JP6187684B2 - 部品上にパターン化されたコーティングを形成する方法 - Google Patents
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- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B81B2203/00—Basic microelectromechanical structures
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- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
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- B81—MICROSTRUCTURAL TECHNOLOGY
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- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
- B81C2201/053—Depositing a protective layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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Description
BE 部品
CA コーティング領域
UCA 非コーティング領域
RT リリースフィルム
LF コーティング(ラミネートフィルム等)
TL 第1及び第2の分割線(CAを包囲)
TR 基板
MK、CK MEMS又はチップコンポーネント
MW MEMSウェーハ
MM (MK内の)マイクロホン膜
AN 凹部(マイクロホン膜上)
KA 基板上のデバイスの上方を覆うキャップ
CR カバー
SO サウンドホール(カバー又は基板内)
ZR (2つのコンポーネントの間の)ギャップ
MA マスク
ML 金属層/メタライジング部
DM 密封材
FV 前側空間
RV 後側空間
DR 硬化すると弾性材料となる粘稠な塊状物
SK サウンドチャネル(SO、DM及びLF中の開口、コンポーネント間及びMKとTRとの間のギャップによって形成されている)
Claims (16)
- コーティング領域(CA)と非コーティング領域(UCA)とを有する表面を有する部品の表面にパターン状のコーティングを形成する方法であって、
a.前記部品へリリースフィルム(RT)を形成し、非コーティング領域内において少なくとも部分的に固定することと、
b.前記コーティング領域(CA)内の前記リリースフィルムを除去することと、
c.前記リリースフィルム(RTS)及び前記部品の表面全体にわたってコーティング(LF)を形成することと、
d.前記コーティング領域(CA)を取り囲む第2の分割線(TL2)に沿って前記コーティングを分割することと、
e.少なくとも第2の分割線(TL2)で囲まれた領域内の前記リリースフィルム(RT)の接着力を低減することと、
f.前記非コーティング領域内の前記リリースフィルムを、その上に形成された前記コーティングと共に剥離することと、
を含み、
−前記部品(BE)が、基板(TR)上に配置された1又は複数のMEMSコンポーネント又はチップコンポーネント(MK、CK)を有するデバイスの一部であり、該部品がこれらのコンポーネントを構成しており、
−工程d)において、コーティング(LF)として、フィルムを前記デバイスの表面全体にわたって、前記MEMSコンポーネント又はチップコンポーネントのそれぞれ、或いは装置としてのコンポーネント全体を基板上で密封するように貼付し、
−工程g)により、非コーティング領域(UCA)に、MEMSコンポーネントへのメディアアクセスを形成する、方法。 - UVリリーステープ又は熱リリーステープが前記リリースフィルム(RT)として用いられ、前記工程e)において、UV光、レーザー又は熱の作用により前記リリースフィルムの接着力が低減される請求項1に記載の方法。
- −工程a)において、MEMSウェーハの複数のMEMSコンポーネント(MK)に対し同時にリリースフィルム(RT)を貼付し、
−次いで工程b)を実行し、
−MEMSコンポーネントを分離し、
−少なくとも1つのMEMSコンポーネント(MK)及び少なくとも1つのチップコンポーネント(CK)を前記デバイスに取り付け、
−その後、工程c)からf)を実行する、
請求項1又は2に記載の方法。 - −工程b)において、非コーティング領域(UCA)を取り囲む第1の分割線(TL1)に沿って前記リリースフィルム(RT)に切り込みを形成し、
−工程b)において、コーティング領域(CA)のうち、第1の分割線(TL1)で囲まれた領域の外側のリリースフィルムを除去し、
−次いでコーティング(LF)を形成し、
−工程e)において、まず、熱又はUV照射の作用により、非コーティング領域全体上のリリースフィルムの接着力を低減し、その後、工程d)においてコーティング内の第2の分割線(TL2)に沿って第2の切り込みを形成し、或いは工程e)の前に工程d)を実行し、
−次いで、工程f)を実行する、
請求項1から3のいずれか1項に記載の方法。 - −前記部品(BE)がMEMSマイクロホンであり、単独で、或いはデバイスに組み込まれた形で基板(TR)上に実装されており、
−工程f)において、マイクロホンのマイクロホン膜上に、非コーティング領域(UCA)として凹部(AN)を露出させ、
−MEMSマイクロホン又はデバイスを覆うように、被覆(CR、KA)を基板上に固定し、被覆の下でMEMSマイクロホン又はデバイスを収容する空洞を包囲及び密封し、
−平坦な基板(TR)を用い、その上に被覆としてキャップ(KA)を形成し、或いはトラフ状の基板を用い、それを覆うように平坦な被覆(CR)を形成し、
−被覆(KA、CR)又は基板(TR)内にサウンドホール(SO)を設ける、
請求項1から4のいずれか1項に記載の方法。 - コーティング(LF)により、マイクロホン膜の上側の空間を、膜の下側の空間に対し密封し、それにより、膜の上側の空間がコーティングの上方及びカバーの下側に残存する空洞を含み、
コーティングの下側且つマイクロホン膜の下側の空間が、コーティングを貫通し、基板に対し密封された、少なくとも1つのMEMS及び/又はチップコンポーネントの間のギャップを含む、
請求項4又は5に記載の方法。 - 工程c)において、コーティング(LF)として、深絞り加工可能なフィルムがデバイス上に形成される、請求項5又は6に記載の方法。
- −工程b)及びf)において、2つのコンポーネント(CK、MK)間のギャップ上の架橋領域にもリリースフィルム(RT)を残すか、除去せずにおき、
−工程c)の実施中及び後に、架橋領域に残存したリリースフィルムが、ギャップ上のコーティング(LF)を補強する、
請求項1から7のいずれか1項に記載の方法。 - −リリースフィルム(RT)として熱リリーステープが用いられ、前記リリースフィルム(RT)の貼付が、基板(TR)上でのコンポーネントの組み立て後に行われ、
−工程e)において、全体に残ったリリースフィルムの接着力が、熱の作用により低減され、
−非コーティング領域(UCA)内のリリースフィルム及びその上に形成されたコーティング(LF)の剥離が、エアブロー、吸引又は粘着フィルムを用いた剥離により行われる、
請求項1に記載の方法。 - 工程c)において、コーティング(LF)として、深絞り加工可能で熱硬化可能なフィルムがデバイス上に形成される、請求項1から9のいずれか1項に記載の方法。
- −デバイスに隣接し、それを完全に包囲する端領域を除く基板上のコーティングを除去し、それにより、コーティングが前記端領域全体において前記基板に密着して終端し、
−キャップを、基板のコーティングが除去された領域の上に載置し、基板と接合する、
請求項5から10のいずれか1項に記載の方法。 - −MEMSコンポーネントとしてMEMSマイクロホンが、デバイス内に組み込まれ、フリップチップ実装を用いて基板上にマウントされ、
−カバーとして、キャップが、サウンドホール(SO)内に設けられ、基板上でデバイスを覆うようにマウントされ、
−2つのコンポーネント間のギャップの上方にサウンドホールが設けられ、
−デバイスの上方のキャップとコーティングの間が密封され、内側からキャップ周囲のサウンドホールが密封され、
−サウンドホール下方の密封材に開口が設けられ、
−サウンドホール(SO)を貫通して連続したサウンドチャネル(Schallkanal)(SK)、密封材(DM)及びコーティング(LF)が、ギャップを通り、MEMSコンポーネント(MK)の下側に開口するように、コーティングを貫通してギャップに向かって開口を延在させた、
請求項5から11のいずれか1項に記載の方法。 - キャップ(KA)を設置後に、サウンドホール(SO)を通して、粘性塊として、密封材(DM)を塗布し、その後、硬化させる、請求項12に記載の方法。
- ギャップを覆うようにコーティング(LF)の上にキャップを載置する前に、密封材(DM)を配置する、請求項12に記載の方法。
- 密封材(DM)として、弾性材料からなる密封リングが、ギャップを覆うコーティングの上に配置された、請求項14に記載の方法。
- 粘性を示し、硬化状態で弾性を示す組成物(LD)として、密封材(DM)が、コーティング(LF)とキャップ(KA)の間のサウンドホール(SO)の領域内に、サウンドホールを閉じ、コーティングとの境界を密封するように形成され、
次いで、レーザードリリング法を用いて、密封材(DM)及びコーティング(LF)に開口(OE)を形成する、
請求項12又は13に記載の方法。
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DE102013106353.5A DE102013106353B4 (de) | 2013-06-18 | 2013-06-18 | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
DE102013106353.5 | 2013-06-18 | ||
PCT/EP2014/059633 WO2014202283A2 (de) | 2013-06-18 | 2014-05-12 | Verfahren zum aufbringen einer strukturierten beschichtung auf ein bauelement |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10407441B2 (en) | 2010-05-14 | 2019-09-10 | Dana-Farber Cancer Institute, Inc. | Compositions and methods for treating neoplasia, inflammatory disease and other disorders |
US10925881B2 (en) | 2014-02-28 | 2021-02-23 | Tensha Therapeutics, Inc. | Treatment of conditions associated with hyperinsulinaemia |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014105849B3 (de) * | 2014-04-25 | 2015-09-17 | Epcos Ag | Mikrofon mit vergrößertem Rückvolumen und Verfahren zur Herstellung |
DE102015106442B4 (de) | 2015-04-27 | 2018-03-22 | Infineon Technologies Ag | Chipgehäuse und Verfahren zu seiner Herstellung |
DE102015016744A1 (de) | 2015-07-30 | 2017-02-02 | Lohmann Gmbh & Co. Kg | Release Liner |
DE102015112642A1 (de) * | 2015-07-31 | 2017-02-02 | Epcos Ag | Mikrofon in Top-Portausführung und Verfahren zur Herstellung |
WO2017059898A1 (en) * | 2015-10-07 | 2017-04-13 | Tdk Corporation | Top port microphone with enlarged back volume |
DE102016113347A1 (de) | 2016-07-20 | 2018-01-25 | Infineon Technologies Ag | Verfahren zum produzieren eines halbleitermoduls |
DE102016117990B4 (de) | 2016-09-23 | 2019-07-04 | Infineon Technologies Ag | Temporäre mechanische stabilisierung von halbleiterhohlräumen |
US11795116B2 (en) | 2016-12-21 | 2023-10-24 | Corning Incorporated | Ceramic assembly and method of forming the same |
US11081413B2 (en) * | 2018-02-23 | 2021-08-03 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with inner and outer cavities |
DE102018104279A1 (de) | 2018-02-26 | 2019-08-29 | Tdk Electronics Ag | Elektronische Vorrichtung |
US10549984B2 (en) * | 2018-06-29 | 2020-02-04 | Sae Magnetics (H.K.) Ltd. | MEMS package and method of manufacturing the same |
CN110902642A (zh) | 2018-09-17 | 2020-03-24 | 新科实业有限公司 | Mems封装件及制造其的方法 |
US10863282B2 (en) | 2019-01-30 | 2020-12-08 | Sae Magnetics (H.K.) Ltd. | MEMS package, MEMS microphone and method of manufacturing the MEMS package |
US10785576B1 (en) | 2019-04-30 | 2020-09-22 | Sae Magnetics (H.K.) Ltd. | MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone |
US10934159B2 (en) | 2019-06-03 | 2021-03-02 | Sae Magnetics (H.K.) Ltd. | MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone |
US11350220B2 (en) | 2020-01-17 | 2022-05-31 | Sae Magnetics (H.K.) Ltd. | MEMS package, MEMS microphone and method of manufacturing the MEMS package |
KR20220054995A (ko) * | 2020-10-26 | 2022-05-03 | 주식회사 엘지에너지솔루션 | 이차전지용 전극판 제조방법 및 이차전지용 전극판 |
Family Cites Families (221)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2105010A (en) * | 1933-02-25 | 1938-01-11 | Brush Dev Co | Piezoelectric device |
US3447217A (en) * | 1964-02-05 | 1969-06-03 | Hitachi Ltd | Method of producing ceramic piezoelectric vibrator |
US3587322A (en) * | 1969-06-17 | 1971-06-28 | Simmonds Precision Products | Pressure transducer mounting |
US3735211A (en) * | 1971-06-21 | 1973-05-22 | Fairchild Camera Instr Co | Semiconductor package containing a dual epoxy and metal seal between a cover and a substrate, and method for forming said seal |
US3726002A (en) * | 1971-08-27 | 1973-04-10 | Ibm | Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate |
JPS562346Y2 (ja) * | 1974-05-23 | 1981-01-20 | ||
US4127840A (en) * | 1977-02-22 | 1978-11-28 | Conrac Corporation | Solid state force transducer |
US4454440A (en) * | 1978-12-22 | 1984-06-12 | United Technologies Corporation | Surface acoustic wave (SAW) pressure sensor structure |
JPS55112864U (ja) * | 1979-02-02 | 1980-08-08 | ||
US4222277A (en) * | 1979-08-13 | 1980-09-16 | Kulite Semiconductor Products, Inc. | Media compatible pressure transducer |
US4277814A (en) * | 1979-09-04 | 1981-07-07 | Ford Motor Company | Semiconductor variable capacitance pressure transducer assembly |
JPS622879Y2 (ja) * | 1981-03-25 | 1987-01-22 | ||
CH642504A5 (en) * | 1981-06-01 | 1984-04-13 | Asulab Sa | Hybrid electroacoustic transducer |
US4424419A (en) * | 1981-10-19 | 1984-01-03 | Northern Telecom Limited | Electret microphone shield |
US4558184A (en) * | 1983-02-24 | 1985-12-10 | At&T Bell Laboratories | Integrated capacitive transducer |
US4545440A (en) * | 1983-04-07 | 1985-10-08 | Treadway John E | Attachment for pneumatic hammers for punching holes of varying size |
US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
JPS60111129A (ja) * | 1983-11-21 | 1985-06-17 | Yokogawa Hokushin Electric Corp | 圧力センサ |
US4641054A (en) * | 1984-08-09 | 1987-02-03 | Nippon Ceramic Company, Limited | Piezoelectric electro-acoustic transducer |
US4691363A (en) * | 1985-12-11 | 1987-09-01 | American Telephone & Telegraph Company, At&T Information Systems Inc. | Transducer device |
JPS62173814A (ja) * | 1986-01-28 | 1987-07-30 | Alps Electric Co Ltd | 弾性表面波素子搭載ユニツト |
ATA74486A (de) * | 1986-03-20 | 1987-04-15 | Akg Akustische Kino Geraete | Richtmikrophon nach dem elektrostatischen oder elektrodynamischen wandlerprinzip |
JPH0726887B2 (ja) * | 1986-05-31 | 1995-03-29 | 株式会社堀場製作所 | コンデンサマイクロフオン型検出器用ダイアフラム |
US5091051A (en) * | 1986-12-22 | 1992-02-25 | Raytheon Company | Saw device method |
NL8702589A (nl) * | 1987-10-30 | 1989-05-16 | Microtel Bv | Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent. |
US5293781A (en) * | 1987-11-09 | 1994-03-15 | California Institute Of Technology | Tunnel effect measuring systems and particle detectors |
US4816125A (en) * | 1987-11-25 | 1989-03-28 | The Regents Of The University Of California | IC processed piezoelectric microphone |
US5216490A (en) * | 1988-01-13 | 1993-06-01 | Charles Stark Draper Laboratory, Inc. | Bridge electrodes for microelectromechanical devices |
US4985926A (en) * | 1988-02-29 | 1991-01-15 | Motorola, Inc. | High impedance piezoelectric transducer |
US4825335A (en) * | 1988-03-14 | 1989-04-25 | Endevco Corporation | Differential capacitive transducer and method of making |
US4866683A (en) * | 1988-05-24 | 1989-09-12 | Honeywell, Inc. | Integrated acoustic receiver or projector |
US4984268A (en) * | 1988-11-21 | 1991-01-08 | At&T Bell Laboratories | Telephone handset construction |
US5146435A (en) * | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
DE4000903C1 (ja) * | 1990-01-15 | 1990-08-09 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
US5101543A (en) * | 1990-07-02 | 1992-04-07 | Gentex Corporation | Method of making a variable capacitor microphone |
US5059848A (en) * | 1990-08-20 | 1991-10-22 | The United States Of America As Represented By The Secretary Of The Army | Low-cost saw packaging technique |
US5153379A (en) * | 1990-10-09 | 1992-10-06 | Motorola, Inc. | Shielded low-profile electronic component assembly |
US5189777A (en) * | 1990-12-07 | 1993-03-02 | Wisconsin Alumni Research Foundation | Method of producing micromachined differential pressure transducers |
JP2772739B2 (ja) * | 1991-06-20 | 1998-07-09 | いわき電子株式会社 | リードレスパッケージの外部電極構造及びその製造方法 |
US5184107A (en) * | 1991-01-28 | 1993-02-02 | Honeywell, Inc. | Piezoresistive pressure transducer with a conductive elastomeric seal |
US5178015A (en) * | 1991-07-22 | 1993-01-12 | Monolithic Sensors Inc. | Silicon-on-silicon differential input sensors |
US5257547A (en) * | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
US5650685A (en) * | 1992-01-30 | 1997-07-22 | The United States Of America As Represented By The Secretary Of The Army | Microcircuit package with integrated acoustic isolator |
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
FR2697675B1 (fr) * | 1992-11-05 | 1995-01-06 | Suisse Electronique Microtech | Procédé de fabrication de transducteurs capacitifs intégrés. |
US5531787A (en) * | 1993-01-25 | 1996-07-02 | Lesinski; S. George | Implantable auditory system with micromachined microsensor and microactuator |
US5475606A (en) * | 1993-03-05 | 1995-12-12 | International Business Machines Corporation | Faraday cage for a printed circuit card |
US5477008A (en) * | 1993-03-19 | 1995-12-19 | Olin Corporation | Polymer plug for electronic packages |
US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
US5465008A (en) * | 1993-10-08 | 1995-11-07 | Stratedge Corporation | Ceramic microelectronics package |
JPH07111254A (ja) * | 1993-10-12 | 1995-04-25 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
US6191928B1 (en) * | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
US5452268A (en) * | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
US5545912A (en) * | 1994-10-27 | 1996-08-13 | Motorola, Inc. | Electronic device enclosure including a conductive cap and substrate |
US6004419A (en) * | 1994-12-27 | 1999-12-21 | Dai Nippon Printing Co., Ltd. | Heat transfer printing process for producing raised images |
US5677049A (en) * | 1994-12-27 | 1997-10-14 | Dai Nippon Printing Co., Ltd. | Heat transfer printing sheet for producting raised images |
JP3171043B2 (ja) * | 1995-01-11 | 2001-05-28 | 株式会社村田製作所 | 弾性表面波装置 |
US5506919A (en) * | 1995-03-27 | 1996-04-09 | Eastman Kodak Company | Conductive membrane optical modulator |
JP3328102B2 (ja) * | 1995-05-08 | 2002-09-24 | 松下電器産業株式会社 | 弾性表面波装置及びその製造方法 |
US5659195A (en) * | 1995-06-08 | 1997-08-19 | The Regents Of The University Of California | CMOS integrated microsensor with a precision measurement circuit |
DK172085B1 (da) * | 1995-06-23 | 1997-10-13 | Microtronic As | Mikromekanisk mikrofon |
US5573435A (en) * | 1995-08-31 | 1996-11-12 | The Whitaker Corporation | Tandem loop contact for an electrical connector |
TW332166B (en) * | 1995-10-06 | 1998-05-21 | Laurance Lewellin Richard | Method for making articles with rice hulls |
US5674785A (en) * | 1995-11-27 | 1997-10-07 | Micron Technology, Inc. | Method of producing a single piece package for semiconductor die |
JP3294490B2 (ja) * | 1995-11-29 | 2002-06-24 | 株式会社日立製作所 | Bga型半導体装置 |
JP3432982B2 (ja) * | 1995-12-13 | 2003-08-04 | 沖電気工業株式会社 | 表面実装型半導体装置の製造方法 |
US6242842B1 (en) * | 1996-12-16 | 2001-06-05 | Siemens Matsushita Components Gmbh & Co. Kg | Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production |
DE19548046C2 (de) * | 1995-12-21 | 1998-01-15 | Siemens Matsushita Components | Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen |
DE19548051A1 (de) * | 1995-12-21 | 1997-06-26 | Siemens Matsushita Components | Elektronisches Bauelement insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - |
DE19548048C2 (de) * | 1995-12-21 | 1998-01-15 | Siemens Matsushita Components | Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement (OFW-Bauelement) |
JPH09222372A (ja) * | 1996-02-19 | 1997-08-26 | Mitsubishi Electric Corp | 半導体式センサ |
US5888845A (en) * | 1996-05-02 | 1999-03-30 | National Semiconductor Corporation | Method of making high sensitivity micro-machined pressure sensors and acoustic transducers |
JPH11510666A (ja) * | 1996-05-24 | 1999-09-14 | シーメンス マツシタ コンポーネンツ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ウント コンパニコマンデイート ゲゼルシヤフト | 電子デバイス、特に表面音波で作動するデバイス―sawデバイス |
US5939968A (en) * | 1996-06-19 | 1999-08-17 | Littelfuse, Inc. | Electrical apparatus for overcurrent protection of electrical circuits |
AU6541996A (en) * | 1996-06-24 | 1998-01-14 | International Business Machines Corporation | Stacked semiconductor device package |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
US5838551A (en) * | 1996-08-01 | 1998-11-17 | Northern Telecom Limited | Electronic package carrying an electronic component and assembly of mother board and electronic package |
US5740261A (en) * | 1996-11-21 | 1998-04-14 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
JP3576727B2 (ja) * | 1996-12-10 | 2004-10-13 | 株式会社デンソー | 表面実装型パッケージ |
DE19653097A1 (de) * | 1996-12-20 | 1998-07-02 | Forschungszentrum Juelich Gmbh | Schicht mit porösem Schichtbereich, eine solche Schicht enthaltendes Interferenzfilter sowie Verfahren zu ihrer Herstellung |
US5999821A (en) * | 1997-01-29 | 1999-12-07 | Motorola, Inc. | Radiotelephone having a user interface module |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US5923995A (en) * | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
US6118881A (en) * | 1997-05-13 | 2000-09-12 | Lucent Technologies Inc. | Reduction of flow-induced microphone noise |
US5831262A (en) * | 1997-06-27 | 1998-11-03 | Lucent Technologies Inc. | Article comprising an optical fiber attached to a micromechanical device |
WO1999000844A2 (en) * | 1997-06-30 | 1999-01-07 | Formfactor, Inc. | Sockets for semiconductor devices with spring contact elements |
JP3336913B2 (ja) * | 1997-06-30 | 2002-10-21 | 株式会社村田製作所 | 電子部品のパッケージ構造 |
US5990418A (en) * | 1997-07-29 | 1999-11-23 | International Business Machines Corporation | Hermetic CBGA/CCGA structure with thermal paste cooling |
TW387198B (en) * | 1997-09-03 | 2000-04-11 | Hosiden Corp | Audio sensor and its manufacturing method, and semiconductor electret capacitance microphone using the same |
US6150753A (en) * | 1997-12-15 | 2000-11-21 | Cae Blackstone | Ultrasonic transducer assembly having a cobalt-base alloy housing |
DE19757560A1 (de) * | 1997-12-23 | 1999-07-01 | Forschungszentrum Juelich Gmbh | Verfahren zur Herstellung einer porösen Schicht mit Hilfe eines elektrochemischen Ätzprozesses |
DE19806550B4 (de) * | 1998-02-17 | 2004-07-22 | Epcos Ag | Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement |
DE19806818C1 (de) * | 1998-02-18 | 1999-11-04 | Siemens Matsushita Components | Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements |
US6282072B1 (en) * | 1998-02-24 | 2001-08-28 | Littelfuse, Inc. | Electrical devices having a polymer PTC array |
US6400065B1 (en) * | 1998-03-31 | 2002-06-04 | Measurement Specialties, Inc. | Omni-directional ultrasonic transducer apparatus and staking method |
DE19818824B4 (de) * | 1998-04-27 | 2008-07-31 | Epcos Ag | Elektronisches Bauelement und Verfahren zu dessen Herstellung |
DE19822794C1 (de) * | 1998-05-20 | 2000-03-09 | Siemens Matsushita Components | Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente |
US6052464A (en) * | 1998-05-29 | 2000-04-18 | Motorola, Inc. | Telephone set having a microphone for receiving or an earpiece for generating an acoustic signal via a keypad |
FI105880B (fi) * | 1998-06-18 | 2000-10-13 | Nokia Mobile Phones Ltd | Mikromekaanisen mikrofonin kiinnitys |
US6108184A (en) * | 1998-11-13 | 2000-08-22 | Littlefuse, Inc. | Surface mountable electrical device comprising a voltage variable material |
JP2000223446A (ja) | 1998-11-27 | 2000-08-11 | Denso Corp | 半導体装置およびその製造方法 |
US6078245A (en) * | 1998-12-17 | 2000-06-20 | Littelfuse, Inc. | Containment of tin diffusion bar |
US7003127B1 (en) * | 1999-01-07 | 2006-02-21 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
US6838972B1 (en) * | 1999-02-22 | 2005-01-04 | Littelfuse, Inc. | PTC circuit protection devices |
US6157546A (en) * | 1999-03-26 | 2000-12-05 | Ericsson Inc. | Shielding apparatus for electronic devices |
US6182342B1 (en) * | 1999-04-02 | 2001-02-06 | Andersen Laboratories, Inc. | Method of encapsulating a saw device |
US6136419A (en) * | 1999-05-26 | 2000-10-24 | International Business Machines Corporation | Ceramic substrate having a sealed layer |
CA2315417A1 (en) * | 1999-08-11 | 2001-02-11 | Hiroshi Une | Electret capacitor microphone |
US6732588B1 (en) * | 1999-09-07 | 2004-05-11 | Sonionmems A/S | Pressure transducer |
US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
US6829131B1 (en) * | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
FR2799883B1 (fr) * | 1999-10-15 | 2003-05-30 | Thomson Csf | Procede d'encapsulation de composants electroniques |
CA2387125C (en) * | 1999-11-19 | 2011-10-18 | Gentex Corporation | Vehicle accessory microphone |
US6324907B1 (en) * | 1999-11-29 | 2001-12-04 | Microtronic A/S | Flexible substrate transducer assembly |
US20020076910A1 (en) * | 1999-12-15 | 2002-06-20 | Pace Benedict G. | High density electronic interconnection |
US6613605B2 (en) * | 1999-12-15 | 2003-09-02 | Benedict G Pace | Interconnection method entailing protuberances formed by melting metal over contact areas |
DE19961842B4 (de) * | 1999-12-21 | 2008-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mehrschichtleiterplatte |
US6236145B1 (en) * | 2000-02-29 | 2001-05-22 | Cts Corporation | High thermal resistivity crystal resonator support structure and oscillator package |
JP2001267473A (ja) * | 2000-03-17 | 2001-09-28 | Hitachi Ltd | 半導体装置およびその製造方法 |
DE10016867A1 (de) * | 2000-04-05 | 2001-10-18 | Epcos Ag | Bauelement mit Beschriftung |
US6809413B1 (en) * | 2000-05-16 | 2004-10-26 | Sandia Corporation | Microelectronic device package with an integral window mounted in a recessed lip |
US6384473B1 (en) * | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
US6856225B1 (en) * | 2000-05-17 | 2005-02-15 | Xerox Corporation | Photolithographically-patterned out-of-plane coil structures and method of making |
US7153717B2 (en) * | 2000-05-30 | 2006-12-26 | Ic Mechanics Inc. | Encapsulation of MEMS devices using pillar-supported caps |
JP2002001857A (ja) * | 2000-06-21 | 2002-01-08 | Nitto Denko Corp | 樹脂基板及び液晶表示装置 |
US6535460B2 (en) * | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
US6439869B1 (en) * | 2000-08-16 | 2002-08-27 | Micron Technology, Inc. | Apparatus for molding semiconductor components |
US6530515B1 (en) * | 2000-09-26 | 2003-03-11 | Amkor Technology, Inc. | Micromachine stacked flip chip package fabrication method |
US6566672B1 (en) * | 2000-09-29 | 2003-05-20 | Heidelberger Druckmaschinen Ag | Light sensor for sheet products |
JP2002134875A (ja) * | 2000-10-26 | 2002-05-10 | Murata Mfg Co Ltd | モジュール部品、モジュール部品の実装構造、および電子装置 |
US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
US7439616B2 (en) * | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
US7092539B2 (en) * | 2000-11-28 | 2006-08-15 | University Of Florida Research Foundation, Inc. | MEMS based acoustic array |
WO2002074686A2 (en) * | 2000-12-05 | 2002-09-26 | Analog Devices, Inc. | A method and device for protecting micro electromechanical systems structures during dicing of a wafer |
GB2386030B (en) * | 2000-12-22 | 2004-08-18 | Bruel & Kjaer Sound & Vibratio | A micromachined capacitive transducer |
US6448697B1 (en) * | 2000-12-28 | 2002-09-10 | Cts Corporation | Piezoelectric device having increased mechanical compliance |
DE10104574A1 (de) * | 2001-02-01 | 2002-08-08 | Epcos Ag | Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung |
AU2002250080A1 (en) * | 2001-02-14 | 2002-08-28 | Gentex Corporation | Vehicle accessory microphone |
US6437449B1 (en) * | 2001-04-06 | 2002-08-20 | Amkor Technology, Inc. | Making semiconductor devices having stacked dies with biased back surfaces |
KR100404904B1 (ko) * | 2001-06-09 | 2003-11-07 | 전자부품연구원 | 차동 용량형 압력센서 및 그 제조방법 |
JP3794292B2 (ja) * | 2001-07-03 | 2006-07-05 | 株式会社村田製作所 | 圧電型電気音響変換器およびその製造方法 |
DE10136743B4 (de) * | 2001-07-27 | 2013-02-14 | Epcos Ag | Verfahren zur hermetischen Verkapselung eines Bauelementes |
TW554498B (en) * | 2001-08-17 | 2003-09-21 | Citizen Watch Co Ltd | Electronic device and production process thereof |
US7298856B2 (en) * | 2001-09-05 | 2007-11-20 | Nippon Hoso Kyokai | Chip microphone and method of making same |
US6930364B2 (en) * | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
WO2003032484A1 (de) * | 2001-09-28 | 2003-04-17 | Epcos Ag | Verfahren zur verkapselung eines elektrischen bauelementes und damit verkapseltes oberflächenwellenbauelement |
WO2003047307A2 (en) * | 2001-11-27 | 2003-06-05 | Corporation For National Research Initiatives | A miniature condenser microphone and fabrication method therefor |
US6649446B1 (en) * | 2001-11-29 | 2003-11-18 | Clarisay, Inc. | Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof |
DE10164494B9 (de) * | 2001-12-28 | 2014-08-21 | Epcos Ag | Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung |
DE10164502B4 (de) * | 2001-12-28 | 2013-07-04 | Epcos Ag | Verfahren zur hermetischen Verkapselung eines Bauelements |
US6800987B2 (en) * | 2002-01-22 | 2004-10-05 | Measurement Specialties, Inc. | Protective housing for ultrasonic transducer apparatus |
US6891266B2 (en) * | 2002-02-14 | 2005-05-10 | Mia-Com | RF transition for an area array package |
JP3908059B2 (ja) * | 2002-02-27 | 2007-04-25 | スター精密株式会社 | エレクトレットコンデンサマイクロホン |
US6627814B1 (en) * | 2002-03-22 | 2003-09-30 | David H. Stark | Hermetically sealed micro-device package with window |
US6673697B2 (en) * | 2002-04-03 | 2004-01-06 | Intel Corporation | Packaging microelectromechanical structures |
US7217588B2 (en) * | 2005-01-05 | 2007-05-15 | Sharp Laboratories Of America, Inc. | Integrated MEMS packaging |
US6621392B1 (en) * | 2002-04-25 | 2003-09-16 | International Business Machines Corporation | Micro electromechanical switch having self-aligned spacers |
US6713314B2 (en) * | 2002-08-14 | 2004-03-30 | Intel Corporation | Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
US6850133B2 (en) * | 2002-08-14 | 2005-02-01 | Intel Corporation | Electrode configuration in a MEMS switch |
DE10238523B4 (de) * | 2002-08-22 | 2014-10-02 | Epcos Ag | Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung |
US7072482B2 (en) * | 2002-09-06 | 2006-07-04 | Sonion Nederland B.V. | Microphone with improved sound inlet port |
US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
JP3826875B2 (ja) * | 2002-10-29 | 2006-09-27 | セイコーエプソン株式会社 | 圧電デバイスおよびその製造方法 |
US6909589B2 (en) * | 2002-11-20 | 2005-06-21 | Corporation For National Research Initiatives | MEMS-based variable capacitor |
US7371970B2 (en) * | 2002-12-06 | 2008-05-13 | Flammer Jeffrey D | Rigid-flex circuit board system |
US7492019B2 (en) * | 2003-03-07 | 2009-02-17 | Ic Mechanics, Inc. | Micromachined assembly with a multi-layer cap defining a cavity |
US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
WO2004093506A2 (en) * | 2003-04-15 | 2004-10-28 | Wavezero, Inc. | Electomagnetic interference shielding for a printed circuit board |
JP3966237B2 (ja) * | 2003-06-19 | 2007-08-29 | セイコーエプソン株式会社 | 圧電デバイス、圧電デバイスを搭載した電子機器 |
DE10344229A1 (de) * | 2003-09-24 | 2005-05-19 | Steag Microparts Gmbh | Mikrostruktuierte Vorrichtung zum entnehmbaren Speichern von kleinen Flüssigkeitsmengen und Verfahren zum Entnehmen der in dieser Vorrichtung gespeicherten Flüssigkeit |
US7233679B2 (en) * | 2003-09-30 | 2007-06-19 | Motorola, Inc. | Microphone system for a communication device |
JP4264103B2 (ja) * | 2004-03-03 | 2009-05-13 | パナソニック株式会社 | エレクトレットコンデンサーマイクロホン |
DE102004011148B3 (de) | 2004-03-08 | 2005-11-10 | Infineon Technologies Ag | Mikrophon und Verfahren zum Herstellen eines Mikrophons |
CN1926919B (zh) * | 2004-03-09 | 2011-01-26 | 松下电器产业株式会社 | 驻极体电容式麦克风 |
JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
DE102004020204A1 (de) * | 2004-04-22 | 2005-11-10 | Epcos Ag | Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung |
JP3998658B2 (ja) * | 2004-04-28 | 2007-10-31 | 富士通メディアデバイス株式会社 | 弾性波デバイスおよびパッケージ基板 |
US7280436B2 (en) * | 2004-05-07 | 2007-10-09 | Corporation For National Research Initiatives | Miniature acoustic detector based on electron surface tunneling |
DE102004037817B4 (de) * | 2004-08-04 | 2014-08-07 | Epcos Ag | Elektrisches Bauelement in Flip-Chip-Bauweise |
US7608789B2 (en) * | 2004-08-12 | 2009-10-27 | Epcos Ag | Component arrangement provided with a carrier substrate |
US7157836B2 (en) * | 2004-10-19 | 2007-01-02 | Seiko Epson Corporation | Piezoelectric device |
JP2006173557A (ja) * | 2004-11-22 | 2006-06-29 | Toshiba Corp | 中空型半導体装置とその製造方法 |
DE102004058879B4 (de) * | 2004-12-06 | 2013-11-07 | Austriamicrosystems Ag | MEMS-Mikrophon und Verfahren zur Herstellung |
US20060125577A1 (en) * | 2004-12-13 | 2006-06-15 | International Semiconductor Techonology Ltd. | Acoustic resonator device and method for manufacturing the same |
US7181972B2 (en) * | 2004-12-27 | 2007-02-27 | General Electric Company | Static and dynamic pressure sensor |
US7373835B2 (en) * | 2005-01-31 | 2008-05-20 | Sanyo Electric Industries, Ltd. | Semiconductor sensor |
DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
US7401525B2 (en) * | 2005-03-23 | 2008-07-22 | Honeywell International Inc. | Micro-machined pressure sensor with polymer diaphragm |
JP2007000958A (ja) * | 2005-06-22 | 2007-01-11 | Fuji Xerox Co Ltd | ドナー基板、微小構造体、およびそれらの製造方法 |
US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
SG130158A1 (en) * | 2005-08-20 | 2007-03-20 | Bse Co Ltd | Silicon based condenser microphone and packaging method for the same |
DE102005046008B4 (de) * | 2005-09-26 | 2007-05-24 | Infineon Technologies Ag | Halbleitersensorbauteil mit Sensorchip und Verfahren zur Herstellung desselben |
WO2007042336A2 (en) * | 2005-10-14 | 2007-04-19 | Stmicroelectronics S.R.L. | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device |
DE102005050398A1 (de) * | 2005-10-20 | 2007-04-26 | Epcos Ag | Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung |
DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
DE102005053765B4 (de) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
DE102005054461B4 (de) * | 2005-11-15 | 2010-10-14 | Daimler Ag | Vorrichtung zum schwenkbeweglichen Verbinden von mindestens zwei Bauteilen und Verfahren zur Montage der Vorrichtung |
US20080014720A1 (en) * | 2006-03-16 | 2008-01-17 | Dynatex International | Street smart wafer breaking mechanism |
DE102006019118B4 (de) * | 2006-04-25 | 2011-08-18 | Epcos Ag, 81669 | Bauelement mit optischer Markierung und Verfahren zur Herstellung |
DE102006025162B3 (de) * | 2006-05-30 | 2008-01-31 | Epcos Ag | Flip-Chip-Bauelement und Verfahren zur Herstellung |
DE102006046292B9 (de) * | 2006-09-29 | 2014-04-30 | Epcos Ag | Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung |
KR100831405B1 (ko) * | 2006-10-02 | 2008-05-21 | (주) 파이오닉스 | 웨이퍼 본딩 패키징 방법 |
US8228898B2 (en) * | 2006-11-27 | 2012-07-24 | International Business Machines Corporation | Method and system for distributed call recording |
GB2451909B (en) * | 2007-08-17 | 2012-07-11 | Wolfson Microelectronics Plc | Mems process and device |
WO2009038692A1 (en) * | 2007-09-19 | 2009-03-26 | Akustica, Inc. | A mems package |
US20090081828A1 (en) * | 2007-09-26 | 2009-03-26 | Northrop Grumman Systems Corporation | MEMS Fabrication Method |
DE102008005686B9 (de) | 2008-01-23 | 2019-06-27 | Tdk Corporation | MEMS-Bauelement und Verfahren zur Herstellung eines MEMS-Bauelements |
GB0805473D0 (en) * | 2008-03-26 | 2008-04-30 | Graphene Ind Ltd | Method and article |
EP2133306A1 (en) * | 2008-06-13 | 2009-12-16 | Stichting Dutch Polymer Institute | Polymer micro-actuators sensitive to one or more inputs |
DE102008041059A1 (de) * | 2008-08-06 | 2010-02-04 | Q-Cells Ag | Verfahren zur Herstellung einer strukturiert prozessierten oder strukturiert beschichteten Substratoberfläche |
JP2010190706A (ja) * | 2009-02-18 | 2010-09-02 | Panasonic Corp | 慣性力センサ |
JP5388792B2 (ja) * | 2009-10-23 | 2014-01-15 | 新日鉄住金化学株式会社 | 多層接着シート及びその製造方法 |
EP2381698A1 (en) * | 2010-04-21 | 2011-10-26 | Nxp B.V. | Microphone |
US8865499B2 (en) * | 2010-07-08 | 2014-10-21 | Epcos Ag | MEMS microphone and method for producing the MEMS microphone |
US20130337608A1 (en) * | 2011-03-10 | 2013-12-19 | Sumitomo Bakelite Co., Ltd. | Semiconductor device, and process for manufacturing semiconductor device |
JP5862238B2 (ja) * | 2011-05-27 | 2016-02-16 | 東洋紡株式会社 | 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法 |
US8975157B2 (en) * | 2012-02-08 | 2015-03-10 | Advanced Semiconductor Engineering, Inc. | Carrier bonding and detaching processes for a semiconductor wafer |
JP5926632B2 (ja) * | 2012-06-28 | 2016-05-25 | 株式会社ディスコ | 半導体チップの樹脂封止方法 |
KR20140023112A (ko) * | 2012-08-17 | 2014-02-26 | 삼성전자주식회사 | 반도체 패키지를 포함하는 전자 장치 및 그 제조 방법 |
JP5576542B1 (ja) * | 2013-08-09 | 2014-08-20 | 太陽誘電株式会社 | 回路モジュール及び回路モジュールの製造方法 |
-
2013
- 2013-06-18 DE DE102013106353.5A patent/DE102013106353B4/de active Active
-
2014
- 2014-05-12 JP JP2016520322A patent/JP6187684B2/ja not_active Expired - Fee Related
- 2014-05-12 US US14/970,749 patent/US9556022B2/en active Active
- 2014-05-12 WO PCT/EP2014/059633 patent/WO2014202283A2/de active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10407441B2 (en) | 2010-05-14 | 2019-09-10 | Dana-Farber Cancer Institute, Inc. | Compositions and methods for treating neoplasia, inflammatory disease and other disorders |
US10925881B2 (en) | 2014-02-28 | 2021-02-23 | Tensha Therapeutics, Inc. | Treatment of conditions associated with hyperinsulinaemia |
Also Published As
Publication number | Publication date |
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DE102013106353B4 (de) | 2018-06-28 |
WO2014202283A3 (de) | 2015-02-26 |
US20160297676A1 (en) | 2016-10-13 |
DE102013106353A1 (de) | 2014-12-18 |
US9556022B2 (en) | 2017-01-31 |
WO2014202283A2 (de) | 2014-12-24 |
JP2016523725A (ja) | 2016-08-12 |
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