローブおよびその製造方法並びにその応用

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20030808

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20040830

Comment text: Request for Examination of Application

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20060407

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20060502

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20060503

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20090424

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20100427

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20110421

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20120423

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20130502

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20130502

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20140418

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20140418

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20150430

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20150430

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20170424

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20170424

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20190429

Year of fee payment: 14

PR1001 Payment of annual fee

Payment date: 20190429

Start annual number: 14

End annual number: 14

PR1001 Payment of annual fee

Payment date: 20200420

Start annual number: 15

End annual number: 15

PR1001 Payment of annual fee

Payment date: 20210427

Start annual number: 16

End annual number: 16

PC1801 Expiration of term

Termination date: 20220806

Termination category: Expiration of duration