JP4973186B2 - 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料 - Google Patents

金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料 Download PDF

Info

Publication number
JP4973186B2
JP4973186B2 JP2006510967A JP2006510967A JP4973186B2 JP 4973186 B2 JP4973186 B2 JP 4973186B2 JP 2006510967 A JP2006510967 A JP 2006510967A JP 2006510967 A JP2006510967 A JP 2006510967A JP 4973186 B2 JP4973186 B2 JP 4973186B2
Authority
JP
Japan
Prior art keywords
metal
fine particle
fine particles
particle dispersion
dispersant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006510967A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2005088652A1 (ja
Inventor
英之 平社
啓介 阿部
恭宏 真田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP2006510967A priority Critical patent/JP4973186B2/ja
Publication of JPWO2005088652A1 publication Critical patent/JPWO2005088652A1/ja
Application granted granted Critical
Publication of JP4973186B2 publication Critical patent/JP4973186B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/142—Thermal or thermo-mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • C09D17/004—Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
    • C09D17/006—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Colloid Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
JP2006510967A 2004-03-10 2005-03-09 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料 Expired - Lifetime JP4973186B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006510967A JP4973186B2 (ja) 2004-03-10 2005-03-09 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004068065 2004-03-10
JP2004068065 2004-03-10
PCT/JP2005/004119 WO2005088652A1 (ja) 2004-03-10 2005-03-09 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料
JP2006510967A JP4973186B2 (ja) 2004-03-10 2005-03-09 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料

Publications (2)

Publication Number Publication Date
JPWO2005088652A1 JPWO2005088652A1 (ja) 2008-01-31
JP4973186B2 true JP4973186B2 (ja) 2012-07-11

Family

ID=34975837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006510967A Expired - Lifetime JP4973186B2 (ja) 2004-03-10 2005-03-09 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料

Country Status (9)

Country Link
US (1) US7390440B2 (https=)
EP (1) EP1724789B1 (https=)
JP (1) JP4973186B2 (https=)
CN (1) CN1930638B (https=)
AT (1) ATE492888T1 (https=)
CA (1) CA2554371A1 (https=)
DE (1) DE602005025454D1 (https=)
TW (1) TW200533784A (https=)
WO (1) WO2005088652A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101085265B1 (ko) * 2004-06-16 2011-11-22 도호 티타늄 가부시키가이샤 니켈 분말 및 그 제조 방법
JP5170989B2 (ja) * 2006-07-07 2013-03-27 株式会社日本触媒 導電性銅被膜の製造方法
CN101495580A (zh) * 2006-07-28 2009-07-29 旭硝子株式会社 含金属微粒的分散液、其制造方法及具有金属膜的物品
US7968008B2 (en) * 2006-08-03 2011-06-28 Fry's Metals, Inc. Particles and inks and films using them
JP5098098B2 (ja) * 2006-09-29 2012-12-12 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
US7919015B2 (en) 2006-10-05 2011-04-05 Xerox Corporation Silver-containing nanoparticles with replacement stabilizer
JP5365006B2 (ja) * 2007-01-19 2013-12-11 三菱マテリアル株式会社 金属膜形成方法
US8048488B2 (en) * 2008-01-14 2011-11-01 Xerox Corporation Methods for removing a stabilizer from a metal nanoparticle using a destabilizer
JP5234252B2 (ja) * 2008-03-28 2013-07-10 古河電気工業株式会社 銅微粒子分散溶液の製造方法
DE102009015470A1 (de) 2008-12-12 2010-06-17 Byk-Chemie Gmbh Verfahren zur Herstellung von Metallnanopartikeln und auf diese Weise erhaltene Metallnanopartikel und ihre Verwendung
US8834965B2 (en) * 2009-02-12 2014-09-16 Xerox Corporation Organoamine stabilized silver nanoparticles and process for producing same
JP5387034B2 (ja) * 2009-02-20 2014-01-15 大日本印刷株式会社 導電性基板
JPWO2010101028A1 (ja) * 2009-03-02 2012-09-06 東レ株式会社 網目状金属微粒子積層フィルム及びその製造方法
JP5606439B2 (ja) * 2009-06-16 2014-10-15 バンドー化学株式会社 導電性インク及びこれを用いた導電性被膜付基材の製造方法
JP5696999B2 (ja) * 2010-05-31 2015-04-08 独立行政法人物質・材料研究機構 金属ナノ粒子コロイドの製造方法
EP2468826A1 (de) * 2010-12-21 2012-06-27 Bayer MaterialScience AG Pickering-Emulsion zur Herstellung elektrisch leitfähiger Beschichtungen und Verfahren zur Herstellung einer Pickering-Emulsion
JP5790433B2 (ja) * 2011-11-18 2015-10-07 住友金属鉱山株式会社 銀粉及びその製造方法
JP5960568B2 (ja) * 2012-10-01 2016-08-02 Ｄｏｗａエレクトロニクス株式会社 銀微粒子の製造方法
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
EP3061547B1 (en) * 2013-10-24 2019-12-04 Daicel Corporation Method for producing dispersion liquid containing silver nanoparticles, and dispersion liquid containing silver nanoparticles
JP6404614B2 (ja) * 2014-06-25 2018-10-10 古河機械金属株式会社 コアシェル型金属微粒子の製造方法、コアシェル型金属微粒子、導電性インクおよび基板の製造方法
JP2019085432A (ja) * 2017-11-01 2019-06-06 日野自動車株式会社 潤滑油用摩擦調整剤および潤滑油組成物

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226316A (ja) * 1994-02-14 1995-08-22 Toyohisa Fujita 磁性エレクトロレオロジー流体及びその製造方法
US5792514A (en) * 1994-12-23 1998-08-11 Roehm Gmbh Chemische Fabrik Method for the production of coatings
EP0914244A1 (en) * 1995-12-28 1999-05-12 James R. Heath Organically-functionalized monodisperse nanocrystals of metals
JP2794009B2 (ja) * 1996-01-29 1998-09-03 富士ゼロックス株式会社 電気接続用異方導電性粒子の製造方法および電気接続用異方導電材料の製造方法
JP3205793B2 (ja) * 1996-12-19 2001-09-04 株式会社巴製作所 超微粒子及びその製造方法
US6103868A (en) * 1996-12-27 2000-08-15 The Regents Of The University Of California Organically-functionalized monodisperse nanocrystals of metals
JP3402214B2 (ja) * 1998-09-14 2003-05-06 三菱マテリアル株式会社 金属微粒子分散液の製造方法
WO2000076699A1 (fr) * 1999-06-15 2000-12-21 Kimoto, Masaaki Poudre metallique composite ultrafine et procede de production de ladite poudre
US6589312B1 (en) * 1999-09-01 2003-07-08 David G. Snow Nanoparticles for hydrogen storage, transportation, and distribution
JP2004510678A (ja) * 2000-10-04 2004-04-08 ザ　ボード　オブ　トラスティーズ　オブ　ザ　ユニバーシティ　オブ　アーカンソー コロイドナノ結晶の合成
KR100647238B1 (ko) * 2000-10-25 2006-11-17 하리마카세이 가부시기가이샤 도전성 금속 페이스트 및 그 제조 방법
JP3942816B2 (ja) 2000-10-25 2007-07-11 ハリマ化成株式会社 金属間のロウ付け接合方法
JP2002317215A (ja) * 2001-04-19 2002-10-31 Mitsuboshi Belting Ltd 金属微粒子の製造方法
JP3774638B2 (ja) 2001-04-24 2006-05-17 ハリマ化成株式会社 インクジェット印刷法を利用する回路パターンの形成方法
JP3764349B2 (ja) 2001-05-07 2006-04-05 ハリマ化成株式会社 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法
JP4834848B2 (ja) * 2001-05-30 2011-12-14 Ｄｏｗａエレクトロニクス株式会社 低温焼成用銅粉または導電ペースト用銅粉
CA2451141A1 (en) * 2001-06-20 2003-10-16 Nanophase Technologies Corporation Non-aqueous dispersion of nanocrytalline metal oxides
JP4234355B2 (ja) * 2001-06-28 2009-03-04 大日精化工業株式会社 微細化顔料の製造方法および着色用組成物
US6645444B2 (en) * 2001-06-29 2003-11-11 Nanospin Solutions Metal nanocrystals and synthesis thereof
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
JP3911557B2 (ja) * 2001-12-07 2007-05-09 独立行政法人産業技術総合研究所 金属超微粒子を担持した多孔質材料の作製方法
JP2003187640A (ja) * 2001-12-18 2003-07-04 Bando Chem Ind Ltd 金属コロイド液及び導電性被膜
JP2004018891A (ja) * 2002-06-13 2004-01-22 Sumitomo Metal Mining Co Ltd 銀微粒子コロイド分散液の製造方法
JP2004051997A (ja) * 2002-07-16 2004-02-19 Ulvac Japan Ltd 金属微粒子分散液及びその調製方法、並びに透明着色膜及びその作製方法
JP4248857B2 (ja) * 2002-11-29 2009-04-02 三ツ星ベルト株式会社 銀微粒子の製造方法
CN100344528C (zh) 2003-06-10 2007-10-24 旭硝子株式会社 金属氢化物微粒及其制造方法、含有金属氢化物微粒的分散液和金属质材料
JP2005081501A (ja) * 2003-09-09 2005-03-31 Ulvac Japan Ltd 金属ナノ粒子及びその製造方法、金属ナノ粒子分散液及びその製造方法、並びに金属細線及び金属膜及びその形成方法
US7160525B1 (en) * 2003-10-14 2007-01-09 The Board Of Trustees Of The University Of Arkansas Monodisperse noble metal nanocrystals
US7850870B2 (en) * 2004-10-28 2010-12-14 Dow Corning Corporation Conductive curable compositions
US7771625B2 (en) * 2004-11-29 2010-08-10 Dainippon Ink And Chemicals, Inc. Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder

Also Published As

Publication number Publication date
CA2554371A1 (en) 2005-09-22
EP1724789B1 (en) 2010-12-22
EP1724789A1 (en) 2006-11-22
US20060266156A1 (en) 2006-11-30
US7390440B2 (en) 2008-06-24
TWI365923B (https=) 2012-06-11
DE602005025454D1 (de) 2011-02-03
CN1930638A (zh) 2007-03-14
JPWO2005088652A1 (ja) 2008-01-31
WO2005088652A1 (ja) 2005-09-22
CN1930638B (zh) 2010-09-22
ATE492888T1 (de) 2011-01-15
EP1724789A4 (en) 2009-04-08
TW200533784A (en) 2005-10-16

Similar Documents

Publication Publication Date Title
JP4973186B2 (ja) 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料
JP4496216B2 (ja) 導電性金属ペースト
CN107848077B (zh) 含金属微粒的组合物
JP5151476B2 (ja) インク組成物及び金属質材料
JP4747839B2 (ja) 金属水素化物微粒子を含有する分散液及びその製造方法、並びに金属質材料
JP3764349B2 (ja) 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法
JP2019527770A (ja) 金属ナノ粒子コロイド分散体の製造方法
TWI499679B (zh) 導電性膏用銅粉及導電性膏
CN105788756A (zh) 一种透明金属导电膜及其制备方法
WO2016080544A1 (ja) 金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体
WO2019142633A1 (ja) 接合用組成物
JPWO2015159480A1 (ja) 接合用組成物及びそれを用いた金属接合体
Hsiao et al. Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5 Ag-0.5 Cu nanoparticles by a chemical reduction method
JP2015163695A (ja) 超音波エアロゾル（ｕａ）のための低粘度および高保持量の銀ナノ粒子インク
KR101166001B1 (ko) 금속 함유 미립자, 금속 함유 미립자 분산액 및 도전성금속 함유 재료
JP4761110B2 (ja) 金属被膜とその形成方法
JP2005060816A (ja) 合金微粒子の製造方法及び合金薄膜の製造方法
JP2015056392A (ja) 導電性ペースト材料の製造と製造方法
WO2019065965A1 (ja) 導電性ペースト
KR100784762B1 (ko) 도전성 금속 페이스트
JP2005050764A (ja) 金属薄膜
JP2006124814A (ja) プリント配線板用金属箔の製造方法及びプリント配線板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110510

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110609

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110906

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110916

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120313

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120326

R151 Written notification of patent or utility model registration

Ref document number: 4973186

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150420

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250