JP5635432B2 - 光電素子及びその製造方法 - Google Patents
光電素子及びその製造方法 Download PDFInfo
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- JP5635432B2 JP5635432B2 JP2011022205A JP2011022205A JP5635432B2 JP 5635432 B2 JP5635432 B2 JP 5635432B2 JP 2011022205 A JP2011022205 A JP 2011022205A JP 2011022205 A JP2011022205 A JP 2011022205A JP 5635432 B2 JP5635432 B2 JP 5635432B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
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- Led Devices (AREA)
- Photovoltaic Devices (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30266210P | 2010-02-09 | 2010-02-09 | |
| US61/302,662 | 2010-02-09 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014211281A Division JP5908558B2 (ja) | 2010-02-09 | 2014-10-16 | 光電素子及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011166139A JP2011166139A (ja) | 2011-08-25 |
| JP2011166139A5 JP2011166139A5 (enExample) | 2014-03-20 |
| JP5635432B2 true JP5635432B2 (ja) | 2014-12-03 |
Family
ID=44352986
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011022205A Active JP5635432B2 (ja) | 2010-02-09 | 2011-02-04 | 光電素子及びその製造方法 |
| JP2014211281A Active JP5908558B2 (ja) | 2010-02-09 | 2014-10-16 | 光電素子及びその製造方法 |
| JP2016057950A Pending JP2016154244A (ja) | 2010-02-09 | 2016-03-23 | 光電素子及びその製造方法 |
| JP2017233869A Pending JP2018056586A (ja) | 2010-02-09 | 2017-12-06 | 光電素子及びその製造方法 |
| JP2019140478A Active JP6917417B2 (ja) | 2010-02-09 | 2019-07-31 | 光電素子及びその製造方法 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014211281A Active JP5908558B2 (ja) | 2010-02-09 | 2014-10-16 | 光電素子及びその製造方法 |
| JP2016057950A Pending JP2016154244A (ja) | 2010-02-09 | 2016-03-23 | 光電素子及びその製造方法 |
| JP2017233869A Pending JP2018056586A (ja) | 2010-02-09 | 2017-12-06 | 光電素子及びその製造方法 |
| JP2019140478A Active JP6917417B2 (ja) | 2010-02-09 | 2019-07-31 | 光電素子及びその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8207550B2 (enExample) |
| JP (5) | JP5635432B2 (enExample) |
| KR (2) | KR101280400B1 (enExample) |
| CN (2) | CN103715320B (enExample) |
| DE (1) | DE102011010629B4 (enExample) |
| TW (6) | TWI395352B (enExample) |
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| KR20090022700A (ko) * | 2007-08-31 | 2009-03-04 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| US7985979B2 (en) | 2007-12-19 | 2011-07-26 | Koninklijke Philips Electronics, N.V. | Semiconductor light emitting device with light extraction structures |
| US10205059B2 (en) | 2010-02-09 | 2019-02-12 | Epistar Corporation | Optoelectronic device and the manufacturing method thereof |
| TWI395352B (zh) * | 2010-02-09 | 2013-05-01 | Epistar Corp | 光電元件及其製造方法 |
| US9640728B2 (en) | 2010-02-09 | 2017-05-02 | Epistar Corporation | Optoelectronic device and the manufacturing method thereof |
| JP5727271B2 (ja) * | 2011-03-24 | 2015-06-03 | スタンレー電気株式会社 | 半導体発光素子 |
| TWI458122B (zh) * | 2011-11-23 | 2014-10-21 | Toshiba Kk | 半導體發光元件 |
| KR101984698B1 (ko) * | 2012-01-11 | 2019-05-31 | 삼성전자주식회사 | 기판 구조체, 이로부터 제조된 반도체소자 및 그 제조방법 |
| CN108054261A (zh) * | 2012-02-14 | 2018-05-18 | 晶元光电股份有限公司 | 具有平整表面的电流扩散层的发光元件 |
| US20130234149A1 (en) * | 2012-03-09 | 2013-09-12 | Electro Scientific Industries, Inc. | Sidewall texturing of light emitting diode structures |
| CN103367561B (zh) * | 2012-03-30 | 2016-08-17 | 清华大学 | 发光二极管的制备方法 |
| CN103367383B (zh) | 2012-03-30 | 2016-04-13 | 清华大学 | 发光二极管 |
| CN103367585B (zh) | 2012-03-30 | 2016-04-13 | 清华大学 | 发光二极管 |
| CA3093332C (en) | 2012-06-08 | 2022-05-17 | Wulftec International Inc. | Apparatuses for wrapping a load and supplying film for wrapping a load and associated methods |
| KR101393605B1 (ko) * | 2012-08-01 | 2014-05-09 | 광전자 주식회사 | 요철형 질화갈륨층을 가진 알루미늄갈륨인듐인계 발광다이오드 및 그 제조 방법 |
| KR101412142B1 (ko) * | 2012-09-13 | 2014-06-25 | 광전자 주식회사 | 엔형 질화갈륨 윈도우층을 가진 알루미늄갈륨인듐인계 발광다이오드 및 그 제조 방법 |
| TWI591848B (zh) | 2013-11-28 | 2017-07-11 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
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| TWI552382B (zh) * | 2014-01-24 | 2016-10-01 | 隆達電子股份有限公司 | 發光二極體裝置及其製造方法 |
| CN103872203A (zh) * | 2014-04-08 | 2014-06-18 | 三安光电股份有限公司 | 具有表面微结构的高亮度发光二极管及其制备和筛选方法 |
| KR102153111B1 (ko) * | 2014-04-10 | 2020-09-07 | 엘지이노텍 주식회사 | 발광소자 |
| US10043947B2 (en) * | 2014-05-08 | 2018-08-07 | Lg Innotek Co., Ltd. | Light emitting device |
| JP6595801B2 (ja) * | 2014-05-30 | 2019-10-23 | エルジー イノテック カンパニー リミテッド | 発光素子 |
| KR102164070B1 (ko) * | 2014-05-30 | 2020-10-12 | 엘지이노텍 주식회사 | 발광소자 |
| KR102237105B1 (ko) * | 2014-05-30 | 2021-04-08 | 엘지이노텍 주식회사 | 발광소자 |
| KR102199995B1 (ko) * | 2014-06-02 | 2021-01-11 | 엘지이노텍 주식회사 | 발광소자 |
| JP6245380B2 (ja) | 2014-11-07 | 2017-12-13 | 信越半導体株式会社 | 発光素子及び発光素子の製造方法 |
| US9871171B2 (en) * | 2014-11-07 | 2018-01-16 | Epistar Corporation | Light-emitting device and manufacturing method thereof |
| JP6468459B2 (ja) * | 2015-03-31 | 2019-02-13 | ウシオ電機株式会社 | 半導体発光素子 |
| JP6650143B2 (ja) | 2015-09-30 | 2020-02-19 | ローム株式会社 | 半導体発光素子 |
| US9847454B2 (en) * | 2015-10-02 | 2017-12-19 | Epistar Corporation | Light-emitting device |
| CN105185883B (zh) * | 2015-10-12 | 2019-05-10 | 扬州乾照光电有限公司 | 侧壁粗化的AlGaInP基LED及其制造方法 |
| CN105428485B (zh) * | 2015-12-21 | 2019-06-21 | 扬州乾照光电有限公司 | GaP表面粗化的AlGaInP基LED及其制造方法 |
| JP6332301B2 (ja) * | 2016-02-25 | 2018-05-30 | 日亜化学工業株式会社 | 発光素子 |
| CN105914274A (zh) * | 2016-06-13 | 2016-08-31 | 南昌凯迅光电有限公司 | 一种侧壁粗化高亮度发光二极管及其制备方法 |
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| TWI626766B (zh) * | 2017-06-01 | 2018-06-11 | 錼創科技股份有限公司 | 發光元件 |
| CN115312646A (zh) * | 2019-01-17 | 2022-11-08 | 泉州三安半导体科技有限公司 | 一种半导体发光元件 |
| CN112152085B (zh) * | 2020-11-24 | 2021-02-12 | 度亘激光技术(苏州)有限公司 | 半导体结构的制备方法、半导体结构和半导体器件 |
| CN112885718B (zh) * | 2021-01-20 | 2022-07-05 | 厦门乾照光电股份有限公司 | 一种复合导电薄膜的制备方法 |
| KR102629307B1 (ko) * | 2022-04-26 | 2024-01-29 | 숭실대학교산학협력단 | 질화물 반도체 소자의 제조방법 |
| CN115458647B (zh) * | 2022-10-31 | 2025-08-19 | 天津三安光电有限公司 | 一种垂直led芯片结构及其制造方法及发光装置 |
| KR102721221B1 (ko) * | 2023-05-30 | 2024-10-24 | 웨이브로드 주식회사 | 반도체 소자용 템플릿을 이용한 반도체 적층체 및 그 제조 방법 |
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