JP5844868B2 - レーザーによってボーリング孔を掘り進めるためのレーザー掘削設備 - Google Patents
レーザーによってボーリング孔を掘り進めるためのレーザー掘削設備 Download PDFInfo
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Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B7/00—Special methods or apparatus for drilling
- E21B7/14—Drilling by use of heat, e.g. flame drilling
- E21B7/15—Drilling by use of heat, e.g. flame drilling of electrically generated heat
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/60—Drill bits characterised by conduits or nozzles for drilling fluids
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B21/00—Methods or apparatus for flushing boreholes, e.g. by use of exhaust air from motor
- E21B21/10—Valve arrangements in drilling-fluid circulation systems
- E21B21/103—Down-hole by-pass valve arrangements, i.e. between the inside of the drill string and the annulus
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B29/00—Cutting or destroying pipes, packers, plugs or wire lines, located in boreholes or wells, e.g. cutting of damaged pipes, of windows; Deforming of pipes in boreholes or wells; Reconditioning of well casings while in the ground
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B43/00—Methods or apparatus for obtaining oil, gas, water, soluble or meltable materials or a slurry of minerals from wells
- E21B43/11—Perforators; Permeators
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B7/00—Special methods or apparatus for drilling
- E21B7/14—Drilling by use of heat, e.g. flame drilling
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- Engineering & Computer Science (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Geochemistry & Mineralogy (AREA)
- Fluid Mechanics (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Earth Drilling (AREA)
- Laser Beam Processing (AREA)
- Laser Surgery Devices (AREA)
- Lasers (AREA)
- Drilling And Exploitation, And Mining Machines And Methods (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Description
本願は、2008年8月2日に出願された“System and Methods for Borehole Drilling(ボーリング孔を開けるための設備及び方法)”という名称の米国仮特許出願第61/090,384号、2008年10月3日に出願された“Methods to Optically Pattern to Chip Rock Formations(岩層を削り取るために岩石に光学的にパターンを形成するための設備及び方法)”という名称の米国仮特許出願第61/102,730号、2008年10月17日に出願された“Transmission of High Optical Power Levels via Optical Fibers for Applications such as Rock Drilling and Power Transmission(削岩、動力伝送のような用途のための光ファイバを介する高い光学出力レベルの伝送)”という名称の米国仮特許出願第61/106,472号及び2009年2月17日に出願された“Method and Apparatus for an Armored High Power Optical Fiber for Providing Boreholes in the Earth(地中にボーリング孔を設けるための強化高出力光ファイバのための方法及び装置”という名称の米国仮特許出願第61/153,271号に基づく優先権を主張している。これらの出願による開示の内容は、これらに言及することにより本明細書に参照として組み込まれている。
109 流路、 111 垂直経路、 113 水平経路、
205 レーザービーム、 207 光線、
209 コリメータレンズ、 211 スポット形状形成レンズ、
213 マイクロ光学アレイ、
1000 レーザー掘削装置、 1001 ボーリング孔、
1002 地中、 1003 電源、
1004,1005 ケーブル、 1006 レーザー、
1007 冷却機、 1008 レーザービーム伝送手段、
1009 コイル巻き管、 1011 流体搬送手段、 1012 コイル巻き管、
1013 回転結合手段、 1014 坑底アセンブリ、
1015 支持構造、 1016 注入管、 1017 分流機、
1018 吹出し防止装置(BOP)、 1019 切削処理装置、
1020 坑口、 1021 ボーリング孔の底、
1022 コネクタ、 1023 コイル巻き管の坑底端部、
1024 レーザービーム、 1030 地表、
1101 光路、 1103 スキャナー、
1105 回折光学系、 1107 コリメータ光学系、
1109 ガルバノミラー、 1113 岩の表面
1203 開口部、 1202 ポート、
1207 第一の流路、 1209 第二の流路、
1301 エアーナイフ、 1313 LBHA、
1400 上方部分、 1401 下方部分、
1402 ファイバ、 1403 ファイバ、
1404 密閉チャンバ、 1405 空気増幅ノズル、
1406 ビーム整形光学素子、 1407 層流出口、
1408,1409 硬質ローラー、 1410 モーター、
1411 回転軸、 1412 ギヤ、 1413 駆動ギヤ、
1414 ポート、 1417 第二の流体経路、
1418 ハウジング、 1419 ハウジング、
1420 瞳面、 14100 LBHA、
1500 レーザービーム、 1501 ビーム照射領域、
1502 ボーリング孔の壁又は底、 1505 第一の領域、
1506 第二の領域、 1507 第三の領域、
1508 第四の領域、 1509 第五の領域、 1510 チャート、
1601 x軸、 1602 y軸、 1603 z軸、
1605,1606 ボーリング孔、
1701 x軸、 1702 y軸、 1703 z軸、
1801 x軸、 1802 y軸、 1803 z軸、
1805 レーザービーム、 1807 複数の光線、
1809 コリメータレンズ、 1811 入射曲面、
1813 射出曲面、 1815 アキシコンレンズ、
1817 窓、 1820 光学アセンブリ、
1830 ボーリング孔の面、 1920 光学アセンブリ、
1905 レーザービーム、 1907 光線、
1913 球面レンズ、 1915 トロイダル形状レンズ、
1917 一対の非球面トロイダル形状レンズ、
1919 窓、
2002 光学的回転結合手段、 2003 流体による回転結合手段、
2004 基底軸、 2005,2006 支持面、
2007 開口部、 2008 レーザー伝送手段、
2009 コイル巻き管、 2010 光カプラー、
2012 コイル巻き管、 2013 回転結合手段、
2025 長距離高出力レーザービーム伝送手段、
2140 ファイバ、 2105 レーザービーム、
2109 コリメータレンズ、 2111 回折光学素子、
2113 再投影レンズ、 2120 パターン、
2121 パターン、 2201 ボーリング孔の底面、
2202 第一の回転軸線、 2203,2205 第一の対のスポット、
2207,2209 第二の対のスポット、
2212 ボーリング孔、 2301 中心、
2302 長軸、 2303 ミラー軸、
2401 矩形状のスポット、 2502 複数の独立したショット、
2601 四角形のショット、 2602 ラスター走査方式、
2701 光ビーム、 2702 碁盤縞のライン、
2703 岩表面、 2704 岩、 2705 岩石破片、
2801 液体又は気体の流れ、 2802 岩盤、
2803,2804,2805 ビームスポット形状のライン、
2807 光学ヘッド、 2808 岩の表面、
2809 岩石破片、
2901 岩盤、 2902 パターン、
2903,2904,2905 ビームスポット形状のライン、
2907 光学ヘッド、 2908 岩の表面、
2909 デブリス、 2911 気体又は液体、
2915 ノズル、 2920 回転モーター、
2924 光ファイバ、 2928 レール、
3001 第一の回転モーター、 3003 パターン状の複数の光ファイバ、
3005 ジンバル、 3007 第二の回転モーター、
3008 レーザービーム伝送手段、
3009 固定のクリール、 3010 第三の回転モーター、
3011 ステッピングモーター、
3013 ステッピングモーター、
3015 ミラー、 3017 ミラー、 3019 光学素子、
3021 光路、 3023 ボーリング孔内のケーシング、
3025 長距離高出力レーザービーム伝送手段、
3101 パターン状のファイバ、 3105 レール、
3107 ファイバコネクタ、 3109 光学ヘッド、
3113 コリメータ、 3114 ビーム拡大器、
3115 DOE/ROE、 3117 正のレンズ、
3119 ビーム拡大器、 3123 岩盤、
3125 面、 3129 光路、
3131 パターン状のスポット、 3201 光ファイバの列、
3203 レール、 3207 ファイバコネクタ、
3209 光学ヘッド、 3211 光学アセンブリ、
3213 光路、 3215 レーザービームショットパターン、
3219 面、 3301 光学ヘッド、
3303 第一のミラー、 3305 複数の光ファイバ、
3307 コネクタ、 3309 パターン、
3311 光路、 3313 岩の表面、
3315 F−シータ光学系、 3319 ショットパターン、
3317 レール、 3401 複数のファイバの束、
3403 出力ケーブル、 3404 光学ヘッド、
3405 第一のモーター、 3407 レール、
3409 第二のモーター、 3413 ファイバコネクタ、
3415 光路、 3417 ライン形状のショットパターン、
3419 岩の表面、 3421 レンズ、
3501 レーザーエネルギの供給源、
3503 出力ケーブル、 3505 第一の回転モーター、
3507 第二のモーター、 3509 ビーム整形光学系、
3511 光学アセンブリ、 3515 光路、
3517 レール、 3519 面、
3521 複数のファイバの束、 3523 ファイバ、
3525 コネクタ、 3601 レーザー供給源、
3603 第一のモーター、 3605 第二のモーター、
3607 Z方向の動きを提供する手段、
3609 コネクタ、 3613 複数のファイバの束、
4001 第一のレーザー、 4002 第二のレーザー、
4003 第三のレーザー、 4004 第四のレーザー、
4005 ビーム結合器、 4006 光ファイバ、
4007 ビーム、
5001,5002,5003,5004 レーザー、
5005 ビーム結合器、 5006 光ファイバ、
5007 ビーム、 5008 主発振器、
6000 スプール、 6001 支持部材、
6002 荷重支持軸受け、 6003 入力ケーブル、
6004 出力ケーブル、 6005 光カプラー、
6006 光カプラー、 6007 部材、
6008 無負荷支持軸受け、 6009,6010 光学素子、
8000 第一の受動的なファイバ部分、
8002 ファイバ増幅器、 8003 カプラー、
8004 受動的なファイバ部分、
9000 上方部分、 9001 下方部分、
9002 伝送するための手段、 9003 下方端部、
9004 瞳面、 9005 空気増幅ノズル、
9006 ビーム整形光学素子、 9007 層流出口、
9008,9009 硬質ローラー、
9101 LBHA、 9103 第一の出口ポート、
9105 第二の出口ポート、 9107 第一の流体流路、
9109 第二の流体経路、 9111 境界層、
9112 ボーリング孔の底、 9114 ボーリング孔の側壁、
9115 上面、 9116 角度、
9117 角度が付けられている面、 9119 下面
Claims (7)
- レーザーによってボーリング孔を掘り進めるためのレーザー掘削設備であって、
レーザー供給源と、
近位端及び遠位端を有し、前記近位端が前記レーザー供給源に光学的に接続され、前記レーザー供給源からのレーザービームを前記近位端で受けて前記遠位端にまで伝送するレーザー伝送ケーブルと、
前記レーザー伝送ケーブルの前記遠位端に接続され、前記ボーリング孔内に配置されるようにされた坑底アセンブリであって、前記レーザー伝送ケーブルの前記遠位端から射出されるレーザービームのパターンを所定のレーザービームパターンに整形するビーム整形光学素子、及び該ビーム整形光学素子を前記レーザービームの中心軸線周りで回転させる手段、を有する坑底アセンブリと、を備えており、
前記所定のレーザーパターンが、前記中心軸線に交わる線状の形状であり且つ前記中心軸線と交わる位置から外側に離れるにしたがって略線形に増加するエネルギ付与分布を有し、
前記ビーム整形光学素子が前記手段によって回転されることにより、前記所定のレーザーパターンが前記中心軸線周りで回転されて、前記ボーリング孔の底面に略均一のエネルギ付与分布が形成されるようにされた、レーザー掘削設備。 - 前記坑底アセンブリが、前記レーザー伝送ケーブルの前記遠位端を保持する第1のハウジングと、該第1のハウジングに対して回転可能に取付けられた第2のハウジングと、をさらに備え、前記ビーム整形光学素子が前記第2のハウジング内に取付けられており、前記回転させる手段が前記第2のハウジングを前記第1のハウジングに対して前記中心軸線周りで回転させるようにされた、請求項1に記載のレーザー掘削設備。
- 前記第2のハウジングの先端部に設けられ、前記ボーリング孔の前記底面に機械的に接触して該底面の岩石物質を取り除くようにされた機械的アセンブリをさらに備える、請求項2に記載のレーザー掘削設備。
- 前記機械的アセンブリが、ローラーである、請求項3に記載のレーザー掘削設備。
- 前記第1及び第2のハウジング内に流体を供給する流体供給源をさらに備え、
前記第1のハウジングの外周面に第1の出口ポートが設けられ、前記第2のハウジングの先端部に第2の出口ポートが設けられており、前記流体が、前記第2の出口ポートからは前記ボーリング孔の前記底面に向かって下方に放出され、前記第1の出口ポートからは前記ボーリング孔の頂部に向かって上方に放出されるようにされた、請求項2乃至4の何れか一項に記載のレーザー掘削設備。 - 前記レーザー供給源が複数のレーザーからなる、請求項1乃至5の何れか一項に記載のレーザー掘削設備。
- 前記レーザー供給源からの前記レーザービームの出力が少なくとも20kWであり、
前記レーザー伝送ケーブルが、少なくとも0.305kmの長さを有する光ファイバである、請求項1乃至6の何れか一項に記載のレーザー掘削設備。
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