JP6435535B2 - ワークの特性測定装置およびワークの特性測定方法 - Google Patents

ワークの特性測定装置およびワークの特性測定方法 Download PDF

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JP6435535B2
JP6435535B2 JP2015001621A JP2015001621A JP6435535B2 JP 6435535 B2 JP6435535 B2 JP 6435535B2 JP 2015001621 A JP2015001621 A JP 2015001621A JP 2015001621 A JP2015001621 A JP 2015001621A JP 6435535 B2 JP6435535 B2 JP 6435535B2
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workpiece
storage hole
work
vacuum
inspection
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Japanese (ja)
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JP2016125965A (ja
Inventor
島 智 幸 小
島 智 幸 小
平 晃 久 小
平 晃 久 小
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Tokyo Weld Co Ltd
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Tokyo Weld Co Ltd
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Priority to JP2015001621A priority Critical patent/JP6435535B2/ja
Priority to TW104138517A priority patent/TWI580976B/zh
Priority to KR1020150168195A priority patent/KR101691100B1/ko
Priority to MYPI2015704788A priority patent/MY180349A/en
Priority to CN201610008562.XA priority patent/CN105785253B/zh
Publication of JP2016125965A publication Critical patent/JP2016125965A/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2632Circuits therefor for testing diodes
    • G01R31/2635Testing light-emitting diodes, laser diodes or photodiodes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)
  • Environmental & Geological Engineering (AREA)
  • Sorting Of Articles (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
JP2015001621A 2015-01-07 2015-01-07 ワークの特性測定装置およびワークの特性測定方法 Active JP6435535B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015001621A JP6435535B2 (ja) 2015-01-07 2015-01-07 ワークの特性測定装置およびワークの特性測定方法
TW104138517A TWI580976B (zh) 2015-01-07 2015-11-20 Method for measuring the characteristic of a workpiece and measuring the characteristics of the workpiece
KR1020150168195A KR101691100B1 (ko) 2015-01-07 2015-11-30 워크의 특성 측정 장치 및 워크의 특성 측정 방법
MYPI2015704788A MY180349A (en) 2015-01-07 2015-12-29 Work characteristic measuring apparatus and work characteristic measuring method
CN201610008562.XA CN105785253B (zh) 2015-01-07 2016-01-06 工件的特性测定装置以及工件的特性测定方法

Applications Claiming Priority (1)

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JP2015001621A JP6435535B2 (ja) 2015-01-07 2015-01-07 ワークの特性測定装置およびワークの特性測定方法

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JP2016125965A JP2016125965A (ja) 2016-07-11
JP6435535B2 true JP6435535B2 (ja) 2018-12-12

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JP2015001621A Active JP6435535B2 (ja) 2015-01-07 2015-01-07 ワークの特性測定装置およびワークの特性測定方法

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JP (1) JP6435535B2 (ko)
KR (1) KR101691100B1 (ko)
CN (1) CN105785253B (ko)
MY (1) MY180349A (ko)
TW (1) TWI580976B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107490723A (zh) * 2017-08-14 2017-12-19 苏州马尔萨斯文化传媒有限公司 一种用于绝缘体的自动化检测装置及其检测方法
TWI611999B (zh) * 2017-08-15 2018-01-21 致茂電子股份有限公司 可避免誤分料之電子元件檢測設備及其檢測方法
JP6828640B2 (ja) * 2017-08-31 2021-02-10 日亜化学工業株式会社 発光装置の発光検査方法
KR102066685B1 (ko) * 2018-04-18 2020-01-15 주재철 워크 이송 회전 테이블
KR20190124132A (ko) * 2018-04-25 2019-11-04 (주)테크윙 전자부품 테스트용 핸들러
TWI727520B (zh) * 2019-11-27 2021-05-11 萬潤科技股份有限公司 電子元件搬送方法及電子元件搬送裝置與搬送設備
TWI722682B (zh) * 2019-11-27 2021-03-21 萬潤科技股份有限公司 電子元件搬送方法與設備
CN111208406B (zh) * 2020-03-09 2020-11-20 海宁永力电子陶瓷有限公司 一种半导体发光二极管测试装置
JP7370069B2 (ja) * 2020-08-31 2023-10-27 株式会社 東京ウエルズ ワーク検査装置
CN113634507B (zh) * 2021-08-13 2023-02-17 东阳东磁自动化科技有限公司 一种对于软磁产品的厚度测量分档设备及其实现方法
WO2023105665A1 (ja) * 2021-12-08 2023-06-15 フジオーゼックス株式会社 ワーク外観画像検査機
CN114291564B (zh) * 2021-12-31 2022-09-06 昆山市和博电子科技有限公司 一种产品入料结构及其入料方法
CN114994473B (zh) * 2022-05-26 2023-02-28 深圳市标谱半导体股份有限公司 电性耐压测试机

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415298U (ko) * 1990-05-28 1992-02-06
US6144435A (en) * 1995-04-28 2000-11-07 Canon Kabushiki Kaisha Liquid crystal device, process for producing same and liquid crystal apparatus
JP4151041B2 (ja) * 1998-06-19 2008-09-17 日東工業株式会社 チップ1個分離搬送装置のトラブルチップの排除手段
JP3690257B2 (ja) * 2000-08-28 2005-08-31 株式会社村田製作所 チップ部品の搬送装置
US6797936B1 (en) * 2002-01-03 2004-09-28 Opto Electronic Systems, Inc. Automated laser diode testing
JP2004226101A (ja) * 2003-01-20 2004-08-12 Tokyo Weld Co Ltd ワーク検査システム
JP4346912B2 (ja) * 2003-01-20 2009-10-21 株式会社 東京ウエルズ 真空吸引システムおよびその制御方法
JP2004315123A (ja) * 2003-04-14 2004-11-11 Tokyo Weld Co Ltd ワーク分離搬送システム
JP4021812B2 (ja) * 2003-06-26 2007-12-12 株式会社 東京ウエルズ ワーク送給装置
JP4930971B2 (ja) * 2005-12-16 2012-05-16 株式会社 東京ウエルズ ワーク搬送装置
JP5294195B2 (ja) * 2008-05-01 2013-09-18 株式会社 東京ウエルズ ワーク特性測定装置およびワーク特性測定方法
JP5388282B2 (ja) * 2009-04-17 2014-01-15 株式会社 東京ウエルズ ワーク搬送装置及びワーク搬送方法
JP2012020822A (ja) 2010-07-13 2012-02-02 Tokyo Weld Co Ltd ワーク搬送装置
JP5679195B2 (ja) * 2011-05-27 2015-03-04 株式会社 東京ウエルズ ワーク搬送検査装置およびワーク搬送検査方法
TWI447060B (zh) * 2011-10-05 2014-08-01 Tokyo Weld Co Ltd Workpiece handling equipment
JP2014076519A (ja) * 2012-10-11 2014-05-01 Seiko Epson Corp 部品搬送装置、電子部品検査装置および部品搬送方法
JP6144065B2 (ja) * 2013-02-14 2017-06-07 株式会社 東京ウエルズ ワーク測定装置およびワーク測定方法

Also Published As

Publication number Publication date
JP2016125965A (ja) 2016-07-11
TWI580976B (zh) 2017-05-01
KR20160085198A (ko) 2016-07-15
CN105785253B (zh) 2018-09-28
CN105785253A (zh) 2016-07-20
KR101691100B1 (ko) 2016-12-29
TW201637973A (zh) 2016-11-01
MY180349A (en) 2020-11-28

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