JP5395360B2 - 電子部品内蔵基板の製造方法 - Google Patents

電子部品内蔵基板の製造方法 Download PDF

Info

Publication number
JP5395360B2
JP5395360B2 JP2008042621A JP2008042621A JP5395360B2 JP 5395360 B2 JP5395360 B2 JP 5395360B2 JP 2008042621 A JP2008042621 A JP 2008042621A JP 2008042621 A JP2008042621 A JP 2008042621A JP 5395360 B2 JP5395360 B2 JP 5395360B2
Authority
JP
Japan
Prior art keywords
insulating layer
layer
substrate
core substrate
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008042621A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009200389A (ja
JP2009200389A5 (https=
Inventor
修 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008042621A priority Critical patent/JP5395360B2/ja
Priority to US12/366,140 priority patent/US8116066B2/en
Publication of JP2009200389A publication Critical patent/JP2009200389A/ja
Publication of JP2009200389A5 publication Critical patent/JP2009200389A5/ja
Application granted granted Critical
Publication of JP5395360B2 publication Critical patent/JP5395360B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10643—Disc shaped leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)
JP2008042621A 2008-02-25 2008-02-25 電子部品内蔵基板の製造方法 Active JP5395360B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008042621A JP5395360B2 (ja) 2008-02-25 2008-02-25 電子部品内蔵基板の製造方法
US12/366,140 US8116066B2 (en) 2008-02-25 2009-02-05 Method of manufacturing electronic component built-in substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008042621A JP5395360B2 (ja) 2008-02-25 2008-02-25 電子部品内蔵基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009200389A JP2009200389A (ja) 2009-09-03
JP2009200389A5 JP2009200389A5 (https=) 2011-01-13
JP5395360B2 true JP5395360B2 (ja) 2014-01-22

Family

ID=40998725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008042621A Active JP5395360B2 (ja) 2008-02-25 2008-02-25 電子部品内蔵基板の製造方法

Country Status (2)

Country Link
US (1) US8116066B2 (https=)
JP (1) JP5395360B2 (https=)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7989950B2 (en) * 2008-08-14 2011-08-02 Stats Chippac Ltd. Integrated circuit packaging system having a cavity
US8823160B2 (en) * 2008-08-22 2014-09-02 Stats Chippac Ltd. Integrated circuit package system having cavity
KR20110122008A (ko) * 2010-05-03 2011-11-09 삼성전기주식회사 적층 세라믹 커패시터, 이를 포함하는 인쇄회로기판 및 그의 제조방법
US8519270B2 (en) 2010-05-19 2013-08-27 Unimicron Technology Corp. Circuit board and manufacturing method thereof
US8677613B2 (en) 2010-05-20 2014-03-25 International Business Machines Corporation Enhanced modularity in heterogeneous 3D stacks
TWI446497B (zh) * 2010-08-13 2014-07-21 欣興電子股份有限公司 嵌埋被動元件之封裝基板及其製法
JP5585426B2 (ja) 2010-12-07 2014-09-10 Ｔｄｋ株式会社 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法
JP2013038374A (ja) 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
DE102011075866A1 (de) * 2011-05-16 2012-11-22 Continental Automotive Gmbh Mehrlagige Leiterplatte mit eingebettetem EMV-Kondensator
WO2012164719A1 (ja) * 2011-06-02 2012-12-06 株式会社メイコー 部品内蔵基板及びその製造方法
WO2013008552A1 (ja) * 2011-07-13 2013-01-17 イビデン株式会社 電子部品内蔵配線板及びその製造方法
KR20130032529A (ko) * 2011-09-23 2013-04-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN103187311B (zh) * 2011-12-27 2016-02-03 深南电路有限公司 封装基板制作方法
JP2013171926A (ja) * 2012-02-20 2013-09-02 Denso Corp 電子部品
KR101304359B1 (ko) * 2012-04-18 2013-09-11 대덕전자 주식회사 캐비티 인쇄회로기판 제조방법
US9059157B2 (en) * 2012-06-04 2015-06-16 Stats Chippac Ltd. Integrated circuit packaging system with substrate and method of manufacture thereof
US9087847B2 (en) * 2012-08-14 2015-07-21 Bridge Semiconductor Corporation Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
US8901435B2 (en) * 2012-08-14 2014-12-02 Bridge Semiconductor Corporation Hybrid wiring board with built-in stopper, interposer and build-up circuitry
JP5236826B1 (ja) * 2012-08-15 2013-07-17 太陽誘電株式会社 電子部品内蔵基板
WO2014041627A1 (ja) * 2012-09-12 2014-03-20 株式会社メイコー 部品内蔵基板の製造方法
JP2014072279A (ja) * 2012-09-28 2014-04-21 Dainippon Printing Co Ltd 部品内蔵配線基板の製造方法
JP5540061B2 (ja) * 2012-11-30 2014-07-02 欣興電子股▲ふん▼有限公司 回路基板およびその製造方法
KR102026229B1 (ko) * 2012-12-12 2019-09-27 엘지이노텍 주식회사 인쇄회로 기판 및 그 제조 방법
JP2014116548A (ja) * 2012-12-12 2014-06-26 Ngk Spark Plug Co Ltd 多層配線基板およびその製造方法
KR101497192B1 (ko) * 2012-12-27 2015-02-27 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
US8803310B1 (en) * 2013-02-08 2014-08-12 Unimicron Technology Corp. Embedded electronic device package structure
JP6158601B2 (ja) * 2013-06-10 2017-07-05 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP6173781B2 (ja) * 2013-06-10 2017-08-02 新光電気工業株式会社 配線基板及び配線基板の製造方法
US8980691B2 (en) * 2013-06-28 2015-03-17 Stats Chippac, Ltd. Semiconductor device and method of forming low profile 3D fan-out package
JP2015050309A (ja) * 2013-08-31 2015-03-16 京セラサーキットソリューションズ株式会社 配線基板の製造方法
JP2015065322A (ja) * 2013-09-25 2015-04-09 日東電工株式会社 半導体装置の製造方法
WO2015064642A1 (ja) * 2013-10-30 2015-05-07 京セラ株式会社 配線基板およびこれを用いた実装構造体
US9171795B2 (en) * 2013-12-16 2015-10-27 Stats Chippac Ltd. Integrated circuit packaging system with embedded component and method of manufacture thereof
KR102186146B1 (ko) * 2014-01-03 2020-12-03 삼성전기주식회사 패키지 기판, 패키지 기판 제조 방법 및 이를 이용한 반도체 패키지
JP2015133424A (ja) * 2014-01-14 2015-07-23 住友電工デバイス・イノベーション株式会社 電子部品の製造方法
KR102333083B1 (ko) * 2014-05-30 2021-12-01 삼성전기주식회사 패키지 기판 및 패키지 기판 제조 방법
US9653322B2 (en) * 2014-06-23 2017-05-16 Infineon Technologies Austria Ag Method for fabricating a semiconductor package
KR102222608B1 (ko) * 2014-08-01 2021-03-05 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP6393566B2 (ja) * 2014-09-17 2018-09-19 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
KR102194720B1 (ko) * 2014-09-30 2020-12-23 삼성전기주식회사 방열 구조체를 포함하는 회로기판
US10079156B2 (en) 2014-11-07 2018-09-18 Advanced Semiconductor Engineering, Inc. Semiconductor package including dielectric layers defining via holes extending to component pads
US9721799B2 (en) 2014-11-07 2017-08-01 Advanced Semiconductor Engineering, Inc. Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof
JP6465386B2 (ja) * 2014-11-17 2019-02-06 新光電気工業株式会社 配線基板及び電子部品装置と配線基板の製造方法及び電子部品装置の製造方法
US9420695B2 (en) 2014-11-19 2016-08-16 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and semiconductor process
US9426891B2 (en) 2014-11-21 2016-08-23 Advanced Semiconductor Engineering, Inc. Circuit board with embedded passive component and manufacturing method thereof
KR102356810B1 (ko) * 2015-01-22 2022-01-28 삼성전기주식회사 전자부품내장형 인쇄회로기판 및 그 제조방법
JP6752553B2 (ja) 2015-04-28 2020-09-09 新光電気工業株式会社 配線基板
US9837484B2 (en) * 2015-05-27 2017-12-05 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming substrate including embedded component with symmetrical structure
US9748227B2 (en) 2015-07-15 2017-08-29 Apple Inc. Dual-sided silicon integrated passive devices
WO2017111838A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Vertically embedded passive components
US10453786B2 (en) 2016-01-19 2019-10-22 General Electric Company Power electronics package and method of manufacturing thereof
CN107295747B (zh) * 2016-03-31 2021-03-12 奥特斯(中国)有限公司 器件载体及制造器件载体的方法
JP7080579B2 (ja) * 2016-12-02 2022-06-06 凸版印刷株式会社 電子部品製造方法
JP7021854B2 (ja) * 2017-01-24 2022-02-17 ゼネラル・エレクトリック・カンパニイ 電力用電子回路パッケージおよびその製造方法
JP6815880B2 (ja) * 2017-01-25 2021-01-20 株式会社ディスコ 半導体パッケージの製造方法
JP6673304B2 (ja) * 2017-07-21 2020-03-25 株式会社村田製作所 多層基板
JP2019067994A (ja) * 2017-10-04 2019-04-25 トヨタ自動車株式会社 積層基板とその製造方法
KR102029101B1 (ko) * 2017-12-28 2019-10-07 삼성전자주식회사 반도체 패키지
CN108282957B (zh) * 2018-01-30 2019-10-15 维沃移动通信有限公司 一种印制电路板、印制电路板的制作方法及移动终端
EP3557608A1 (en) * 2018-04-19 2019-10-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit
KR102046857B1 (ko) * 2018-05-11 2019-11-21 주식회사 네패스 반도체 패키지
US10757813B2 (en) 2018-10-12 2020-08-25 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof
US11069622B2 (en) * 2019-03-22 2021-07-20 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Interposer-type component carrier and method of manufacturing the same
KR102679998B1 (ko) * 2019-06-13 2024-07-02 삼성전기주식회사 인쇄회로기판
CN111863627B (zh) * 2020-06-29 2022-04-19 珠海越亚半导体股份有限公司 集成无源器件封装结构及其制作方法和基板
KR102824545B1 (ko) * 2021-08-10 2025-06-25 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 안테나 패키지 기판
US20240047228A1 (en) * 2022-08-02 2024-02-08 Advanced Micro Devices, Inc. Methods for constructing package substrates with high density
CN117560860A (zh) * 2022-08-04 2024-02-13 辉达公司 堆叠多个印刷电路板的方法和配置
US20250038145A1 (en) * 2023-07-28 2025-01-30 Mediatek Inc. Semiconductor package structure
KR102737071B1 (ko) * 2024-01-02 2024-12-03 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지 기판

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809053B2 (ja) * 2000-01-20 2006-08-16 新光電気工業株式会社 電子部品パッケージ
JP3709882B2 (ja) * 2003-07-22 2005-10-26 松下電器産業株式会社 回路モジュールとその製造方法
JP4198566B2 (ja) * 2003-09-29 2008-12-17 新光電気工業株式会社 電子部品内蔵基板の製造方法
JP2005302854A (ja) 2004-04-08 2005-10-27 Fujikura Ltd 部品内蔵両面基板、部品内蔵両面配線板およびその製造方法
JP2006019441A (ja) * 2004-06-30 2006-01-19 Shinko Electric Ind Co Ltd 電子部品内蔵基板の製造方法
KR100645643B1 (ko) * 2004-07-14 2006-11-15 삼성전기주식회사 수동소자칩 내장형의 인쇄회로기판의 제조방법
TWI301739B (en) * 2004-12-03 2008-10-01 Via Tech Inc Structure and method for embedded passive component assembly
KR100700922B1 (ko) 2005-10-17 2007-03-28 삼성전기주식회사 수동 소자를 내장한 기판 및 그 제조 방법
JP4673207B2 (ja) * 2005-12-16 2011-04-20 イビデン株式会社 多層プリント配線板およびその製造方法

Also Published As

Publication number Publication date
US20090215231A1 (en) 2009-08-27
JP2009200389A (ja) 2009-09-03
US8116066B2 (en) 2012-02-14

Similar Documents

Publication Publication Date Title
JP5395360B2 (ja) 電子部品内蔵基板の製造方法
JP4361826B2 (ja) 半導体装置
JP5826532B2 (ja) 半導体装置及びその製造方法
JP5410660B2 (ja) 配線基板及びその製造方法と電子部品装置及びその製造方法
JP5566200B2 (ja) 配線基板及びその製造方法
JP5389770B2 (ja) 電子素子内蔵印刷回路基板及びその製造方法
JP2014154800A (ja) 配線基板及びその製造方法
JP2009135162A (ja) 配線基板及び電子部品装置
JP2011258772A (ja) 配線基板及びその製造方法並びに半導体装置
US20170033037A1 (en) Packaging substrate
JP2002164467A (ja) 回路ブロック体及びその製造方法、配線回路装置及びその製造方法並びに半導体装置及びその製造方法
JP2008270532A (ja) インダクタ内蔵基板及びその製造方法
JP2011071315A (ja) 配線基板及び配線基板の製造方法
JP5454681B2 (ja) モジュール基板およびその製造方法
JP2009081357A (ja) 配線基板の製造方法及び配線基板
US8334590B1 (en) Semiconductor device having insulating and interconnection layers
JP4934444B2 (ja) 半導体装置とその製造方法
JP4398683B2 (ja) 多層配線基板の製造方法
JP2005011883A (ja) 配線基板、半導体装置および配線基板の製造方法
US20070143992A1 (en) Method for manufacturing wiring board
JP5174355B2 (ja) 配線基板及びその製造方法と半導体装置
TW201927090A (zh) 佈線板及其製造方法
JP6387226B2 (ja) 複合基板
JP2010098064A (ja) 積層配線基板及びその製造方法
JP2017201674A (ja) プリント配線板およびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101119

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120228

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120229

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120423

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130820

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130903

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131001

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131018

R150 Certificate of patent or registration of utility model

Ref document number: 5395360

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150