JP5202822B2 - 硬化性オルガノポリシロキサン組成物および半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物および半導体装置 Download PDF

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Publication number
JP5202822B2
JP5202822B2 JP2006173777A JP2006173777A JP5202822B2 JP 5202822 B2 JP5202822 B2 JP 5202822B2 JP 2006173777 A JP2006173777 A JP 2006173777A JP 2006173777 A JP2006173777 A JP 2006173777A JP 5202822 B2 JP5202822 B2 JP 5202822B2
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group
sio
curable organopolysiloxane
organopolysiloxane composition
component
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Expired - Lifetime
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JP2006173777A
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English (en)
Japanese (ja)
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JP2008001828A (ja
JP2008001828A5 (enExample
Inventor
好次 森田
匡慶 寺田
博司 江南
誠 吉武
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2006173777A priority Critical patent/JP5202822B2/ja
Priority to TW096119562A priority patent/TWI425053B/zh
Priority to US12/306,049 priority patent/US8080614B2/en
Priority to MYPI20085206A priority patent/MY147862A/en
Priority to PCT/JP2007/062649 priority patent/WO2007148812A1/en
Priority to CN2007800215923A priority patent/CN101466795B/zh
Priority to KR1020087031182A priority patent/KR101436800B1/ko
Priority to AT07767457T priority patent/ATE451426T1/de
Priority to DE602007003724T priority patent/DE602007003724D1/de
Priority to EP07767457A priority patent/EP2032653B1/en
Publication of JP2008001828A publication Critical patent/JP2008001828A/ja
Publication of JP2008001828A5 publication Critical patent/JP2008001828A5/ja
Application granted granted Critical
Publication of JP5202822B2 publication Critical patent/JP5202822B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
JP2006173777A 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置 Expired - Lifetime JP5202822B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2006173777A JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置
TW096119562A TWI425053B (zh) 2006-06-23 2007-05-31 硬化性有機聚矽氧烷組合物及半導體裝置
EP07767457A EP2032653B1 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device
PCT/JP2007/062649 WO2007148812A1 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device
CN2007800215923A CN101466795B (zh) 2006-06-23 2007-06-18 可固化的有机基聚硅氧烷组合物和半导体器件
KR1020087031182A KR101436800B1 (ko) 2006-06-23 2007-06-18 경화성 오가노폴리실록산 조성물 및 반도체 디바이스
US12/306,049 US8080614B2 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device
DE602007003724T DE602007003724D1 (de) 2006-06-23 2007-06-18 Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement
MYPI20085206A MY147862A (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device
AT07767457T ATE451426T1 (de) 2006-06-23 2007-06-18 Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006173777A JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置

Publications (3)

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JP2008001828A JP2008001828A (ja) 2008-01-10
JP2008001828A5 JP2008001828A5 (enExample) 2009-07-30
JP5202822B2 true JP5202822B2 (ja) 2013-06-05

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JP2006173777A Expired - Lifetime JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置

Country Status (10)

Country Link
US (1) US8080614B2 (enExample)
EP (1) EP2032653B1 (enExample)
JP (1) JP5202822B2 (enExample)
KR (1) KR101436800B1 (enExample)
CN (1) CN101466795B (enExample)
AT (1) ATE451426T1 (enExample)
DE (1) DE602007003724D1 (enExample)
MY (1) MY147862A (enExample)
TW (1) TWI425053B (enExample)
WO (1) WO2007148812A1 (enExample)

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JP2008001828A (ja) 2008-01-10
ATE451426T1 (de) 2009-12-15
KR20090028720A (ko) 2009-03-19
EP2032653B1 (en) 2009-12-09
WO2007148812A1 (en) 2007-12-27
US8080614B2 (en) 2011-12-20
US20090179180A1 (en) 2009-07-16
DE602007003724D1 (de) 2010-01-21
KR101436800B1 (ko) 2014-09-02
CN101466795B (zh) 2011-08-17
TW200808908A (en) 2008-02-16
EP2032653A1 (en) 2009-03-11
TWI425053B (zh) 2014-02-01
MY147862A (en) 2013-01-31
CN101466795A (zh) 2009-06-24

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