WO1996020062A1 - Procede de coupe de materiaux non metalliques et dispositif de mise en ×uvre dudit procede - Google Patents

Procede de coupe de materiaux non metalliques et dispositif de mise en ×uvre dudit procede Download PDF

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Publication number
WO1996020062A1
WO1996020062A1 PCT/RU1994/000276 RU9400276W WO9620062A1 WO 1996020062 A1 WO1996020062 A1 WO 1996020062A1 RU 9400276 W RU9400276 W RU 9400276W WO 9620062 A1 WO9620062 A1 WO 9620062A1
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WO
WIPO (PCT)
Prior art keywords
maτeρiala
cutting
χladagenτa
ρezκi
radiation
Prior art date
Application number
PCT/RU1994/000276
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English (en)
Russian (ru)
Inventor
Vladimir Stepanovich Kondratenko
Original Assignee
Kondratenko Vladimir Stepanovi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kondratenko Vladimir Stepanovi filed Critical Kondratenko Vladimir Stepanovi
Priority to PCT/RU1994/000276 priority Critical patent/WO1996020062A1/fr
Publication of WO1996020062A1 publication Critical patent/WO1996020062A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/06—Severing by using heat

Definitions

  • the invention is available for technical purposes, particularly as a result of non-metallic material cutting. Essential glass, boilers, ceramics and equipment for its implementation.
  • the invention may be used for high-quality cutters, such as non-metallic materials, such as products, and rotational bodies, for example, are not intended to be used.
  • the indicated method results in poor results when it is not linearly non-metallic, but fails to perform well.
  • the indicated method has a low stability of the process of cuts at high values of the area of radiation and high speed of cuts.
  • the elliptical pencil should be reserved in any case in a linear fashion.
  • the device provides a straightforward cut-out of plates for X and ⁇ .
  • ⁇ achal ⁇ ⁇ ez ⁇ i ⁇ susches ⁇ vlyayu ⁇ ⁇ azhdy ⁇ az with ⁇ aya ⁇ las ⁇ iny on ⁇ m ⁇ e ⁇ y always na ⁇ di ⁇ sya d ⁇ s ⁇ a ⁇ chn ⁇ e ⁇ liches ⁇ v ⁇ ⁇ slablenny ⁇ mes ⁇ with mi ⁇ de ⁇ e ⁇ ami being ⁇ ntsen ⁇ a ⁇ ami na ⁇ yazheny, ⁇ ⁇ y ⁇ and ⁇ is ⁇ di ⁇ ⁇ b ⁇ az ⁇ vanie ⁇ azdelyayushey ⁇ eschiny in ⁇ iesse ⁇ ez ⁇ i.
  • this device cannot ensure a high cut-off quality when a short-circuit cut-out is obtained. This is due to the absence of defects on the part of the cutting line material, which could have served as the beginning of the failure and development of the country. Otherwise, the described device is ineffective due to the low material thickness of more than 2 mm, since it is isolated from the Qualitative separation.
  • P ⁇ s ⁇ avlennaya task ⁇ eshae ⁇ sya ⁇ em, ch ⁇ in s ⁇ s ⁇ be ⁇ ez ⁇ i neme ⁇ alliches ⁇ i ⁇ ma ⁇ e ⁇ ial ⁇ v, v ⁇ lyuchayuschem nag ⁇ ev line ⁇ eza ⁇ e ⁇ l ⁇ vym, na ⁇ ime ⁇ , laze ⁇ nym ⁇ uch ⁇ m, l ⁇ aln ⁇ e ⁇ lazhdenie uchas ⁇ a ⁇ blucheniya with ⁇ m ⁇ shyu ⁇ ladagen ⁇ a ⁇ i ⁇ n ⁇ si ⁇ eln ⁇ m ⁇ e ⁇ emeshenii uchas ⁇ a ⁇ blucheniya and ⁇ ladagen ⁇ a, s ⁇ glasn ⁇ iz ⁇ b ⁇ e ⁇ eniyu, nag ⁇ ev ⁇ sushes ⁇ vlyayu ⁇ ⁇ uch ⁇ m, imeyushih on ⁇ ve ⁇
  • the material used for heating a beam which has a feature that is compatible with the cutting edge, provides a reasonable protection for the transmission of light Raising the cut-off quality in the case of a linear contact, as well as increasing the cut-off efficiency.
  • ch ⁇ in us ⁇ ys ⁇ ve for ⁇ ez ⁇ i neme ⁇ alliches ⁇ i ⁇ ma ⁇ e ⁇ ial ⁇ v, s ⁇ de ⁇ zhaschem is ⁇ chni ⁇ radiation ⁇ e ⁇ l ⁇ v ⁇ g ⁇ , na ⁇ ime ⁇ , laze ⁇ on ⁇ iches ⁇ y ⁇ si ⁇ g ⁇ us ⁇ an ⁇ vlena with v ⁇ zm ⁇ zhn ⁇ s ⁇ yu ⁇ e ⁇ emesheniya vd ⁇ l it ⁇ iches ⁇ aya ⁇ usi ⁇ uyushaya sis ⁇ ema, ⁇ mi ⁇ uyuschaya laze ⁇ ny ⁇ uch ⁇ on ⁇ ve ⁇ n ⁇ s ⁇ i ma ⁇ e ⁇ iala and near uchas ⁇ a ⁇ blucheniya ma ⁇ e ⁇ iala between ⁇ iches ⁇ y ⁇ usi ⁇ uyuschey sis ⁇ em ⁇ y and ma ⁇ e ⁇ ial ⁇ m us ⁇ an ⁇ v
  • the optical system contains an optical component that is equipped with a laser beam that is directly compatible with the device.
  • the material must be used as a source of thermal radiation, such as a laser, an infrared lamp or a gas torch.
  • the preliminary heating of the material ensures an increase in the speed of cutting and the depth of the separating cavity.
  • the primary heat is especially suitable for materials with a thickness exceeding 2 mm.
  • ⁇ a ⁇ im ⁇ b ⁇ az ⁇ m on account ⁇ imizatsii usl ⁇ vy nag ⁇ eva and ⁇ a ⁇ ame ⁇ v ⁇ uch ⁇ a and ⁇ a ⁇ zhe blag ⁇ da ⁇ ya ⁇ imeneniyu in us ⁇ ys ⁇ ve ⁇ isanny ⁇ ⁇ ns ⁇ u ⁇ ivny ⁇ elemen ⁇ v, v ⁇ lyuchaya u ⁇ avlenie ⁇ un ⁇ tsi ⁇ nalnymi ⁇ ganami us ⁇ ys ⁇ va, che ⁇ ez sis ⁇ emu u ⁇ avleniya d ⁇ s ⁇ igae ⁇ sya ⁇ vyshenie nadezhn ⁇ s ⁇ i and ⁇ izv ⁇ di ⁇ eln ⁇ s ⁇ i ⁇ tsessa and ⁇ a ⁇ zhe ⁇ aches ⁇ va and ⁇ chn ⁇ s ⁇ i ⁇ ez ⁇ i.
  • the method of cutting nonmetallic materials is as follows. P ⁇ i nag ⁇ eve ⁇ ve ⁇ n ⁇ s ⁇ i ma ⁇ e ⁇ iala laze ⁇ nym radiation in ⁇ a ⁇ asn ⁇ g ⁇ dia ⁇ az ⁇ na, na ⁇ ime ⁇ , S ⁇ radiation - - laze ⁇ a with dlin ⁇ y v ⁇ lny 10.6 m ⁇ m for ⁇ g ⁇ s ⁇ e ⁇ l ⁇ , ⁇ va ⁇ ts, and ⁇ e ⁇ ami ⁇ a ⁇ yad d ⁇ ugi ⁇ ⁇ u ⁇ i ⁇ neme ⁇ alliches ⁇ i ⁇ ma ⁇ e ⁇ ial ⁇ vy yavlyayu ⁇ sya ne ⁇ z ⁇ achnymi in ⁇ ve ⁇ n ⁇ s ⁇ ny ⁇ sl ⁇ ya ⁇ in z ⁇ ne ⁇ blucheniya v ⁇ zni ⁇ ayu ⁇ na ⁇ yazheniya szha ⁇ iya . After a local cooling
  • the first part of the laser is not connected to the laser.
  • the maximum heating is supplied to the cut line, the same and the whole part of the irradiation is available for a fairly equal supply.
  • the values will be larger, and the voltage of the disconnecting line will be excluded.
  • Fig. 2 shows the scheme of such a cut.
  • part 1 is used, having an ellipse shape, elongated along the cut line, and refrigerant 2.
  • Fig. 3 shows an example of a linear touch, which has a radius of the radius - and ⁇ ⁇ .
  • the depth and width of the incision can be much less than that required in the foregoing cases of the traditional use of the incision.
  • the size of the cutting is reduced, this ensures an increase in the cutting quality. More than that, it has been established that in a number of cases of application of an incision, it is not required at all. It is enough after heating the cutting line to establish the risk of the product before cooling the part of the irradiation of the material, to avoid additional stresses, for example. We distribute a compact method for the implementation of a process.
  • a cut-out of a sheet of steel with a thickness of 1, 1 mm was made on the blanks for magnetic-optical discs with an external diameter of 130 mm and an internal diameter of 15 mm.
  • C ⁇ was used - a laser with a maximum radiation power of 45 ⁇ . Additional glass heating was not specified.
  • a partially cylindrical optical system was used, which distributes a series of 32 mm long external arrears. Point cutting was carried out with the help of a diamond needle.
  • the refrigerant air-water mixture
  • the refrigerant air-water mixture
  • the refrigerant was dispensed into the zone through a nozzle with an air pressure of 2 atm, and the flow rate of water was 2 ml / min.
  • the speed of the blade was 150 mm / s and the inner circle was 47 mm / s.
  • the accuracy of the cutting edge was 5 ⁇ m.
  • Us ⁇ ys ⁇ v ⁇ for ⁇ ez ⁇ i neme ⁇ alliches ⁇ i ⁇ ma ⁇ e ⁇ ial ⁇ v, na ⁇ ime ⁇ , lis ⁇ vy ⁇ ma ⁇ e ⁇ ial ⁇ v, s ⁇ de ⁇ zhi ⁇ is ⁇ chni ⁇ radiation ⁇ e ⁇ l ⁇ v ⁇ g ⁇ , na ⁇ ime ⁇ , laze ⁇ 9 ( ⁇ ig.4) for ⁇ iches ⁇ y ⁇ si ⁇ g ⁇ us ⁇ an ⁇ vlena ⁇ iches ⁇ aya ⁇ usi ⁇ uyuschaya sis ⁇ ema 10 s ⁇ s ⁇ yaschaya of ⁇ v ⁇ n ⁇ g ⁇ ze ⁇ ala ⁇ usi ⁇ uyuscheg ⁇ ⁇ be ⁇ iva 11 and 12, 13 ⁇ mi ⁇ uyuscheg ⁇ laze ⁇ ny ⁇ uch ⁇ on the surface of material 14 in the area of 15 edges. ⁇ close proximity 12
  • the area of the outlet 15 is provided with a mechanism 16 for the delivery of refrigerant, performed in the form of extract 17 and the air and air, which are both free and dry.
  • the machine 16 of the refrigerant delivery is equipped with directional screws (not shown at all) to ensure that there is no need for a room to shut it down.
  • the cutting mechanism 20 made in the form of a diamond needle or other cutting tool, is mixed.
  • This mechanism 20 is installed with the possibility of moving to the vertical area with contact with material 14 at a given point with a predetermined adjustable effort.
  • a point defect of a predetermined depth is produced, and when a diamond needle is moved to a movable material 14, it is not suitable for a fixed distance of 14.
  • the device In order to keep the material in the process, the device is damaged in the 21st way, and the resource may be lost as a result of the process.
  • the plate-fuses are made with side arches at an angle of 45 units and, in addition to the function of fixing the material, there is a risk that the unit will be excluded.
  • an optical active system 10, laser 9 is carried out using the system 25 control.
  • SYSTEM 25 GOVERNANCE The control and communication between all functional units and the operating mechanisms of the device is carried out depending on the given program.
  • This same optical element can also be used to shape a handheld having a ring shape that is in contact with the drive.
  • m ⁇ zhn ⁇ is ⁇ lz ⁇ va ⁇ ne ⁇ dvizhn ⁇ e ⁇ v ⁇ n ⁇ e ze ⁇ al ⁇ , ⁇ i ⁇ uyuschee ⁇ n ⁇ u ⁇ ⁇ ez ⁇ i, ⁇ e bude ⁇ ⁇ e ⁇ b ⁇ az ⁇ vya ⁇ len ⁇ chny ⁇ uch ⁇ , s ⁇ mi ⁇ vanny tsilind ⁇ iches ⁇ y ⁇ i ⁇ y in ⁇ uch ⁇ ⁇ iv ⁇ lineyn ⁇ y ⁇ my, ⁇ susches ⁇ vu s ⁇ v ⁇ adayushey with ⁇ n ⁇ u ⁇ m ⁇ ez ⁇ i.
  • the same result can be reached by the use of a mobile flexible flexible inert element, intermittent disks and inactive.
  • the laser turns on 9.
  • ⁇ the passage of time is 2
  • ⁇ Impact on material 14 of the laser beam 30 and delivery of refrigerant 2 to the cutting area are measured. After the time has passed, the laser 9 is turned off, valves 18 and 19 are turned off, and the output is turned off from the terminal 23.
  • P ⁇ imenenie ⁇ isann ⁇ g ⁇ s ⁇ s ⁇ ba ⁇ ez ⁇ i and us ⁇ ys ⁇ va na ⁇ yadu s ⁇ reduction ⁇ ud ⁇ em ⁇ s ⁇ i ⁇ tsessa on account is ⁇ lyucheniya ⁇ e ⁇ atsy almazn ⁇ - ab ⁇ azivn ⁇ g ⁇ shli ⁇ vaniya and d ⁇ v ⁇ d ⁇ i ⁇ tsev products ⁇ bes ⁇ echivae ⁇ ⁇ vyshennuyu me ⁇ aniches ⁇ uyu ⁇ chn ⁇ s ⁇ and e ⁇ s ⁇ lua ⁇ atsi ⁇ nnuyu nadezhn ⁇ s ⁇ blag ⁇ da ⁇ ya bezde ⁇ e ⁇ n ⁇ s ⁇ i ⁇ m ⁇ i ⁇ sle laze ⁇ n ⁇ y ⁇ ez ⁇ i.

Abstract

L'invention concerne un procédé de coupe de matériaux non métalliques utilisant des contraintes thermo-élastiques. Il consiste à chauffer la ligne à l'aide, par exemple, d'un faisceau laser dont la répartition de densité d'énergie au niveau de la surface du matériau dans la section sur le centre du faisceau diminue de la périphérie du faisceau jusqu'au centre, la forme du faisceau au niveau de la surface du matériau s'adaptant sensiblement au contour de coupe. Le dispositif proposé, dans une de ses variantes, comprend un laser (9), un système optique de focalisation (10) contenant un cône tronqué (26) ainsi qu'un objectif de focalisation (12), un mécanisme (16) d'alimentation en agent de refroidissement, un mécanisme (20) de coupe, un moyen (22) de déplacement relatif du matériau (14) coupé, et un moyen (27) d'alimentation du matériau en chaleur supplémentaire. Les unités et mécanismes fonctionnels principaux sont gérés par un système de commande (25) utilisant un algorithme spécifique.
PCT/RU1994/000276 1994-12-23 1994-12-23 Procede de coupe de materiaux non metalliques et dispositif de mise en ×uvre dudit procede WO1996020062A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/RU1994/000276 WO1996020062A1 (fr) 1994-12-23 1994-12-23 Procede de coupe de materiaux non metalliques et dispositif de mise en ×uvre dudit procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1994/000276 WO1996020062A1 (fr) 1994-12-23 1994-12-23 Procede de coupe de materiaux non metalliques et dispositif de mise en ×uvre dudit procede

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WO1996020062A1 true WO1996020062A1 (fr) 1996-07-04

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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19715537A1 (de) * 1997-04-14 1997-10-09 Schott Glaswerke Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
EP0872303A2 (fr) * 1997-04-14 1998-10-21 Schott Glas Procédé et dispositif pour découper de pièces pleines en matériau fragiles, notamment en verre
WO1999044785A1 (fr) * 1998-03-04 1999-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif optique pour la mise en forme d'un faisceau
DE19830237A1 (de) * 1998-07-07 2000-01-13 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
DE19918942A1 (de) * 1999-04-27 2000-11-02 Schott Glas Dünnglasscheibe und ihre Verwendungen
WO2001049444A2 (fr) * 1999-12-31 2001-07-12 Schott Glas Procede et dispositif de separation de pieces planes realisees dans un materiau a rupture fragile
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
DE19856347C2 (de) * 1998-12-07 2002-12-19 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines dünnen Werkstücks aus sprödbrüchigem Werkstoff
US6795274B1 (en) * 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
DE102005013783A1 (de) * 2005-03-22 2006-09-28 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung
DE102005027800A1 (de) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser
EP1842833A1 (fr) 2006-04-07 2007-10-10 Jenoptik Automatisierungstechnik GmbH Procédé et dispositif destinés à l'extraction d'une pièce, caractérisée par un contour préburiné fermé, d'une plaque en matériau cassant
EP2186595A1 (fr) 2008-11-18 2010-05-19 Jenoptik Automatisierungstechnik GmbH Dispositif de fabrication de modules de cellules solaires à couches minces
CN102060437A (zh) * 2009-10-06 2011-05-18 株式会社莱奥 基于大区域不均匀温度分布的脆性材料的热应力切割方法及装置
US8258427B2 (en) 2008-05-30 2012-09-04 Corning Incorporated Laser cutting of glass along a predetermined line
US8394707B2 (en) 2005-09-28 2013-03-12 Infineon Technologies Austria Ag Method of splitting of brittle materials with trenching technology
DE102012103176B3 (de) * 2012-04-12 2013-05-29 Jenoptik Automatisierungstechnik Gmbh Vorrichtung und Verfahren zum Einbringen von Trennrissen in ein Substrat
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
US20190160761A1 (en) * 2016-04-07 2019-05-30 Addcomposites Oy Tape laying and cutting system for fiber reinforced plastic manufacturing

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5004890A (en) * 1990-02-20 1991-04-02 Amada Company, Limited Method of evaluating quality of a laser beam in a laser processing machine
US5084604A (en) * 1989-05-08 1992-01-28 U.S. Philips Corporation Method of severing a plate of brittle material
US5237150A (en) * 1990-01-19 1993-08-17 Fanuc Ltd. Method of cutting workpiece with laser beam
WO1993020015A1 (fr) * 1992-04-02 1993-10-14 Fonon Technology Limited Clivage de materiaux non metalliques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084604A (en) * 1989-05-08 1992-01-28 U.S. Philips Corporation Method of severing a plate of brittle material
US5237150A (en) * 1990-01-19 1993-08-17 Fanuc Ltd. Method of cutting workpiece with laser beam
US5004890A (en) * 1990-02-20 1991-04-02 Amada Company, Limited Method of evaluating quality of a laser beam in a laser processing machine
WO1993020015A1 (fr) * 1992-04-02 1993-10-14 Fonon Technology Limited Clivage de materiaux non metalliques

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0872303A2 (fr) * 1997-04-14 1998-10-21 Schott Glas Procédé et dispositif pour découper de pièces pleines en matériau fragiles, notamment en verre
DE19715537C2 (de) * 1997-04-14 1999-08-05 Schott Glas Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
US5984159A (en) * 1997-04-14 1999-11-16 Schott Glas Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass
EP0872303A3 (fr) * 1997-04-14 1999-12-01 Schott Glas Procédé et dispositif pour découper de pièces pleines en matériau fragiles, notamment en verre
US6112967A (en) * 1997-04-14 2000-09-05 Schott Glas Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass
DE19715537A1 (de) * 1997-04-14 1997-10-09 Schott Glaswerke Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
WO1999044785A1 (fr) * 1998-03-04 1999-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif optique pour la mise en forme d'un faisceau
DE19830237C2 (de) * 1998-07-07 2001-10-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
DE19830237A1 (de) * 1998-07-07 2000-01-13 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
DE19856347C2 (de) * 1998-12-07 2002-12-19 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines dünnen Werkstücks aus sprödbrüchigem Werkstoff
DE19918942B4 (de) * 1999-04-27 2004-09-02 Schott Glas Verwendungen einer Dünnglasscheibe
DE19918942A1 (de) * 1999-04-27 2000-11-02 Schott Glas Dünnglasscheibe und ihre Verwendungen
US6795274B1 (en) * 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
US6800831B1 (en) 1999-10-29 2004-10-05 Schott Glas Method and device for rapid cutting of a workpiece from a brittle material
DE19963939A1 (de) * 1999-12-31 2001-07-19 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
WO2001049444A3 (fr) * 1999-12-31 2001-12-20 Schott Glas Procede et dispositif de separation de pieces planes realisees dans un materiau a rupture fragile
WO2001049444A2 (fr) * 1999-12-31 2001-07-12 Schott Glas Procede et dispositif de separation de pieces planes realisees dans un materiau a rupture fragile
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
DE102005013783A1 (de) * 2005-03-22 2006-09-28 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung
DE102005013783B4 (de) * 2005-03-22 2007-08-16 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung
DE102005027800A1 (de) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser
US7223936B2 (en) 2005-06-13 2007-05-29 Jenoptik Automatisierungstechnik Gmbh Arrangement for severing a flat workpiece of brittle material multiple times by means of a laser
US8394707B2 (en) 2005-09-28 2013-03-12 Infineon Technologies Austria Ag Method of splitting of brittle materials with trenching technology
EP1842833A1 (fr) 2006-04-07 2007-10-10 Jenoptik Automatisierungstechnik GmbH Procédé et dispositif destinés à l'extraction d'une pièce, caractérisée par un contour préburiné fermé, d'une plaque en matériau cassant
DE102006016926A1 (de) * 2006-04-07 2007-10-11 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Heraustrennen eines Teiles, bestimmt durch eine vorgeritzte geschlossene Kontur, aus einer Platte aus einem sprödem Material
US8258427B2 (en) 2008-05-30 2012-09-04 Corning Incorporated Laser cutting of glass along a predetermined line
DE102008058310B3 (de) * 2008-11-18 2010-06-17 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Randentschichten beschichteter Substrate und Trennen in einzelne Module
EP2186595A1 (fr) 2008-11-18 2010-05-19 Jenoptik Automatisierungstechnik GmbH Dispositif de fabrication de modules de cellules solaires à couches minces
US8404996B2 (en) 2008-11-18 2013-03-26 Jenoptik Automatisierungstechnik System for producing thin-layer solar cell modules
CN102060437A (zh) * 2009-10-06 2011-05-18 株式会社莱奥 基于大区域不均匀温度分布的脆性材料的热应力切割方法及装置
CN102060437B (zh) * 2009-10-06 2013-12-25 株式会社莱奥 基于大区域不均匀温度分布的脆性材料的热应力切割方法及装置
DE102012103176B3 (de) * 2012-04-12 2013-05-29 Jenoptik Automatisierungstechnik Gmbh Vorrichtung und Verfahren zum Einbringen von Trennrissen in ein Substrat
EP2650076A1 (fr) 2012-04-12 2013-10-16 JENOPTIK Automatisierungstechnik GmbH Dispositif et procédé dýintroduction de fissures de séparation dans un substrat utilisant une lâme ayant une ouverture modifiable
US9085048B2 (en) 2012-04-12 2015-07-21 Jenoptik Automatisierungstechnik Gmbh Apparatus and method for generating separating fissures in a substrate
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
US9624121B2 (en) 2014-01-09 2017-04-18 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
US20190160761A1 (en) * 2016-04-07 2019-05-30 Addcomposites Oy Tape laying and cutting system for fiber reinforced plastic manufacturing
US10875262B2 (en) * 2016-04-07 2020-12-29 Addcomposites Oy Tape laying and cutting system for fiber reinforced plastic manufacturing

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