KR100571967B1 - 소형 광대역 변환기 - Google Patents
소형 광대역 변환기 Download PDFInfo
- Publication number
- KR100571967B1 KR100571967B1 KR1020037002017A KR20037002017A KR100571967B1 KR 100571967 B1 KR100571967 B1 KR 100571967B1 KR 1020037002017 A KR1020037002017 A KR 1020037002017A KR 20037002017 A KR20037002017 A KR 20037002017A KR 100571967 B1 KR100571967 B1 KR 100571967B1
- Authority
- KR
- South Korea
- Prior art keywords
- diaphragm
- cover member
- acoustic transducer
- silicon
- substrate
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63740100A | 2000-08-11 | 2000-08-11 | |
US09/637,401 | 2000-08-11 | ||
US09/910,110 | 2001-07-20 | ||
US09/910,110 US6987859B2 (en) | 2001-07-20 | 2001-07-20 | Raised microstructure of silicon based device |
PCT/US2001/025184 WO2002015636A2 (en) | 2000-08-11 | 2001-08-10 | Miniature broadband transducer |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030033026A KR20030033026A (ko) | 2003-04-26 |
KR100571967B1 true KR100571967B1 (ko) | 2006-04-18 |
Family
ID=27092826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037002017A KR100571967B1 (ko) | 2000-08-11 | 2001-08-10 | 소형 광대역 변환기 |
Country Status (9)
Country | Link |
---|---|
EP (2) | EP1310136B1 (da) |
JP (3) | JP4338395B2 (da) |
KR (1) | KR100571967B1 (da) |
CN (2) | CN1498513B (da) |
AT (2) | ATE321429T1 (da) |
AU (1) | AU2001281241A1 (da) |
DE (2) | DE60118208T2 (da) |
DK (2) | DK1469701T3 (da) |
WO (1) | WO2002015636A2 (da) |
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KR101113366B1 (ko) * | 2008-02-20 | 2012-03-02 | 오므론 가부시키가이샤 | 정전 용량형 진동 센서 |
KR101158223B1 (ko) * | 2008-07-25 | 2012-06-19 | 오므론 가부시키가이샤 | 정전용량형 진동 센서 |
KR101807069B1 (ko) * | 2016-10-21 | 2017-12-08 | 현대자동차 주식회사 | 마이크로폰 및 그 제조방법 |
KR101807071B1 (ko) * | 2016-10-06 | 2017-12-08 | 현대자동차 주식회사 | 마이크로폰 및 그 제조 방법 |
WO2020072904A1 (en) * | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance |
US11528546B2 (en) | 2021-04-05 | 2022-12-13 | Knowles Electronics, Llc | Sealed vacuum MEMS die |
US11540048B2 (en) | 2021-04-16 | 2022-12-27 | Knowles Electronics, Llc | Reduced noise MEMS device with force feedback |
US11649161B2 (en) | 2021-07-26 | 2023-05-16 | Knowles Electronics, Llc | Diaphragm assembly with non-uniform pillar distribution |
US11671766B2 (en) | 2018-10-05 | 2023-06-06 | Knowles Electronics, Llc. | Microphone device with ingress protection |
US11772961B2 (en) | 2021-08-26 | 2023-10-03 | Knowles Electronics, Llc | MEMS device with perimeter barometric relief pierce |
US11780726B2 (en) | 2021-11-03 | 2023-10-10 | Knowles Electronics, Llc | Dual-diaphragm assembly having center constraint |
US11787688B2 (en) | 2018-10-05 | 2023-10-17 | Knowles Electronics, Llc | Methods of forming MEMS diaphragms including corrugations |
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US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
US6987859B2 (en) | 2001-07-20 | 2006-01-17 | Knowles Electronics, Llc. | Raised microstructure of silicon based device |
US7439616B2 (en) | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
US7166910B2 (en) | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US8617934B1 (en) | 2000-11-28 | 2013-12-31 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages |
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US7023066B2 (en) | 2001-11-20 | 2006-04-04 | Knowles Electronics, Llc. | Silicon microphone |
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DE10238523B4 (de) | 2002-08-22 | 2014-10-02 | Epcos Ag | Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung |
US6781231B2 (en) | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
JP2004356707A (ja) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | 音響検出機構 |
US7030536B2 (en) * | 2003-12-29 | 2006-04-18 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
JP4201723B2 (ja) * | 2004-02-13 | 2008-12-24 | 東京エレクトロン株式会社 | 容量検知型センサ素子 |
DE102004020204A1 (de) | 2004-04-22 | 2005-11-10 | Epcos Ag | Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung |
US7329933B2 (en) | 2004-10-29 | 2008-02-12 | Silicon Matrix Pte. Ltd. | Silicon microphone with softly constrained diaphragm |
US7346178B2 (en) * | 2004-10-29 | 2008-03-18 | Silicon Matrix Pte. Ltd. | Backplateless silicon microphone |
JP4539450B2 (ja) | 2004-11-04 | 2010-09-08 | オムロン株式会社 | 容量型振動センサ及びその製造方法 |
KR100685092B1 (ko) * | 2005-03-14 | 2007-02-22 | 주식회사 케이이씨 | Mems 공정을 이용한 마이크로폰 및 그 제조 방법 |
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US7825484B2 (en) | 2005-04-25 | 2010-11-02 | Analog Devices, Inc. | Micromachined microphone and multisensor and method for producing same |
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DE102005031601B4 (de) * | 2005-07-06 | 2016-03-03 | Robert Bosch Gmbh | Kapazitives, mikromechanisches Mikrofon |
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KR100765149B1 (ko) * | 2005-10-05 | 2007-10-15 | 전자부품연구원 | 초소형 음향 감지 장치 및 그 제조 방법 |
KR100785803B1 (ko) * | 2005-12-07 | 2007-12-13 | 한국전자통신연구원 | 판 스프링 구조를 갖는 초소형 마이크로 폰, 스피커 및이를 이용한 음성 인식/합성장치 |
DE102006001493B4 (de) * | 2006-01-11 | 2007-10-18 | Austriamicrosystems Ag | MEMS-Sensor und Verfahren zur Herstellung |
CN105704622A (zh) * | 2006-01-20 | 2016-06-22 | 应美盛股份有限公司 | 用于电容式传声器隔膜的支撑设备 |
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2001
- 2001-08-10 DK DK04076015T patent/DK1469701T3/da active
- 2001-08-10 EP EP01959715A patent/EP1310136B1/en not_active Expired - Lifetime
- 2001-08-10 AT AT01959715T patent/ATE321429T1/de not_active IP Right Cessation
- 2001-08-10 AU AU2001281241A patent/AU2001281241A1/en not_active Abandoned
- 2001-08-10 CN CN018140300A patent/CN1498513B/zh not_active Expired - Lifetime
- 2001-08-10 DK DK01959715T patent/DK1310136T3/da active
- 2001-08-10 DE DE60118208T patent/DE60118208T2/de not_active Expired - Lifetime
- 2001-08-10 DE DE60133679T patent/DE60133679T2/de not_active Expired - Lifetime
- 2001-08-10 JP JP2002519372A patent/JP4338395B2/ja not_active Expired - Fee Related
- 2001-08-10 AT AT04076015T patent/ATE392790T1/de not_active IP Right Cessation
- 2001-08-10 EP EP04076015A patent/EP1469701B1/en not_active Expired - Lifetime
- 2001-08-10 KR KR1020037002017A patent/KR100571967B1/ko not_active IP Right Cessation
- 2001-08-10 WO PCT/US2001/025184 patent/WO2002015636A2/en active IP Right Grant
- 2001-08-10 CN CN2010102062254A patent/CN101867858B/zh not_active Expired - Lifetime
-
2006
- 2006-11-06 JP JP2006300831A patent/JP2007116721A/ja active Pending
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- 2009-04-01 JP JP2009088945A patent/JP5049312B2/ja not_active Expired - Fee Related
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KR101113366B1 (ko) * | 2008-02-20 | 2012-03-02 | 오므론 가부시키가이샤 | 정전 용량형 진동 센서 |
US8327711B2 (en) | 2008-02-20 | 2012-12-11 | Omron Corporation | Electrostatic capacitive vibrating sensor |
KR101158223B1 (ko) * | 2008-07-25 | 2012-06-19 | 오므론 가부시키가이샤 | 정전용량형 진동 센서 |
KR101511825B1 (ko) * | 2008-07-25 | 2015-04-14 | 오므론 가부시키가이샤 | 정전용량형 진동 센서 |
KR101807071B1 (ko) * | 2016-10-06 | 2017-12-08 | 현대자동차 주식회사 | 마이크로폰 및 그 제조 방법 |
US10149066B2 (en) | 2016-10-06 | 2018-12-04 | Hyundai Motor Company | Microphone and manufacturing method thereof |
KR101807069B1 (ko) * | 2016-10-21 | 2017-12-08 | 현대자동차 주식회사 | 마이크로폰 및 그 제조방법 |
US10341783B2 (en) | 2016-10-21 | 2019-07-02 | Hyundai Motor Company | Microphone and method of manufacturing the same |
WO2020072904A1 (en) * | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance |
US10939214B2 (en) | 2018-10-05 | 2021-03-02 | Knowles Electronics, Llc | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance |
US11617042B2 (en) | 2018-10-05 | 2023-03-28 | Knowles Electronics, Llc. | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance |
US11671766B2 (en) | 2018-10-05 | 2023-06-06 | Knowles Electronics, Llc. | Microphone device with ingress protection |
US11787688B2 (en) | 2018-10-05 | 2023-10-17 | Knowles Electronics, Llc | Methods of forming MEMS diaphragms including corrugations |
US11528546B2 (en) | 2021-04-05 | 2022-12-13 | Knowles Electronics, Llc | Sealed vacuum MEMS die |
US11540048B2 (en) | 2021-04-16 | 2022-12-27 | Knowles Electronics, Llc | Reduced noise MEMS device with force feedback |
US11649161B2 (en) | 2021-07-26 | 2023-05-16 | Knowles Electronics, Llc | Diaphragm assembly with non-uniform pillar distribution |
US11772961B2 (en) | 2021-08-26 | 2023-10-03 | Knowles Electronics, Llc | MEMS device with perimeter barometric relief pierce |
US11780726B2 (en) | 2021-11-03 | 2023-10-10 | Knowles Electronics, Llc | Dual-diaphragm assembly having center constraint |
Also Published As
Publication number | Publication date |
---|---|
ATE392790T1 (de) | 2008-05-15 |
CN101867858A (zh) | 2010-10-20 |
EP1469701A3 (en) | 2005-11-16 |
JP2007116721A (ja) | 2007-05-10 |
DK1310136T3 (da) | 2006-07-31 |
JP2009153203A (ja) | 2009-07-09 |
CN1498513A (zh) | 2004-05-19 |
JP2004506394A (ja) | 2004-02-26 |
WO2002015636A2 (en) | 2002-02-21 |
CN1498513B (zh) | 2010-07-14 |
JP4338395B2 (ja) | 2009-10-07 |
DK1469701T3 (da) | 2008-08-18 |
EP1469701A2 (en) | 2004-10-20 |
DE60118208T2 (de) | 2007-04-12 |
DE60133679D1 (de) | 2008-05-29 |
DE60133679T2 (de) | 2009-06-10 |
DE60118208D1 (de) | 2006-05-11 |
WO2002015636A3 (en) | 2002-10-24 |
KR20030033026A (ko) | 2003-04-26 |
EP1469701B1 (en) | 2008-04-16 |
EP1310136B1 (en) | 2006-03-22 |
JP5049312B2 (ja) | 2012-10-17 |
AU2001281241A1 (en) | 2002-02-25 |
CN101867858B (zh) | 2012-02-22 |
EP1310136A2 (en) | 2003-05-14 |
ATE321429T1 (de) | 2006-04-15 |
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