JP6061251B2 - 半導体基板の製造方法 - Google Patents

半導体基板の製造方法 Download PDF

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Publication number
JP6061251B2
JP6061251B2 JP2013142151A JP2013142151A JP6061251B2 JP 6061251 B2 JP6061251 B2 JP 6061251B2 JP 2013142151 A JP2013142151 A JP 2013142151A JP 2013142151 A JP2013142151 A JP 2013142151A JP 6061251 B2 JP6061251 B2 JP 6061251B2
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JP
Japan
Prior art keywords
amorphous layer
layer
substrate
manufacturing
amorphous
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Active
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JP2013142151A
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English (en)
Japanese (ja)
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JP2015015401A (ja
JP2015015401A5 (enExample
Inventor
功 今岡
功 今岡
小林　元樹
元樹 小林
英次 内田
英次 内田
邦明 八木
邦明 八木
孝光 河原
孝光 河原
直記 八田
直記 八田
章行 南
章行 南
豊和 坂田
豊和 坂田
牧野　友厚
友厚 牧野
▲高▼木　秀樹
秀樹 ▲高▼木
優一 倉島
優一 倉島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
National Institute of Advanced Industrial Science and Technology AIST
Sicoxs Corp
Original Assignee
Toyota Industries Corp
National Institute of Advanced Industrial Science and Technology AIST
Sicoxs Corp
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Publication date
Priority to JP2013142151A priority Critical patent/JP6061251B2/ja
Application filed by Toyota Industries Corp, National Institute of Advanced Industrial Science and Technology AIST, Sicoxs Corp filed Critical Toyota Industries Corp
Priority to KR1020167003236A priority patent/KR101846299B1/ko
Priority to CN201480038163.7A priority patent/CN105474354B/zh
Priority to US14/902,764 priority patent/US9761479B2/en
Priority to PCT/JP2014/067777 priority patent/WO2015002266A1/ja
Priority to EP14820214.6A priority patent/EP3018696B8/en
Publication of JP2015015401A publication Critical patent/JP2015015401A/ja
Publication of JP2015015401A5 publication Critical patent/JP2015015401A5/ja
Application granted granted Critical
Publication of JP6061251B2 publication Critical patent/JP6061251B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2013142151A 2013-07-05 2013-07-05 半導体基板の製造方法 Active JP6061251B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013142151A JP6061251B2 (ja) 2013-07-05 2013-07-05 半導体基板の製造方法
CN201480038163.7A CN105474354B (zh) 2013-07-05 2014-07-03 半导体基板的制造方法
US14/902,764 US9761479B2 (en) 2013-07-05 2014-07-03 Manufacturing method for semiconductor substrate
PCT/JP2014/067777 WO2015002266A1 (ja) 2013-07-05 2014-07-03 半導体基板の製造方法
KR1020167003236A KR101846299B1 (ko) 2013-07-05 2014-07-03 반도체 기판의 제조 방법
EP14820214.6A EP3018696B8 (en) 2013-07-05 2014-07-03 Manufacturing method for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013142151A JP6061251B2 (ja) 2013-07-05 2013-07-05 半導体基板の製造方法

Publications (3)

Publication Number Publication Date
JP2015015401A JP2015015401A (ja) 2015-01-22
JP2015015401A5 JP2015015401A5 (enExample) 2016-10-27
JP6061251B2 true JP6061251B2 (ja) 2017-01-18

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JP2013142151A Active JP6061251B2 (ja) 2013-07-05 2013-07-05 半導体基板の製造方法

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US (1) US9761479B2 (enExample)
EP (1) EP3018696B8 (enExample)
JP (1) JP6061251B2 (enExample)
KR (1) KR101846299B1 (enExample)
CN (1) CN105474354B (enExample)
WO (1) WO2015002266A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019013170A1 (ja) 2017-07-10 2019-01-17 株式会社タムラ製作所 半導体基板、半導体素子、及び半導体基板の製造方法
WO2023067876A1 (ja) 2021-10-20 2023-04-27 株式会社サイコックス 多結晶炭化珪素基板の製造方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015156381A1 (ja) 2014-04-10 2015-10-15 富士電機株式会社 半導体基板の処理方法及び該処理方法を用いる半導体装置の製造方法
JP2016139655A (ja) * 2015-01-26 2016-08-04 富士通株式会社 半導体装置及び半導体装置の製造方法
US10424514B2 (en) 2015-03-04 2019-09-24 Mtec Corporation Method for manufacturing semiconductor substrate
JP6572694B2 (ja) 2015-09-11 2019-09-11 信越化学工業株式会社 ＳｉＣ複合基板の製造方法及び半導体基板の製造方法
JP6544166B2 (ja) * 2015-09-14 2019-07-17 信越化学工業株式会社 ＳｉＣ複合基板の製造方法
JP6582779B2 (ja) 2015-09-15 2019-10-02 信越化学工業株式会社 ＳｉＣ複合基板の製造方法
JP6515757B2 (ja) 2015-09-15 2019-05-22 信越化学工業株式会社 ＳｉＣ複合基板の製造方法
TWI730053B (zh) * 2016-02-16 2021-06-11 瑞士商Ｇ射線瑞士公司 用於電荷傳輸通過接合界面的結構、系統及方法
JP6619874B2 (ja) 2016-04-05 2019-12-11 株式会社サイコックス 多結晶ＳｉＣ基板およびその製造方法
CN107958839B (zh) * 2016-10-18 2020-09-29 上海新昇半导体科技有限公司 晶圆键合方法及其键合装置
US10971365B2 (en) * 2017-02-21 2021-04-06 Ev Group E. Thallner Gmbh Method and device for bonding substrates
CN110366611B (zh) 2017-03-02 2021-07-27 信越化学工业株式会社 碳化硅基板的制造方法及碳化硅基板
JP7247885B2 (ja) * 2017-03-27 2023-03-29 住友電気工業株式会社 積層体およびｓａｗデバイス
US20190019472A1 (en) * 2017-07-13 2019-01-17 Vanguard International Semiconductor Corporation Display system and method for forming an output buffer of a source driver
JP6854516B2 (ja) * 2017-07-19 2021-04-07 株式会社テンシックス 化合物半導体基板及びその製造方法
CN112005344B (zh) * 2018-04-27 2023-11-17 东京毅力科创株式会社 基板处理系统和基板处理方法
JP2019210162A (ja) * 2018-05-31 2019-12-12 ローム株式会社 半導体基板構造体及びパワー半導体装置
JP2019210161A (ja) * 2018-05-31 2019-12-12 ローム株式会社 半導体基板構造体及びパワー半導体装置
JP7024668B2 (ja) * 2018-09-05 2022-02-24 株式会社Sumco Ｓｏｉウェーハ及びその製造方法
DE102018132447B4 (de) 2018-12-17 2022-10-13 Infineon Technologies Ag Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung
CN109986191A (zh) * 2019-04-15 2019-07-09 上海交通大学 一种应用于金属/高分子连接的表面处理方法
JP6737378B2 (ja) * 2019-05-09 2020-08-05 信越化学工業株式会社 ＳｉＣ複合基板
EP3989374A4 (en) * 2019-06-18 2023-07-05 Inter-University Research Institute Corporation National Institutes of Natural Sciences Method for manufacturing optical element and optical element
US20230178368A1 (en) 2020-06-01 2023-06-08 Mitsubishi Electric Corporation Composite substrate, method for producing composite substrate, semiconductor device, and method for producing semiconductor device
JP7625248B2 (ja) * 2021-01-20 2025-02-03 国立研究開発法人理化学研究所 接合体の製造方法および接合体
JP2023068782A (ja) * 2021-11-04 2023-05-18 株式会社サイコックス 半導体基板とその製造方法
FR3134228B1 (fr) 2022-03-30 2025-05-02 Mersen France Gennevilliers Procede de fabrication de carbure de silicium polycristallin utilisable pour la fabrication de substrats de circuits integres, et carbure de silicium ainsi obtenu
JP2024025064A (ja) 2022-08-10 2024-02-26 株式会社サイコックス ＳｉＣ単結晶転写用複合基板、ＳｉＣ単結晶転写用複合基板の製造方法、およびＳｉＣ接合基板の製造方法
JP2024073797A (ja) 2022-11-18 2024-05-30 株式会社サイコックス 研磨組成物
FR3146237A1 (fr) 2023-02-24 2024-08-30 Mersen France Gennevilliers Plaque en SiC polycristallin dopé à planéité et conductivité électrique améliorées, et procédé de fabrication d’une telle plaque
JP2024121436A (ja) 2023-02-27 2024-09-06 住友金属鉱山株式会社 ＳｉＣ半導体装置用基板、ＳｉＣ接合基板、ＳｉＣ多結晶基板およびＳｉＣ多結晶基板の製造方法
KR20250164769A (ko) * 2023-03-21 2025-11-25 에베 그룹 에. 탈너 게엠베하 기판의 표면 처리를 위한 방법 및 이러한 기판을 또 다른 기판과 본딩하기 위한 방법 및 이러한 방법들을 수행하기 위한 장치
JP2024169169A (ja) 2023-05-25 2024-12-05 住友金属鉱山株式会社 ＳｉＣ半導体装置用基板、ＳｉＣ接合基板、ＳｉＣ多結晶基板およびＳｉＣ多結晶基板の製造方法
US20250308953A1 (en) * 2024-03-26 2025-10-02 Applied Materials, Inc. In-Line Validation of Substrate Bonding Surface

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2681472B1 (fr) * 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
JPH05251292A (ja) * 1992-03-06 1993-09-28 Nec Corp 半導体装置の製造方法
JP2791429B2 (ja) 1996-09-18 1998-08-27 工業技術院長 シリコンウェハーの常温接合法
US6251754B1 (en) * 1997-05-09 2001-06-26 Denso Corporation Semiconductor substrate manufacturing method
US6159825A (en) * 1997-05-12 2000-12-12 Silicon Genesis Corporation Controlled cleavage thin film separation process using a reusable substrate
JP2000091176A (ja) * 1998-09-10 2000-03-31 Toyota Central Res & Dev Lab Inc 基板張り合わせ方法
US6534381B2 (en) * 1999-01-08 2003-03-18 Silicon Genesis Corporation Method for fabricating multi-layered substrates
US6881644B2 (en) * 1999-04-21 2005-04-19 Silicon Genesis Corporation Smoothing method for cleaved films made using a release layer
JP4450126B2 (ja) * 2000-01-21 2010-04-14 日新電機株式会社 シリコン系結晶薄膜の形成方法
FR2810448B1 (fr) * 2000-06-16 2003-09-19 Soitec Silicon On Insulator Procede de fabrication de substrats et substrats obtenus par ce procede
FR2817395B1 (fr) * 2000-11-27 2003-10-31 Soitec Silicon On Insulator Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede
US6497763B2 (en) * 2001-01-19 2002-12-24 The United States Of America As Represented By The Secretary Of The Navy Electronic device with composite substrate
US7192841B2 (en) * 2002-04-30 2007-03-20 Agency For Science, Technology And Research Method of wafer/substrate bonding
JP4556158B2 (ja) * 2002-10-22 2010-10-06 株式会社Sumco 貼り合わせｓｏｉ基板の製造方法および半導体装置
JP3929983B2 (ja) * 2004-03-03 2007-06-13 富士通メディアデバイス株式会社 接合基板、弾性表面波素子および弾性表面波デバイス並びにその製造方法
US8138061B2 (en) * 2005-01-07 2012-03-20 International Business Machines Corporation Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide
JP4934966B2 (ja) * 2005-02-04 2012-05-23 株式会社Ｓｕｍｃｏ Ｓｏｉ基板の製造方法
US7462552B2 (en) * 2005-05-23 2008-12-09 Ziptronix, Inc. Method of detachable direct bonding at low temperatures
JP2008263087A (ja) * 2007-04-12 2008-10-30 Shin Etsu Chem Co Ltd Ｓｏｉ基板の製造方法
FR2921749B1 (fr) * 2007-09-27 2014-08-29 Soitec Silicon On Insulator Procede de fabrication d'une structure comprenant un substrat et une couche deposee sur l'une de ses faces.
JP2009117533A (ja) 2007-11-05 2009-05-28 Shin Etsu Chem Co Ltd 炭化珪素基板の製造方法
US8871610B2 (en) * 2008-10-02 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
FR2938120B1 (fr) * 2008-10-31 2011-04-08 Commissariat Energie Atomique Procede de formation d'une couche monocristalline dans le domaine micro-electronique
JP2012124473A (ja) * 2010-11-15 2012-06-28 Ngk Insulators Ltd 複合基板及び複合基板の製造方法
JP5712100B2 (ja) * 2011-09-29 2015-05-07 富士フイルム株式会社 反射防止フィルムの製造方法、反射防止フィルム、塗布組成物
EP2783846A4 (en) * 2011-11-24 2015-09-02 Konica Minolta Inc GAS BARRIER LAYER AND ELECTRONIC DEVICE THEREFOR
FR2983342B1 (fr) * 2011-11-30 2016-05-20 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure limitant la formation de defauts et heterostructure ainsi obtenue
EP2822026B1 (en) * 2012-02-29 2018-03-14 Kyocera Corporation Composite substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019013170A1 (ja) 2017-07-10 2019-01-17 株式会社タムラ製作所 半導体基板、半導体素子、及び半導体基板の製造方法
US11264241B2 (en) 2017-07-10 2022-03-01 Tamura Corporation Semiconductor substrate, semiconductor element and method for producing semiconductor substrate
WO2023067876A1 (ja) 2021-10-20 2023-04-27 株式会社サイコックス 多結晶炭化珪素基板の製造方法

Also Published As

Publication number Publication date
US20160204023A1 (en) 2016-07-14
KR101846299B1 (ko) 2018-05-18
WO2015002266A1 (ja) 2015-01-08
KR20160040565A (ko) 2016-04-14
EP3018696B1 (en) 2021-11-17
EP3018696A4 (en) 2017-03-15
CN105474354A (zh) 2016-04-06
US9761479B2 (en) 2017-09-12
JP2015015401A (ja) 2015-01-22
CN105474354B (zh) 2018-04-17
EP3018696A1 (en) 2016-05-11
EP3018696B8 (en) 2022-02-23

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