JP4989085B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP4989085B2 JP4989085B2 JP2006048374A JP2006048374A JP4989085B2 JP 4989085 B2 JP4989085 B2 JP 4989085B2 JP 2006048374 A JP2006048374 A JP 2006048374A JP 2006048374 A JP2006048374 A JP 2006048374A JP 4989085 B2 JP4989085 B2 JP 4989085B2
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- 239000004065 semiconductor Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 145
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 230000015556 catabolic process Effects 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 21
- 239000010703 silicon Substances 0.000 description 21
- 229920002120 photoresistant polymer Polymers 0.000 description 20
- 239000011229 interlayer Substances 0.000 description 13
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 9
- 229910052796 boron Inorganic materials 0.000 description 9
- 238000005468 ion implantation Methods 0.000 description 8
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 108091006146 Channels Proteins 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 2
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
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- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0856—Source regions
- H01L29/086—Impurity concentration or distribution
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0886—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Description
3 埋め込みシリコン層 4 LOCOS膜 5 ゲート電極
6 第1のドリフト層 7 ソース層 8 N+層
9 第2のドリフト層 10 低濃度ソース層 11 チャネル不純物層
12 ドレイン層 13 第1の層間絶縁膜 14 ドレイン電極
15 ソース電極 16 第2の層間絶縁膜
17 フィールドプレート 20 ダミー酸化膜
21,23,24,25,26,27 ホトレジスト層
21A ホトレジスト片 22 ゲート酸化膜
CH1,CH2 コンタクトホール
OF オフセット長 R 凹部 SL スリット
Claims (9)
- 第1導電型の半導体層上にフィールド絶縁膜を介して形成されたゲート電極と、第2導電型の第1のドリフト層と、前記ゲート電極を間に挟んで前記第1のドリフト層と対向して配置されたソース層と、前記第1のドリフト層より深く前記半導体層中に拡散され、前記第1のドリフト層の下方からフィールド絶縁膜の下方へ延びる第2導電型の第2のドリフト層とを備え、前記フィールド絶縁膜の端部の下方の前記第2のドリフト層の下部に凹部が形成されていることを特徴とする半導体装置。
- 前記ゲート電極の一部上から前記第1のドリフト層の一部上に延びるフィールドプレートを備えることを特徴とする請求項1に記載の半導体装置。
- 前記フィールドプレートは第2層金属層からなることを特徴とする請求項2に記載の半導体装置。
- 第1のドリフト層は前記フィールド絶縁膜の端から離れて配置されていることを特徴とする請求項1に記載の半導体装置。
- 前記フィールド絶縁膜の下部に接して前記半導体層より高濃度の第1導電型のチャネル不純物層が形成されていることを特徴とする請求項1、2、3、4のいずれかに記載の半導体装置。
- 前記第1のドリフト層及び前記第2のドリフト層と接触したドレイン層を備えることを特徴とする請求項1、2、3、4、5のいずれかに記載の半導体装置。
- 前記半導体層は、第2導電型の単結晶半導体基板上にエピタキシャル成長されたエピタキシャル半導体層であり、前記単結晶半導体基板と前記半導体層の界面に前記半導体層より高濃度の第1導電型の埋め込み半導体層が形成されていることを特徴とする請求項1、2、3、4、5、6のいずれかに記載の半導体装置。
- 第1導電型の半導体層上にスリットを有する第2導電型の第2のドリフト層を形成する工程と、前記半導体層の表面にその端部が前記スリットに入るように、選択酸化法によりフィールド絶縁膜を形成する工程と、前記フィールド絶縁膜上にゲート絶縁膜を形成する工程と、前記第2のドリフト層を熱拡散することにより、前記第2のドリフト層の下方に前記スリットに対応した凹部を形成する工程と、前記第2のドリフト層の表面に第1のドリフト層を形成する工程と、前記ゲート電極を間に挟んで前記第1のドリフト層と対向する第2導電型のソース層を形成する工程を備えることを特徴とする半導体装置の製造方法。
- 前記フィールド絶縁膜の下部に接して前記半導体層より高濃度の第1導電型のチャネル層を形成する工程を備えることを特徴とする請求項8に記載の半導体装置の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006048374A JP4989085B2 (ja) | 2006-02-24 | 2006-02-24 | 半導体装置及びその製造方法 |
TW096103838A TWI329362B (en) | 2006-02-24 | 2007-02-02 | Semiconductor device and manufacturing method thereof |
CN2007100849579A CN101026192B (zh) | 2006-02-24 | 2007-02-17 | 半导体装置及其制造方法 |
US11/708,685 US7705399B2 (en) | 2006-02-24 | 2007-02-21 | Semiconductor device with field insulation film formed therein |
EP07003779A EP1826824B1 (en) | 2006-02-24 | 2007-02-23 | Semiconductor device and method of manufacturing the same |
KR1020070018330A KR100813390B1 (ko) | 2006-02-24 | 2007-02-23 | 반도체 장치 및 그 제조 방법 |
DE602007009885T DE602007009885D1 (de) | 2006-02-24 | 2007-02-23 | Halbleiteranordnung und Verfahren zu deren Herstellung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006048374A JP4989085B2 (ja) | 2006-02-24 | 2006-02-24 | 半導体装置及びその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009105942A Division JP2009164651A (ja) | 2009-04-24 | 2009-04-24 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2007227747A JP2007227747A (ja) | 2007-09-06 |
JP4989085B2 true JP4989085B2 (ja) | 2012-08-01 |
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JP2006048374A Active JP4989085B2 (ja) | 2006-02-24 | 2006-02-24 | 半導体装置及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7705399B2 (ja) |
EP (1) | EP1826824B1 (ja) |
JP (1) | JP4989085B2 (ja) |
KR (1) | KR100813390B1 (ja) |
CN (1) | CN101026192B (ja) |
DE (1) | DE602007009885D1 (ja) |
TW (1) | TWI329362B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5307973B2 (ja) * | 2006-02-24 | 2013-10-02 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置 |
JP4989085B2 (ja) | 2006-02-24 | 2012-08-01 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
KR100858924B1 (ko) * | 2006-11-13 | 2008-09-17 | 고려대학교 산학협력단 | 액화천연가스의 수증기 개질반응에 의한 수소가스 제조용담지 촉매, 그 제조방법 및 상기 담지 촉매를 이용한수소가스 제조방법 |
JP2010010408A (ja) * | 2008-06-27 | 2010-01-14 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
US11088031B2 (en) | 2014-11-19 | 2021-08-10 | Key Foundry Co., Ltd. | Semiconductor and method of fabricating the same |
US10224407B2 (en) | 2017-02-28 | 2019-03-05 | Sandisk Technologies Llc | High voltage field effect transistor with laterally extended gate dielectric and method of making thereof |
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US7148540B2 (en) * | 2004-06-28 | 2006-12-12 | Agere Systems Inc. | Graded conductive structure for use in a metal-oxide-semiconductor device |
DE102004036387B4 (de) * | 2004-07-27 | 2018-05-03 | Robert Bosch Gmbh | Hochvolt-MOS-Transistor und entsprechendes Herstellungsverfahren |
JP4972855B2 (ja) * | 2004-08-04 | 2012-07-11 | 富士電機株式会社 | 半導体装置およびその製造方法 |
WO2008027027A2 (en) * | 2005-09-07 | 2008-03-06 | Cree, Inc | Transistor with fluorine treatment |
JP4989085B2 (ja) | 2006-02-24 | 2012-08-01 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
JP5307973B2 (ja) * | 2006-02-24 | 2013-10-02 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置 |
US7618866B2 (en) * | 2006-06-09 | 2009-11-17 | International Business Machines Corporation | Structure and method to form multilayer embedded stressors |
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2006
- 2006-02-24 JP JP2006048374A patent/JP4989085B2/ja active Active
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- 2007-02-21 US US11/708,685 patent/US7705399B2/en active Active
- 2007-02-23 EP EP07003779A patent/EP1826824B1/en not_active Expired - Fee Related
- 2007-02-23 KR KR1020070018330A patent/KR100813390B1/ko not_active IP Right Cessation
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TWI329362B (en) | 2010-08-21 |
DE602007009885D1 (de) | 2010-12-02 |
CN101026192A (zh) | 2007-08-29 |
EP1826824A2 (en) | 2007-08-29 |
US7705399B2 (en) | 2010-04-27 |
CN101026192B (zh) | 2010-06-16 |
KR20070088376A (ko) | 2007-08-29 |
EP1826824B1 (en) | 2010-10-20 |
KR100813390B1 (ko) | 2008-03-12 |
EP1826824A3 (en) | 2008-11-19 |
TW200805653A (en) | 2008-01-16 |
JP2007227747A (ja) | 2007-09-06 |
US20070200171A1 (en) | 2007-08-30 |
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