JP6397821B2 - ワークピースの分離のための方法及び装置 - Google Patents

ワークピースの分離のための方法及び装置 Download PDF

Info

Publication number
JP6397821B2
JP6397821B2 JP2015533244A JP2015533244A JP6397821B2 JP 6397821 B2 JP6397821 B2 JP 6397821B2 JP 2015533244 A JP2015533244 A JP 2015533244A JP 2015533244 A JP2015533244 A JP 2015533244A JP 6397821 B2 JP6397821 B2 JP 6397821B2
Authority
JP
Japan
Prior art keywords
workpiece
laser pulse
modified
pulse
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015533244A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015529161A5 (enExample
JP2015529161A (ja
Inventor
チョウ，ハイビン
シャン，ファン
リコウ，マシュー
チョウ，ミン
サイメンソン，グレン
シュイ，チェン
ブルックハイザー，ジェームズ
フランケル，ジョセフ
ダーウィン，マイケル
ランデル，ジャック
ピシャー，マシュー
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド, エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2015529161A publication Critical patent/JP2015529161A/ja
Publication of JP2015529161A5 publication Critical patent/JP2015529161A5/ja
Application granted granted Critical
Publication of JP6397821B2 publication Critical patent/JP6397821B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
JP2015533244A 2012-09-21 2013-09-23 ワークピースの分離のための方法及び装置 Expired - Fee Related JP6397821B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US201261704038P 2012-09-21 2012-09-21
US61/704,038 2012-09-21
US201261735489P 2012-12-10 2012-12-10
US61/735,489 2012-12-10
US201361766274P 2013-02-19 2013-02-19
US61/766,274 2013-02-19
US201361866736P 2013-08-16 2013-08-16
US61/866,736 2013-08-16
US14/032,829 US9610653B2 (en) 2012-09-21 2013-09-20 Method and apparatus for separation of workpieces and articles produced thereby
US14/032,829 2013-09-20
PCT/US2013/061162 WO2014047549A1 (en) 2012-09-21 2013-09-23 Method and apparatus for separation of workpieces and articles produced thereby

Publications (3)

Publication Number Publication Date
JP2015529161A JP2015529161A (ja) 2015-10-05
JP2015529161A5 JP2015529161A5 (enExample) 2016-11-24
JP6397821B2 true JP6397821B2 (ja) 2018-09-26

Family

ID=50337863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015533244A Expired - Fee Related JP6397821B2 (ja) 2012-09-21 2013-09-23 ワークピースの分離のための方法及び装置

Country Status (6)

Country Link
US (1) US9610653B2 (enExample)
JP (1) JP6397821B2 (enExample)
KR (1) KR20150056597A (enExample)
CN (1) CN104684677B (enExample)
TW (1) TWI637807B (enExample)
WO (1) WO2014047549A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012110971B4 (de) * 2012-11-14 2025-03-20 Schott Ag Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
JP2016513016A (ja) * 2013-02-04 2016-05-12 ニューポート コーポレーション 透明及び半透明な基板をレーザ切断する方法及び装置
US20180016179A1 (en) * 2015-01-06 2018-01-18 Corning Incorporated A glass-carrier assembly and methods for processing a flexible glass sheet
CN104827191A (zh) * 2015-05-12 2015-08-12 大族激光科技产业集团股份有限公司 蓝宝石的激光切割方法
CN107922259B (zh) 2015-09-04 2021-05-07 Ａｇｃ株式会社 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置
CN108025965B (zh) * 2015-09-04 2021-02-09 Ａｇｃ株式会社 玻璃管的制造方法、玻璃物品的制造方法、玻璃管、玻璃物品和玻璃物品的制造装置
US11077526B2 (en) 2015-09-09 2021-08-03 Electro Scientific Industries, Inc. Laser processing apparatus, methods of laser-processing workpieces and related arrangements
US10864599B2 (en) 2016-03-17 2020-12-15 Electro Scientific Industries, Inc. Location of image plane in a laser processing system
EP3842391B1 (en) 2016-09-01 2023-11-01 Agc Inc. Glass article
DE102016220844A1 (de) * 2016-10-24 2018-04-26 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Vorhersage der Kippneigung eines freigeschnittenen Werkstückteils und Bearbeitungsmaschine zur trennenden Bearbeitung eines plattenförmigen Werkstücks
JP7146770B2 (ja) 2016-12-30 2022-10-04 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工装置における光学部品の寿命を延ばすための方法及びシステム
JP6531878B2 (ja) 2017-02-21 2019-06-19 Ａｇｃ株式会社 ガラス板およびガラス板の製造方法
EP3587366B1 (en) 2017-02-21 2023-09-13 AGC Inc. Glass plate and manufacturing method of glass plate
US20190062196A1 (en) * 2017-08-25 2019-02-28 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using an afocal beam adjustment assembly
CN116275467A (zh) 2018-06-05 2023-06-23 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法以及使用其加工工件的方法
KR102240325B1 (ko) * 2018-06-18 2021-04-13 신에츠 엔지니어링 가부시키가이샤 워크 분리 장치 및 워크 분리 방법
US11054574B2 (en) 2019-05-16 2021-07-06 Corning Research & Development Corporation Methods of singulating optical waveguide sheets to form optical waveguide substrates
DE102019003822A1 (de) * 2019-06-02 2020-12-03 Keming Du Verfahren zur Bearbeitung transparenter Materialien
DE102020123146A1 (de) 2019-09-06 2021-03-11 Andreas Wienkamp Verfahren und Vorrichtung zum Einbringen eines Schnitts in ein Werkstück
JP2021163914A (ja) * 2020-04-02 2021-10-11 浜松ホトニクス株式会社 レーザ加工装置、レーザ加工方法及びウェハ
DE102021105034A1 (de) 2021-03-02 2022-09-08 Cericom GmbH Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks aus Glas
DE102021214310A1 (de) 2021-12-14 2023-06-15 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Erzeugen mindestens einer Hohlstruktur, EUVSpiegel und EUV-Lithographiesystem

Family Cites Families (184)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL261422A (enExample) 1956-10-12
DE1244346B (de) 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
US3629545A (en) 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
NL6801184A (enExample) 1968-01-26 1969-07-29
GB1246481A (en) 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
US3629546A (en) 1969-04-02 1971-12-21 American Can Co Air-cooled laser processing of materials
US3751238A (en) 1970-02-25 1973-08-07 Corning Glass Works Method of chemically strengthening a silicate article containing soda
IT996776B (it) 1972-10-12 1975-12-10 Glaverbel Procedimento e dispositivo per ta gliare un materiale vetroso o vetro cristallino
DE3110235A1 (de) 1981-03-17 1982-10-21 Trumpf GmbH & Co, 7257 Ditzingen "verfahren und vorrichtung zum brennschneiden mittels eines laserstrahls"
US4467168A (en) 1981-04-01 1984-08-21 Creative Glassworks International Method of cutting glass with a laser and an article made therewith
US4468534A (en) 1982-09-30 1984-08-28 Boddicker Franc W Method and device for cutting glass
US4702042A (en) 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
US4639572A (en) 1985-11-25 1987-01-27 Ibm Corporation Laser cutting of composite materials
DE69013047T2 (de) 1989-05-08 1995-04-13 Philips Nv Verfahren zum Spalten einer Platte aus sprödem Werkstoff.
US5073687A (en) * 1989-06-22 1991-12-17 Canon Kabushiki Kaisha Method and apparatus for working print board by laser
US5132505A (en) 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JP2524477B2 (ja) 1993-12-20 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 液晶パネル形成用基板及びその製造方法
US5776220A (en) 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
WO1997007927A1 (en) 1995-08-31 1997-03-06 Corning Incorporated Method and apparatus for breaking brittle materials
JP3271691B2 (ja) 1996-02-29 2002-04-02 セイコーインスツルメンツ株式会社 表示装置の製造方法
JPH10128567A (ja) 1996-10-30 1998-05-19 Nec Kansai Ltd レーザ割断方法
MY120533A (en) 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
US5961852A (en) 1997-09-09 1999-10-05 Optical Coating Laboratory, Inc. Laser scribe and break process
US6407360B1 (en) 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
JP3178524B2 (ja) 1998-11-26 2001-06-18 住友重機械工業株式会社 レーザマーキング方法と装置及びマーキングされた部材
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6211488B1 (en) 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6327875B1 (en) 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
DE10029110B4 (de) 1999-06-15 2006-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren für die Materialbearbeitung und Verwendung desselben
KR100626983B1 (ko) 1999-06-18 2006-09-22 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저를 이용한 스크라이브 방법
US6684885B2 (en) 1999-06-18 2004-02-03 Paul M. Graczyk Laser surgery eye shield
JP3370310B2 (ja) 1999-06-18 2003-01-27 三星ダイヤモンド工業株式会社 レーザーを用いたスクライブ法
US6472295B1 (en) 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
JP4172112B2 (ja) 1999-09-03 2008-10-29 旭硝子株式会社 ガラスリボンの割断方法
DE19952331C1 (de) 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
DE19955824A1 (de) 1999-11-20 2001-06-13 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
CN1413136A (zh) 1999-11-24 2003-04-23 应用光子学公司 非金属材料的分离方法和装置
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
DE19963939B4 (de) 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE10016628A1 (de) 2000-04-04 2001-10-18 Schott Glas Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen
WO2001085387A1 (en) 2000-05-11 2001-11-15 Ptg Precision Technology Center Limited Llc System for cutting brittle materials
JP2002019528A (ja) 2000-07-05 2002-01-23 Kasai Kogyo Co Ltd トノボード装置
DE10041519C1 (de) 2000-08-24 2001-11-22 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
WO2002048059A1 (de) 2000-12-15 2002-06-20 Lzh Laserzentrum Hannover E.V. Verfahren zum durchtrennen von bauteilen aus glas, keramik, glaskeramik oder dergleichen durch erzeugung eines thermischen spannungsrisses an dem bauteil entlang einer trennzone
FR2819505B1 (fr) 2001-01-12 2003-02-28 Saint Gobain Procede de decoupe des bords d'un ruban continu de verre, dispositif de mise en oeuvre, plateau de verre decoupe selon ce procede
WO2002100620A1 (en) 2001-06-11 2002-12-19 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for scribing fragile substance
TW592868B (en) 2001-07-18 2004-06-21 Mitsuboshi Diamond Ind Co Ltd Device and method for scribing fragile material substrate
RU2206525C2 (ru) 2001-07-25 2003-06-20 Кондратенко Владимир Степанович Способ резки хрупких неметаллических материалов
US6559411B2 (en) 2001-08-10 2003-05-06 First Solar, Llc Method and apparatus for laser scribing glass sheet substrate coatings
TW568809B (en) 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
KR100786179B1 (ko) 2002-02-02 2007-12-18 삼성전자주식회사 비금속 기판 절단 방법 및 장치
JP4267240B2 (ja) 2002-02-22 2009-05-27 日本板硝子株式会社 ガラス構造物の製造方法
EP1498216B1 (en) 2002-03-12 2010-12-29 Hamamatsu Photonics K.K. Method of cutting processed object
CN100335259C (zh) 2002-03-12 2007-09-05 三星钻石工业股份有限公司 加工脆性材料的划线方法及装置
US6787732B1 (en) * 2002-04-02 2004-09-07 Seagate Technology Llc Method for laser-scribing brittle substrates and apparatus therefor
US6744009B1 (en) 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
AU2003224098A1 (en) 2002-04-19 2003-11-03 Xsil Technology Limited Laser machining
FR2839508B1 (fr) 2002-05-07 2005-03-04 Saint Gobain Vitrage decoupe sans rompage
JP4408607B2 (ja) 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置
JP4032857B2 (ja) 2002-07-24 2008-01-16 ソニー株式会社 タッチパネル用のガラス基板、タッチパネル及び携帯端末
TWI277612B (en) 2002-08-09 2007-04-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
JP2004083378A (ja) 2002-08-29 2004-03-18 Central Glass Co Ltd 化学強化ガラス
EP1396556A1 (en) 2002-09-06 2004-03-10 ALSTOM (Switzerland) Ltd Method for controlling the microstructure of a laser metal formed hard layer
KR100657196B1 (ko) 2002-11-06 2006-12-14 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 라인 형성장치 및 스크라이브 라인 형성방법
JP2004168584A (ja) 2002-11-19 2004-06-17 Thk Co Ltd ガラス基板材の切断方法
KR100497820B1 (ko) 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
CN100506500C (zh) 2003-01-10 2009-07-01 三星钻石工业股份有限公司 脆性材料基板的划线装置和划线方法以及自动截断生产线
JP2004217492A (ja) 2003-01-17 2004-08-05 Murakami Corp ガラス板材の切抜方法
JP2004223796A (ja) 2003-01-21 2004-08-12 Kyoto Seisakusho Co Ltd 脆性材料の割断加工方法
WO2004067243A1 (ja) 2003-01-29 2004-08-12 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断装置および基板分断方法
JP4515034B2 (ja) 2003-02-28 2010-07-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2004080643A1 (ja) * 2003-03-12 2004-09-23 Hamamatsu Photonics K.K. レーザ加工方法
TWI248920B (en) 2003-03-21 2006-02-11 Rorze Systems Corp Apparatus for cutting glass plate
JP2004343008A (ja) 2003-05-19 2004-12-02 Disco Abrasive Syst Ltd レーザ光線を利用した被加工物分割方法
JP4535692B2 (ja) 2003-05-28 2010-09-01 セントラル硝子株式会社 化学強化ガラス
JP2005019667A (ja) 2003-06-26 2005-01-20 Disco Abrasive Syst Ltd レーザ光線を利用した半導体ウエーハの分割方法
JP2005088078A (ja) 2003-09-17 2005-04-07 Lemi Ltd 走査型レーザ装置
JP4615231B2 (ja) 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
JP2005268752A (ja) 2004-02-19 2005-09-29 Canon Inc レーザ割断方法、被割断部材および半導体素子チップ
JP4716663B2 (ja) * 2004-03-19 2011-07-06 株式会社リコー レーザ加工装置、レーザ加工方法、及び該加工装置又は加工方法により作製された構造体
DE102004014277A1 (de) 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
DE102004020737A1 (de) 2004-04-27 2005-11-24 Lzh Laserzentrum Hannover E.V. Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung
DE102004024475A1 (de) 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien
JP4916312B2 (ja) 2004-07-30 2012-04-11 三星ダイヤモンド工業株式会社 基板の垂直クラック形成方法および垂直クラック形成装置
US20060021977A1 (en) 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US7820941B2 (en) 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US7550367B2 (en) * 2004-08-17 2009-06-23 Denso Corporation Method for separating semiconductor substrate
US7575999B2 (en) 2004-09-01 2009-08-18 Micron Technology, Inc. Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
JP3887394B2 (ja) 2004-10-08 2007-02-28 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
CN101044597B (zh) 2004-10-20 2012-11-28 株式会社半导体能源研究所 激光照射方法、激光照射装置和制造半导体器件的方法
JP4722054B2 (ja) 2004-10-25 2011-07-13 三星ダイヤモンド工業株式会社 クラック形成方法およびクラック形成装置
JP4917257B2 (ja) 2004-11-12 2012-04-18 浜松ホトニクス株式会社 レーザ加工方法
KR100906543B1 (ko) 2004-12-08 2009-07-07 가부시키가이샤 레이져 솔루션즈 피분할체에 있어서의 분할 기점 형성 방법, 피분할체의 분할 방법, 및 펄스 레이저광에 의한 피가공물의 가공방법
JP2006159747A (ja) 2004-12-09 2006-06-22 Japan Steel Works Ltd:The レーザ加工方法及びその装置
US20080305615A1 (en) 2004-12-28 2008-12-11 Mitsuboshi Diamond Industrial Co., Ltd. Method of Scribing and Breaking Substrate Made of a Brittle Material and System for Scribing and Breaking Substrate
US7528342B2 (en) 2005-02-03 2009-05-05 Laserfacturing, Inc. Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
JP4198123B2 (ja) * 2005-03-22 2008-12-17 浜松ホトニクス株式会社 レーザ加工方法
JP2006294099A (ja) 2005-04-07 2006-10-26 Asahi Glass Co Ltd 磁気記録媒体用ガラス基板の周面研磨装置及び製造方法
DE102005024497B4 (de) 2005-05-27 2008-06-19 Schott Ag Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material
US7626138B2 (en) 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
KR101081613B1 (ko) 2005-09-13 2011-11-09 가부시키가이샤 레미 취성재료의 할단방법 및 장치
JP2007165850A (ja) * 2005-11-16 2007-06-28 Denso Corp ウェハおよびウェハの分断方法
JP4816390B2 (ja) * 2005-11-16 2011-11-16 株式会社デンソー 半導体チップの製造方法および半導体チップ
US20070155131A1 (en) 2005-12-21 2007-07-05 Intel Corporation Method of singulating a microelectronic wafer
DE102006018622B3 (de) 2005-12-29 2007-08-09 H2B Photonics Gmbh Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material
KR20070074297A (ko) 2006-01-09 2007-07-12 주식회사 탑 엔지니어링 초음파를 이용한 글라스 기판의 브레이크 장치
WO2007094348A1 (ja) 2006-02-15 2007-08-23 Toray Engineering Co., Ltd. レーザスクライブ方法、レーザスクライブ装置、及びこの方法または装置を用いて割断した割断基板
JP2008007360A (ja) 2006-06-28 2008-01-17 Optrex Corp マザーガラス基板及びガラス基板ならびにそのガラス基板の製造方法
JP2008007384A (ja) 2006-06-30 2008-01-17 Optrex Corp ガラス基板の製造方法
US7897487B2 (en) 2006-07-03 2011-03-01 Hamamatsu Photonics K.K. Laser processing method and chip
DE102006033217A1 (de) 2006-07-14 2008-01-17 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Erzeugung optisch wahrnehmbarer laserinduzierter Risse in sprödes Material
TWI350824B (en) 2006-08-30 2011-10-21 Nat Applied Res Laboratories A pre-fixed position thermal fracturing method of brittle material and device for the same
JP4954653B2 (ja) 2006-09-19 2012-06-20 浜松ホトニクス株式会社 レーザ加工方法
JP5132911B2 (ja) 2006-10-03 2013-01-30 浜松ホトニクス株式会社 レーザ加工方法
JP2008115067A (ja) 2006-11-07 2008-05-22 Lemi Ltd フラットパネルディスプレィ薄板の割断方法
US20080110952A1 (en) 2006-11-15 2008-05-15 Marvin William Kemmerer Sheet separation through fluid impact
WO2008108332A1 (ja) 2007-03-02 2008-09-12 Nippon Electric Glass Co., Ltd. 強化板ガラスとその製造方法
US7977602B2 (en) 2007-03-21 2011-07-12 Photon Dynamics, Inc. Laser ablation using multiple wavelengths
JP2008229711A (ja) 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ方法およびその装置
WO2008126742A1 (ja) * 2007-04-05 2008-10-23 Cyber Laser Inc. レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
US7982162B2 (en) 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8062732B2 (en) 2007-05-22 2011-11-22 Corning Incorporated Glass article having improved edge
US8109808B2 (en) 2007-05-30 2012-02-07 Toyo Kohan Co., Ltd. Method of surface-finishing glass substrate for magnetic disks and glass substrate for magnetic disks
JP4730345B2 (ja) 2007-06-18 2011-07-20 ソニー株式会社 ガラス基板対を有する表示装置及びその切断方法
JP4886620B2 (ja) 2007-07-04 2012-02-29 株式会社東芝 レーザ割断装置及び基板の製造方法
JP4402708B2 (ja) 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
US20090040640A1 (en) 2007-08-07 2009-02-12 Jinnam Kim Glass cutting method, glass for flat panel display thereof and flat panel display device using it
JP5113462B2 (ja) 2007-09-12 2013-01-09 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法
JP2009090598A (ja) 2007-10-11 2009-04-30 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の曲線状クラック形成方法および脆性材料基板
US8011207B2 (en) 2007-11-20 2011-09-06 Corning Incorporated Laser scoring of glass sheets at high speeds and with low residual stress
KR100949152B1 (ko) 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
CN101468875A (zh) 2007-12-24 2009-07-01 鸿富锦精密工业（深圳）有限公司 脆性非金属基材及其切割方法
CN101497493B (zh) 2008-02-01 2012-12-26 鸿富锦精密工业（深圳）有限公司 激光切割装置
GB2457720A (en) 2008-02-23 2009-08-26 Philip Thomas Rumsby Method for laser processing on the opposite sides of thin transparent substrates
US8232218B2 (en) 2008-02-29 2012-07-31 Corning Incorporated Ion exchanged, fast cooled glasses
MY158789A (en) 2008-03-19 2016-11-15 Hoya Corp Glass for magnetic recording media substrates, magnetic recording media substrates, magnetic recording media and method for preparation thereof
JP5345334B2 (ja) 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8173038B2 (en) 2008-04-18 2012-05-08 Corning Incorporated Methods and systems for forming microstructures in glass substrates
JP2009280452A (ja) 2008-05-23 2009-12-03 Central Glass Co Ltd ガラス基板及び製造方法
JP5005612B2 (ja) 2008-05-24 2012-08-22 株式会社レミ 脆性材料のフルカット割断方法
US8053704B2 (en) 2008-05-27 2011-11-08 Corning Incorporated Scoring of non-flat materials
US8258427B2 (en) 2008-05-30 2012-09-04 Corning Incorporated Laser cutting of glass along a predetermined line
US8051679B2 (en) 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
DE102008052006B4 (de) 2008-10-10 2018-12-20 3D-Micromac Ag Verfahren und Vorrichtung zur Herstellung von Proben für die Transmissionselektronenmikroskopie
JP2010150068A (ja) 2008-12-25 2010-07-08 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
CN102264659B (zh) 2008-12-25 2014-03-12 旭硝子株式会社 脆性材料基板的割断方法、装置及车辆用窗玻璃
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
US8347651B2 (en) 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8245540B2 (en) 2009-02-24 2012-08-21 Corning Incorporated Method for scoring a sheet of brittle material
US9302346B2 (en) 2009-03-20 2016-04-05 Corning, Incorporated Precision laser scoring
US8590873B2 (en) 2009-04-08 2013-11-26 Corning Incorporated Method and device for restraining movement of continuously traveling glass sheet
US20100279067A1 (en) 2009-04-30 2010-11-04 Robert Sabia Glass sheet having enhanced edge strength
US8132427B2 (en) 2009-05-15 2012-03-13 Corning Incorporated Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet
US8269138B2 (en) 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
JP5636423B2 (ja) 2009-05-27 2014-12-03 コーニング インコーポレイテッド 高温でのガラスのレーザ・スコアリング
US8543888B2 (en) 2009-06-09 2013-09-24 Microchip Technology Incorporated Programmable cyclic redundancy check CRC unit
EP2450169A4 (en) 2009-07-03 2012-11-21 Asahi Glass Co Ltd CUTTING METHOD AND CUTTING DEVICE FOR A SUBSTRATE OF SPRING MATERIAL AND VEHICLE GLASS OBTAINED IN THIS CUTTING METHOD
WO2011025908A1 (en) * 2009-08-28 2011-03-03 Corning Incorporated Methods for laser cutting articles from chemically strengthened glass substrates
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
JP2011088382A (ja) 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
US8171753B2 (en) 2009-11-18 2012-05-08 Corning Incorporated Method for cutting a brittle material
US20110127242A1 (en) 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
JP5584560B2 (ja) * 2010-08-31 2014-09-03 三星ダイヤモンド工業株式会社 レーザスクライブ方法
US20120175652A1 (en) 2011-01-06 2012-07-12 Electro Scientific Industries, Inc. Method and apparatus for improved singulation of light emitting devices
TWI457191B (zh) 2011-02-04 2014-10-21 Mitsuboshi Diamond Ind Co Ltd 雷射切割方法及雷射加工裝置
JP5789802B2 (ja) * 2011-03-22 2015-10-07 株式会社ソシオネクスト 半導体チップの製造方法
JP2014210669A (ja) * 2011-08-31 2014-11-13 旭硝子株式会社 強化ガラスの切断方法
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
KR20140138134A (ko) 2012-02-28 2014-12-03 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품
JP2015511572A (ja) 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
US9227868B2 (en) 2012-02-29 2016-01-05 Electro Scientific Industries, Inc. Method and apparatus for machining strengthened glass and articles produced thereby
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
JP5575200B2 (ja) * 2012-09-28 2014-08-20 浜松ホトニクス株式会社 レーザ加工装置及びその製造方法

Also Published As

Publication number Publication date
CN104684677B (zh) 2018-11-16
TWI637807B (zh) 2018-10-11
JP2015529161A (ja) 2015-10-05
WO2014047549A1 (en) 2014-03-27
US9610653B2 (en) 2017-04-04
CN104684677A (zh) 2015-06-03
US20140083983A1 (en) 2014-03-27
TW201436918A (zh) 2014-10-01
KR20150056597A (ko) 2015-05-26

Similar Documents

Publication Publication Date Title
JP6397821B2 (ja) ワークピースの分離のための方法及び装置
EP3363771B1 (en) Method of machining and releasing closed forms from a transparent substrate using burst of ultrafast laser pulses
JP7292006B2 (ja) ディスプレイガラス組成物のレーザ切断及び加工
TWI633070B (zh) 使用雷射切割玻璃製品的方法與玻璃製品
CN102026926B (zh) 脆性材料基板的加工方法
JP5314674B2 (ja) 脆性材料基板の加工方法
JP5539625B2 (ja) レーザ加工方法
EP2859984A2 (en) A method of laser processing a transparent material
TWI469841B (zh) 使用經傾斜的雷射掃描來加工工作件的方法和設備
JP2017509568A (ja) イオン交換可能なガラス基材のレーザ切断
JP2009226457A (ja) レーザ加工方法
WO2015031435A2 (en) Method of separating a glass sheet from a carrier
JP5378314B2 (ja) レーザ切断方法
JP5590642B2 (ja) スクライブ加工装置及びスクライブ加工方法
JPWO2004002705A1 (ja) 脆性材料基板のスクライブ装置及びスクライブ方法
JP5444158B2 (ja) 脆性材料基板の割断方法
CN116568644A (zh) 陶瓷切割方法及装置
JP2014033218A (ja) レーザ切断方法およびレーザ加工装置
JP5678816B2 (ja) ガラス基板の割断方法および割断装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160923

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160923

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160927

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170704

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170927

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180411

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180821

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180903

R150 Certificate of patent or registration of utility model

Ref document number: 6397821

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees