JP2011097000A - Tabテープ及びその製造方法 - Google Patents
Tabテープ及びその製造方法 Download PDFInfo
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- JP2011097000A JP2011097000A JP2010037648A JP2010037648A JP2011097000A JP 2011097000 A JP2011097000 A JP 2011097000A JP 2010037648 A JP2010037648 A JP 2010037648A JP 2010037648 A JP2010037648 A JP 2010037648A JP 2011097000 A JP2011097000 A JP 2011097000A
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- Prior art keywords
- tab tape
- pattern
- base film
- region
- plating layer
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 238000007747 plating Methods 0.000 claims abstract description 36
- 239000010410 layer Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 4
- 229910002056 binary alloy Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 10
- 239000002245 particle Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/37—Effects of the manufacturing process
- H01L2924/37001—Yield
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】本発明のTABテープは、ベースフィルム上に形成される配線パターンと金属メッキ層とを含むTABテープであって、ベースフィルムの両側にスプロケットホールを含む移送領域を有し、該移送領域に、ベースフィルムが露出される露出領域を含む構成とした。
【選択図】図2a
Description
ここで、前記回路パターンの形成では、絶縁性フィルムの表面活性化処理後に、フォトリソグラフィを通じて回路パターンを形成し、前記移送領域は、選択的エッチングを通じて露出領域を形成することを特徴とする。
Claims (11)
- ベースフィルムと、
前記ベースフィルム上に形成される配線パターン及び金属メッキ層と、
前記ベースフィルムの両側に沿って配列されるスプロケットホールを含む移送領域と、を含み、
前記移送領域は、前記ベースフィルムが露出される露出領域を含むことを特徴とする、TABテープ。 - 前記移送領域は、
前記スプロケットホールの外部領域に形成される金属メッキ層パターンをさらに含むことを特徴とする、請求項1に記載のTABテープ。 - 前記金属メッキ層パターンは、
前記スプロケットホールに隣接するパターン領域に形成されることを特徴とする、請求項2に記載のTABテープ。 - 前記金属メッキ層パターンは、
前記スプロケットホールと離隔するパターン領域に形成されることを特徴とする、請求項2に記載のTABテープ。 - 前記パターン領域は、
前記スプロケットホールと離隔するメッキラインを少なくとも1本以上含む構造で形成されることを特徴とする、請求項4に記載のTABテープ。 - 前記金属メッキ層を形成する金属は、
Cu、Ni、Pd、Au、Sn、Ag、Coのうちいずれか一つ、またはこれらの2元または3元合金であることを特徴とする、請求項1〜5のいずれか1項に記載のTABテープ。 - ベースフィルム上にスプロケットホールと入出力端子パターンとを含む回路パターンを形成し、
前記ベースフィルムの両側に形成された移送領域に、ベースフィルムが露出される露出領域を形成することを特徴とする、TABテープの製造方法。 - 前記回路パターンの形成は、
絶縁性フィルムの表面活性化処理を行い、
フォトリソグラフィ処理によって所定の回路パターンを形成する、
ことを特徴とする、請求項7に記載のTABテープの製造方法。 - 前記表面活性化処理は、
Cu、Ni、Pd、Au、Sn、Ag、Coのうちいずれか一つ、またはそれらの2元または3元合金を用いて単層または多層でメッキ処理層を形成することを特徴とする、請求項8に記載のTABテープの製造方法。 - 前記移送領域に形成される露出領域は、選択的エッチングを通じて形成されることを特徴とする、請求項7に記載のTABテープの製造方法。
- 前記露出領域の形成は、
前記ベースフィルム上にフォトレジストを塗布し、
選択的除去領域パターンを有するフォトマスクを用いてフォトリソグラフィ工程を行って前記移送領域にフォトレジスト層パターンを形成すること、
を含むことを特徴とする、請求項7に記載のTABテープの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0105177 | 2009-11-02 | ||
KR1020090105177A KR101457939B1 (ko) | 2009-11-02 | 2009-11-02 | 탭 테이프 및 그 제조방법 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013189311A Division JP5782079B2 (ja) | 2009-11-02 | 2013-09-12 | Tabテープ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011097000A true JP2011097000A (ja) | 2011-05-12 |
JP5411019B2 JP5411019B2 (ja) | 2014-02-12 |
Family
ID=43924186
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010037648A Active JP5411019B2 (ja) | 2009-11-02 | 2010-02-23 | Tabテープ及びその製造方法 |
JP2013189311A Active JP5782079B2 (ja) | 2009-11-02 | 2013-09-12 | Tabテープ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013189311A Active JP5782079B2 (ja) | 2009-11-02 | 2013-09-12 | Tabテープ |
Country Status (5)
Country | Link |
---|---|
US (3) | US8791370B2 (ja) |
JP (2) | JP5411019B2 (ja) |
KR (1) | KR101457939B1 (ja) |
CN (2) | CN104900537B (ja) |
TW (1) | TWI467708B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014504034A (ja) * | 2011-01-31 | 2014-02-13 | エルジー イノテック カンパニー リミテッド | リードクラックが強化された電子素子用テープ |
JP2014192298A (ja) * | 2013-03-27 | 2014-10-06 | Seiko Epson Corp | 半導体装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101457939B1 (ko) * | 2009-11-02 | 2014-11-10 | 엘지이노텍 주식회사 | 탭 테이프 및 그 제조방법 |
DE102011018342A1 (de) * | 2011-04-20 | 2012-10-25 | Heraeus Materials Technology Gmbh & Co. Kg | Verfahren zur Herstellung einer bereichsweise beschichteten Trägerstruktur |
JP6843676B2 (ja) * | 2017-03-30 | 2021-03-17 | 日本発條株式会社 | 剤料供給方法及び対象構造体 |
KR102322539B1 (ko) * | 2018-02-07 | 2021-11-04 | 삼성전자주식회사 | 반도체 패키지 및 이를 포함하는 디스플레이 장치 |
TWI744575B (zh) * | 2018-05-11 | 2021-11-01 | 瑞鼎科技股份有限公司 | 應用於顯示器之驅動裝置的封裝結構 |
KR102597160B1 (ko) * | 2018-07-13 | 2023-11-02 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 배터리 모듈 |
KR102662861B1 (ko) | 2018-07-13 | 2024-05-03 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 배터리 모듈 |
CN111429810B (zh) * | 2019-01-09 | 2022-02-11 | 昆山工研院新型平板显示技术中心有限公司 | 可拉伸器件及可拉伸器件的制作方法 |
CN110210143A (zh) * | 2019-06-05 | 2019-09-06 | 爱驰汽车有限公司 | 基于cms系统的端子图或线束布线图的显示方法、系统及装置 |
CN110519930A (zh) * | 2019-08-27 | 2019-11-29 | 江苏上达电子有限公司 | 一种防止cof卷带生产中产生金属异物的方法 |
US11425820B1 (en) * | 2021-02-19 | 2022-08-23 | Synaptics Incorporated | Technologies for mounting display driver integrated circuit chips on display panels |
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JP5782079B2 (ja) | 2015-09-24 |
KR20110048399A (ko) | 2011-05-11 |
TWI467708B (zh) | 2015-01-01 |
US20150311176A1 (en) | 2015-10-29 |
JP5411019B2 (ja) | 2014-02-12 |
TW201117330A (en) | 2011-05-16 |
US20110100687A1 (en) | 2011-05-05 |
CN104900537B (zh) | 2018-02-02 |
CN102054792A (zh) | 2011-05-11 |
US20140291004A1 (en) | 2014-10-02 |
JP2013243416A (ja) | 2013-12-05 |
US9105631B2 (en) | 2015-08-11 |
KR101457939B1 (ko) | 2014-11-10 |
US10020280B2 (en) | 2018-07-10 |
CN102054792B (zh) | 2015-05-20 |
US8791370B2 (en) | 2014-07-29 |
CN104900537A (zh) | 2015-09-09 |
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