JP5782079B2 - Tabテープ - Google Patents
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- JP5782079B2 JP5782079B2 JP2013189311A JP2013189311A JP5782079B2 JP 5782079 B2 JP5782079 B2 JP 5782079B2 JP 2013189311 A JP2013189311 A JP 2013189311A JP 2013189311 A JP2013189311 A JP 2013189311A JP 5782079 B2 JP5782079 B2 JP 5782079B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/37—Effects of the manufacturing process
- H01L2924/37001—Yield
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Description
ここで、前記回路パターンの形成では、絶縁性フィルムの表面活性化処理後に、フォトリソグラフィを通じて回路パターンを形成し、前記移送領域は、選択的エッチングを通じて露出領域を形成することを特徴とする。
Claims (6)
- ベースフィルムと、
前記ベースフィルム上に形成される配線パターンを含む回路領域と、
前記回路領域の両側の外側に前記ベースフィルムが露出される移送領域と、
前記移送領域に所定間隔を置いて形成されるスプロケットホールと、
前記移送領域内で前記スプロケットホールに隣接して形成された一つ以上のメッキラインと、を含み、
前記回路領域及び前記一つ以上のメッキラインは前記ベースフィルム上に形成された金属層のうちの第1領域の金属層を除いた第2領域の金属層を前記ベースフィルムが露出されるように選択的に除去し、残された前記第1領域の金属層で各々形成され、
前記スプロケットホールは第1スプロケットホールと、前記第1スプロケットホールから前記所定間隔を置いて形成される第2スプロケットホールを含み、
前記メッキラインは、前記第1スプロケットホールと前記第2スプロケットホールとの間の領域内の前記ベースフィルム上に形成され、一側は前記第1スプロケットホールと接し、他側は前記第2スプロケットホールと接することを特徴とするTABテープ。 - 前記メッキラインは、Cu、Ni、Pd、Au、Sn、Ag、Coのうちいずれか一つ、またはこれらの2元または3元合金であることを特徴とする請求項1に記載のTABテープ。
- 前記メッキラインは、CuとSnとの2元合金であることを特徴とする請求項2に記載のTABテープ。
- ベースフィルムと、
前記ベースフィルム上に形成される配線パターンを含む回路領域と、
前記回路領域の両側の外側に前記ベースフィルムが露出される移送領域と、
前記移送領域に前記所定間隔を置いて形成されるスプロケットホールと、
前記移送領域内で前記スプロケットホールに隣接して形成された一つ以上のメッキラインと、を含み、
前記回路領域及び前記一つ以上のメッキラインは前記ベースフィルム上に形成された金属層のうちの第1領域の金属層を除いた第2領域の金属層を前記ベースフィルムが露出されるように選択的に除去し、残された前記第1領域の金属層で各々形成され、
前記メッキラインは、前記回路領域から前記スプロケットホールより遠い移送領域と、前記回路領域から前記スプロケットホールより近い移送領域に各々形成されることを特徴とするTABテープ。 - 前記回路領域には、前記配線パターンにインナーリードボンディングされて実装される半導体チップをさらに含むことを特徴とする請求項1又は4に記載のTAPテープ。
- 前記配線パターンは、前記半導体チップを中心に、前記ベースフィルムの一側に伸びている入力端子のパターンと、前記ベースフィルムの他側に伸びている出力端子のパターンをさらに含むことを特徴とする請求項5に記載のTAPテープ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090105177A KR101457939B1 (ko) | 2009-11-02 | 2009-11-02 | 탭 테이프 및 그 제조방법 |
KR10-2009-0105177 | 2009-11-02 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010037648A Division JP5411019B2 (ja) | 2009-11-02 | 2010-02-23 | Tabテープ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2013243416A JP2013243416A (ja) | 2013-12-05 |
JP5782079B2 true JP5782079B2 (ja) | 2015-09-24 |
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ID=43924186
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2010037648A Active JP5411019B2 (ja) | 2009-11-02 | 2010-02-23 | Tabテープ及びその製造方法 |
JP2013189311A Active JP5782079B2 (ja) | 2009-11-02 | 2013-09-12 | Tabテープ |
Family Applications Before (1)
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JP2010037648A Active JP5411019B2 (ja) | 2009-11-02 | 2010-02-23 | Tabテープ及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (3) | US8791370B2 (ja) |
JP (2) | JP5411019B2 (ja) |
KR (1) | KR101457939B1 (ja) |
CN (2) | CN102054792B (ja) |
TW (1) | TWI467708B (ja) |
Families Citing this family (13)
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KR101457939B1 (ko) * | 2009-11-02 | 2014-11-10 | 엘지이노텍 주식회사 | 탭 테이프 및 그 제조방법 |
KR101259844B1 (ko) * | 2011-01-31 | 2013-05-03 | 엘지이노텍 주식회사 | 리드 크랙이 강화된 전자소자용 탭 테이프 및 그의 제조 방법 |
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JP6182928B2 (ja) | 2013-03-27 | 2017-08-23 | セイコーエプソン株式会社 | 半導体装置 |
JP6843676B2 (ja) * | 2017-03-30 | 2021-03-17 | 日本発條株式会社 | 剤料供給方法及び対象構造体 |
KR102322539B1 (ko) * | 2018-02-07 | 2021-11-04 | 삼성전자주식회사 | 반도체 패키지 및 이를 포함하는 디스플레이 장치 |
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2009
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US20110100687A1 (en) | 2011-05-05 |
CN102054792B (zh) | 2015-05-20 |
US10020280B2 (en) | 2018-07-10 |
JP2013243416A (ja) | 2013-12-05 |
CN104900537A (zh) | 2015-09-09 |
US20140291004A1 (en) | 2014-10-02 |
US9105631B2 (en) | 2015-08-11 |
JP2011097000A (ja) | 2011-05-12 |
CN102054792A (zh) | 2011-05-11 |
JP5411019B2 (ja) | 2014-02-12 |
TW201117330A (en) | 2011-05-16 |
TWI467708B (zh) | 2015-01-01 |
KR20110048399A (ko) | 2011-05-11 |
CN104900537B (zh) | 2018-02-02 |
US8791370B2 (en) | 2014-07-29 |
KR101457939B1 (ko) | 2014-11-10 |
US20150311176A1 (en) | 2015-10-29 |
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