JP6793103B2 - ひずみゲージ - Google Patents
ひずみゲージ Download PDFInfo
- Publication number
- JP6793103B2 JP6793103B2 JP2017191820A JP2017191820A JP6793103B2 JP 6793103 B2 JP6793103 B2 JP 6793103B2 JP 2017191820 A JP2017191820 A JP 2017191820A JP 2017191820 A JP2017191820 A JP 2017191820A JP 6793103 B2 JP6793103 B2 JP 6793103B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- functional layer
- strain gauge
- base material
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
- G01B7/20—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0063—Reactive sputtering characterised by means for introducing or removing gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
- C23C14/0652—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2268—Arrangements for correcting or for compensating unwanted effects
- G01L1/2281—Arrangements for correcting or for compensating unwanted effects for temperature variations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017191820A JP6793103B2 (ja) | 2017-09-29 | 2017-09-29 | ひずみゲージ |
| CN202310346190.1A CN116608762B (zh) | 2017-09-29 | 2018-09-26 | 应变片 |
| PCT/JP2018/035706 WO2019065740A1 (ja) | 2017-09-29 | 2018-09-26 | ひずみゲージ |
| CN201880076750.3A CN111417829B (zh) | 2017-09-29 | 2018-09-26 | 应变片 |
| US16/650,560 US11542590B2 (en) | 2017-09-29 | 2018-09-26 | Strain gauge |
| EP23187300.1A EP4269936B1 (en) | 2017-09-29 | 2018-09-26 | Strain gauge |
| EP18862478.7A EP3690387B1 (en) | 2017-09-29 | 2018-09-26 | Strain gauge |
| US17/929,830 US11702730B2 (en) | 2017-09-29 | 2022-09-06 | Strain gauge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017191820A JP6793103B2 (ja) | 2017-09-29 | 2017-09-29 | ひずみゲージ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020098850A Division JP2020129013A (ja) | 2020-06-05 | 2020-06-05 | ひずみゲージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019066311A JP2019066311A (ja) | 2019-04-25 |
| JP2019066311A5 JP2019066311A5 (enExample) | 2020-03-26 |
| JP6793103B2 true JP6793103B2 (ja) | 2020-12-02 |
Family
ID=65901960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017191820A Active JP6793103B2 (ja) | 2017-09-29 | 2017-09-29 | ひずみゲージ |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11542590B2 (enExample) |
| EP (2) | EP3690387B1 (enExample) |
| JP (1) | JP6793103B2 (enExample) |
| CN (2) | CN116608762B (enExample) |
| WO (1) | WO2019065740A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240003762A1 (en) * | 2020-10-30 | 2024-01-04 | Nitto Denko Corporation | Strain sensor, functional film, and method for manufacturing same |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7201542B2 (ja) * | 2019-06-21 | 2023-01-10 | ミネベアミツミ株式会社 | 転がり軸受、回転装置、軸受監視装置、軸受監視方法 |
| JP7390139B2 (ja) | 2019-09-05 | 2023-12-01 | ミネベアミツミ株式会社 | センサモジュール、ひずみ検出装置 |
| JP7426794B2 (ja) * | 2019-10-01 | 2024-02-02 | ミネベアミツミ株式会社 | センサモジュール |
| JP2021110703A (ja) * | 2020-01-15 | 2021-08-02 | ミネベアミツミ株式会社 | ひずみゲージ |
| JP7406517B2 (ja) * | 2020-03-24 | 2023-12-27 | ミネベアミツミ株式会社 | ひずみゲージ |
| JP7659380B2 (ja) * | 2020-10-30 | 2025-04-09 | 日東電工株式会社 | 積層フィルムおよび歪みセンサの製造方法 |
| JP7638081B2 (ja) * | 2020-10-30 | 2025-03-03 | 日東電工株式会社 | 積層フィルムおよび歪みセンサ |
| JP7736429B2 (ja) * | 2020-10-30 | 2025-09-09 | 日東電工株式会社 | 積層フィルム、第2積層フィルムの製造方法およびひずみセンサの製造方法 |
| JP2022106507A (ja) * | 2021-01-07 | 2022-07-20 | ミネベアミツミ株式会社 | ひずみゲージ |
| JP7189240B2 (ja) * | 2021-01-18 | 2022-12-13 | ミネベアミツミ株式会社 | ひずみゲージ |
| JP2023021714A (ja) * | 2021-08-02 | 2023-02-14 | ミネベアミツミ株式会社 | 脈波測定装置 |
| JP2023021715A (ja) * | 2021-08-02 | 2023-02-14 | ミネベアミツミ株式会社 | 脈波測定装置 |
| DE102021209525A1 (de) | 2021-08-31 | 2023-03-02 | CEROBEAR GmbH | Wälzlager und Verfahren zur Überwachung eines Wälzlagers |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240003762A1 (en) * | 2020-10-30 | 2024-01-04 | Nitto Denko Corporation | Strain sensor, functional film, and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019066311A (ja) | 2019-04-25 |
| EP3690387A1 (en) | 2020-08-05 |
| CN111417829A (zh) | 2020-07-14 |
| US11702730B2 (en) | 2023-07-18 |
| US20200325571A1 (en) | 2020-10-15 |
| WO2019065740A1 (ja) | 2019-04-04 |
| EP4269936B1 (en) | 2024-08-07 |
| CN116608762B (zh) | 2025-09-05 |
| CN111417829B (zh) | 2023-04-25 |
| EP4269936A3 (en) | 2023-12-13 |
| CN116608762A (zh) | 2023-08-18 |
| EP3690387A4 (en) | 2021-06-09 |
| EP3690387B1 (en) | 2023-11-01 |
| US11542590B2 (en) | 2023-01-03 |
| EP4269936A2 (en) | 2023-11-01 |
| US20220411915A1 (en) | 2022-12-29 |
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