DE602005025454D1 - Metallhaltiger feinpartikel, flüssigdispersion eines metallhaltigen feinpartikels und leitfähiges metallhaltiges material - Google Patents
Metallhaltiger feinpartikel, flüssigdispersion eines metallhaltigen feinpartikels und leitfähiges metallhaltiges materialInfo
- Publication number
- DE602005025454D1 DE602005025454D1 DE200560025454 DE602005025454T DE602005025454D1 DE 602005025454 D1 DE602005025454 D1 DE 602005025454D1 DE 200560025454 DE200560025454 DE 200560025454 DE 602005025454 T DE602005025454 T DE 602005025454T DE 602005025454 D1 DE602005025454 D1 DE 602005025454D1
- Authority
- DE
- Germany
- Prior art keywords
- metal
- containing fine
- fine particles
- fine particle
- liquid dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/142—Thermal or thermo-mechanical treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
- C09D17/004—Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
- C09D17/006—Metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Colloid Chemistry (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004068065 | 2004-03-10 | ||
PCT/JP2005/004119 WO2005088652A1 (ja) | 2004-03-10 | 2005-03-09 | 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005025454D1 true DE602005025454D1 (de) | 2011-02-03 |
Family
ID=34975837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200560025454 Active DE602005025454D1 (de) | 2004-03-10 | 2005-03-09 | Metallhaltiger feinpartikel, flüssigdispersion eines metallhaltigen feinpartikels und leitfähiges metallhaltiges material |
Country Status (9)
Country | Link |
---|---|
US (1) | US7390440B2 (de) |
EP (1) | EP1724789B1 (de) |
JP (1) | JP4973186B2 (de) |
CN (1) | CN1930638B (de) |
AT (1) | ATE492888T1 (de) |
CA (1) | CA2554371A1 (de) |
DE (1) | DE602005025454D1 (de) |
TW (1) | TW200533784A (de) |
WO (1) | WO2005088652A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1968773B (zh) * | 2004-06-16 | 2011-08-03 | 东邦钛株式会社 | 镍粉及其制备方法 |
JP5170989B2 (ja) * | 2006-07-07 | 2013-03-27 | 株式会社日本触媒 | 導電性銅被膜の製造方法 |
EP2048205A4 (de) * | 2006-07-28 | 2010-07-21 | Asahi Glass Co Ltd | Dispersion mit metallfeinteilchen, verfahren zur herstellung der dispersion sowie gegenstände mit metallfilmen |
US7968008B2 (en) * | 2006-08-03 | 2011-06-28 | Fry's Metals, Inc. | Particles and inks and films using them |
JP5098098B2 (ja) * | 2006-09-29 | 2012-12-12 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
US7919015B2 (en) | 2006-10-05 | 2011-04-05 | Xerox Corporation | Silver-containing nanoparticles with replacement stabilizer |
JP5365006B2 (ja) * | 2007-01-19 | 2013-12-11 | 三菱マテリアル株式会社 | 金属膜形成方法 |
US8048488B2 (en) * | 2008-01-14 | 2011-11-01 | Xerox Corporation | Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
JP5234252B2 (ja) * | 2008-03-28 | 2013-07-10 | 古河電気工業株式会社 | 銅微粒子分散溶液の製造方法 |
DE102009015470A1 (de) | 2008-12-12 | 2010-06-17 | Byk-Chemie Gmbh | Verfahren zur Herstellung von Metallnanopartikeln und auf diese Weise erhaltene Metallnanopartikel und ihre Verwendung |
US8834965B2 (en) * | 2009-02-12 | 2014-09-16 | Xerox Corporation | Organoamine stabilized silver nanoparticles and process for producing same |
JP5387034B2 (ja) * | 2009-02-20 | 2014-01-15 | 大日本印刷株式会社 | 導電性基板 |
US20110297436A1 (en) * | 2009-03-02 | 2011-12-08 | Toray Industries, Inc. | Net-like metal fine particle multilayer film and method for producing same |
WO2010146812A1 (ja) * | 2009-06-16 | 2010-12-23 | バンドー化学株式会社 | 導電性インク及びこれを用いた導電性被膜付基材の製造方法 |
US9017578B2 (en) * | 2010-05-31 | 2015-04-28 | National Institute For Materials Science | Method for producing a metal nanoparticle colloid |
EP2468826A1 (de) * | 2010-12-21 | 2012-06-27 | Bayer MaterialScience AG | Pickering-Emulsion zur Herstellung elektrisch leitfähiger Beschichtungen und Verfahren zur Herstellung einer Pickering-Emulsion |
JP5790433B2 (ja) * | 2011-11-18 | 2015-10-07 | 住友金属鉱山株式会社 | 銀粉及びその製造方法 |
JP5960568B2 (ja) * | 2012-10-01 | 2016-08-02 | Dowaエレクトロニクス株式会社 | 銀微粒子の製造方法 |
US20140097003A1 (en) * | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
EP3061547B1 (de) * | 2013-10-24 | 2019-12-04 | Daicel Corporation | Verfahren zur herstellung von dispersionsflüssigkeitshaltigen silbernanopartikeln und dispersionsflüssigkeitshaltige silbernanopartikel |
JP6404614B2 (ja) * | 2014-06-25 | 2018-10-10 | 古河機械金属株式会社 | コアシェル型金属微粒子の製造方法、コアシェル型金属微粒子、導電性インクおよび基板の製造方法 |
JP2019085432A (ja) * | 2017-11-01 | 2019-06-06 | 日野自動車株式会社 | 潤滑油用摩擦調整剤および潤滑油組成物 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07226316A (ja) * | 1994-02-14 | 1995-08-22 | Toyohisa Fujita | 磁性エレクトロレオロジー流体及びその製造方法 |
US5792514A (en) * | 1994-12-23 | 1998-08-11 | Roehm Gmbh Chemische Fabrik | Method for the production of coatings |
AU1743397A (en) * | 1995-12-28 | 1997-07-28 | James R. Heath | Organically-functionalized monodisperse nanocrystals of metals |
JP2794009B2 (ja) * | 1996-01-29 | 1998-09-03 | 富士ゼロックス株式会社 | 電気接続用異方導電性粒子の製造方法および電気接続用異方導電材料の製造方法 |
JP3205793B2 (ja) * | 1996-12-19 | 2001-09-04 | 株式会社巴製作所 | 超微粒子及びその製造方法 |
US6103868A (en) * | 1996-12-27 | 2000-08-15 | The Regents Of The University Of California | Organically-functionalized monodisperse nanocrystals of metals |
JP3402214B2 (ja) * | 1998-09-14 | 2003-05-06 | 三菱マテリアル株式会社 | 金属微粒子分散液の製造方法 |
JP4732645B2 (ja) * | 1999-06-15 | 2011-07-27 | 丸山 稔 | 金属複合超微粒子の製造方法 |
US6589312B1 (en) * | 1999-09-01 | 2003-07-08 | David G. Snow | Nanoparticles for hydrogen storage, transportation, and distribution |
WO2002029140A1 (en) * | 2000-10-04 | 2002-04-11 | The Board Of Trustees Of The University Of Arkansas | Synthesis of colloidal nanocrystals |
WO2002035554A1 (fr) * | 2000-10-25 | 2002-05-02 | Harima Chemicals, Inc. | Pate metallique electro-conductrice et procede de production de cette pate |
JP3942816B2 (ja) | 2000-10-25 | 2007-07-11 | ハリマ化成株式会社 | 金属間のロウ付け接合方法 |
JP2002317215A (ja) * | 2001-04-19 | 2002-10-31 | Mitsuboshi Belting Ltd | 金属微粒子の製造方法 |
JP3774638B2 (ja) | 2001-04-24 | 2006-05-17 | ハリマ化成株式会社 | インクジェット印刷法を利用する回路パターンの形成方法 |
JP3764349B2 (ja) | 2001-05-07 | 2006-04-05 | ハリマ化成株式会社 | 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法 |
JP4834848B2 (ja) * | 2001-05-30 | 2011-12-14 | Dowaエレクトロニクス株式会社 | 低温焼成用銅粉または導電ペースト用銅粉 |
JP2005519756A (ja) * | 2001-06-20 | 2005-07-07 | ナノフェイズ テクノロジーズ コーポレイション | ナノ結晶性金属酸化物の非水系分散体 |
JP4234355B2 (ja) * | 2001-06-28 | 2009-03-04 | 大日精化工業株式会社 | 微細化顔料の製造方法および着色用組成物 |
US6645444B2 (en) * | 2001-06-29 | 2003-11-11 | Nanospin Solutions | Metal nanocrystals and synthesis thereof |
US20030146019A1 (en) * | 2001-11-22 | 2003-08-07 | Hiroyuki Hirai | Board and ink used for forming conductive pattern, and method using thereof |
JP3911557B2 (ja) * | 2001-12-07 | 2007-05-09 | 独立行政法人産業技術総合研究所 | 金属超微粒子を担持した多孔質材料の作製方法 |
JP2003187640A (ja) * | 2001-12-18 | 2003-07-04 | Bando Chem Ind Ltd | 金属コロイド液及び導電性被膜 |
JP2004018891A (ja) * | 2002-06-13 | 2004-01-22 | Sumitomo Metal Mining Co Ltd | 銀微粒子コロイド分散液の製造方法 |
JP2004051997A (ja) * | 2002-07-16 | 2004-02-19 | Ulvac Japan Ltd | 金属微粒子分散液及びその調製方法、並びに透明着色膜及びその作製方法 |
JP4248857B2 (ja) * | 2002-11-29 | 2009-04-02 | 三ツ星ベルト株式会社 | 銀微粒子の製造方法 |
KR101093465B1 (ko) | 2003-06-10 | 2011-12-13 | 아사히 가라스 가부시키가이샤 | 금속 수소화물 미립자, 그 제조 방법, 금속 수소화물미립자를 함유하는 분산액 및 금속질 재료 |
JP2005081501A (ja) * | 2003-09-09 | 2005-03-31 | Ulvac Japan Ltd | 金属ナノ粒子及びその製造方法、金属ナノ粒子分散液及びその製造方法、並びに金属細線及び金属膜及びその形成方法 |
US7160525B1 (en) * | 2003-10-14 | 2007-01-09 | The Board Of Trustees Of The University Of Arkansas | Monodisperse noble metal nanocrystals |
US7850870B2 (en) * | 2004-10-28 | 2010-12-14 | Dow Corning Corporation | Conductive curable compositions |
EP1825940B1 (de) * | 2004-11-29 | 2012-06-13 | DIC Corporation | Verfahren zur herstellung von oberflächenbehandeltem silberhaltigem pulver |
-
2005
- 2005-03-09 JP JP2006510967A patent/JP4973186B2/ja active Active
- 2005-03-09 CA CA 2554371 patent/CA2554371A1/en not_active Abandoned
- 2005-03-09 CN CN2005800072992A patent/CN1930638B/zh not_active Expired - Fee Related
- 2005-03-09 AT AT05720390T patent/ATE492888T1/de not_active IP Right Cessation
- 2005-03-09 DE DE200560025454 patent/DE602005025454D1/de active Active
- 2005-03-09 EP EP20050720390 patent/EP1724789B1/de not_active Not-in-force
- 2005-03-09 WO PCT/JP2005/004119 patent/WO2005088652A1/ja not_active Application Discontinuation
- 2005-03-10 TW TW94107336A patent/TW200533784A/zh not_active IP Right Cessation
-
2006
- 2006-08-10 US US11/501,801 patent/US7390440B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI365923B (de) | 2012-06-11 |
WO2005088652A1 (ja) | 2005-09-22 |
ATE492888T1 (de) | 2011-01-15 |
CA2554371A1 (en) | 2005-09-22 |
TW200533784A (en) | 2005-10-16 |
EP1724789A1 (de) | 2006-11-22 |
JP4973186B2 (ja) | 2012-07-11 |
CN1930638A (zh) | 2007-03-14 |
EP1724789B1 (de) | 2010-12-22 |
EP1724789A4 (de) | 2009-04-08 |
CN1930638B (zh) | 2010-09-22 |
JPWO2005088652A1 (ja) | 2008-01-31 |
US20060266156A1 (en) | 2006-11-30 |
US7390440B2 (en) | 2008-06-24 |
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