KR101436800B1 - 경화성 오가노폴리실록산 조성물 및 반도체 디바이스 - Google Patents

경화성 오가노폴리실록산 조성물 및 반도체 디바이스 Download PDF

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KR101436800B1
KR101436800B1 KR1020087031182A KR20087031182A KR101436800B1 KR 101436800 B1 KR101436800 B1 KR 101436800B1 KR 1020087031182 A KR1020087031182 A KR 1020087031182A KR 20087031182 A KR20087031182 A KR 20087031182A KR 101436800 B1 KR101436800 B1 KR 101436800B1
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curable organopolysiloxane
organopolysiloxane composition
silicon
cured product
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KR20090028720A (ko
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요시쓰구 모리타
마사요시 데라다
히로지 에나미
마코토 요시타케
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
KR1020087031182A 2006-06-23 2007-06-18 경화성 오가노폴리실록산 조성물 및 반도체 디바이스 Active KR101436800B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006173777A JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置
JPJP-P-2006-173777 2006-06-23
PCT/JP2007/062649 WO2007148812A1 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device

Publications (2)

Publication Number Publication Date
KR20090028720A KR20090028720A (ko) 2009-03-19
KR101436800B1 true KR101436800B1 (ko) 2014-09-02

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KR1020087031182A Active KR101436800B1 (ko) 2006-06-23 2007-06-18 경화성 오가노폴리실록산 조성물 및 반도체 디바이스

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US (1) US8080614B2 (enExample)
EP (1) EP2032653B1 (enExample)
JP (1) JP5202822B2 (enExample)
KR (1) KR101436800B1 (enExample)
CN (1) CN101466795B (enExample)
AT (1) ATE451426T1 (enExample)
DE (1) DE602007003724D1 (enExample)
MY (1) MY147862A (enExample)
TW (1) TWI425053B (enExample)
WO (1) WO2007148812A1 (enExample)

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Publication number Publication date
US20090179180A1 (en) 2009-07-16
WO2007148812A1 (en) 2007-12-27
MY147862A (en) 2013-01-31
US8080614B2 (en) 2011-12-20
JP2008001828A (ja) 2008-01-10
EP2032653A1 (en) 2009-03-11
JP5202822B2 (ja) 2013-06-05
EP2032653B1 (en) 2009-12-09
CN101466795B (zh) 2011-08-17
ATE451426T1 (de) 2009-12-15
TWI425053B (zh) 2014-02-01
CN101466795A (zh) 2009-06-24
KR20090028720A (ko) 2009-03-19
DE602007003724D1 (de) 2010-01-21
TW200808908A (en) 2008-02-16

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