JP5068723B2 - 化学的機械研磨システムのための可撓膜を有する支持ヘッド - Google Patents
化学的機械研磨システムのための可撓膜を有する支持ヘッド Download PDFInfo
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- JP5068723B2 JP5068723B2 JP2008258585A JP2008258585A JP5068723B2 JP 5068723 B2 JP5068723 B2 JP 5068723B2 JP 2008258585 A JP2008258585 A JP 2008258585A JP 2008258585 A JP2008258585 A JP 2008258585A JP 5068723 B2 JP5068723 B2 JP 5068723B2
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
Rodel,Inc.の商品名)。
Claims (2)
- 化学的機械研磨装置用の支持ヘッドであって、
ベースと、
前記ベースに連結されて第1チャンバと第2チャンバとを画成する可撓膜と、
を備え、
前記可撓膜の下面は、基板受容面を提供し、
前記可撓膜は第1の膜部と第2の膜部を備え、
前記第1の膜部は、上方延在部分と円状内側部分と環状外側部分を備え、
前記上方延在部分は、前記基板受容面から上方へ延び、
前記円状内側部分は、前記第1チャンバに連結されて、前記基板受容面上の基板の中央部を押圧するように構成され、
前記環状外側部分は、前記円状内側部分と前記上方延在部分の間に位置し、前記第2チャンバに連結されて、前記基板の縁部を押圧するように構成され、
前記第2の膜部は、前記円状内側部分と前記環状外側部分との間にある前記第1の膜部に連結されて、前記第1のチャンバを画成する、
化学的機械研磨装置用の支持ヘッド。 - 支持ヘッドのベースに連結されて、第1チャンバと第2チャンバを画定する可撓膜であって、
基板受容面を提供する下面と、
上方延在部分と円状内側部分と環状外側部分とを備える第1の膜部と、を具備し
前記上方延在部分は、前記基板受容面から上方へ延び、
前記円状内側部分は、前記第1チャンバに連結されて、前記基板受容面上の基板の中央部を押圧するように構成され、
前記環状外側部分は、前記円状内側部分と前記上方延在部分の間に位置し、前記第2チャンバに連結されて、前記基板の縁部を押圧するように構成され、
前記円状内側部分と前記環状外側部分との間にある前記第1の膜部に連結されて、前記第1のチャンバを画成する、第2の膜部を更に具備する、
可撓膜。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74567996A | 1996-11-08 | 1996-11-08 | |
US08/745679 | 1997-05-21 | ||
US08/861,260 US6183354B1 (en) | 1996-11-08 | 1997-05-21 | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US08/861260 | 1997-05-21 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003028833A Division JP4233339B2 (ja) | 1996-11-08 | 2003-02-05 | 化学的機械研磨システムのための可撓膜を有する支持ヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009033197A JP2009033197A (ja) | 2009-02-12 |
JP5068723B2 true JP5068723B2 (ja) | 2012-11-07 |
Family
ID=24997773
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34566897A Expired - Fee Related JP3439970B2 (ja) | 1996-11-08 | 1997-11-10 | 化学的機械研磨システムのための可撓膜を有する支持ヘッド |
JP2003028833A Expired - Lifetime JP4233339B2 (ja) | 1996-11-08 | 2003-02-05 | 化学的機械研磨システムのための可撓膜を有する支持ヘッド |
JP2005234735A Expired - Fee Related JP4368341B2 (ja) | 1996-11-08 | 2005-08-12 | 化学機械研磨支持ヘッド用保持リング |
JP2007218692A Expired - Lifetime JP4940061B2 (ja) | 1996-11-08 | 2007-08-24 | 化学的機械研磨用の膜 |
JP2008258585A Expired - Lifetime JP5068723B2 (ja) | 1996-11-08 | 2008-10-03 | 化学的機械研磨システムのための可撓膜を有する支持ヘッド |
JP2008290041A Expired - Lifetime JP5216542B2 (ja) | 1996-11-08 | 2008-11-12 | 化学機械研磨ヘッド用保持リング |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34566897A Expired - Fee Related JP3439970B2 (ja) | 1996-11-08 | 1997-11-10 | 化学的機械研磨システムのための可撓膜を有する支持ヘッド |
JP2003028833A Expired - Lifetime JP4233339B2 (ja) | 1996-11-08 | 2003-02-05 | 化学的機械研磨システムのための可撓膜を有する支持ヘッド |
JP2005234735A Expired - Fee Related JP4368341B2 (ja) | 1996-11-08 | 2005-08-12 | 化学機械研磨支持ヘッド用保持リング |
JP2007218692A Expired - Lifetime JP4940061B2 (ja) | 1996-11-08 | 2007-08-24 | 化学的機械研磨用の膜 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008290041A Expired - Lifetime JP5216542B2 (ja) | 1996-11-08 | 2008-11-12 | 化学機械研磨ヘッド用保持リング |
Country Status (7)
Country | Link |
---|---|
US (5) | US6183354B1 (ja) |
EP (3) | EP1258317B1 (ja) |
JP (6) | JP3439970B2 (ja) |
KR (1) | KR100366425B1 (ja) |
DE (2) | DE69739521D1 (ja) |
SG (2) | SG87925A1 (ja) |
TW (1) | TW344694B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10384114B2 (en) | 2010-05-26 | 2019-08-20 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Training apparatus and system with musical feedback |
Families Citing this family (220)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US10384114B2 (en) | 2010-05-26 | 2019-08-20 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Training apparatus and system with musical feedback |
Also Published As
Publication number | Publication date |
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KR100366425B1 (ko) | 2003-02-19 |
EP1754571B1 (en) | 2009-07-29 |
JP3439970B2 (ja) | 2003-08-25 |
EP0841123B1 (en) | 2003-01-29 |
US7040971B2 (en) | 2006-05-09 |
EP1754571A1 (en) | 2007-02-21 |
JP5216542B2 (ja) | 2013-06-19 |
EP1258317A1 (en) | 2002-11-20 |
JP2009033197A (ja) | 2009-02-12 |
SG87925A1 (en) | 2002-04-16 |
TW344694B (en) | 1998-11-11 |
KR19980042123A (ko) | 1998-08-17 |
JP4368341B2 (ja) | 2009-11-18 |
EP0841123A1 (en) | 1998-05-13 |
JP2005328103A (ja) | 2005-11-24 |
JP2007335895A (ja) | 2007-12-27 |
JP2009065195A (ja) | 2009-03-26 |
US6857946B2 (en) | 2005-02-22 |
JP2003264162A (ja) | 2003-09-19 |
US20020086624A1 (en) | 2002-07-04 |
US6540594B2 (en) | 2003-04-01 |
JP4233339B2 (ja) | 2009-03-04 |
EP1258317B1 (en) | 2011-03-09 |
US6183354B1 (en) | 2001-02-06 |
SG70042A1 (en) | 2000-01-25 |
US20050037698A1 (en) | 2005-02-17 |
DE69739521D1 (de) | 2009-09-10 |
US20040033769A1 (en) | 2004-02-19 |
DE69740146D1 (de) | 2011-04-21 |
JP4940061B2 (ja) | 2012-05-30 |
JPH10180627A (ja) | 1998-07-07 |
US6386955B2 (en) | 2002-05-14 |
US20010000775A1 (en) | 2001-05-03 |
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