JP6881463B2 - Rc−igbtおよびその製造方法 - Google Patents
Rc−igbtおよびその製造方法 Download PDFInfo
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- JP6881463B2 JP6881463B2 JP2018539794A JP2018539794A JP6881463B2 JP 6881463 B2 JP6881463 B2 JP 6881463B2 JP 2018539794 A JP2018539794 A JP 2018539794A JP 2018539794 A JP2018539794 A JP 2018539794A JP 6881463 B2 JP6881463 B2 JP 6881463B2
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Description
特許文献1 特開2013−065724号公報
特許文献2 特開2015−135954号公報
図1Aは、実施例1に係る半導体装置100の一例を示す平面図である。図1Bは、実施例1に係る半導体装置100のa−a'断面の一例を示す図である。本例の半導体装置100は、IGBT(Insulated Gate Bipolar Transistor)等のトランジスタを含むトランジスタ部70、および、FWD(Free Wheel Diode)等のダイオードを含むダイオード部80を有する半導体チップである。図1Aにおいてはチップ端部周辺のチップ表面を示しており、他の領域を省略している。
図5Aは、比較例1に係る半導体装置500の一例を示す平面図である。図5Bは、比較例1に係る半導体装置500のa−a'断面の一例を示す図である。図5Cは、比較例1に係る半導体装置500のb−b'断面の一例を示す図である。
図7Aは、実施例2に係る半導体装置100の一例を示す平面図である。図7Bは、実施例2に係る半導体装置100のa−a'断面の一例を示す図である。図7Cは、実施例2に係る半導体装置100のb−b'断面の一例を示す図である。本例のソース領域12およびコンタクト領域15は、トランジスタ部70におけるトレンチ部の延伸方向において、交互に設けられている。
図8は、実施例3に係る半導体装置100の構成の一例を示す。本例のコンタクト層28は、ドーパントを多段で注入することにより形成される。例えば、コンタクト層28は、3段の注入工程により形成される。
図10Aは、実施例4に係る半導体装置100の一例を示す平面図である。図10Bは、実施例4に係る半導体装置100のa−a'断面の一例を示す図である。本例の半導体装置100は、トランジスタ部70とダイオード部80とで構造の異なるメサ部を有する。
Claims (18)
- トランジスタ部とダイオード部とを有するRC−IGBTであって、
半導体基板と、
前記半導体基板の上面側に設けられた第1導電型のドリフト領域と、
前記ドリフト領域の上方に設けられた第2導電型のベース領域と、
前記ベース領域の上方に設けられた第1導電型のソース領域と、
前記ソース領域の上端側から、前記ソース領域および前記ベース領域を貫通して設けられた2以上のトレンチ部と
を備え、
前記ダイオード部は、
前記ソース領域と、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記コンタクト層の下端は、前記ソース領域の下端よりも深く、
前記コンタクトトレンチの下方において、前記コンタクト層のドーピング濃度は、同一の深さの前記ソース領域のドーピング濃度よりも大きく、
前記ソース領域は、前記半導体基板のおもて面および前記コンタクトトレンチの側壁に接して設けられ、
前記コンタクト層は、前記トランジスタ部の前記コンタクトトレンチの底面から、前記ソース領域に張り出して設けられる
RC−IGBT。 - トランジスタ部とダイオード部とを有するRC−IGBTであって、
半導体基板と、
前記半導体基板の上面側に設けられた第1導電型のドリフト領域と、
前記ドリフト領域の上方に設けられた第2導電型のベース領域と、
前記ベース領域の上方に設けられた第1導電型のソース領域と、
前記ソース領域の上端側から、前記ソース領域および前記ベース領域を貫通して設けられた2以上のトレンチ部と
を備え、
前記ダイオード部は、
前記ソース領域と、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記コンタクト層の下端は、前記ソース領域の下端よりも深く、
前記コンタクト層は、前記コンタクトトレンチの側壁の少なくとも一部に設けられる
RC−IGBT。 - トランジスタ部とダイオード部とを有するRC−IGBTであって、
半導体基板と、
前記半導体基板の上面側に設けられた第1導電型のドリフト領域と、
前記ドリフト領域の上方に設けられた第2導電型のベース領域と、
前記ベース領域の上方に設けられた第1導電型のソース領域と、
前記ソース領域の上端側から、前記ソース領域および前記ベース領域を貫通して設けられた2以上のトレンチ部と
を備え、
前記ダイオード部は、
前記ソース領域と、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記トランジスタ部は、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記トランジスタ部の前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記ダイオード部の前記コンタクトトレンチの幅は、前記トランジスタ部の前記コンタクトトレンチの幅よりも狭く、
前記ソース領域は、前記半導体基板のおもて面および前記コンタクトトレンチの側壁に接して設けられ、
前記コンタクト層は、前記トランジスタ部の前記コンタクトトレンチの底面から、前記ソース領域に張り出して設けられる
RC−IGBT。 - トランジスタ部とダイオード部とを有するRC−IGBTであって、
半導体基板と、
前記半導体基板の上面側に設けられた第1導電型のドリフト領域と、
前記ドリフト領域の上方に設けられた第2導電型のベース領域と、
前記ベース領域の上方に設けられた第1導電型のソース領域と、
前記ソース領域の上端側から、前記ソース領域および前記ベース領域を貫通して設けられた2以上のトレンチ部と
を備え、
前記ダイオード部は、
前記ソース領域と、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記ダイオード部の前記コンタクト層の下端は、前記トランジスタ部の前記コンタクト層の下端よりも浅い
RC−IGBT。 - トランジスタ部とダイオード部とを有するRC−IGBTであって、
半導体基板と、
前記半導体基板の上面側に設けられた第1導電型のドリフト領域と、
前記ドリフト領域の上方に設けられた第2導電型のベース領域と、
前記ベース領域の上方に設けられた第1導電型のソース領域と、
前記ソース領域の上端側から、前記ソース領域および前記ベース領域を貫通して設けられた2以上のトレンチ部と
を備え、
前記ダイオード部は、
前記ソース領域と、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記ダイオード部の前記コンタクト層におけるドーピング濃度のピークの個数は、前記トランジスタ部の前記コンタクト層におけるドーピング濃度のピークの個数よりも少ない
RC−IGBT。 - トランジスタ部とダイオード部とを有するRC−IGBTであって、
半導体基板と、
前記半導体基板の上面側に設けられた第1導電型のドリフト領域と、
前記ドリフト領域の上方に設けられた第2導電型のベース領域と、
前記ベース領域の上方に設けられた第1導電型のソース領域と、
前記ソース領域の上端側から、前記ソース領域および前記ベース領域を貫通して設けられた2以上のトレンチ部と
を備え、
前記ダイオード部は、
前記ソース領域と、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記ダイオード部の前記コンタクト層のドーピング濃度は、前記トランジスタ部の前記コンタクト層のドーピング濃度よりも薄い
RC−IGBT。 - トランジスタ部とダイオード部とを有するRC−IGBTであって、
半導体基板と、
前記半導体基板の上面側に設けられた第1導電型のドリフト領域と、
前記ドリフト領域の上方に設けられた第2導電型のベース領域と、
前記ベース領域の上方に設けられた第1導電型のソース領域と、
前記ソース領域の上端側から、前記ソース領域および前記ベース領域を貫通して設けられた2以上のトレンチ部と
前記ドリフト領域と前記ベース領域との間に設けられ、前記ドリフト領域よりも高濃度である第1導電型の第1蓄積領域と、
を備え、
前記ダイオード部は、
前記ソース領域と、
前記2以上のトレンチ部のうち隣接する2つのトレンチ部の間において、前記半導体基板の上面側に設けられたコンタクトトレンチと、
前記コンタクトトレンチの下方に設けられ、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層と
を含み、
前記コンタクト層の下端は、前記ソース領域の下端よりも深い
RC−IGBT。 - 前記ソース領域は、前記ダイオード部において、前記コンタクトトレンチと接している
請求項1から7のいずれか一項に記載のRC−IGBT。 - 前記ダイオード部の前記コンタクトトレンチは、前記トランジスタ部の前記コンタクトトレンチよりもアスペクト比が高い
請求項1から8のいずれか一項に記載のRC−IGBT。 - 前記ダイオード部の前記コンタクトトレンチの下端は、前記トランジスタ部の前記コンタクトトレンチの下端よりも深い
請求項1から9のいずれか一項に記載のRC−IGBT。 - 前記ドリフト領域よりもドーピング濃度が高い第1導電型の第1蓄積領域と、
前記第1蓄積領域よりも深く形成され、前記ドリフト領域よりもドーピング濃度が高い第1導電型の第2蓄積領域と
を更に備え、
前記第1蓄積領域および前記第2蓄積領域は、前記トランジスタ部に形成されている
請求項1から6のいずれか一項に記載のRC−IGBT。 - 前記第1蓄積領域よりも深く形成され、前記ドリフト領域よりもドーピング濃度が高い第1導電型の第2蓄積領域と
を更に備え、
前記第1蓄積領域および前記第2蓄積領域は、前記トランジスタ部に形成されている
請求項7に記載のRC−IGBT。 - 前記第1蓄積領域および前記第2蓄積領域は、前記ダイオード部にも形成されている
請求項11または12に記載のRC−IGBT。 - 前記コンタクト層の下端は、前記ソース領域の下端よりも浅い
請求項3から6のいずれか一項に記載のRC−IGBT。 - 前記コンタクト層の下端は、前記ソース領域の下端よりも深い
請求項3から6のいずれか一項に記載のRC−IGBT。 - トランジスタ部とダイオード部とを有するRC−IGBTの製造方法であって、
半導体基板の上面側に、第1導電型のドリフト領域、第2導電型のベース領域、第1導電型のソース領域、および、前記ソース領域および前記ベース領域を貫通する2以上のトレンチ部を形成する段階と、
前記ダイオード部において、2つのトレンチ部の間であって、前記半導体基板の上面側にコンタクトトレンチを形成する段階と、
前記ダイオード部において、前記コンタクトトレンチの下方に、前記ベース領域よりも高ドーピング濃度である第2導電型のコンタクト層を形成する段階と、
前記トランジスタ部において、2つのトレンチ部の間であって、前記半導体基板の上面側にコンタクトトレンチを形成する段階と、
前記トランジスタ部において、前記コンタクトトレンチの下方に第2導電型のコンタクト層を形成する段階と
を備え、
前記トランジスタ部の前記コンタクト層を2段階のイオン注入で形成し、前記ダイオード部の前記コンタクト層を1段階のイオン注入で形成する
RC−IGBTの製造方法。 - 前記コンタクト層の下端は、前記ソース領域の下端よりも浅い
請求項16に記載のRC−IGBTの製造方法。 - 前記ダイオード部の前記コンタクトトレンチの幅は、前記トランジスタ部の前記コンタクトトレンチの幅よりも狭い
請求項16又は17に記載のRC−IGBTの製造方法。
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