JP5180826B2 - フィルム及び離型フィルム - Google Patents

フィルム及び離型フィルム Download PDF

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Publication number
JP5180826B2
JP5180826B2 JP2008522529A JP2008522529A JP5180826B2 JP 5180826 B2 JP5180826 B2 JP 5180826B2 JP 2008522529 A JP2008522529 A JP 2008522529A JP 2008522529 A JP2008522529 A JP 2008522529A JP 5180826 B2 JP5180826 B2 JP 5180826B2
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Japan
Prior art keywords
film
layer
methyl
copolymer
pentene
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Active
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JP2008522529A
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English (en)
Japanese (ja)
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JPWO2008001682A1 (ja
Inventor
達也 谷崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Mitsui Chemicals Tohcello Inc
Original Assignee
Mitsui Chemicals Inc
Mitsui Chemicals Tohcello Inc
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Application filed by Mitsui Chemicals Inc, Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Inc
Priority to JP2008522529A priority Critical patent/JP5180826B2/ja
Publication of JPWO2008001682A1 publication Critical patent/JPWO2008001682A1/ja
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Publication of JP5180826B2 publication Critical patent/JP5180826B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/14—Monomers containing five or more carbon atoms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2008522529A 2006-06-27 2007-06-22 フィルム及び離型フィルム Active JP5180826B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008522529A JP5180826B2 (ja) 2006-06-27 2007-06-22 フィルム及び離型フィルム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006177217 2006-06-27
JP2006177217 2006-06-27
JP2008522529A JP5180826B2 (ja) 2006-06-27 2007-06-22 フィルム及び離型フィルム
PCT/JP2007/062575 WO2008001682A1 (fr) 2006-06-27 2007-06-22 Film et film de démoulage

Publications (2)

Publication Number Publication Date
JPWO2008001682A1 JPWO2008001682A1 (ja) 2009-11-26
JP5180826B2 true JP5180826B2 (ja) 2013-04-10

Family

ID=38845448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008522529A Active JP5180826B2 (ja) 2006-06-27 2007-06-22 フィルム及び離型フィルム

Country Status (4)

Country Link
JP (1) JP5180826B2 (fr)
CN (1) CN101479327B (fr)
TW (1) TWI414554B (fr)
WO (1) WO2008001682A1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5368054B2 (ja) * 2008-10-15 2013-12-18 日本メクトロン株式会社 フレキシブル回路基板の製造方法及びフレキシブル回路基板
JP5622362B2 (ja) * 2009-02-24 2014-11-12 三井化学株式会社 積層体
JP5297233B2 (ja) * 2009-03-09 2013-09-25 三井化学株式会社 半導体封止プロセス用離型フィルム、およびそれを用いた樹脂封止半導体の製造方法
CN103221453A (zh) * 2011-03-28 2013-07-24 日本瑞翁株式会社 热固化性交联环状烯烃树脂组合物、热固化性交联环状烯烃树脂膜、热固化性交联环状烯烃树脂组合物的制造方法及热固化性交联环状烯烃树脂膜的制造方法
JP5704449B2 (ja) * 2011-04-07 2015-04-22 住友ベークライト株式会社 繊維強化樹脂成形品の製造方法、および繊維強化樹脂成形品
CN102294864A (zh) * 2011-07-01 2011-12-28 刘烈新 复合耐高温离型膜
JP6225437B2 (ja) * 2012-08-16 2017-11-08 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品の被覆方法
JP6237557B2 (ja) * 2013-11-22 2017-11-29 王子ホールディングス株式会社 二軸延伸ポリプロピレンフィルム
JP2015159214A (ja) * 2014-02-25 2015-09-03 住友ベークライト株式会社 電磁波シールドフィルム及びフレキシブルプリント基板
JP6271320B2 (ja) * 2014-03-28 2018-01-31 アキレス株式会社 離型フィルム
CN105172292A (zh) * 2015-09-15 2015-12-23 蚌埠冠宜型材科技有限公司 一种铸造用薄膜
CN106042553B (zh) * 2016-06-13 2018-06-26 昆山致信天城电子材料有限公司 一种耐高温离型膜及制造工艺
JP2018167458A (ja) * 2017-03-29 2018-11-01 日本メクトロン株式会社 離型フィルムおよびフレキシブルプリント基板の製造方法
JP6942530B2 (ja) * 2017-06-20 2021-09-29 三井化学株式会社 多層二軸延伸フィルムおよび転写フィルム
SG11202004352PA (en) * 2017-11-17 2020-06-29 Agc Inc Laminated film and method for producing semiconductor element
CN112789148B (zh) * 2018-10-04 2023-07-07 日东电工株式会社 耐热脱模片和热压接方法
KR102601956B1 (ko) 2019-03-28 2023-11-13 미쓰이 가가쿠 토세로 가부시키가이샤 프린트 배선기판 제조공정용 이형필름, 프린트 기판의 제조방법, 프린트 기판 제조장치 및 프린트 기판
CN110213889A (zh) * 2019-04-11 2019-09-06 豫鑫达（深圳）智能化设备有限责任公司 一种用于柔性线路板压合的离型膜输出及收纳结构
CN111993734A (zh) * 2019-05-27 2020-11-27 宁波长阳科技股份有限公司 一种耐高温离型膜及其制备方法
CN112297559A (zh) * 2019-07-31 2021-02-02 宁波长阳科技股份有限公司 一种热稳定的离型膜及其制造方法
WO2022034834A1 (fr) * 2020-08-12 2022-02-17 住友ベークライト株式会社 Film de démoulage et procédé de fabrication d'un produit moulé
CN112622312A (zh) * 2020-12-29 2021-04-09 宁波长阳科技股份有限公司 脱模膜及其制备方法和应用
CN112778681B (zh) * 2020-12-31 2023-09-29 苏州市新广益电子股份有限公司 一种柔性印刷电路板制造专用脱模膜
CN112874097A (zh) * 2021-02-07 2021-06-01 刘烈新 一种高温高效离型特氟龙与尼龙多层复合材料

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232031A (ja) * 1985-08-02 1987-02-12 Mitsui Petrochem Ind Ltd 多層プリント配線基板製造用ポリ４―メチル―１―ペンテン製表面粗化フィルム及びシート
JPH02175247A (ja) * 1988-12-28 1990-07-06 Mitsui Petrochem Ind Ltd 積層体からなる離型フィルム
JPH02238911A (ja) * 1989-03-13 1990-09-21 Mitsui Petrochem Ind Ltd ポリ４―メチル―１―ペンテン製の両面が粗化された離型フィルム及びその製造方法
JP2000289170A (ja) * 1999-04-09 2000-10-17 Toyobo Co Ltd 離型フィルム
JP2002225207A (ja) * 2000-09-20 2002-08-14 Mitsui Chemicals Inc ４−メチル−１−ペンテン共重合体多層フィルムおよびその製造方法
JP2002252458A (ja) * 2001-02-26 2002-09-06 Mitsubishi Polyester Film Copp 多層プリント配線板製造用ポリエステルフィルム
WO2006067964A1 (fr) * 2004-12-21 2006-06-29 Mitsubishi Polyester Film Corporation Film de démoulage en polyester pour le moulage par pressage à chaud
WO2006120983A1 (fr) * 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. Stratifié comprenant du polymère 4-méthyle-1-pentène et film de séparation comprenant le stratifié

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1264685A4 (fr) * 2000-09-20 2003-05-21 Mitsui Chemicals Inc Film au copolymere 4-methyl-1-pentene multicouche et procede de production de ce dernier
JP4489699B2 (ja) * 2003-03-28 2010-06-23 三井化学株式会社 延伸フィルムおよびその製造方法
JP2006212954A (ja) * 2005-02-04 2006-08-17 Mitsui Chemicals Inc 離型フィルム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232031A (ja) * 1985-08-02 1987-02-12 Mitsui Petrochem Ind Ltd 多層プリント配線基板製造用ポリ４―メチル―１―ペンテン製表面粗化フィルム及びシート
JPH02175247A (ja) * 1988-12-28 1990-07-06 Mitsui Petrochem Ind Ltd 積層体からなる離型フィルム
JPH02238911A (ja) * 1989-03-13 1990-09-21 Mitsui Petrochem Ind Ltd ポリ４―メチル―１―ペンテン製の両面が粗化された離型フィルム及びその製造方法
JP2000289170A (ja) * 1999-04-09 2000-10-17 Toyobo Co Ltd 離型フィルム
JP2002225207A (ja) * 2000-09-20 2002-08-14 Mitsui Chemicals Inc ４−メチル−１−ペンテン共重合体多層フィルムおよびその製造方法
JP2002252458A (ja) * 2001-02-26 2002-09-06 Mitsubishi Polyester Film Copp 多層プリント配線板製造用ポリエステルフィルム
WO2006067964A1 (fr) * 2004-12-21 2006-06-29 Mitsubishi Polyester Film Corporation Film de démoulage en polyester pour le moulage par pressage à chaud
WO2006120983A1 (fr) * 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. Stratifié comprenant du polymère 4-méthyle-1-pentène et film de séparation comprenant le stratifié

Also Published As

Publication number Publication date
CN101479327B (zh) 2012-05-30
CN101479327A (zh) 2009-07-08
TWI414554B (zh) 2013-11-11
WO2008001682A1 (fr) 2008-01-03
TW200806731A (en) 2008-02-01
JPWO2008001682A1 (ja) 2009-11-26

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