JP5501375B2 - ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 - Google Patents
ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0025—Means for supplying energy to the end effector
- B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
- Y10T74/20311—Robotic arm including power cable or connector
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本出願は、2009年1月11日に本出願とともに出願された「Electrostatic End Effector Apparatus,Systems and Methods for Transporting Substrates」という名称の米国特許出願第61/143,807号(代理人整理番号第13249/L号)という本発明の譲受人に譲渡された同時係属の米国特許出願および特許に関する。同出願を、あらゆる目的のために全体として参照により本明細書に組み込む。
Claims (10)
- 真空チャンバと、
前記真空チャンバ内で基板を輸送するロボット装置と
を備え、前記ロボット装置が、
前記真空チャンバ内で回転する複数のアームと、
前記複数のアームの1つの回転軸となるシャフトと、
前記複数のアームの少なくとも1つに取り付けられた電気エンドエフェクタと、
前記シャフトの下端の下方にあり、前記シャフトとは別に同軸上にあり、電源に接続されている支持体と、を含み、
前記電源から前記支持体に電力を供給することで前記シャフトの下端と前記支持体の上端が電気的に結合され、前記真空チャンバ内で前記電気エンドエフェクタに電気エネルギーを提供するようになっており、
前記支持体が上下方向に移動可能であり、前記電気的結合が、前記支持体に設けられた第1の組の接点を移動させて前記シャフトの下端に設けられた第2の組の接点と接触させるように動作する電磁石を使用することによるロボットシステム。 - 前記電気エンドエフェクタに接続された電気回路が、前記複数のアームの回転継手を通過している、請求項1に記載のシステム。
- 前記支持体が、前記シャフトの軸について回転可能であり、ばね部材により前記シャフトの軸方向について下方向に固定されている、請求項1に記載のシステム。
- 前記シャフトの下端が磁性体を備え、前記電源から前記支持体の電磁石に電力を供給することにより、前記支持体が前記磁性体に引っ張られ、前記第1の組の接点と前記第2の組の接点が接触して電気的に結合され、前記支持体は前記ばね部材により前記シャフト下端から離れる方向に力が加えられるようになっている、請求項3に記載のシステム。
- 前記電気的結合が、前記電気エンドエフェクタにエネルギーを提供する容量性構成要素に電気的に結合されている、請求項1に記載のシステム。
- 電子デバイス加工システム内で基板を移動させる基板輸送ロボット装置であって、
少なくとも1つの回転するアーム、前記少なくとも1つの回転するアームの回転軸となるシャフト、および前記少なくとも1つの回転するアームに取り付けられた電気エンドエフェクタを含むロボットと、
前記シャフトの下端の下方にあり、前記シャフトとは別に同軸上にあり、電源に接続されている支持体とを備え、
前記電源から前記支持体に電力を供給することで前記シャフトの下端と前記支持体の上端が電気的に結合され、前記真空チャンバ内で前記電気エンドエフェクタに電気エネルギーを提供するようになっており、
前記支持体が上下方向に移動可能であり、前記電気的結合が、前記支持体に設けられた第1の組の接点を移動させて前記シャフトの下端に設けられた第2の組の接点と接触させるように動作する電磁石を使用することによる装置。 - 電子デバイス加工クラスタツール内で基板を移動させる方法であって、
少なくとも1つの回転する可動アーム、前記少なくとも1つの可動アームの回転軸となるシャフト、および前記少なくとも1つの可動アームに取り付けられた電気エンドエフェクタを含むロボットを真空チャンバ内に提供するステップと、
前記シャフトの下端の下方にあり、前記シャフトとは別に同軸上にあり、電源に接続されている支持体を提供するステップと、
前記電源から前記支持体に電力を供給することで前記シャフトの下端と前記支持体の上端が電気的に結合され、前記電気エンドエフェクタに結合された電気リードに電気エネルギーを供給するステップと
を含み、
前記支持体が上下方向に移動可能であり、前記電気的結合が、前記支持体に設けられた第1の組の接点を移動させて前記シャフトの下端に設けられた第2の組の接点と接触させるように動作する電磁石を使用することによる方法。 - 電子デバイス加工システム内で基板を移動させる基板輸送ロボット装置であって、
回転するアーム、前記回転するアームの1つの回転軸となるシャフト、および前記アームの別の1つに取り付けられた電気エンドエフェクタを含むロボットと、
前記シャフトの下端の下方にあり、前記シャフトとは別に同軸上にあり、電源に接続されている支持体と、
前記電気エンドエフェクタに結合されて、前記可動アームの回転継手を通過する電気リードとを備え、
前記電源から前記支持体に電力を供給することで前記シャフトの下端と前記支持体の上端が電気的に結合され、前記電気エンドエフェクタに結合された電気リードに電気エネルギーを供給し、
前記支持体が上下方向に移動可能であり、前記電気的結合が、前記支持体に設けられた第1の組の接点を移動させて前記シャフトの下端に設けられた第2の組の接点と接触させるように動作する電磁石を使用することによる装置。 - 前記電気リードが、締付け部材によってチャネル内で締め付けられている、請求項8に記載の基板輸送ロボット装置。
- 前記電気リードが、前記電気エンドエフェクタと、前記電気的結合との間を接続している、請求項8に記載の基板輸送ロボット装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14380909P | 2009-01-11 | 2009-01-11 | |
US61/143,809 | 2009-01-11 | ||
PCT/US2010/020510 WO2010081009A2 (en) | 2009-01-11 | 2010-01-08 | Systems, apparatus and methods for making an electrical connection to a robot and electrical end effector thereof |
Publications (3)
Publication Number | Publication Date |
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JP2012514544A JP2012514544A (ja) | 2012-06-28 |
JP2012514544A5 JP2012514544A5 (ja) | 2013-09-12 |
JP5501375B2 true JP5501375B2 (ja) | 2014-05-21 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011545461A Active JP5501375B2 (ja) | 2009-01-11 | 2010-01-08 | ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8264187B2 (ja) |
JP (1) | JP5501375B2 (ja) |
KR (1) | KR101287000B1 (ja) |
CN (1) | CN102349146B (ja) |
TW (1) | TWI405649B (ja) |
WO (1) | WO2010081009A2 (ja) |
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