JP7297363B2 - 基板処理ツール - Google Patents
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- JP7297363B2 JP7297363B2 JP2021154527A JP2021154527A JP7297363B2 JP 7297363 B2 JP7297363 B2 JP 7297363B2 JP 2021154527 A JP2021154527 A JP 2021154527A JP 2021154527 A JP2021154527 A JP 2021154527A JP 7297363 B2 JP7297363 B2 JP 7297363B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/14—Arm movement, spatial
- Y10S901/15—Jointed arm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/27—Arm part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
- Y10T74/20329—Joint between elements
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Polarising Elements (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
Claims (9)
- 基板処理装置のフレームを設けることと、
前記フレームに接続される第1のアームを設けることであって、前記第1のアームが、上側アーム、前アームおよびエンドエフェクタを有し、第1の径方向の軸に沿って延伸および後退するように構成される3リンクアームである、第1のアームを設けることと、
前記フレームに接続される第2のアームを設けることであって、前記第2のアームが、上側アーム、前アームおよびエンドエフェクタを有し、第2の径方向の軸に沿って延伸および後退するように構成される3リンクアームであり、前記第1および第2のアームは、前記第1および第2のアームが従属する共通のベース上で共通の回転軸を有する、第2のアームを設けることと、
それぞれの径方向の軸に沿った前記第1および第2のアームの延伸および後退が結合され、前記第1および第2のアームのそれぞれのエンドエフェクタが、共通の移送面に沿って実質的に一致して移動するように、前記第1および第2のアームに結合される駆動セクションにより、それぞれの径方向の軸に沿って前記第1および第2のアームの両方を延伸させ、前記共通の回転軸を中心に前記第1および第2のアームの両方を回転させることと
を含み、
前記駆動セクションが、2自由度の駆動セクションである、
方法。 - 前記第1および第2のアームの延伸および後退は、前記第1および第2のアームの一方が延伸すると、前記第1および第2のアームの他方が後退するように、相互の延伸および後退である、請求項1記載の方法。
- それぞれのエンドエフェクタにより、少なくとも1つの基板を保持すること
をさらに含み、
前記第1および第2のアームのエンドエフェクタが、前記共通の移送面に一致して位置付けられる、
請求項1記載の方法。 - 前記駆動セクションが、同軸駆動シャフトの配置を含む、請求項1記載の方法。
- 前記エンドエフェクタのそれぞれは、前記エンドエフェクタの間の角度が、各アームによりアクセス可能な、放射状に隣接する基板保持ステーションの間の角度と実質的に一致するように、それぞれのアームに取り付けられる、請求項1記載の方法。
- 前記エンドエフェクタの間の角度が、調節可能な角度である、請求項5記載の方法。
- 少なくとも前記駆動セクションに接続される制御装置により、前記制御装置に接続される少なくとも1つのセンサから、基板検知信号を取得することと、
前記第1および第2のアームのうちの少なくとも1つのエンドエフェクタの位置にオフセットを適用することであって、前記オフセットが、少なくとも基板搬送装置の熱膨張に応じて計算される、オフセットを適用することと
をさらに含む請求項1記載の方法。 - 前記第1および第2のアームのそれぞれの上側アームが、前記駆動セクションに前記共通のベースの前記共通の回転軸で接続され、前記第1および第2のアームのそれぞれの前アームが、それぞれの上側アームにエルボ軸で接続され、前記第1および第2のアームのそれぞれのエンドエフェクタが、それぞれの前アームにリスト軸で接続される、請求項1記載の方法。
- フレームと、
前記フレームに接続される第1のアームであって、前記第1のアームが、上側アーム、前アームおよびエンドエフェクタを有し、第1の径方向の軸に沿って延伸および後退するように構成される3リンクアームである、第1のアームと、
前記フレームに接続される第2のアームであって、前記第2のアームが、上側アーム、前アームおよびエンドエフェクタを有し、第2の径方向の軸に沿って延伸および後退するように構成される3リンクアームである、第2のアームと、
前記第1および第2のアームに結合される駆動セクションと、
少なくとも前記駆動セクションに接続される制御装置と、
前記制御装置に接続される少なくとも1つのセンサと
を備え、
前記第1および第2のアームは、前記第1および第2のアームが従属する共通のベース上で共通の回転軸を有し、
前記駆動セクションは、同軸駆動スピンドルを形成する、同軸に配置された2自由度を有し、前記駆動セクションは、それぞれの径方向の軸に沿った前記第1および第2のアームの延伸および後退が結合され、前記第1および第2のアームのそれぞれのエンドエフェクタが、共通の移送面に沿って実質的に一致して移動するように、それぞれの径方向の軸に沿って前記第1および第2のアームを延伸させ、前記共通の回転軸を中心に前記第1および第2のアームを回転させるように構成され、
前記制御装置は、前記少なくとも1つのセンサから基板検知信号を得て、前記第1および第2のアームのうちの少なくとも1つのエンドエフェクタの位置にオフセットを適用するように構成され、前記オフセットが、少なくとも基板搬送装置の熱膨張に応じて計算される、
基板処理装置。
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JP2023094975A JP2023113891A (ja) | 2011-03-11 | 2023-06-08 | 基板処理ツール |
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US201161451912P | 2011-03-11 | 2011-03-11 | |
US61/451,912 | 2011-03-11 | ||
US13/417,837 | 2012-03-12 | ||
US13/417,837 US8918203B2 (en) | 2011-03-11 | 2012-03-12 | Substrate processing apparatus |
JP2019146549A JP7294940B2 (ja) | 2011-03-11 | 2019-08-08 | 基板処理ツール |
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JP2022000915A JP2022000915A (ja) | 2022-01-04 |
JP7297363B2 true JP7297363B2 (ja) | 2023-06-26 |
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JP2013557942A Active JP6059156B2 (ja) | 2011-03-11 | 2012-03-12 | 基板処理ツール |
JP2016238593A Active JP6571629B2 (ja) | 2011-03-11 | 2016-12-08 | 基板処理ツール |
JP2019146549A Active JP7294940B2 (ja) | 2011-03-11 | 2019-08-08 | 基板処理ツール |
JP2021154527A Active JP7297363B2 (ja) | 2011-03-11 | 2021-09-22 | 基板処理ツール |
JP2023094975A Pending JP2023113891A (ja) | 2011-03-11 | 2023-06-08 | 基板処理ツール |
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JP2016238593A Active JP6571629B2 (ja) | 2011-03-11 | 2016-12-08 | 基板処理ツール |
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US (7) | US8918203B2 (ja) |
JP (5) | JP6059156B2 (ja) |
KR (5) | KR102436038B1 (ja) |
CN (1) | CN103503127B (ja) |
TW (2) | TWI691388B (ja) |
WO (1) | WO2012125572A2 (ja) |
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