JP7007795B2 - 有機膜の気相堆積 - Google Patents

有機膜の気相堆積 Download PDF

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JP7007795B2
JP7007795B2 JP2016197037A JP2016197037A JP7007795B2 JP 7007795 B2 JP7007795 B2 JP 7007795B2 JP 2016197037 A JP2016197037 A JP 2016197037A JP 2016197037 A JP2016197037 A JP 2016197037A JP 7007795 B2 JP7007795 B2 JP 7007795B2
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reactant
substrate
temperature
vapor
deposition
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JP2017076784A (ja
JP2017076784A5 (enExample
Inventor
ヴィジャミ ジェイ． ポア
マルコ トゥオミネン
ハンヌ フオタリ
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エーエスエム アイピー ホールディング ビー．ブイ．
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Priority claimed from US14/879,962 external-priority patent/US10695794B2/en
Application filed by エーエスエム アイピー ホールディング ビー．ブイ． filed Critical エーエスエム アイピー ホールディング ビー．ブイ．
Publication of JP2017076784A publication Critical patent/JP2017076784A/ja
Publication of JP2017076784A5 publication Critical patent/JP2017076784A5/ja
Priority to JP2021176474A priority Critical patent/JP7299289B2/ja
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Publication of JP7007795B2 publication Critical patent/JP7007795B2/ja
Priority to JP2023098005A priority patent/JP7383192B2/ja
Priority to JP2023188391A priority patent/JP7738621B2/ja
Priority to JP2025145351A priority patent/JP2025183257A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H10P14/6334—
    • H10P14/6339—
    • H10P14/6532—
    • H10P14/683—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2505/00—Polyamides
    • B05D2505/50—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/145—After-treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)
JP2016197037A 2015-10-09 2016-10-05 有機膜の気相堆積 Active JP7007795B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021176474A JP7299289B2 (ja) 2015-10-09 2021-10-28 有機膜の気相堆積
JP2023098005A JP7383192B2 (ja) 2015-10-09 2023-06-14 有機膜の気相堆積
JP2023188391A JP7738621B2 (ja) 2015-10-09 2023-11-02 有機膜の気相堆積
JP2025145351A JP2025183257A (ja) 2015-10-09 2025-09-02 有機膜の気相堆積

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14/879,962 2015-10-09
US14/879,962 US10695794B2 (en) 2015-10-09 2015-10-09 Vapor phase deposition of organic films
US15/070,594 2016-03-15
US15/070,594 US10343186B2 (en) 2015-10-09 2016-03-15 Vapor phase deposition of organic films

Related Child Applications (1)

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JP2021176474A Division JP7299289B2 (ja) 2015-10-09 2021-10-28 有機膜の気相堆積

Publications (3)

Publication Number Publication Date
JP2017076784A JP2017076784A (ja) 2017-04-20
JP2017076784A5 JP2017076784A5 (enExample) 2019-11-14
JP7007795B2 true JP7007795B2 (ja) 2022-01-25

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JP2016197037A Active JP7007795B2 (ja) 2015-10-09 2016-10-05 有機膜の気相堆積
JP2021176474A Active JP7299289B2 (ja) 2015-10-09 2021-10-28 有機膜の気相堆積
JP2023098005A Active JP7383192B2 (ja) 2015-10-09 2023-06-14 有機膜の気相堆積
JP2023188391A Active JP7738621B2 (ja) 2015-10-09 2023-11-02 有機膜の気相堆積
JP2025145351A Pending JP2025183257A (ja) 2015-10-09 2025-09-02 有機膜の気相堆積

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JP2021176474A Active JP7299289B2 (ja) 2015-10-09 2021-10-28 有機膜の気相堆積
JP2023098005A Active JP7383192B2 (ja) 2015-10-09 2023-06-14 有機膜の気相堆積
JP2023188391A Active JP7738621B2 (ja) 2015-10-09 2023-11-02 有機膜の気相堆積
JP2025145351A Pending JP2025183257A (ja) 2015-10-09 2025-09-02 有機膜の気相堆積

Country Status (4)

Country Link
US (1) US10343186B2 (enExample)
JP (5) JP7007795B2 (enExample)
KR (4) KR102546221B1 (enExample)
TW (3) TWI707978B (enExample)

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TWI865747B (zh) 2020-03-30 2024-12-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 在兩不同表面上同時選擇性沉積兩不同材料
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