CN1930638B - 含有金属的微粒、含有金属的微粒分散液及含有导电性金属的材料 - Google Patents

含有金属的微粒、含有金属的微粒分散液及含有导电性金属的材料 Download PDF

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Publication number
CN1930638B
CN1930638B CN2005800072992A CN200580007299A CN1930638B CN 1930638 B CN1930638 B CN 1930638B CN 2005800072992 A CN2005800072992 A CN 2005800072992A CN 200580007299 A CN200580007299 A CN 200580007299A CN 1930638 B CN1930638 B CN 1930638B
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CN
China
Prior art keywords
metal
dispersant
temperature
firing
firing temperature
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Expired - Fee Related
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CN2005800072992A
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English (en)
Chinese (zh)
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CN1930638A (zh
Inventor
平社英之
阿部启介
真田恭宏
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AGC Inc
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Asahi Glass Co Ltd
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Publication of CN1930638A publication Critical patent/CN1930638A/zh
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Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/142—Thermal or thermo-mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • C09D17/004—Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
    • C09D17/006—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Colloid Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
CN2005800072992A 2004-03-10 2005-03-09 含有金属的微粒、含有金属的微粒分散液及含有导电性金属的材料 Expired - Fee Related CN1930638B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP068065/2004 2004-03-10
JP2004068065 2004-03-10
PCT/JP2005/004119 WO2005088652A1 (ja) 2004-03-10 2005-03-09 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料

Publications (2)

Publication Number Publication Date
CN1930638A CN1930638A (zh) 2007-03-14
CN1930638B true CN1930638B (zh) 2010-09-22

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CN2005800072992A Expired - Fee Related CN1930638B (zh) 2004-03-10 2005-03-09 含有金属的微粒、含有金属的微粒分散液及含有导电性金属的材料

Country Status (9)

Country Link
US (1) US7390440B2 (https=)
EP (1) EP1724789B1 (https=)
JP (1) JP4973186B2 (https=)
CN (1) CN1930638B (https=)
AT (1) ATE492888T1 (https=)
CA (1) CA2554371A1 (https=)
DE (1) DE602005025454D1 (https=)
TW (1) TW200533784A (https=)
WO (1) WO2005088652A1 (https=)

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JP5170989B2 (ja) * 2006-07-07 2013-03-27 株式会社日本触媒 導電性銅被膜の製造方法
CN101495580A (zh) * 2006-07-28 2009-07-29 旭硝子株式会社 含金属微粒的分散液、其制造方法及具有金属膜的物品
US7968008B2 (en) * 2006-08-03 2011-06-28 Fry's Metals, Inc. Particles and inks and films using them
JP5098098B2 (ja) * 2006-09-29 2012-12-12 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
US7919015B2 (en) 2006-10-05 2011-04-05 Xerox Corporation Silver-containing nanoparticles with replacement stabilizer
JP5365006B2 (ja) * 2007-01-19 2013-12-11 三菱マテリアル株式会社 金属膜形成方法
US8048488B2 (en) * 2008-01-14 2011-11-01 Xerox Corporation Methods for removing a stabilizer from a metal nanoparticle using a destabilizer
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DE102009015470A1 (de) 2008-12-12 2010-06-17 Byk-Chemie Gmbh Verfahren zur Herstellung von Metallnanopartikeln und auf diese Weise erhaltene Metallnanopartikel und ihre Verwendung
US8834965B2 (en) * 2009-02-12 2014-09-16 Xerox Corporation Organoamine stabilized silver nanoparticles and process for producing same
JP5387034B2 (ja) * 2009-02-20 2014-01-15 大日本印刷株式会社 導電性基板
JPWO2010101028A1 (ja) * 2009-03-02 2012-09-06 東レ株式会社 網目状金属微粒子積層フィルム及びその製造方法
JP5606439B2 (ja) * 2009-06-16 2014-10-15 バンドー化学株式会社 導電性インク及びこれを用いた導電性被膜付基材の製造方法
JP5696999B2 (ja) * 2010-05-31 2015-04-08 独立行政法人物質・材料研究機構 金属ナノ粒子コロイドの製造方法
EP2468826A1 (de) * 2010-12-21 2012-06-27 Bayer MaterialScience AG Pickering-Emulsion zur Herstellung elektrisch leitfähiger Beschichtungen und Verfahren zur Herstellung einer Pickering-Emulsion
JP5790433B2 (ja) * 2011-11-18 2015-10-07 住友金属鉱山株式会社 銀粉及びその製造方法
JP5960568B2 (ja) * 2012-10-01 2016-08-02 Ｄｏｗａエレクトロニクス株式会社 銀微粒子の製造方法
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
EP3061547B1 (en) * 2013-10-24 2019-12-04 Daicel Corporation Method for producing dispersion liquid containing silver nanoparticles, and dispersion liquid containing silver nanoparticles
JP6404614B2 (ja) * 2014-06-25 2018-10-10 古河機械金属株式会社 コアシェル型金属微粒子の製造方法、コアシェル型金属微粒子、導電性インクおよび基板の製造方法
JP2019085432A (ja) * 2017-11-01 2019-06-06 日野自動車株式会社 潤滑油用摩擦調整剤および潤滑油組成物

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Also Published As

Publication number Publication date
CA2554371A1 (en) 2005-09-22
EP1724789B1 (en) 2010-12-22
EP1724789A1 (en) 2006-11-22
US20060266156A1 (en) 2006-11-30
JP4973186B2 (ja) 2012-07-11
US7390440B2 (en) 2008-06-24
TWI365923B (https=) 2012-06-11
DE602005025454D1 (de) 2011-02-03
CN1930638A (zh) 2007-03-14
JPWO2005088652A1 (ja) 2008-01-31
WO2005088652A1 (ja) 2005-09-22
ATE492888T1 (de) 2011-01-15
EP1724789A4 (en) 2009-04-08
TW200533784A (en) 2005-10-16

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Address after: Tokyo, Japan

Patentee after: AGC Corporation

Address before: Tokyo, Japan

Patentee before: Asahi Glass Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100922

Termination date: 20210309