JP5111790B2 - エッチング液及びこれを用いた配線形成方法 - Google Patents
エッチング液及びこれを用いた配線形成方法 Download PDFInfo
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- JP5111790B2 JP5111790B2 JP2006163441A JP2006163441A JP5111790B2 JP 5111790 B2 JP5111790 B2 JP 5111790B2 JP 2006163441 A JP2006163441 A JP 2006163441A JP 2006163441 A JP2006163441 A JP 2006163441A JP 5111790 B2 JP5111790 B2 JP 5111790B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/26—Acidic compositions for etching refractory metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
Description
22:ゲート線
24:ゲート終端
26:ゲート電極
27:蓄積電極
28:蓄積電極線
30:ゲート絶縁膜
40:半導体層
55、56:オーミックコンタクト層
62:データ線
65:ソース電極
66:ドレイン電極
67:ドレイン電極拡張部
68:データ終端
70:保護膜
82:画素電極
Claims (9)
- 基板上にモリブデン/銅/窒化モリブデンを順次的に積層して形成した多重膜配線をエッチングするためのエッチング液であって、過酸化水素10ないし20重量%、有機酸1ないし5重量%、トリアゾール系化合物0.1ないし1重量%、ふっ素化合物0.01ないし0.5重量%及び超純水を含み、
前記有機酸は、酢酸(acetic acid)、ブタン酸(butanoic acid)、クエン酸(citric acid)、ギ酸(formic acid)、グルコン酸(gluconic acid)、グリコール酸(glycolic acid)、マロン酸(malonic acid)、シュウ酸(oxalic acid)またはペンタン酸(pentanoic acid)のうちのいずれか一つであり、
前記トリアゾール系化合物は、1、2、3―トリアゾール、1、2、4―トリアゾール、5―フェニル―1、2、4―トリアゾール、5―アミノ―1、2、4―トリアゾール、ベンゾトリアゾル、1―メチル―ベンゾトリアゾルまたはトリルトリアゾールのうちのいずれか一つであり、
前記ふっ素化合物は、フッ化水素酸(hydrofluoric acid)、フッ化アンモニウム(ammonium fluoride)、フッ化ナトリウム(sodium fluoride)、フッ化カリウム(potassium fluoride)のうちのいずれか一つであることを特徴とするモリブデン/銅/窒化モリブデン多重膜配線用エッチング液。 - 前記有機酸はクエン酸であり、前記トリアゾール系化合物はベンゾトリアゾルであり、前記ふっ素化合物はフッ化水素酸であることを特徴とする請求項1に記載のエッチング液。
- 基板上にモリブデン層、銅層及び窒化モリブデン層を順次的に積層して多重膜を形成し、前記多重膜を過酸化水素10ないし20重量%、有機酸1ないし5重量%、トリアゾール0.1ないし1重量%、ふっ素化合物0.01ないし0.5重量%及び超純水を含み、
前記有機酸は、酢酸(acetic acid)、ブタン酸(butanoic acid)、クエン酸(citric acid)、ギ酸(formic acid)、グルコン酸(gluconic acid)、グリコール酸(glycolic acid)、マロン酸(malonic acid)、シュウ酸(oxalic acid)またはペンタン酸(pentanoic acid)のうちのいずれか一つであり、
前記トリアゾール系化合物は、1、2、3―トリアゾール、1、2、4―トリアゾール、5―フェニル―1、2、4―トリアゾール、5―アミノ―1、2、4―トリアゾール、ベンゾトリアゾル、1―メチル―ベンゾトリアゾルまたはトリルトリアゾールのうちのいずれか一つであり、
前記ふっ素化合物は、フッ化水素酸(hydrofluoric acid)、フッ化アンモニウム(ammonium fluoride)、フッ化ナトリウム(sodium fluoride)、フッ化カリウム(potassium fluoride)のうちのいずれか一つであるエッチング液を用いてエッチングすることを含むことを特徴とする配線形成方法。 - 前記有機酸はクエン酸であり、前記トリアゾール系化合物はベンゾトリアゾルであり、前記ふっ素化合物はフッ化水素酸であることを特徴とする請求項3に記載の配線形成方法。
- 前記基板は絶縁体または半導体で構成されることを特徴とする請求項3に記載の配線形成方法。
- 前記エッチングは20ないし50℃で行われることを特徴とする請求項3に記載の配線形成方法。
- 前記エッチングは噴射方式で行われることを特徴とする請求項3に記載の配線形成方法。
- 前記エッチングは50ないし120秒間行われることを特徴とする請求項3に記載の配線形成方法。
- 前記エッチングにおいては、前記多重膜を構成する窒化モリブデン、銅及びモリブデン層が一括的にエッチングされることを特徴とする請求項3に記載の配線形成方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0054015 | 2005-06-22 | ||
KR1020050054015A KR101199533B1 (ko) | 2005-06-22 | 2005-06-22 | 식각액, 이를 이용하는 배선 형성 방법 및 박막 트랜지스터기판의 제조 방법 |
Publications (3)
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JP2007005790A JP2007005790A (ja) | 2007-01-11 |
JP2007005790A5 JP2007005790A5 (ja) | 2009-05-07 |
JP5111790B2 true JP5111790B2 (ja) | 2013-01-09 |
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JP2006163441A Active JP5111790B2 (ja) | 2005-06-22 | 2006-06-13 | エッチング液及びこれを用いた配線形成方法 |
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US (1) | US7943519B2 (ja) |
JP (1) | JP5111790B2 (ja) |
KR (1) | KR101199533B1 (ja) |
CN (1) | CN1884618B (ja) |
TW (1) | TWI390018B (ja) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101353123B1 (ko) * | 2005-12-09 | 2014-01-17 | 동우 화인켐 주식회사 | 금속막 식각용액 |
US8017950B2 (en) * | 2005-12-29 | 2011-09-13 | Lg Display Co., Ltd. | Organic electro-luminescence display device and method of manfacturing the same |
KR20080008562A (ko) * | 2006-07-20 | 2008-01-24 | 삼성전자주식회사 | 어레이 기판의 제조방법, 어레이 기판 및 이를 갖는표시장치 |
JP5559956B2 (ja) * | 2007-03-15 | 2014-07-23 | 東進セミケム株式会社 | 薄膜トランジスタ液晶表示装置のエッチング液組成物 |
KR100839428B1 (ko) * | 2007-05-17 | 2008-06-19 | 삼성에스디아이 주식회사 | 식각액, 및 이를 이용한 박막트랜지스터를 갖는 기판의제조 방법 |
JP2010537444A (ja) * | 2007-10-08 | 2010-12-02 | ビーエーエスエフ ソシエタス・ヨーロピア | エッチング剤組成物及び金属Cu/Moのためのエッチング方法 |
KR20090037725A (ko) * | 2007-10-12 | 2009-04-16 | 삼성전자주식회사 | 박막트랜지스터 기판, 그 제조 방법 및 이를 갖는 표시장치 |
KR101406573B1 (ko) * | 2008-01-25 | 2014-06-11 | 동우 화인켐 주식회사 | 식각액 조성물 및 이를 이용한 금속 패턴의 형성방법 |
KR101495683B1 (ko) * | 2008-09-26 | 2015-02-26 | 솔브레인 주식회사 | 액정표시장치의 구리 및 구리/몰리브데늄 또는 구리/몰리브데늄합금 전극용 식각조성물 |
KR101475954B1 (ko) * | 2008-11-04 | 2014-12-24 | 동우 화인켐 주식회사 | 액정표시장치용 어레이 기판의 제조 방법 |
KR101172113B1 (ko) | 2008-11-14 | 2012-08-10 | 엘지이노텍 주식회사 | 터치스크린 및 그 제조방법 |
KR101529733B1 (ko) * | 2009-02-06 | 2015-06-19 | 동우 화인켐 주식회사 | 액정표시장치용 어레이 기판의 제조방법 |
TWI479574B (zh) | 2009-03-16 | 2015-04-01 | Hannstar Display Corp | Tft陣列基板及其製造方法 |
JP5604056B2 (ja) * | 2009-05-15 | 2014-10-08 | 関東化学株式会社 | 銅含有積層膜用エッチング液 |
CN102472938B (zh) * | 2009-07-23 | 2016-03-30 | 东友精细化工有限公司 | 液晶显示装置用阵列基板的制造方法 |
WO2011021860A2 (en) * | 2009-08-20 | 2011-02-24 | Dongwoo Fine-Chem Co., Ltd. | Method of fabricating array substrate for liquid crystal display |
KR101687311B1 (ko) * | 2009-10-07 | 2016-12-16 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
KR20110046992A (ko) * | 2009-10-29 | 2011-05-06 | 동우 화인켐 주식회사 | 식각액 조성물 |
CN102696097B (zh) * | 2009-12-25 | 2015-08-05 | 三菱瓦斯化学株式会社 | 蚀刻液及使用其的半导体装置的制造方法 |
KR20110123025A (ko) * | 2010-05-06 | 2011-11-14 | 삼성전자주식회사 | 금속 배선 식각액 및 이를 이용한 금속 배선 형성 방법 |
US20140151682A1 (en) * | 2010-07-15 | 2014-06-05 | Sharp Kabushiki Kaisha | Circuit board, display device, and process for production of circuit board |
KR101951044B1 (ko) * | 2011-08-04 | 2019-02-21 | 동우 화인켐 주식회사 | 액정표시장치용 어레이 기판의 제조방법 |
TWI467724B (zh) * | 2012-05-30 | 2015-01-01 | Innocom Tech Shenzhen Co Ltd | 應用於面板的導電結構及其製造方法 |
JP2014032999A (ja) | 2012-08-01 | 2014-02-20 | Panasonic Liquid Crystal Display Co Ltd | 薄膜トランジスタ及びその製造方法 |
KR20140060679A (ko) * | 2012-11-12 | 2014-05-21 | 동우 화인켐 주식회사 | 액정표시장치용 어레이 기판의 제조방법 |
CN103924244A (zh) * | 2013-01-14 | 2014-07-16 | 易安爱富科技有限公司 | 铜/钼膜或铜/钼合金膜的蚀刻液组合物 |
CN104280916A (zh) * | 2013-07-03 | 2015-01-14 | 东友精细化工有限公司 | 制造液晶显示器用阵列基板的方法 |
KR102169571B1 (ko) * | 2014-03-31 | 2020-10-23 | 동우 화인켐 주식회사 | 액정표시장치용 어레이 기판의 제조방법 |
JP6312317B2 (ja) * | 2014-07-29 | 2018-04-18 | 株式会社Adeka | マスクブランクス除去用組成物及びマスクブランクスの除去方法 |
KR102240456B1 (ko) * | 2014-07-30 | 2021-04-15 | 에스케이하이닉스 주식회사 | 광학적 관통 비아를 가지는 반도체 소자 |
KR102331036B1 (ko) | 2014-10-10 | 2021-11-26 | 삼영순화(주) | 에칭액 조성물 및 이를 이용하는 다층막의 에칭 방법 |
US9576984B1 (en) * | 2016-01-14 | 2017-02-21 | Hon Hai Precision Industry Co., Ltd. | Thin film transistor array panel and conducting structure |
JP6190920B2 (ja) * | 2016-06-08 | 2017-08-30 | パナソニック液晶ディスプレイ株式会社 | 薄膜トランジスタ |
CN106549021B (zh) | 2016-12-02 | 2018-10-09 | 京东方科技集团股份有限公司 | 柔性显示基板、柔性显示装置及其修复方法 |
CN106653772B (zh) * | 2016-12-30 | 2019-10-01 | 惠科股份有限公司 | 一种显示面板及制程 |
KR20190027019A (ko) * | 2017-09-04 | 2019-03-14 | 삼성디스플레이 주식회사 | 식각액 조성물 및 이를 이용한 금속 패턴과 박막 트랜지스터 기판 제조 방법 |
CN108149247A (zh) * | 2017-12-04 | 2018-06-12 | 佛山杰致信息科技有限公司 | 一种薄膜晶体管用蚀刻液的制备方法 |
CN114164003A (zh) * | 2021-12-06 | 2022-03-11 | Tcl华星光电技术有限公司 | 用于显示面板的蚀刻剂组合物及显示面板的蚀刻方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3387529B2 (ja) | 1992-10-06 | 2003-03-17 | 朝日化学工業株式会社 | 銅および銅合金の化学溶解液 |
JP3225470B2 (ja) | 1992-12-15 | 2001-11-05 | 旭電化工業株式会社 | 銅の化学溶解剤 |
JP3535755B2 (ja) * | 1997-12-25 | 2004-06-07 | キヤノン株式会社 | エッチング方法 |
US6630433B2 (en) * | 1999-07-19 | 2003-10-07 | Honeywell International Inc. | Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
US6171910B1 (en) * | 1999-07-21 | 2001-01-09 | Motorola Inc. | Method for forming a semiconductor device |
JP2001223365A (ja) * | 2000-02-10 | 2001-08-17 | Fujitsu Ltd | 薄膜トランジスタ及びその製造方法 |
JP3768402B2 (ja) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
JP2002231666A (ja) | 2001-01-31 | 2002-08-16 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
JP4224221B2 (ja) * | 2001-03-07 | 2009-02-12 | 日立化成工業株式会社 | 導体用研磨液及びこれを用いた研磨方法 |
SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
KR100459271B1 (ko) | 2002-04-26 | 2004-12-03 | 엘지.필립스 엘시디 주식회사 | 구리 단일막 또는 구리 몰리브덴막의 식각용액 및 그식각방법 |
KR100505328B1 (ko) * | 2002-12-12 | 2005-07-29 | 엘지.필립스 엘시디 주식회사 | 구리 몰리브덴막에서 몰리브덴 잔사를 제거할 수 있는식각용액 및 그 식각 방법 |
KR100960687B1 (ko) * | 2003-06-24 | 2010-06-01 | 엘지디스플레이 주식회사 | 구리(또는 구리합금층)를 포함하는 이중금속층을 일괄식각하기위한 식각액 |
TWI282377B (en) * | 2003-07-25 | 2007-06-11 | Mec Co Ltd | Etchant, replenishment solution and method for producing copper wiring using the same |
US7984526B2 (en) * | 2003-08-08 | 2011-07-26 | Entegris, Inc. | Methods and materials for making a monolithic porous pad cast onto a rotatable base |
JP4431860B2 (ja) * | 2003-10-30 | 2010-03-17 | 三菱瓦斯化学株式会社 | 銅および銅合金の表面処理剤 |
TWI258048B (en) * | 2004-06-15 | 2006-07-11 | Taiwan Tft Lcd Ass | Structure of TFT electrode for preventing metal layer diffusion and manufacturing method thereof |
KR20060062913A (ko) * | 2004-12-06 | 2006-06-12 | 삼성전자주식회사 | 표시 장치용 배선과 상기 배선을 포함하는 박막트랜지스터 표시판 및 그 제조 방법 |
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JP4902299B2 (ja) * | 2006-09-11 | 2012-03-21 | 三星電子株式会社 | 表示装置の製造方法 |
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TWI390018B (zh) | 2013-03-21 |
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