KR0171438B1 - 반도체 장치를 회로 기판상에 장착하는 방법 및 반도체 장치가 장착된 회로 기판 - Google Patents

반도체 장치를 회로 기판상에 장착하는 방법 및 반도체 장치가 장착된 회로 기판 Download PDF

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Publication number
KR0171438B1
KR0171438B1 KR1019940024239A KR19940024239A KR0171438B1 KR 0171438 B1 KR0171438 B1 KR 0171438B1 KR 1019940024239 A KR1019940024239 A KR 1019940024239A KR 19940024239 A KR19940024239 A KR 19940024239A KR 0171438 B1 KR0171438 B1 KR 0171438B1
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KR
South Korea
Prior art keywords
semiconductor device
circuit board
conductive adhesive
mounting
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940024239A
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English (en)
Korean (ko)
Inventor
요시히로 베스호
요시히로 도무라
Original Assignee
모리시따 요오이찌
마쯔시다 덴끼 산교 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5242647A external-priority patent/JP2548891B2/ja
Priority claimed from JP5242645A external-priority patent/JP2721789B2/ja
Priority claimed from JP5242646A external-priority patent/JP2721790B2/ja
Application filed by 모리시따 요오이찌, 마쯔시다 덴끼 산교 가부시끼 가이샤 filed Critical 모리시따 요오이찌
Application granted granted Critical
Publication of KR0171438B1 publication Critical patent/KR0171438B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W72/20—
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W72/072—
    • H10W72/073—
    • H10W72/251—
    • H10W72/856—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Wire Bonding (AREA)
KR1019940024239A 1993-09-29 1994-09-27 반도체 장치를 회로 기판상에 장착하는 방법 및 반도체 장치가 장착된 회로 기판 Expired - Fee Related KR0171438B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5242647A JP2548891B2 (ja) 1993-09-29 1993-09-29 半導体装置の実装方法とその実装体
JP5242645A JP2721789B2 (ja) 1993-09-29 1993-09-29 半導体装置の封止方法
JP5242646A JP2721790B2 (ja) 1993-09-29 1993-09-29 半導体装置の封止方法

Publications (1)

Publication Number Publication Date
KR0171438B1 true KR0171438B1 (ko) 1999-10-15

Family

ID=27333060

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940024239A Expired - Fee Related KR0171438B1 (ko) 1993-09-29 1994-09-27 반도체 장치를 회로 기판상에 장착하는 방법 및 반도체 장치가 장착된 회로 기판

Country Status (4)

Country Link
US (2) US5670826A (OSRAM)
EP (1) EP0645805B1 (OSRAM)
KR (1) KR0171438B1 (OSRAM)
DE (1) DE69426347T2 (OSRAM)

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US6020220A (en) * 1996-07-09 2000-02-01 Tessera, Inc. Compliant semiconductor chip assemblies and methods of making same
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JP3692935B2 (ja) * 1998-07-01 2005-09-07 セイコーエプソン株式会社 半導体装置の製造方法
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US6376051B1 (en) 1999-03-10 2002-04-23 Matsushita Electric Industrial Co., Ltd. Mounting structure for an electronic component and method for producing the same
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Also Published As

Publication number Publication date
DE69426347T2 (de) 2001-05-17
EP0645805B1 (en) 2000-11-29
US5651179A (en) 1997-07-29
EP0645805A3 (OSRAM) 1995-04-12
EP0645805A2 (en) 1995-03-29
US5670826A (en) 1997-09-23
DE69426347D1 (de) 2001-01-04

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