JP5155644B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5155644B2
JP5155644B2 JP2007316920A JP2007316920A JP5155644B2 JP 5155644 B2 JP5155644 B2 JP 5155644B2 JP 2007316920 A JP2007316920 A JP 2007316920A JP 2007316920 A JP2007316920 A JP 2007316920A JP 5155644 B2 JP5155644 B2 JP 5155644B2
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JP
Japan
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lead
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common
suspension
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JP2007316920A
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English (en)
Japanese (ja)
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JP2009044114A5 (https=
JP2009044114A (ja
Inventor
典之 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
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Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2007316920A priority Critical patent/JP5155644B2/ja
Priority to TW097121800A priority patent/TWI452663B/zh
Priority to TW103127991A priority patent/TWI514534B/zh
Priority to CN2008101339421A priority patent/CN101452902B/zh
Priority to KR1020080069792A priority patent/KR101477807B1/ko
Priority to CN201210209452.1A priority patent/CN102709268B/zh
Priority to US12/176,477 priority patent/US7847376B2/en
Publication of JP2009044114A publication Critical patent/JP2009044114A/ja
Priority to US12/954,876 priority patent/US8368191B2/en
Publication of JP2009044114A5 publication Critical patent/JP2009044114A5/ja
Application granted granted Critical
Publication of JP5155644B2 publication Critical patent/JP5155644B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP2007316920A 2007-07-19 2007-12-07 半導体装置 Active JP5155644B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2007316920A JP5155644B2 (ja) 2007-07-19 2007-12-07 半導体装置
TW103127991A TWI514534B (zh) 2007-07-19 2008-06-11 Semiconductor device and manufacturing method thereof
TW097121800A TWI452663B (zh) 2007-07-19 2008-06-11 Semiconductor device and manufacturing method thereof
KR1020080069792A KR101477807B1 (ko) 2007-07-19 2008-07-18 반도체 장치 및 그 제조 방법
CN2008101339421A CN101452902B (zh) 2007-07-19 2008-07-18 半导体器件及其制造方法
CN201210209452.1A CN102709268B (zh) 2007-07-19 2008-07-18 半导体器件及其制造方法
US12/176,477 US7847376B2 (en) 2007-07-19 2008-07-21 Semiconductor device and manufacturing method of the same
US12/954,876 US8368191B2 (en) 2007-07-19 2010-11-28 Semiconductor device and manufacturing method of the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007187789 2007-07-19
JP2007187789 2007-07-19
JP2007316920A JP5155644B2 (ja) 2007-07-19 2007-12-07 半導体装置

Publications (3)

Publication Number Publication Date
JP2009044114A JP2009044114A (ja) 2009-02-26
JP2009044114A5 JP2009044114A5 (https=) 2011-01-27
JP5155644B2 true JP5155644B2 (ja) 2013-03-06

Family

ID=40444481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007316920A Active JP5155644B2 (ja) 2007-07-19 2007-12-07 半導体装置

Country Status (4)

Country Link
JP (1) JP5155644B2 (https=)
KR (1) KR101477807B1 (https=)
CN (2) CN101452902B (https=)
TW (2) TWI452663B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102044514A (zh) * 2010-04-29 2011-05-04 中颖电子股份有限公司 芯片引线键合区及应用其的半导体器件
JP5798021B2 (ja) * 2011-12-01 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置
KR102071078B1 (ko) 2012-12-06 2020-01-30 매그나칩 반도체 유한회사 멀티 칩 패키지
CN104103620B (zh) * 2014-07-29 2017-02-15 日月光封装测试(上海)有限公司 引线框架及半导体封装体
CN104485323B (zh) * 2014-12-23 2017-08-25 日月光封装测试(上海)有限公司 引线框架和半导体封装体
CN104547477A (zh) * 2015-01-29 2015-04-29 李秀娟 一种用于肛周脓肿引流术后护理的中药制剂及制备方法
JP2017045944A (ja) 2015-08-28 2017-03-02 ルネサスエレクトロニクス株式会社 半導体装置
JP6394634B2 (ja) * 2016-03-31 2018-09-26 日亜化学工業株式会社 リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法
US10714418B2 (en) * 2018-03-26 2020-07-14 Texas Instruments Incorporated Electronic device having inverted lead pins
US11862540B2 (en) 2020-03-06 2024-01-02 Stmicroelectronics Sdn Bhd Mold flow balancing for a matrix leadframe
CN114203665B (zh) * 2021-12-31 2025-02-11 矽典微电子(上海)有限公司 封装框架及封装结构

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
JPS6476745A (en) * 1987-09-17 1989-03-22 Hitachi Ltd Lead frame
JPH01106461A (ja) * 1987-10-20 1989-04-24 Fujitsu Ltd リードフレーム
US5543657A (en) * 1994-10-07 1996-08-06 International Business Machines Corporation Single layer leadframe design with groundplane capability
TW363333B (en) * 1995-04-24 1999-07-01 Toshiba Corp Semiconductor apparatus and manufacturing method thereof and electric apparatus
JPH11168169A (ja) * 1997-12-04 1999-06-22 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
JP2000058739A (ja) * 1998-08-10 2000-02-25 Hitachi Ltd 半導体装置およびその製造に用いるリードフレーム
JP2002026179A (ja) * 2000-07-04 2002-01-25 Nec Kyushu Ltd 半導体装置およびその製造方法
JP2002043497A (ja) * 2000-07-27 2002-02-08 Mitsubishi Electric Corp 半導体装置
JP2003023134A (ja) * 2001-07-09 2003-01-24 Hitachi Ltd 半導体装置およびその製造方法
JP4611579B2 (ja) * 2001-07-30 2011-01-12 ルネサスエレクトロニクス株式会社 リードフレーム、半導体装置およびその樹脂封止法
WO2003012863A1 (fr) * 2001-07-31 2003-02-13 Renesas Technology Corp. Dispositif semi-conducteur et procede de fabrication associe
AU2003234812A1 (en) * 2002-06-05 2003-12-22 Hitachi Ulsi Systems Co., Ltd. Semiconductor device
JP3851845B2 (ja) * 2002-06-06 2006-11-29 株式会社ルネサステクノロジ 半導体装置
KR100975692B1 (ko) * 2002-07-01 2010-08-12 가부시끼가이샤 르네사스 테크놀로지 반도체 장치
US7064420B2 (en) * 2002-09-30 2006-06-20 St Assembly Test Services Ltd. Integrated circuit leadframe with ground plane
JP4159431B2 (ja) * 2002-11-15 2008-10-01 株式会社ルネサステクノロジ 半導体装置の製造方法
WO2005024933A1 (ja) * 2003-08-29 2005-03-17 Renesas Technology Corp. 半導体装置の製造方法
JP2005191342A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法
JP4417150B2 (ja) * 2004-03-23 2010-02-17 株式会社ルネサステクノロジ 半導体装置
JP2007180077A (ja) * 2005-12-27 2007-07-12 Renesas Technology Corp 半導体装置

Also Published As

Publication number Publication date
TWI452663B (zh) 2014-09-11
KR20090009142A (ko) 2009-01-22
TWI514534B (zh) 2015-12-21
TW200915520A (en) 2009-04-01
CN102709268B (zh) 2015-04-08
JP2009044114A (ja) 2009-02-26
TW201445691A (zh) 2014-12-01
CN102709268A (zh) 2012-10-03
KR101477807B1 (ko) 2014-12-30
CN101452902B (zh) 2012-08-08
CN101452902A (zh) 2009-06-10

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