TW200611927A - Prepreg, method for producing the same, laminated sheet and printed circuit board - Google Patents

Prepreg, method for producing the same, laminated sheet and printed circuit board

Info

Publication number
TW200611927A
TW200611927A TW094125302A TW94125302A TW200611927A TW 200611927 A TW200611927 A TW 200611927A TW 094125302 A TW094125302 A TW 094125302A TW 94125302 A TW94125302 A TW 94125302A TW 200611927 A TW200611927 A TW 200611927A
Authority
TW
Taiwan
Prior art keywords
prepreg
epoxy resin
circuit board
printed circuit
laminated sheet
Prior art date
Application number
TW094125302A
Other languages
English (en)
Inventor
Makoto Ito
Original Assignee
Shin Kobe Electric Machinery
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery filed Critical Shin Kobe Electric Machinery
Publication of TW200611927A publication Critical patent/TW200611927A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW094125302A 2004-07-26 2005-07-26 Prepreg, method for producing the same, laminated sheet and printed circuit board TW200611927A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004216750 2004-07-26
JP2005167622A JP5010112B2 (ja) 2004-07-26 2005-06-08 プリプレグの製造法、積層板およびプリント配線板の製造法

Publications (1)

Publication Number Publication Date
TW200611927A true TW200611927A (en) 2006-04-16

Family

ID=35786170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125302A TW200611927A (en) 2004-07-26 2005-07-26 Prepreg, method for producing the same, laminated sheet and printed circuit board

Country Status (3)

Country Link
JP (1) JP5010112B2 (zh)
TW (1) TW200611927A (zh)
WO (1) WO2006011421A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4793277B2 (ja) * 2007-02-14 2011-10-12 新神戸電機株式会社 エポキシ樹脂ワニスの製造法、プリプレグの製造法、積層板および配線板の製造法
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP2009021468A (ja) * 2007-07-13 2009-01-29 Panasonic Corp 伝熱プリント配線板と、これに用いる伝熱プリプレグ及びその製造方法と、伝熱プリント配線板の製造方法
CN105744750B (zh) 2008-08-18 2019-06-18 赛姆布兰特有限公司 卤代烃聚合物涂层
JP2010229368A (ja) * 2009-03-30 2010-10-14 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板
JP2011153265A (ja) * 2010-01-28 2011-08-11 Mitsubishi Electric Corp 樹脂組成物及び樹脂硬化物
CN102741315B (zh) 2010-01-29 2014-12-03 日本化药株式会社 酚化合物、环氧树脂、环氧树脂组合物、预浸料及它们的固化物
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
JP5447355B2 (ja) * 2010-12-02 2014-03-19 新神戸電機株式会社 熱硬化性樹脂組成物の製造法、プリプレグおよび積層板の製造法
JP2012131899A (ja) * 2010-12-21 2012-07-12 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂シート、金属ベース回路基板、インバータ装置、及びパワー半導体装置
JP5962514B2 (ja) * 2011-01-19 2016-08-03 日立化成株式会社 液晶性樹脂組成物、放熱材料前駆体、ｂステージシート、プリプレグ、放熱材料、積層板、金属基板、プリント配線板、液晶性樹脂組成物の製造方法、放熱材料前駆体の製造方法及び放熱材料の製造方法
JP5885330B2 (ja) 2011-07-26 2016-03-15 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
CN103764713B (zh) * 2011-08-31 2016-08-24 日立化成株式会社 树脂组合物、树脂片、带金属箔的树脂片、树脂固化物片、结构体、以及动力用或光源用半导体装置
JP6086182B2 (ja) * 2012-03-12 2017-03-01 Tdk株式会社 樹脂組成物、並びにこれを用いた樹脂シート、積層板
JP2013185145A (ja) * 2012-03-12 2013-09-19 Tdk Corp エポキシ樹脂硬化物、並びにこれを用いた積層板
JP2013185144A (ja) * 2012-03-12 2013-09-19 Tdk Corp 樹脂硬化物、並びにこれを用いた樹脂シート、積層板
JP5942641B2 (ja) * 2012-07-02 2016-06-29 日立化成株式会社 樹脂シート及びその製造方法、樹脂シート硬化物、並びに放熱用部材
JP6081751B2 (ja) * 2012-09-13 2017-02-15 三菱化学株式会社 高熱伝導性樹脂組成物
JP6411010B2 (ja) * 2013-04-01 2018-10-24 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂組成物の製造方法、熱伝導材料前駆体、ｂステージシート、プリプレグ、熱伝導材料、積層板、金属基板及びプリント配線板
JP6671958B2 (ja) 2013-10-09 2020-03-25 日本化薬株式会社 フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
JP6861697B2 (ja) 2016-03-10 2021-04-21 デンカ株式会社 セラミックス樹脂複合体
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
JP2018021180A (ja) * 2017-06-26 2018-02-08 日立化成株式会社 エポキシ樹脂組成物、熱伝導材料前駆体、ｂステージシート、プリプレグ、熱伝導材料、積層板、金属基板及びプリント配線板
EP3722368B1 (en) 2017-12-05 2021-10-13 Denka Company Limited Nitride ceramic resin composite body

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136298A (ja) * 1983-12-23 1985-07-19 松下電工株式会社 多層配線板
JPS6330520A (ja) * 1986-07-25 1988-02-09 Yuka Shell Epoxy Kk 積層板用エポキシ樹脂組成物
JPH0388394A (ja) * 1989-08-31 1991-04-12 Shin Kobe Electric Mach Co Ltd 多層印刷配線板
JPH0621593A (ja) * 1992-04-14 1994-01-28 Hitachi Chem Co Ltd 印刷配線用基板の製造方法
KR20020063258A (ko) * 2000-10-24 2002-08-01 미쓰이 가가쿠 가부시키가이샤 에폭시 수지 조성물 및 그 용도
JP2002249641A (ja) * 2001-02-23 2002-09-06 Matsushita Electric Works Ltd エポキシ樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ及び積層板
JP3912302B2 (ja) * 2003-03-19 2007-05-09 新神戸電機株式会社 エポキシ樹脂ワニスの製造法とプリプレグの製造法、積層板およびプリント配線板の製造法

Also Published As

Publication number Publication date
JP2006063315A (ja) 2006-03-09
WO2006011421A1 (ja) 2006-02-02
JP5010112B2 (ja) 2012-08-29

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