JP4985116B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP4985116B2 JP4985116B2 JP2007150426A JP2007150426A JP4985116B2 JP 4985116 B2 JP4985116 B2 JP 4985116B2 JP 2007150426 A JP2007150426 A JP 2007150426A JP 2007150426 A JP2007150426 A JP 2007150426A JP 4985116 B2 JP4985116 B2 JP 4985116B2
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- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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Description
前記外囲樹脂ケースの周壁部にあらかじめ形成した端子取付穴に前記外部端子を前記金属ベース側から圧入して装着し、前記外部端子のL形脚部と金属ベースとの間の間隙に装填して外部端子を所定の装着位置に支持する絶縁物製の端子押え枠を設けて組み立てるものとし(請求項1)、具体的には次記のような態様で構成する。
(1)前記の外囲樹脂ケースを各機種の共通部品として、このケースに装着する外部端子の配列位置を機種,およびユーザー指定の仕様に対応して柔軟に変更できるようにするために、外囲樹脂ケースの周壁部に形成した端子取付穴を、あらかじめ機種,仕様によって異なる端子配列にすべて対応するよう割り付けて形成する(請求項2)。
(2)また、外囲樹脂ケースの周壁部から上方に引出した外部端子相互間の絶縁沿面距離を稼ぐために、外囲樹脂ケースの周壁部上面には、端子取付穴の配列ピッチに対応する凹凸状段部を形成する(請求項3)。
(3)一方、外囲樹脂ケースの端子取付穴に圧入装着した外部端子をガタツキなく強固に保持するために、外部端子の圧入部位にガタ防止用のサポート凸部を形成して端子取付穴へ圧入するようにする(請求項4)。
(4)さらに、前項(3)と同様な外部端子のガタツキ防止策として、外囲樹脂ケースに装着した外部端子のL形脚部と金属ベースとの間の間隙に装填して外部端子を所定の装着位置に支持する絶縁物製の端子押え枠を設ける(請求項5)。
(5)また、前項(4)の端子支持構造において、外囲樹脂ケースに装着した外部端子の脚部を端子押え枠で所定位置に安定よく押さえ込み支持させるために、端子押え枠の上面には、外部端子の脚部を左右から挟んで嵌合保持するように凸状の隔壁部を外囲樹脂ケースの端子取付穴の配列ピッチに対応して形成する(請求項6)。
(6)さらに、外部端子の脚部と端子押え枠との間を接着剤で強固に結合させるようにし(請求項7)、ここでワイヤ接続の際にボンディングツールより外部端子に加わる超音波振動が前記接着剤層に吸収されて減衰するのを防ぐために、接着剤としてエポキシ系接着剤,アクリル系接着剤,ウレタン系接着剤,あるいはシリコーン接着剤で接着するようにする(請求項8)。
(7)また、前項(4)の端子押え枠については、該端子押え枠の外周面に圧入突起を分散形成しておき、外囲樹脂ケースの内周へ装填した際に強固に圧入支持させるようにする(請求項9)。
2 絶縁回路基板
3 半導体チップ
5 外囲樹脂ケース
5a 端子取付穴
5b 凹凸状段部
5b−1 溝部
6 外部端子
6a L形脚部
6b サポート凸部
7 ボンディングワイヤ
10 端子押え枠
10a 圧入突起
10b 凸状隔壁
11,12 接着剤
Claims (9)
- 半導体チップと、半導体チップをマウントした絶縁回路基板と、放熱用金属ベースとの積層組立体に外囲樹脂ケースを組合せ、該外囲樹脂ケースの周壁に配列して設けた外部端子の脚部をケース内側に引き出した上で、該端子脚部と前記絶縁回路基板の導体パターンまたは半導体チップとの間にボンディングワイヤを配線した半導体装置において、
前記外囲樹脂ケースの周壁部にあらかじめ形成した端子取付穴に前記外部端子を前記金属ベース側から圧入して装着し、前記外部端子のL形脚部と金属ベースとの間の間隙に装填して外部端子を所定の装着位置に支持する絶縁物製の端子押え枠を設けたことを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、外囲樹脂ケースの周壁部に形成した端子取付穴を、製品の機種,仕様によって異なる端子配列にすべて対応するよう割り付けて形成したことを特徴とする半導体装置。
- 請求項2に記載の半導体装置において、外囲樹脂ケースの周壁部上面に、端子取付穴の配列ピッチに対応する凹凸状段部を形成したことを特徴とする半導体装置。
- 請求項1に記載の半導体装置において、外部端子の圧入部位にガタ防止用のサポート凸部を形成したことを特徴とする半導体装置。
- 請求項1に記載の半導体装置において、外囲樹脂ケースに形成した端子取付穴の配列ピッチに対応して、端子押え枠の上面には外部端子の脚部を左右から挟んで嵌合保持する凸状の隔壁部を形成したことを特徴とする半導体装置。
- 請求項1に記載の半導体装置において、外部端子の脚部と端子押え枠との間を接着剤で結合したことを特徴とする半導体装置。
- 請求項6に記載の半導体装置において、外部端子の脚部と端子押え枠との間を接合する接着剤が、エポキシ系接着剤,アクリル系接着剤,ウレタン系接着剤,シリコーン接着剤のいずれかであることを特徴とする半導体装置。
- 請求項1に記載の半導体装置において、端子押え枠の外周面に圧入突起を分散形成して外囲樹脂ケースの内周に圧入支持したことを特徴とする半導体装置。
- 半導体チップと、半導体チップをマウントした絶縁回路基板と、放熱用金属ベースとの積層組立体に外囲樹脂ケースを組合せ、該外囲樹脂ケースの周壁部に配列して設けた外部端子の脚部をケース内側に引き出した上で、外部端子の脚部と前記絶縁回路基板の導体パターンまたは半導体チップとの間にボンディングワイヤを配線した半導体装置の製造方法であって、
外囲樹脂ケースの成形工程で、そのケース周壁部には機種,仕様によって異なる端子配列にすべてに対応するよう割り付けた端子取付穴を形成しておき、続くパッケージ組立工程では、指定の端子配列に対応する端子取付穴を選択してここに外部端子を前記金属ベース側から圧入装着し、前記外部端子のL形脚部と金属ベースとの間の間隙に装填して外部端子を所定の装着位置に支持する絶縁物製の端子押え枠を設けた上で、該外部端子の脚部と外囲樹脂ケース内に収容した絶縁回路基板または半導体チップとの間にボンディングワイヤを接続することを特徴とする半導体装置の製造方法。
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