TWI365923B - - Google Patents
Info
- Publication number
- TWI365923B TWI365923B TW094107336A TW94107336A TWI365923B TW I365923 B TWI365923 B TW I365923B TW 094107336 A TW094107336 A TW 094107336A TW 94107336 A TW94107336 A TW 94107336A TW I365923 B TWI365923 B TW I365923B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- fine particles
- dispersants
- surface coated
- particle dispersion
- Prior art date
Links
- 239000010419 fine particle Substances 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 4
- 239000006185 dispersion Substances 0.000 abstract 3
- 239000002270 dispersing agent Substances 0.000 abstract 2
- 238000010304 firing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/142—Thermal or thermo-mechanical treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
- C09D17/004—Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
- C09D17/006—Metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Colloid Chemistry (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004068065 | 2004-03-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200533784A TW200533784A (en) | 2005-10-16 |
| TWI365923B true TWI365923B (https=) | 2012-06-11 |
Family
ID=34975837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94107336A TW200533784A (en) | 2004-03-10 | 2005-03-10 | Metal-containing fine particle, liquid dispersion of metal-containing fine particle, and conductive metal-containing material |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7390440B2 (https=) |
| EP (1) | EP1724789B1 (https=) |
| JP (1) | JP4973186B2 (https=) |
| CN (1) | CN1930638B (https=) |
| AT (1) | ATE492888T1 (https=) |
| CA (1) | CA2554371A1 (https=) |
| DE (1) | DE602005025454D1 (https=) |
| TW (1) | TW200533784A (https=) |
| WO (1) | WO2005088652A1 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101085265B1 (ko) * | 2004-06-16 | 2011-11-22 | 도호 티타늄 가부시키가이샤 | 니켈 분말 및 그 제조 방법 |
| JP5170989B2 (ja) * | 2006-07-07 | 2013-03-27 | 株式会社日本触媒 | 導電性銅被膜の製造方法 |
| CN101495580A (zh) * | 2006-07-28 | 2009-07-29 | 旭硝子株式会社 | 含金属微粒的分散液、其制造方法及具有金属膜的物品 |
| US7968008B2 (en) * | 2006-08-03 | 2011-06-28 | Fry's Metals, Inc. | Particles and inks and films using them |
| JP5098098B2 (ja) * | 2006-09-29 | 2012-12-12 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
| US7919015B2 (en) | 2006-10-05 | 2011-04-05 | Xerox Corporation | Silver-containing nanoparticles with replacement stabilizer |
| JP5365006B2 (ja) * | 2007-01-19 | 2013-12-11 | 三菱マテリアル株式会社 | 金属膜形成方法 |
| US8048488B2 (en) * | 2008-01-14 | 2011-11-01 | Xerox Corporation | Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
| JP5234252B2 (ja) * | 2008-03-28 | 2013-07-10 | 古河電気工業株式会社 | 銅微粒子分散溶液の製造方法 |
| DE102009015470A1 (de) | 2008-12-12 | 2010-06-17 | Byk-Chemie Gmbh | Verfahren zur Herstellung von Metallnanopartikeln und auf diese Weise erhaltene Metallnanopartikel und ihre Verwendung |
| US8834965B2 (en) * | 2009-02-12 | 2014-09-16 | Xerox Corporation | Organoamine stabilized silver nanoparticles and process for producing same |
| JP5387034B2 (ja) * | 2009-02-20 | 2014-01-15 | 大日本印刷株式会社 | 導電性基板 |
| JPWO2010101028A1 (ja) * | 2009-03-02 | 2012-09-06 | 東レ株式会社 | 網目状金属微粒子積層フィルム及びその製造方法 |
| JP5606439B2 (ja) * | 2009-06-16 | 2014-10-15 | バンドー化学株式会社 | 導電性インク及びこれを用いた導電性被膜付基材の製造方法 |
| JP5696999B2 (ja) * | 2010-05-31 | 2015-04-08 | 独立行政法人物質・材料研究機構 | 金属ナノ粒子コロイドの製造方法 |
| EP2468826A1 (de) * | 2010-12-21 | 2012-06-27 | Bayer MaterialScience AG | Pickering-Emulsion zur Herstellung elektrisch leitfähiger Beschichtungen und Verfahren zur Herstellung einer Pickering-Emulsion |
| JP5790433B2 (ja) * | 2011-11-18 | 2015-10-07 | 住友金属鉱山株式会社 | 銀粉及びその製造方法 |
| JP5960568B2 (ja) * | 2012-10-01 | 2016-08-02 | Dowaエレクトロニクス株式会社 | 銀微粒子の製造方法 |
| US20140097003A1 (en) * | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
| EP3061547B1 (en) * | 2013-10-24 | 2019-12-04 | Daicel Corporation | Method for producing dispersion liquid containing silver nanoparticles, and dispersion liquid containing silver nanoparticles |
| JP6404614B2 (ja) * | 2014-06-25 | 2018-10-10 | 古河機械金属株式会社 | コアシェル型金属微粒子の製造方法、コアシェル型金属微粒子、導電性インクおよび基板の製造方法 |
| JP2019085432A (ja) * | 2017-11-01 | 2019-06-06 | 日野自動車株式会社 | 潤滑油用摩擦調整剤および潤滑油組成物 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07226316A (ja) * | 1994-02-14 | 1995-08-22 | Toyohisa Fujita | 磁性エレクトロレオロジー流体及びその製造方法 |
| US5792514A (en) * | 1994-12-23 | 1998-08-11 | Roehm Gmbh Chemische Fabrik | Method for the production of coatings |
| EP0914244A1 (en) * | 1995-12-28 | 1999-05-12 | James R. Heath | Organically-functionalized monodisperse nanocrystals of metals |
| JP2794009B2 (ja) * | 1996-01-29 | 1998-09-03 | 富士ゼロックス株式会社 | 電気接続用異方導電性粒子の製造方法および電気接続用異方導電材料の製造方法 |
| JP3205793B2 (ja) * | 1996-12-19 | 2001-09-04 | 株式会社巴製作所 | 超微粒子及びその製造方法 |
| US6103868A (en) * | 1996-12-27 | 2000-08-15 | The Regents Of The University Of California | Organically-functionalized monodisperse nanocrystals of metals |
| JP3402214B2 (ja) * | 1998-09-14 | 2003-05-06 | 三菱マテリアル株式会社 | 金属微粒子分散液の製造方法 |
| WO2000076699A1 (fr) * | 1999-06-15 | 2000-12-21 | Kimoto, Masaaki | Poudre metallique composite ultrafine et procede de production de ladite poudre |
| US6589312B1 (en) * | 1999-09-01 | 2003-07-08 | David G. Snow | Nanoparticles for hydrogen storage, transportation, and distribution |
| JP2004510678A (ja) * | 2000-10-04 | 2004-04-08 | ザ ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ アーカンソー | コロイドナノ結晶の合成 |
| KR100647238B1 (ko) * | 2000-10-25 | 2006-11-17 | 하리마카세이 가부시기가이샤 | 도전성 금속 페이스트 및 그 제조 방법 |
| JP3942816B2 (ja) | 2000-10-25 | 2007-07-11 | ハリマ化成株式会社 | 金属間のロウ付け接合方法 |
| JP2002317215A (ja) * | 2001-04-19 | 2002-10-31 | Mitsuboshi Belting Ltd | 金属微粒子の製造方法 |
| JP3774638B2 (ja) | 2001-04-24 | 2006-05-17 | ハリマ化成株式会社 | インクジェット印刷法を利用する回路パターンの形成方法 |
| JP3764349B2 (ja) | 2001-05-07 | 2006-04-05 | ハリマ化成株式会社 | 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法 |
| JP4834848B2 (ja) * | 2001-05-30 | 2011-12-14 | Dowaエレクトロニクス株式会社 | 低温焼成用銅粉または導電ペースト用銅粉 |
| CA2451141A1 (en) * | 2001-06-20 | 2003-10-16 | Nanophase Technologies Corporation | Non-aqueous dispersion of nanocrytalline metal oxides |
| JP4234355B2 (ja) * | 2001-06-28 | 2009-03-04 | 大日精化工業株式会社 | 微細化顔料の製造方法および着色用組成物 |
| US6645444B2 (en) * | 2001-06-29 | 2003-11-11 | Nanospin Solutions | Metal nanocrystals and synthesis thereof |
| US20030146019A1 (en) * | 2001-11-22 | 2003-08-07 | Hiroyuki Hirai | Board and ink used for forming conductive pattern, and method using thereof |
| JP3911557B2 (ja) * | 2001-12-07 | 2007-05-09 | 独立行政法人産業技術総合研究所 | 金属超微粒子を担持した多孔質材料の作製方法 |
| JP2003187640A (ja) * | 2001-12-18 | 2003-07-04 | Bando Chem Ind Ltd | 金属コロイド液及び導電性被膜 |
| JP2004018891A (ja) * | 2002-06-13 | 2004-01-22 | Sumitomo Metal Mining Co Ltd | 銀微粒子コロイド分散液の製造方法 |
| JP2004051997A (ja) * | 2002-07-16 | 2004-02-19 | Ulvac Japan Ltd | 金属微粒子分散液及びその調製方法、並びに透明着色膜及びその作製方法 |
| JP4248857B2 (ja) * | 2002-11-29 | 2009-04-02 | 三ツ星ベルト株式会社 | 銀微粒子の製造方法 |
| CN100344528C (zh) | 2003-06-10 | 2007-10-24 | 旭硝子株式会社 | 金属氢化物微粒及其制造方法、含有金属氢化物微粒的分散液和金属质材料 |
| JP2005081501A (ja) * | 2003-09-09 | 2005-03-31 | Ulvac Japan Ltd | 金属ナノ粒子及びその製造方法、金属ナノ粒子分散液及びその製造方法、並びに金属細線及び金属膜及びその形成方法 |
| US7160525B1 (en) * | 2003-10-14 | 2007-01-09 | The Board Of Trustees Of The University Of Arkansas | Monodisperse noble metal nanocrystals |
| US7850870B2 (en) * | 2004-10-28 | 2010-12-14 | Dow Corning Corporation | Conductive curable compositions |
| US7771625B2 (en) * | 2004-11-29 | 2010-08-10 | Dainippon Ink And Chemicals, Inc. | Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder |
-
2005
- 2005-03-09 EP EP20050720390 patent/EP1724789B1/en not_active Expired - Lifetime
- 2005-03-09 AT AT05720390T patent/ATE492888T1/de not_active IP Right Cessation
- 2005-03-09 CN CN2005800072992A patent/CN1930638B/zh not_active Expired - Fee Related
- 2005-03-09 JP JP2006510967A patent/JP4973186B2/ja not_active Expired - Lifetime
- 2005-03-09 CA CA 2554371 patent/CA2554371A1/en not_active Abandoned
- 2005-03-09 WO PCT/JP2005/004119 patent/WO2005088652A1/ja not_active Ceased
- 2005-03-09 DE DE200560025454 patent/DE602005025454D1/de not_active Expired - Lifetime
- 2005-03-10 TW TW94107336A patent/TW200533784A/zh not_active IP Right Cessation
-
2006
- 2006-08-10 US US11/501,801 patent/US7390440B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CA2554371A1 (en) | 2005-09-22 |
| EP1724789B1 (en) | 2010-12-22 |
| EP1724789A1 (en) | 2006-11-22 |
| US20060266156A1 (en) | 2006-11-30 |
| JP4973186B2 (ja) | 2012-07-11 |
| US7390440B2 (en) | 2008-06-24 |
| DE602005025454D1 (de) | 2011-02-03 |
| CN1930638A (zh) | 2007-03-14 |
| JPWO2005088652A1 (ja) | 2008-01-31 |
| WO2005088652A1 (ja) | 2005-09-22 |
| CN1930638B (zh) | 2010-09-22 |
| ATE492888T1 (de) | 2011-01-15 |
| EP1724789A4 (en) | 2009-04-08 |
| TW200533784A (en) | 2005-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |