JP4833192B2 - 電子装置 - Google Patents

電子装置 Download PDF

Info

Publication number
JP4833192B2
JP4833192B2 JP2007335689A JP2007335689A JP4833192B2 JP 4833192 B2 JP4833192 B2 JP 4833192B2 JP 2007335689 A JP2007335689 A JP 2007335689A JP 2007335689 A JP2007335689 A JP 2007335689A JP 4833192 B2 JP4833192 B2 JP 4833192B2
Authority
JP
Japan
Prior art keywords
substrate
electronic device
semiconductor chip
electronic
copper core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007335689A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009158742A (ja
JP2009158742A5 (https=
Inventor
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007335689A priority Critical patent/JP4833192B2/ja
Priority to KR1020080125601A priority patent/KR101501627B1/ko
Priority to US12/334,970 priority patent/US7782624B2/en
Priority to TW097150611A priority patent/TW200928699A/zh
Publication of JP2009158742A publication Critical patent/JP2009158742A/ja
Publication of JP2009158742A5 publication Critical patent/JP2009158742A5/ja
Application granted granted Critical
Publication of JP4833192B2 publication Critical patent/JP4833192B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2007335689A 2007-12-27 2007-12-27 電子装置 Active JP4833192B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007335689A JP4833192B2 (ja) 2007-12-27 2007-12-27 電子装置
KR1020080125601A KR101501627B1 (ko) 2007-12-27 2008-12-11 전자 장치
US12/334,970 US7782624B2 (en) 2007-12-27 2008-12-15 Electronic apparatus
TW097150611A TW200928699A (en) 2007-12-27 2008-12-25 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007335689A JP4833192B2 (ja) 2007-12-27 2007-12-27 電子装置

Publications (3)

Publication Number Publication Date
JP2009158742A JP2009158742A (ja) 2009-07-16
JP2009158742A5 JP2009158742A5 (https=) 2010-12-02
JP4833192B2 true JP4833192B2 (ja) 2011-12-07

Family

ID=40798071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007335689A Active JP4833192B2 (ja) 2007-12-27 2007-12-27 電子装置

Country Status (4)

Country Link
US (1) US7782624B2 (https=)
JP (1) JP4833192B2 (https=)
KR (1) KR101501627B1 (https=)
TW (1) TW200928699A (https=)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8040684B2 (en) * 2007-12-31 2011-10-18 Honeywell International Inc. Package for electronic component and method for manufacturing the same
CN101499480B (zh) * 2008-01-30 2013-03-20 松下电器产业株式会社 半导体芯片及半导体装置
US8618676B2 (en) * 2008-10-30 2013-12-31 Stmicroelectronics (Malta) Ltd. Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained
JP2010232314A (ja) * 2009-03-26 2010-10-14 Tdk Corp 電子部品モジュール
JP2010238995A (ja) * 2009-03-31 2010-10-21 Sanyo Electric Co Ltd 半導体モジュールおよびこれを搭載したカメラモジュール
KR101067088B1 (ko) * 2009-09-10 2011-09-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US9313877B2 (en) * 2009-11-10 2016-04-12 Nec Corporation Electronic device and noise suppression method
JP5589462B2 (ja) * 2010-03-16 2014-09-17 カシオ計算機株式会社 半導体装置及び半導体装置の製造方法
US8618652B2 (en) * 2010-04-16 2013-12-31 Intel Corporation Forming functionalized carrier structures with coreless packages
JP5209075B2 (ja) * 2010-05-21 2013-06-12 有限会社 ナプラ 電子デバイス及びその製造方法
JP5421863B2 (ja) * 2010-06-28 2014-02-19 新光電気工業株式会社 半導体パッケージの製造方法
JPWO2012014527A1 (ja) 2010-07-29 2013-09-12 株式会社村田製作所 高周波モジュールおよび通信装置
JP5172925B2 (ja) 2010-09-24 2013-03-27 株式会社東芝 無線装置
GB2484908A (en) * 2010-10-21 2012-05-02 Bluwireless Tech Ltd Layered structures comprising controlled height structures
GB2484704A (en) * 2010-10-21 2012-04-25 Bluwireless Tech Ltd Patch antenna structure formed with an air gap in a flip-chip assembly
WO2012073400A1 (ja) * 2010-11-29 2012-06-07 株式会社村田製作所 抵抗内蔵基板およびこの基板を備える電流検出モジュール
DE102010055627A1 (de) * 2010-12-22 2012-06-28 Epcos Ag Elektrisches Modul zur Aufnahme durch Bestückungsautomaten mittels Erzeugung eines Vakuums
EP2469592A1 (en) 2010-12-23 2012-06-27 Karlsruher Institut für Technologie Integrated circuit chip package device
JP2012147403A (ja) * 2011-01-14 2012-08-02 Mitsumi Electric Co Ltd 高周波モジュール
JP5284382B2 (ja) * 2011-02-01 2013-09-11 株式会社東芝 無線装置及び無線機器
US9693492B2 (en) * 2011-04-14 2017-06-27 Mitsubishi Electric Corporation High-frequency package
KR20120118686A (ko) * 2011-04-19 2012-10-29 엘지이노텍 주식회사 발광소자 모듈
DE102011076273A1 (de) * 2011-05-23 2012-11-29 Continental Automotive Gmbh Leiterplatte für elektrische Bauelemente und Leiterplattensystem
KR101434003B1 (ko) 2011-07-07 2014-08-27 삼성전기주식회사 반도체 패키지 및 그 제조 방법
JP5417389B2 (ja) 2011-07-13 2014-02-12 株式会社東芝 無線装置
JP5414749B2 (ja) 2011-07-13 2014-02-12 株式会社東芝 無線装置
JP5729186B2 (ja) 2011-07-14 2015-06-03 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP5100878B1 (ja) * 2011-09-30 2012-12-19 株式会社フジクラ 部品内蔵基板実装体及びその製造方法並びに部品内蔵基板
US9001002B2 (en) * 2011-09-30 2015-04-07 Apple Inc. Portable electronic device housing having insert molding around antenna
US20130082383A1 (en) * 2011-10-03 2013-04-04 Texas Instruments Incorporated Electronic assembly having mixed interface including tsv die
US9006889B2 (en) 2011-11-11 2015-04-14 Skyworks Solutions, Inc. Flip chip packages with improved thermal performance
FR2987170A1 (fr) * 2012-02-17 2013-08-23 St Microelectronics Grenoble 2 Boitier et dispositif electroniques
US9129929B2 (en) * 2012-04-19 2015-09-08 Sony Corporation Thermal package with heat slug for die stacks
US9325056B2 (en) * 2012-09-11 2016-04-26 Alcatel Lucent Radiation efficient integrated antenna
JP2014067819A (ja) * 2012-09-25 2014-04-17 Fujikura Ltd 部品内蔵基板実装体及びその製造方法並びに部品内蔵基板
JP6121705B2 (ja) 2012-12-12 2017-04-26 株式会社東芝 無線装置
JP6048513B2 (ja) * 2013-01-04 2016-12-21 富士通株式会社 無線通信装置、及び、電子装置
JP5942273B2 (ja) 2013-01-29 2016-06-29 パナソニックＩｐマネジメント株式会社 無線モジュール及び無線モジュールの製造方法
JP6027905B2 (ja) * 2013-01-31 2016-11-16 新光電気工業株式会社 半導体装置
JP5931799B2 (ja) * 2013-05-28 2016-06-08 株式会社日立製作所 層間接続基板およびその製造方法
WO2014196143A1 (ja) * 2013-06-04 2014-12-11 パナソニックＩｐマネジメント株式会社 無線モジュール
KR20150033937A (ko) * 2013-09-25 2015-04-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제작 방법
KR101833154B1 (ko) * 2013-12-09 2018-04-13 인텔 코포레이션 패키징된 다이용 세라믹 상의 안테나와 컴퓨팅 시스템 및 이의 제조방법
CN107078405B (zh) * 2014-10-20 2021-03-05 株式会社村田制作所 无线通信模块
WO2017099853A2 (en) * 2015-08-19 2017-06-15 Phase Sensitive Innovations, Inc. Optically-fed antenna and optically fed antenna array
JP6020943B2 (ja) * 2015-10-19 2016-11-02 株式会社フジクラ 部品内蔵基板の製造方法
US10439282B2 (en) 2016-01-19 2019-10-08 Phase Sensitive Innovations, Inc. Beam steering antenna transmitter, multi-user antenna MIMO transmitter and related methods of communication
TWI593165B (zh) * 2016-02-04 2017-07-21 矽品精密工業股份有限公司 電子封裝件
CN107645033B (zh) * 2016-07-21 2020-10-02 环旭电子股份有限公司 电子模块
US10129979B2 (en) * 2016-09-23 2018-11-13 Apple Inc. PCB assembly with molded matrix core
US10593634B2 (en) 2016-12-30 2020-03-17 Analog Devices, Inc. Packaged devices with integrated antennas
DE102017200126A1 (de) 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
DE102017200127A1 (de) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
TWI678772B (zh) * 2017-04-28 2019-12-01 矽品精密工業股份有限公司 電子封裝件及其製法
TWI663701B (zh) * 2017-04-28 2019-06-21 Siliconware Precision Industries Co., Ltd. 電子封裝件及其製法
TWI684260B (zh) * 2017-05-11 2020-02-01 矽品精密工業股份有限公司 電子封裝件及其製法
JP2019016678A (ja) * 2017-07-06 2019-01-31 株式会社フジクラ 基板モジュール及び基板モジュールの製造方法
US10944180B2 (en) 2017-07-10 2021-03-09 Viasat, Inc. Phased array antenna
KR20190018812A (ko) 2017-08-16 2019-02-26 삼성전기주식회사 반도체 패키지와 이를 구비하는 전자 기기
US11005178B2 (en) 2017-11-21 2021-05-11 Phase Sensitive Innovations, Inc. Antenna and antenna array configurations, antenna systems and related methods of operation
JP6920184B2 (ja) * 2017-12-19 2021-08-18 新光電気工業株式会社 電子装置及び電子モジュール
US10530038B2 (en) * 2018-03-06 2020-01-07 Advanced Semiconductor Engineering, Inc. Semiconductor package device
US11005155B2 (en) * 2018-03-08 2021-05-11 Sony Corporation Microwave antenna apparatus and package
CN110401008B (zh) * 2018-04-25 2022-02-25 华为技术有限公司 带有封装天线的封装架构及通信设备
US10971461B2 (en) 2018-08-16 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacture
DE102019121191B4 (de) 2018-08-16 2022-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Halbleitervorrichtung und herstellungsverfahren
DE102018220712B4 (de) 2018-11-30 2024-06-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wafer-level packaging-basiertes modul sowie verfahren zur herstellung desselben
CN109887893B (zh) * 2019-03-13 2024-02-02 黄山学院 大功率ipm模块的先进封装结构及加工工艺
KR102710329B1 (ko) * 2019-06-21 2024-09-27 삼성전자주식회사 반도체 패키지
CN111128908B (zh) * 2019-11-22 2024-04-16 中国电子科技集团公司第十三研究所 三维堆叠电路结构及其制备方法
CN111029324A (zh) * 2019-11-22 2020-04-17 中国电子科技集团公司第十三研究所 三维微波模块电路结构及其制备方法
JP7744154B2 (ja) * 2021-03-30 2025-09-25 株式会社デンソー 回路基板内に電気部品を備える半導体装置
US20230078536A1 (en) * 2021-09-14 2023-03-16 Apple Inc. Conductive features on system-in-package surfaces
FR3129525B1 (fr) * 2021-11-23 2024-01-26 St Microelectronics Grenoble 2 Circuit électronique
KR102902632B1 (ko) * 2022-02-16 2025-12-22 삼성전자주식회사 고정 부재를 포함하는 반도체 패키지
US12315999B2 (en) 2022-07-15 2025-05-27 Aptiv Technologies AG Solderable waveguide antenna
EP4578068A1 (en) * 2022-09-07 2025-07-02 ViaSat, Inc. Method of creating embedded components on an antenna substrate and antenna apparatus formed with same
US20240096858A1 (en) * 2022-09-15 2024-03-21 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
JP2024117924A (ja) 2023-02-20 2024-08-30 富士通株式会社 半導体装置及び実装方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3141692B2 (ja) * 1994-08-11 2001-03-05 松下電器産業株式会社 ミリ波用検波器
JP2002100698A (ja) * 2000-09-26 2002-04-05 Shinko Electric Ind Co Ltd 半導体装置用パッケージおよび半導体装置
JP2002231974A (ja) * 2001-01-30 2002-08-16 Matsushita Electric Ind Co Ltd 光受信装置及びその実装構造及びその製造方法
US6770955B1 (en) * 2001-12-15 2004-08-03 Skyworks Solutions, Inc. Shielded antenna in a semiconductor package
US6818985B1 (en) * 2001-12-22 2004-11-16 Skyworks Solutions, Inc. Embedded antenna and semiconductor die on a substrate in a laminate package
WO2004042868A1 (en) * 2002-11-07 2004-05-21 Fractus, S.A. Integrated circuit package including miniature antenna
JP2004327641A (ja) * 2003-04-24 2004-11-18 Tdk Corp 電子部品モジュール
SG165149A1 (en) * 2003-10-22 2010-10-28 Zhang Yue Ping Integrating an antenna and a filter in the housing of a device package
US7227502B2 (en) * 2003-12-18 2007-06-05 Matsushita Electric Industrial Co., Ltd. Patch antenna whose directivity is shifted to a particular direction, and a module integrated with the patch antenna
US7119745B2 (en) * 2004-06-30 2006-10-10 International Business Machines Corporation Apparatus and method for constructing and packaging printed antenna devices
JP4148201B2 (ja) * 2004-08-11 2008-09-10 ソニー株式会社 電子回路装置
US7615856B2 (en) * 2004-09-01 2009-11-10 Sanyo Electric Co., Ltd. Integrated antenna type circuit apparatus
JP4725582B2 (ja) * 2005-10-27 2011-07-13 株式会社村田製作所 高周波モジュール
KR100714310B1 (ko) * 2006-02-23 2007-05-02 삼성전자주식회사 변압기 또는 안테나를 구비하는 반도체 패키지들
JP4912716B2 (ja) 2006-03-29 2012-04-11 新光電気工業株式会社 配線基板の製造方法、及び半導体装置の製造方法

Also Published As

Publication number Publication date
US7782624B2 (en) 2010-08-24
US20090168367A1 (en) 2009-07-02
KR20090071386A (ko) 2009-07-01
JP2009158742A (ja) 2009-07-16
TW200928699A (en) 2009-07-01
KR101501627B1 (ko) 2015-03-11

Similar Documents

Publication Publication Date Title
JP4833192B2 (ja) 電子装置
US7839649B2 (en) Circuit board structure having embedded semiconductor element and fabrication method thereof
CN107787112B (zh) 具有电子元件的印刷电路板、其制造方法及电子元件模块
US7242092B2 (en) Substrate assembly with direct electrical connection as a semiconductor package
TWI415235B (zh) Semiconductor device and manufacturing method thereof
CN100472779C (zh) 模块化器件
EP1304742B1 (en) Method for producing a component built-in module
US7018866B2 (en) Circuit component built-in module with embedded semiconductor chip and method of manufacturing
US8115316B2 (en) Packaging board, semiconductor module, and portable apparatus
TWI677062B (zh) 晶片埋入式印刷電路板及應用印刷電路板之半導體封裝及其製造方法
TWI694566B (zh) 半導體封裝載板及其製法與電子封裝件
JP5100878B1 (ja) 部品内蔵基板実装体及びその製造方法並びに部品内蔵基板
CN100472764C (zh) 元器件内装组件及其制造方法
US20110314667A1 (en) Method of manufacturing printed circuit board including electronic component embedded therein
JP5088138B2 (ja) 実装基板および電子機器
US20060145328A1 (en) Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same
JP2009266979A (ja) 半導体装置
US11450597B2 (en) Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same
JP2019197876A (ja) フリップチップパッケージ基板
JP2004274035A (ja) 電子部品内蔵モジュールとその製造方法
KR20210017271A (ko) 반도체 패키지
CN111755409A (zh) 半导体封装基板及其制法与电子封装件及其制法
JP2006210870A (ja) 部品内蔵モジュール及びその製造方法
US20240194579A1 (en) Electronic component module
JP2003078250A (ja) 部品内蔵モジュールおよびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101018

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101018

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110818

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110830

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110921

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4833192

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140930

Year of fee payment: 3