JP6289286B2 - 表示装置および表示装置の製造方法 - Google Patents

表示装置および表示装置の製造方法 Download PDF

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Publication number
JP6289286B2
JP6289286B2 JP2014130279A JP2014130279A JP6289286B2 JP 6289286 B2 JP6289286 B2 JP 6289286B2 JP 2014130279 A JP2014130279 A JP 2014130279A JP 2014130279 A JP2014130279 A JP 2014130279A JP 6289286 B2 JP6289286 B2 JP 6289286B2
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display device
layer
region
substrate
conductive layer
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Japanese (ja)
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JP2016009118A (ja
JP2016009118A5 (enExample
Inventor
純 藤吉
純 藤吉
歴人 鶴岡
歴人 鶴岡
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Japan Display Inc
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Japan Display Inc
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Priority to JP2014130279A priority Critical patent/JP6289286B2/ja
Priority to CN201510280747.1A priority patent/CN105280673B/zh
Priority to CN201811577549.1A priority patent/CN110071139B/zh
Priority to KR1020150081374A priority patent/KR101757532B1/ko
Priority to US14/742,259 priority patent/US9806286B2/en
Publication of JP2016009118A publication Critical patent/JP2016009118A/ja
Publication of JP2016009118A5 publication Critical patent/JP2016009118A5/ja
Priority to US15/719,664 priority patent/US10355240B2/en
Application granted granted Critical
Publication of JP6289286B2 publication Critical patent/JP6289286B2/ja
Priority to US16/430,933 priority patent/US10797265B2/en
Priority to US17/015,145 priority patent/US11322722B2/en
Priority to US17/717,194 priority patent/US11832472B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
JP2014130279A 2014-06-25 2014-06-25 表示装置および表示装置の製造方法 Active JP6289286B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2014130279A JP6289286B2 (ja) 2014-06-25 2014-06-25 表示装置および表示装置の製造方法
CN201510280747.1A CN105280673B (zh) 2014-06-25 2015-05-27 显示装置以及显示装置的制造方法
CN201811577549.1A CN110071139B (zh) 2014-06-25 2015-05-27 显示装置以及显示装置的制造方法
KR1020150081374A KR101757532B1 (ko) 2014-06-25 2015-06-09 표시장치 및 표시장치의 제조 방법
US14/742,259 US9806286B2 (en) 2014-06-25 2015-06-17 Display device and method of manufacturing the same
US15/719,664 US10355240B2 (en) 2014-06-25 2017-09-29 Display device and method of manufacturing the same
US16/430,933 US10797265B2 (en) 2014-06-25 2019-06-04 Display device
US17/015,145 US11322722B2 (en) 2014-06-25 2020-09-09 Semiconductor device
US17/717,194 US11832472B2 (en) 2014-06-25 2022-04-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014130279A JP6289286B2 (ja) 2014-06-25 2014-06-25 表示装置および表示装置の製造方法

Publications (3)

Publication Number Publication Date
JP2016009118A JP2016009118A (ja) 2016-01-18
JP2016009118A5 JP2016009118A5 (enExample) 2016-09-23
JP6289286B2 true JP6289286B2 (ja) 2018-03-07

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JP2014130279A Active JP6289286B2 (ja) 2014-06-25 2014-06-25 表示装置および表示装置の製造方法

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US (5) US9806286B2 (enExample)
JP (1) JP6289286B2 (enExample)
KR (1) KR101757532B1 (enExample)
CN (2) CN110071139B (enExample)

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CN108447872B (zh) * 2018-03-14 2021-01-22 京东方科技集团股份有限公司 阵列基板及其制作方法和显示装置
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KR102670077B1 (ko) * 2018-10-05 2024-05-28 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN109887972A (zh) * 2019-02-27 2019-06-14 武汉华星光电半导体显示技术有限公司 阵列基板及具有该阵列基板的显示装置
JP7373104B2 (ja) * 2019-06-05 2023-11-02 ＪＤＩ Ｄｅｓｉｇｎ ａｎｄ Ｄｅｖｅｌｏｐｍｅｎｔ 合同会社 表示装置の製造方法
WO2020262372A1 (ja) * 2019-06-27 2020-12-30 株式会社村田製作所 樹脂多層基板およびその製造方法
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Publication number Publication date
US20200403185A1 (en) 2020-12-24
JP2016009118A (ja) 2016-01-18
US20220238842A1 (en) 2022-07-28
CN110071139A (zh) 2019-07-30
US9806286B2 (en) 2017-10-31
CN105280673A (zh) 2016-01-27
US10797265B2 (en) 2020-10-06
CN105280673B (zh) 2019-01-11
US11832472B2 (en) 2023-11-28
US10355240B2 (en) 2019-07-16
KR20160000846A (ko) 2016-01-05
US20150380679A1 (en) 2015-12-31
US20180026231A1 (en) 2018-01-25
US11322722B2 (en) 2022-05-03
CN110071139B (zh) 2023-05-05
KR101757532B1 (ko) 2017-07-27
US20190288236A1 (en) 2019-09-19

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