JP4920335B2 - キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置 - Google Patents

キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置 Download PDF

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Publication number
JP4920335B2
JP4920335B2 JP2006214205A JP2006214205A JP4920335B2 JP 4920335 B2 JP4920335 B2 JP 4920335B2 JP 2006214205 A JP2006214205 A JP 2006214205A JP 2006214205 A JP2006214205 A JP 2006214205A JP 4920335 B2 JP4920335 B2 JP 4920335B2
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Japan
Prior art keywords
layer
electrode
capacitor
metal
base resin
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Expired - Fee Related
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JP2006214205A
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English (en)
Japanese (ja)
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JP2008041930A5 (enExample
JP2008041930A (ja
Inventor
直寛 真篠
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006214205A priority Critical patent/JP4920335B2/ja
Priority to CNA2007101397441A priority patent/CN101123853A/zh
Priority to US11/882,646 priority patent/US7755910B2/en
Priority to EP07113862A priority patent/EP1895588A3/en
Publication of JP2008041930A publication Critical patent/JP2008041930A/ja
Publication of JP2008041930A5 publication Critical patent/JP2008041930A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/728—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2006214205A 2006-08-07 2006-08-07 キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置 Expired - Fee Related JP4920335B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006214205A JP4920335B2 (ja) 2006-08-07 2006-08-07 キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置
CNA2007101397441A CN101123853A (zh) 2006-08-07 2007-07-30 内置有电容器的互连体及其制造方法以及电子元件装置
US11/882,646 US7755910B2 (en) 2006-08-07 2007-08-03 Capacitor built-in interposer and method of manufacturing the same and electronic component device
EP07113862A EP1895588A3 (en) 2006-08-07 2007-08-06 Capacitor built-in interposer and method of manufacturing the same and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006214205A JP4920335B2 (ja) 2006-08-07 2006-08-07 キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置

Publications (3)

Publication Number Publication Date
JP2008041930A JP2008041930A (ja) 2008-02-21
JP2008041930A5 JP2008041930A5 (enExample) 2009-07-30
JP4920335B2 true JP4920335B2 (ja) 2012-04-18

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Family Applications (1)

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JP2006214205A Expired - Fee Related JP4920335B2 (ja) 2006-08-07 2006-08-07 キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置

Country Status (4)

Country Link
US (1) US7755910B2 (enExample)
EP (1) EP1895588A3 (enExample)
JP (1) JP4920335B2 (enExample)
CN (1) CN101123853A (enExample)

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JP4783692B2 (ja) * 2006-08-10 2011-09-28 新光電気工業株式会社 キャパシタ内蔵基板及びその製造方法と電子部品装置
TWI375999B (en) * 2007-06-07 2012-11-01 Advanced Semiconductor Eng Substrate with bumps process and structure
KR101143837B1 (ko) * 2007-10-15 2012-07-12 삼성테크윈 주식회사 전자 소자를 내장하는 회로기판 및 회로기판의 제조 방법
KR101015704B1 (ko) * 2008-12-01 2011-02-22 삼성전기주식회사 칩 내장 인쇄회로기판 및 그 제조방법
JP4853530B2 (ja) * 2009-02-27 2012-01-11 株式会社豊田中央研究所 可動部を有するマイクロデバイス
US8389870B2 (en) * 2010-03-09 2013-03-05 International Business Machines Corporation Coreless multi-layer circuit substrate with minimized pad capacitance
TWI446497B (zh) * 2010-08-13 2014-07-21 欣興電子股份有限公司 嵌埋被動元件之封裝基板及其製法
KR20120026855A (ko) 2010-09-10 2012-03-20 삼성전기주식회사 임베디드 볼 그리드 어레이 기판 및 그 제조 방법
US8830689B2 (en) 2010-09-16 2014-09-09 Samsung Electro-Mechanics Co., Ltd. Interposer-embedded printed circuit board
JP2013149948A (ja) * 2011-12-20 2013-08-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US9035194B2 (en) * 2012-10-30 2015-05-19 Intel Corporation Circuit board with integrated passive devices
JP5940965B2 (ja) * 2012-11-27 2016-06-29 株式会社日本自動車部品総合研究所 ノイズ低減構造
US20140167900A1 (en) 2012-12-14 2014-06-19 Gregorio R. Murtagian Surface-mount inductor structures for forming one or more inductors with substrate traces
TWI510152B (zh) * 2013-07-10 2015-11-21 Ind Tech Res Inst 內藏電容模組
JP2015049985A (ja) * 2013-08-30 2015-03-16 富士通株式会社 Ｉｃソケット及び接続端子
US9553059B2 (en) 2013-12-20 2017-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. Backside redistribution layer (RDL) structure
US9853524B2 (en) * 2014-07-29 2017-12-26 Regal Beloit America, Inc. Motor and controller with isolation members between electrical components and associated method
US20170011979A1 (en) * 2015-07-07 2017-01-12 Diodes Incorporated Chip Scale Package
JP6967005B2 (ja) * 2016-08-22 2021-11-17 有限会社アイピーシステムズ キャパシタの製造方法及びキャパシタ内蔵基板の製造方法並びにキャパシタ内蔵基板及び半導体装置実装部品
US10910305B2 (en) 2016-12-30 2021-02-02 Intel Corporation Microelectronic devices designed with capacitive and enhanced inductive bumps
US10388461B2 (en) 2017-08-02 2019-08-20 Perriquest Defense Research Enterprises, Llc Capacitor arrangements
JP7279538B2 (ja) * 2019-06-19 2023-05-23 富士フイルムビジネスイノベーション株式会社 発光装置
JP7575395B2 (ja) * 2019-10-24 2024-10-29 株式会社村田製作所 複合キャパシタ
KR102731933B1 (ko) * 2019-11-15 2024-11-20 에스케이하이닉스 주식회사 반도체 장치 및 반도체 장치의 제조 방법
CN111968959A (zh) * 2020-08-06 2020-11-20 长江存储科技有限责任公司 半导体器件及其制作方法
KR102975801B1 (ko) * 2021-10-20 2026-06-09 삼성전자주식회사 집적 회로 반도체 소자
TWI860794B (zh) * 2023-07-26 2024-11-01 欣興電子股份有限公司 電容元件、包含其的線路載板及其製作方法

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JP4783692B2 (ja) * 2006-08-10 2011-09-28 新光電気工業株式会社 キャパシタ内蔵基板及びその製造方法と電子部品装置

Also Published As

Publication number Publication date
EP1895588A2 (en) 2008-03-05
CN101123853A (zh) 2008-02-13
US7755910B2 (en) 2010-07-13
US20080030968A1 (en) 2008-02-07
EP1895588A3 (en) 2008-05-07
JP2008041930A (ja) 2008-02-21

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