DE69013047T2 - Verfahren zum Spalten einer Platte aus sprödem Werkstoff. - Google Patents

Verfahren zum Spalten einer Platte aus sprödem Werkstoff.

Info

Publication number
DE69013047T2
DE69013047T2 DE69013047T DE69013047T DE69013047T2 DE 69013047 T2 DE69013047 T2 DE 69013047T2 DE 69013047 T DE69013047 T DE 69013047T DE 69013047 T DE69013047 T DE 69013047T DE 69013047 T2 DE69013047 T2 DE 69013047T2
Authority
DE
Germany
Prior art keywords
splitting
plate made
brittle material
brittle
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69013047T
Other languages
English (en)
Other versions
DE69013047D1 (de
Inventor
Jacob Nicolaas Prof Dekker
Maarten Harm Prof Zonneveld
Ireneus Henricus Theo Fierkens
Gennip Theodorus Johannes Van
Peter Leendert Prof Holster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE69013047D1 publication Critical patent/DE69013047D1/de
Application granted granted Critical
Publication of DE69013047T2 publication Critical patent/DE69013047T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/06—Severing by using heat
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
DE69013047T 1989-05-08 1990-05-02 Verfahren zum Spalten einer Platte aus sprödem Werkstoff. Expired - Fee Related DE69013047T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8901143 1989-05-08

Publications (2)

Publication Number Publication Date
DE69013047D1 DE69013047D1 (de) 1994-11-10
DE69013047T2 true DE69013047T2 (de) 1995-04-13

Family

ID=19854608

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69013047T Expired - Fee Related DE69013047T2 (de) 1989-05-08 1990-05-02 Verfahren zum Spalten einer Platte aus sprödem Werkstoff.

Country Status (6)

Country Link
US (1) US5084604A (de)
EP (1) EP0397236B1 (de)
JP (1) JPH02296744A (de)
KR (1) KR900017938A (de)
DE (1) DE69013047T2 (de)
HK (1) HK44196A (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5622540A (en) * 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
WO1996020062A1 (fr) * 1994-12-23 1996-07-04 Kondratenko Vladimir Stepanovi Procede de coupe de materiaux non metalliques et dispositif de mise en ×uvre dudit procede
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
DE69629704T2 (de) * 1995-08-31 2004-07-08 Corning Inc. Verfahren und vorrichtung zum zerbrechen von sprödem material
JPH10128567A (ja) * 1996-10-30 1998-05-19 Nec Kansai Ltd レーザ割断方法
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
US5852497A (en) * 1997-08-28 1998-12-22 Vlsi Technology, Inc. Method and apparatus for detecting edges under an opaque layer
JPH11240730A (ja) * 1998-02-27 1999-09-07 Nec Kansai Ltd 脆性材料の割断方法
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6912356B2 (en) 1999-06-07 2005-06-28 Diversified Industries Ltd. Method and apparatus for fracturing brittle materials by thermal stressing
CA2310883A1 (en) * 1999-06-07 2000-12-07 Norman L. Arrison Method and apparatus for fracturing brittle materials by thermal stressing
US6664503B1 (en) 1999-09-07 2003-12-16 Asahi Glass Company, Ltd. Method for manufacturing a magnetic disk
US6795274B1 (en) 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
TR200201402T2 (tr) 1999-11-24 2003-03-21 Applied Photonics, Inc. Metalik olmayan materyallerin ayrılması için yöntem ve cihaz.
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
KR20020047479A (ko) * 2000-12-13 2002-06-22 김경섭 비금속재료의 레이저 절단 방법
DE10111662A1 (de) * 2001-03-09 2002-09-26 Thyssenkrupp Stahl Ag Verfahren und Vorrichtung zum robotergesteuerten Schneiden und Schweißen mit Laserstrahlung
RU2206525C2 (ru) * 2001-07-25 2003-06-20 Кондратенко Владимир Степанович Способ резки хрупких неметаллических материалов
DE10164579C1 (de) * 2001-12-28 2003-08-21 Jenoptik Automatisierungstech Verfahren zum Trennen von Lichtleitfasern mittels CO¶2¶-Laserstrahlung
KR101043674B1 (ko) 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US20090078370A1 (en) * 2004-08-31 2009-03-26 Vladislav Sklyarevich Method of separating non-metallic material using microwave radiation
US20080236199A1 (en) * 2005-07-28 2008-10-02 Vladislav Sklyarevich Method of Separating Non-Metallic Material Using Microwave Radiation
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8051679B2 (en) * 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
DE102009023602B4 (de) * 2009-06-02 2012-08-16 Grenzebach Maschinenbau Gmbh Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl
EP2450169A4 (de) * 2009-07-03 2012-11-21 Asahi Glass Co Ltd Schneideverfahren und schneidevorrichtung für ein substrat aus sprödem material und in diesem schneideverfahren gewonnenes fahrzeugfensterglas
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) * 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US20150251944A1 (en) * 2014-03-10 2015-09-10 Corning Incorporated Methods and apparatuses for separating glass ribbons
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
JP6500917B2 (ja) * 2015-02-03 2019-04-17 セントラル硝子株式会社 脆性材料の切断方法、脆性材料の切断装置、切断脆性材料の製造方法及び切断脆性材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US422949A (en) * 1890-03-11 Clothes-drier
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
US3921873A (en) * 1973-12-07 1975-11-25 Ppg Industries Inc Method for trimming glass
DE2813302C2 (de) * 1978-03-28 1979-09-13 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V., 8000 Muenchen Verfahren und Vorrichtung zum geradlinigen Schneiden von Flachglas mit Hilfe von thermisch induzierten Spannungen
US4467168A (en) * 1981-04-01 1984-08-21 Creative Glassworks International Method of cutting glass with a laser and an article made therewith
US4468534A (en) * 1982-09-30 1984-08-28 Boddicker Franc W Method and device for cutting glass
US4562333A (en) * 1984-09-04 1985-12-31 General Electric Company Stress assisted cutting of high temperature embrittled materials

Also Published As

Publication number Publication date
HK44196A (en) 1996-03-22
DE69013047D1 (de) 1994-11-10
EP0397236B1 (de) 1994-10-05
JPH02296744A (ja) 1990-12-07
US5084604A (en) 1992-01-28
KR900017938A (ko) 1990-12-20
EP0397236A1 (de) 1990-11-14

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee