JP5010112B2 - プリプレグの製造法、積層板およびプリント配線板の製造法 - Google Patents

プリプレグの製造法、積層板およびプリント配線板の製造法 Download PDF

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Publication number
JP5010112B2
JP5010112B2 JP2005167622A JP2005167622A JP5010112B2 JP 5010112 B2 JP5010112 B2 JP 5010112B2 JP 2005167622 A JP2005167622 A JP 2005167622A JP 2005167622 A JP2005167622 A JP 2005167622A JP 5010112 B2 JP5010112 B2 JP 5010112B2
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JP
Japan
Prior art keywords
epoxy resin
prepreg
parts
volume
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005167622A
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English (en)
Japanese (ja)
Other versions
JP2006063315A (ja
Inventor
玄 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Kobe Electric Machinery Co Ltd
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP2005167622A priority Critical patent/JP5010112B2/ja
Priority to PCT/JP2005/013476 priority patent/WO2006011421A1/fr
Priority to TW094125302A priority patent/TW200611927A/zh
Publication of JP2006063315A publication Critical patent/JP2006063315A/ja
Application granted granted Critical
Publication of JP5010112B2 publication Critical patent/JP5010112B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2005167622A 2004-07-26 2005-06-08 プリプレグの製造法、積層板およびプリント配線板の製造法 Expired - Fee Related JP5010112B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005167622A JP5010112B2 (ja) 2004-07-26 2005-06-08 プリプレグの製造法、積層板およびプリント配線板の製造法
PCT/JP2005/013476 WO2006011421A1 (fr) 2004-07-26 2005-07-22 Préimprégné, son procédé de fabrication, feuille laminée et carte à circuit imprimé
TW094125302A TW200611927A (en) 2004-07-26 2005-07-26 Prepreg, method for producing the same, laminated sheet and printed circuit board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004216750 2004-07-26
JP2004216750 2004-07-26
JP2005167622A JP5010112B2 (ja) 2004-07-26 2005-06-08 プリプレグの製造法、積層板およびプリント配線板の製造法

Publications (2)

Publication Number Publication Date
JP2006063315A JP2006063315A (ja) 2006-03-09
JP5010112B2 true JP5010112B2 (ja) 2012-08-29

Family

ID=35786170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005167622A Expired - Fee Related JP5010112B2 (ja) 2004-07-26 2005-06-08 プリプレグの製造法、積層板およびプリント配線板の製造法

Country Status (3)

Country Link
JP (1) JP5010112B2 (fr)
TW (1) TW200611927A (fr)
WO (1) WO2006011421A1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4793277B2 (ja) * 2007-02-14 2011-10-12 新神戸電機株式会社 エポキシ樹脂ワニスの製造法、プリプレグの製造法、積層板および配線板の製造法
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP2009021468A (ja) * 2007-07-13 2009-01-29 Panasonic Corp 伝熱プリント配線板と、これに用いる伝熱プリプレグ及びその製造方法と、伝熱プリント配線板の製造方法
WO2010020753A2 (fr) 2008-08-18 2010-02-25 Semblant Limited Revêtement de polymère d'hydrocarbure halogéné
JP2010229368A (ja) * 2009-03-30 2010-10-14 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板
JP2011153265A (ja) * 2010-01-28 2011-08-11 Mitsubishi Electric Corp 樹脂組成物及び樹脂硬化物
KR20170078885A (ko) 2010-01-29 2017-07-07 닛뽄 가야쿠 가부시키가이샤 페놀 화합물, 에폭시 수지, 에폭시 수지 조성물, 프리프레그 및 그들의 경화물
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
JP5447355B2 (ja) * 2010-12-02 2014-03-19 新神戸電機株式会社 熱硬化性樹脂組成物の製造法、プリプレグおよび積層板の製造法
JP2012131899A (ja) * 2010-12-21 2012-07-12 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂シート、金属ベース回路基板、インバータ装置、及びパワー半導体装置
WO2012098735A1 (fr) * 2011-01-19 2012-07-26 日立化成工業株式会社 Composition de résine cristalline liquide, précurseur de matériau à dissipation de chaleur, et matériau à dissipation de chaleur
JP5885330B2 (ja) 2011-07-26 2016-03-15 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
CN103764713B (zh) * 2011-08-31 2016-08-24 日立化成株式会社 树脂组合物、树脂片、带金属箔的树脂片、树脂固化物片、结构体、以及动力用或光源用半导体装置
JP6086182B2 (ja) * 2012-03-12 2017-03-01 Tdk株式会社 樹脂組成物、並びにこれを用いた樹脂シート、積層板
JP2013185145A (ja) * 2012-03-12 2013-09-19 Tdk Corp エポキシ樹脂硬化物、並びにこれを用いた積層板
JP2013185144A (ja) * 2012-03-12 2013-09-19 Tdk Corp 樹脂硬化物、並びにこれを用いた樹脂シート、積層板
JP5942641B2 (ja) * 2012-07-02 2016-06-29 日立化成株式会社 樹脂シート及びその製造方法、樹脂シート硬化物、並びに放熱用部材
JP6081751B2 (ja) * 2012-09-13 2017-02-15 三菱化学株式会社 高熱伝導性樹脂組成物
JP6411010B2 (ja) * 2013-04-01 2018-10-24 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂組成物の製造方法、熱伝導材料前駆体、ｂステージシート、プリプレグ、熱伝導材料、積層板、金属基板及びプリント配線板
JP6671958B2 (ja) 2013-10-09 2020-03-25 日本化薬株式会社 フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
TWI716559B (zh) 2016-03-10 2021-01-21 日商電化股份有限公司 陶瓷樹脂複合體
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
JP2018021180A (ja) * 2017-06-26 2018-02-08 日立化成株式会社 エポキシ樹脂組成物、熱伝導材料前駆体、ｂステージシート、プリプレグ、熱伝導材料、積層板、金属基板及びプリント配線板
EP3722368B1 (fr) 2017-12-05 2021-10-13 Denka Company Limited Corps composite de résine céramique de nitrure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136298A (ja) * 1983-12-23 1985-07-19 松下電工株式会社 多層配線板
JPS6330520A (ja) * 1986-07-25 1988-02-09 Yuka Shell Epoxy Kk 積層板用エポキシ樹脂組成物
JPH0388394A (ja) * 1989-08-31 1991-04-12 Shin Kobe Electric Mach Co Ltd 多層印刷配線板
JPH0621593A (ja) * 1992-04-14 1994-01-28 Hitachi Chem Co Ltd 印刷配線用基板の製造方法
KR20020063258A (ko) * 2000-10-24 2002-08-01 미쓰이 가가쿠 가부시키가이샤 에폭시 수지 조성물 및 그 용도
JP2002249641A (ja) * 2001-02-23 2002-09-06 Matsushita Electric Works Ltd エポキシ樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ及び積層板
JP3912302B2 (ja) * 2003-03-19 2007-05-09 新神戸電機株式会社 エポキシ樹脂ワニスの製造法とプリプレグの製造法、積層板およびプリント配線板の製造法

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Publication number Publication date
JP2006063315A (ja) 2006-03-09
WO2006011421A1 (fr) 2006-02-02
TW200611927A (en) 2006-04-16

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