JP4793447B2 - 多層セラミック基板およびその製造方法ならびに電子部品 - Google Patents
多層セラミック基板およびその製造方法ならびに電子部品 Download PDFInfo
- Publication number
- JP4793447B2 JP4793447B2 JP2008534799A JP2008534799A JP4793447B2 JP 4793447 B2 JP4793447 B2 JP 4793447B2 JP 2008534799 A JP2008534799 A JP 2008534799A JP 2008534799 A JP2008534799 A JP 2008534799A JP 4793447 B2 JP4793447 B2 JP 4793447B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- layer portion
- glass
- ceramic substrate
- multilayer ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims description 127
- 239000000758 substrate Substances 0.000 title claims description 76
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title description 15
- 239000010410 layer Substances 0.000 claims description 111
- 239000002344 surface layer Substances 0.000 claims description 96
- 239000004020 conductor Substances 0.000 claims description 82
- 239000011521 glass Substances 0.000 claims description 43
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 31
- 239000000843 powder Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 26
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 22
- 239000002241 glass-ceramic Substances 0.000 claims description 19
- 238000010304 firing Methods 0.000 claims description 12
- 239000006112 glass ceramic composition Substances 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 5
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910015868 MSiO Inorganic materials 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
2,13 内層部
3,4,14,15 表層部
5,19 導体パターン
6,20,21 主面導体膜
12 電子部品
24,25 チップ部品
26 内層用セラミックグリーンシート
27 拘束用セラミックグリーンシート
28 複合積層体
29 積層体
Claims (8)
- 内層部と、前記内層部の主面に接しかつ前記内層部を積層方向に挟むように位置する表層部とからなる積層構造を有し、
前記表層部の熱膨張係数は、前記内層部の熱膨張係数より小さく、前記表層部の熱膨張係数と前記内層部の熱膨張係数との差が1.0ppmK −1 以上であり、
前記表層部は、ガラスとセラミック粉末とを含むガラスセラミック材料からなり、
前記内層部を構成する材料の、前記表層部を構成する材料との間で共通する成分の重量比率が75重量%以上であり、
前記内層部には、Ag系材料からなる導体パターンが形成され、
前記導体パターンは、前記内層部の主面上に位置される主面導体膜を含み、
前記表層部は、前記主面導体膜の中央部を露出させながら、前記主面導体膜の周囲を覆うように形成される、
多層セラミック基板。 - 前記ガラスセラミック材料は、MO−SiO2−Al2O3−B2O3系ガラス(ただし、MOは、CaO、MgO、SrOおよびBaOから選ばれた少なくとも1種)とアルミナ粉末とを含む、請求項1に記載の多層セラミック基板。
- 前記表層部の熱膨張係数と前記内層部の熱膨張係数との差が4.3ppmK−1以下である、請求項1に記載の多層セラミック基板。
- 前記MO−SiO2−Al2O3−B2O3系ガラスは、34〜73重量%のSiO2と、14〜41重量%のMOと、0〜30重量%のAl2O3と、0〜30重量%のB2O3とを含む、請求項2に記載の多層セラミック基板。
- 請求項1ないし4のいずれかに記載の多層セラミック基板を備える、電子部品。
- ガラスとセラミック粉末とを含むガラスセラミックペーストを用意する工程と、
複数の内層用セラミックグリーンシートを用意する工程と、
複数の前記内層用セラミックグリーンシートの特定のものに、Ag系材料からなる導体パターンを形成する工程と、
複数の前記内層用セラミックグリーンシートを積層することによって形成された内層部と、前記内層部の最外層に位置する前記内層用セラミックグリーンシートの外側に向く面上に前記ガラスセラミックペーストを塗布することによって形成された表層部とを有する、積層体を作製する工程と、
前記積層体を焼成する工程と
を備え、
前記導体パターンは、前記内層部の最外層に位置する前記内層用セラミックグリーンシートの外側に向く面上に形成される主面導体膜を含み、
前記積層体において、前記表層部は、前記主面導体膜の中央部を露出させながら、前記主面導体膜の周囲を覆うように形成されている、
多層セラミック基板の製造方法。 - 前記ガラスセラミックペーストは、MO−SiO2−Al2O3−B2O3系ガラス(ただし、MOは、CaO、MgO、SrOおよびBaOから選ばれた少なくとも1種)とアルミナ粉末とを含む、請求項6に記載の多層セラミック基板の製造方法。
- 前記ガラスセラミックペーストおよび前記内層用セラミックグリーンシートが焼結する温度では焼結しない無機材料を含む、拘束用セラミックグリーンシートを用意する工程と、
前記積層体の少なくとも一方主面に前記拘束用セラミックグリーンシートを配置することによって、複合積層体を作製する工程と
をさらに備え、
前記積層体を焼成する工程において、前記ガラスセラミックペーストおよび前記内層用セラミックグリーンシートが焼結するが、前記拘束用セラミックグリーンシートが焼結しない温度で、前記複合積層体が焼成される、
請求項6または7に記載の多層セラミック基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008534799A JP4793447B2 (ja) | 2007-04-20 | 2008-03-25 | 多層セラミック基板およびその製造方法ならびに電子部品 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007111189 | 2007-04-20 | ||
JP2007111189 | 2007-04-20 | ||
JP2008534799A JP4793447B2 (ja) | 2007-04-20 | 2008-03-25 | 多層セラミック基板およびその製造方法ならびに電子部品 |
PCT/JP2008/055495 WO2008132913A1 (ja) | 2007-04-20 | 2008-03-25 | 多層セラミック基板およびその製造方法ならびに電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008132913A1 JPWO2008132913A1 (ja) | 2010-07-22 |
JP4793447B2 true JP4793447B2 (ja) | 2011-10-12 |
Family
ID=39925374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008534799A Expired - Fee Related JP4793447B2 (ja) | 2007-04-20 | 2008-03-25 | 多層セラミック基板およびその製造方法ならびに電子部品 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7998560B2 (ja) |
JP (1) | JP4793447B2 (ja) |
CN (1) | CN101543151B (ja) |
WO (1) | WO2008132913A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150113159A (ko) * | 2013-03-27 | 2015-10-07 | 가부시키가이샤 무라타 세이사쿠쇼 | 절연성 세라믹 페이스트, 세라믹 전자 부품 및 그 제조 방법 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4702481B2 (ja) * | 2008-03-28 | 2011-06-15 | 株式会社村田製作所 | 多層セラミック基板の製造方法 |
JP5550280B2 (ja) * | 2009-07-29 | 2014-07-16 | 京セラ株式会社 | 多層配線基板 |
JP2011040604A (ja) * | 2009-08-12 | 2011-02-24 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
JPWO2011102040A1 (ja) * | 2010-02-19 | 2013-06-17 | 旭硝子株式会社 | 素子搭載用基板およびその製造方法 |
KR101550591B1 (ko) | 2011-09-07 | 2015-09-07 | 티디케이가부시기가이샤 | 적층형 코일 부품 |
KR101525698B1 (ko) * | 2013-12-05 | 2015-06-03 | 삼성전기주식회사 | 적층형 전자부품 및 그 제조방법 |
CN104355539B (zh) * | 2014-10-22 | 2017-09-12 | 曹炜 | 一种稀土离子掺杂的玻璃陶瓷组合物 |
CN104355542A (zh) * | 2014-10-22 | 2015-02-18 | 华文蔚 | 一种玻璃陶瓷的制备方法 |
WO2017002434A1 (ja) | 2015-06-29 | 2017-01-05 | 株式会社村田製作所 | 多層セラミック基板および多層セラミック基板の製造方法 |
US20170062714A1 (en) * | 2015-08-31 | 2017-03-02 | Intel Corporation | Thermally regulated electronic devices, systems, and associated methods |
JP6728859B2 (ja) * | 2016-03-25 | 2020-07-22 | 日立金属株式会社 | セラミック基板およびその製造方法 |
KR102573407B1 (ko) * | 2016-08-24 | 2023-08-30 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
EP3301082B1 (en) * | 2016-09-30 | 2024-09-18 | Infineon Technologies AG | Method for producing a metal-ceramic substrate |
JP7406919B2 (ja) | 2019-03-11 | 2023-12-28 | 株式会社村田製作所 | 積層コイル部品 |
CN113461315A (zh) * | 2020-03-31 | 2021-10-01 | 康宁股份有限公司 | 经由3d打印的多组成玻璃结构 |
CN115073148B (zh) * | 2022-07-21 | 2023-08-08 | 瓷金科技(河南)有限公司 | 一种陶瓷封装基座及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315720A (ja) * | 1992-05-13 | 1993-11-26 | Nippon Cement Co Ltd | ガラス又はガラス・セラミックス基板用導体材料 |
JPH0629664A (ja) * | 1992-07-10 | 1994-02-04 | Nippon Cement Co Ltd | 多層セラミックス配線基板 |
JP2002252461A (ja) * | 2001-02-26 | 2002-09-06 | Kyocera Corp | 配線基板およびその製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894115A (en) * | 1989-02-14 | 1990-01-16 | General Electric Company | Laser beam scanning method for forming via holes in polymer materials |
JP2785544B2 (ja) * | 1991-10-04 | 1998-08-13 | 松下電器産業株式会社 | 多層セラミック基板の製造方法 |
US5456778A (en) * | 1992-08-21 | 1995-10-10 | Sumitomo Metal Ceramics Inc. | Method of fabricating ceramic circuit substrate |
JP2783751B2 (ja) | 1993-12-21 | 1998-08-06 | 富士通株式会社 | 多層セラミック基板の製造方法 |
JP3780386B2 (ja) * | 1996-03-28 | 2006-05-31 | 株式会社村田製作所 | セラミック回路基板及びその製造方法 |
JP3087656B2 (ja) * | 1996-07-24 | 2000-09-11 | 株式会社村田製作所 | 低温焼結無機組成物 |
JPH10194828A (ja) * | 1996-11-12 | 1998-07-28 | Sumitomo Kinzoku Electro Device:Kk | 低温焼成セラミックス多層基板とその製造方法 |
JP3354424B2 (ja) * | 1997-02-27 | 2002-12-09 | 三洋電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP3419291B2 (ja) * | 1997-03-04 | 2003-06-23 | 株式会社村田製作所 | 低温焼結磁器組成物及びそれを用いた多層セラミック基板 |
JP3219022B2 (ja) * | 1997-06-20 | 2001-10-15 | 住友金属工業株式会社 | 電子部品搭載用セラミックス多層配線基板の電極構造 |
TW421980B (en) * | 1997-12-22 | 2001-02-11 | Citizen Watch Co Ltd | Electronic component device, its manufacturing process, and collective circuits |
US6228196B1 (en) * | 1998-06-05 | 2001-05-08 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
JP3358589B2 (ja) * | 1999-06-08 | 2002-12-24 | 株式会社村田製作所 | セラミック基板用組成物、グリーンシートおよびセラミック回路部品 |
JP3687484B2 (ja) * | 1999-06-16 | 2005-08-24 | 株式会社村田製作所 | セラミック基板の製造方法および未焼成セラミック基板 |
JP2001106571A (ja) * | 1999-10-07 | 2001-04-17 | Murata Mfg Co Ltd | 誘電体セラミック組成物及びセラミック電子部品 |
JP2001220230A (ja) * | 2000-02-09 | 2001-08-14 | Murata Mfg Co Ltd | 誘電体磁器組成物 |
JP2002084065A (ja) * | 2000-09-07 | 2002-03-22 | Murata Mfg Co Ltd | 多層セラミック基板およびその製造方法ならびに電子装置 |
JP3591437B2 (ja) * | 2000-09-07 | 2004-11-17 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法ならびに電子装置 |
JP2002226259A (ja) * | 2000-11-29 | 2002-08-14 | Murata Mfg Co Ltd | セラミック電子部品の基体用組成物、セラミック電子部品および積層型セラミック電子部品の製造方法 |
JP2002368420A (ja) * | 2001-06-05 | 2002-12-20 | Murata Mfg Co Ltd | ガラスセラミック多層基板の製造方法およびガラスセラミック多層基板 |
JP4748435B2 (ja) * | 2001-08-21 | 2011-08-17 | 日本電気硝子株式会社 | 積層ガラスセラミック材料及び積層ガラスセラミック焼結体 |
JP4876493B2 (ja) * | 2005-09-07 | 2012-02-15 | 株式会社村田製作所 | 多層セラミック基板および電子部品 |
TWI311451B (en) * | 2005-11-30 | 2009-06-21 | Murata Manufacturing Co | Ceramic substrate, electronic device, and manufacturing method of ceramic substrate |
-
2008
- 2008-03-25 JP JP2008534799A patent/JP4793447B2/ja not_active Expired - Fee Related
- 2008-03-25 WO PCT/JP2008/055495 patent/WO2008132913A1/ja active Application Filing
- 2008-03-25 CN CN2008800002669A patent/CN101543151B/zh not_active Expired - Fee Related
- 2008-11-07 US US12/266,574 patent/US7998560B2/en not_active Expired - Fee Related
-
2009
- 2009-08-12 US US12/539,629 patent/US8257529B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315720A (ja) * | 1992-05-13 | 1993-11-26 | Nippon Cement Co Ltd | ガラス又はガラス・セラミックス基板用導体材料 |
JPH0629664A (ja) * | 1992-07-10 | 1994-02-04 | Nippon Cement Co Ltd | 多層セラミックス配線基板 |
JP2002252461A (ja) * | 2001-02-26 | 2002-09-06 | Kyocera Corp | 配線基板およびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150113159A (ko) * | 2013-03-27 | 2015-10-07 | 가부시키가이샤 무라타 세이사쿠쇼 | 절연성 세라믹 페이스트, 세라믹 전자 부품 및 그 제조 방법 |
US9974168B2 (en) | 2013-03-27 | 2018-05-15 | Murata Manufacturing Co., Ltd. | Insulating ceramic paste, ceramic electronic component, and method for producing the same |
KR101878764B1 (ko) * | 2013-03-27 | 2018-07-16 | 가부시키가이샤 무라타 세이사쿠쇼 | 절연성 세라믹 페이스트, 세라믹 전자 부품 및 그 제조 방법 |
US10292264B2 (en) | 2013-03-27 | 2019-05-14 | Murata Manufacturing Co., Ltd. | Insulating ceramic paste, ceramic electronic component, and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
WO2008132913A1 (ja) | 2008-11-06 |
US7998560B2 (en) | 2011-08-16 |
US20090294020A1 (en) | 2009-12-03 |
US20090061178A1 (en) | 2009-03-05 |
CN101543151B (zh) | 2011-04-13 |
US8257529B2 (en) | 2012-09-04 |
CN101543151A (zh) | 2009-09-23 |
JPWO2008132913A1 (ja) | 2010-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4793447B2 (ja) | 多層セラミック基板およびその製造方法ならびに電子部品 | |
JP4957723B2 (ja) | 多層セラミック基板およびその製造方法ならびに電子部品 | |
JP5029699B2 (ja) | セラミック複合多層基板及びその製造方法並びに電子部品 | |
JP5182367B2 (ja) | 多層セラミック基板およびその製造方法 | |
WO2017002434A1 (ja) | 多層セラミック基板および多層セラミック基板の製造方法 | |
JP2011040604A (ja) | 積層型セラミック電子部品およびその製造方法 | |
JP4788544B2 (ja) | 多層セラミック基板およびその製造方法 | |
JP4497247B2 (ja) | 積層型セラミック電子部品の製造方法 | |
JP2005501795A (ja) | セラミック基板の製造方法及びセラミック基板 | |
JP2011088756A (ja) | 低温焼結セラミック材料、低温焼結セラミック焼結体および多層セラミック基板 | |
JP5015550B2 (ja) | ガラスセラミック回路基板およびその製造方法 | |
JP5354011B2 (ja) | 多層セラミック基板の製造方法 | |
US8241449B2 (en) | Method for producing ceramic body | |
JP2008159726A (ja) | 多層配線基板 | |
JP2009158668A (ja) | セラミック多層配線基板及びその製造方法 | |
KR20090112937A (ko) | 다층 세라믹 기판의 제조 방법 | |
JP4610185B2 (ja) | 配線基板並びにその製造方法 | |
JP2004095753A (ja) | 多層セラミック基板の製造方法 | |
JP5563036B2 (ja) | 多層セラミック基板及びその製造方法 | |
JP6005942B2 (ja) | セラミック多層基板の製造方法 | |
JP2012074747A (ja) | セラミック積層基板の製造方法 | |
JPH10341067A (ja) | 無機多層基板およびビア用導体ペースト | |
JP2006013354A (ja) | 多層回路基板の製造方法 | |
JP2006181738A (ja) | セラミック積層体 | |
JP2009266912A (ja) | セラミック積層基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110405 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110519 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20110519 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110628 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110711 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4793447 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140805 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |