JP5354011B2 - 多層セラミック基板の製造方法 - Google Patents
多層セラミック基板の製造方法 Download PDFInfo
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- JP5354011B2 JP5354011B2 JP2011510242A JP2011510242A JP5354011B2 JP 5354011 B2 JP5354011 B2 JP 5354011B2 JP 2011510242 A JP2011510242 A JP 2011510242A JP 2011510242 A JP2011510242 A JP 2011510242A JP 5354011 B2 JP5354011 B2 JP 5354011B2
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- 239000000919 ceramic Substances 0.000 title claims description 119
- 239000000758 substrate Substances 0.000 title claims description 103
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims description 219
- 239000011521 glass Substances 0.000 claims description 61
- 238000002425 crystallisation Methods 0.000 claims description 59
- 230000008025 crystallization Effects 0.000 claims description 59
- 239000013078 crystal Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 20
- 239000002131 composite material Substances 0.000 claims description 19
- 229910010293 ceramic material Inorganic materials 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 description 25
- 239000004020 conductor Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052661 anorthite Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/56—Using constraining layers before or during sintering
- C04B2237/562—Using constraining layers before or during sintering made of alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/66—Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
2 基材層
6,9 表面電極
7,17 第1の主面
8,18 第2の主面
10,10a 未焼成の複合積層体
11,11a 未焼成の多層セラミック基板
12 未焼成の基材層
12(A) 未焼成の第1の基材層
12(B) 未焼成の第2の基材層
16,19 未焼成の表面電極
21 第1の拘束層
22 第2の拘束層
Claims (8)
- ガラス材料を含む低温焼結セラミック材料を主成分とする未焼成の積層された複数の基材層を含む、未焼成の多層セラミック基板を備えるとともに、前記低温焼結セラミック材料の焼結温度では実質的に焼結しない難焼結性セラミック粉末を主成分とする第1および第2の拘束層が、それぞれ、前記未焼成の多層セラミック基板の互いに対向する第1および第2の主面上に配置された、未焼成の複合積層体を作製する工程と、
前記未焼成の複合積層体を前記低温焼結セラミック材料の焼結温度で焼成し、それによって、焼結した多層セラミック基板を得る工程と、
前記第1および第2の拘束層を除去して、前記焼結した多層セラミック基板を取り出す工程と
を備える、多層セラミック基板の製造方法であって、
前記未焼成の多層セラミック基板の前記第1および第2の主面の少なくとも一方上には表面電極が形成され、前記表面電極の総面積は、前記第1の主面側が前記第2の主面側よりも小さく、
前記未焼成の多層セラミック基板に備える複数の前記基材層は、前記第1の主面を与える第1の基材層と前記第2の主面を与える第2の基材層とを少なくとも備え、
前記第2の基材層に含まれるガラス材料は、前記第1の基材層に含まれるガラス材料よりも、結晶化温度が低いことを特徴とする、
多層セラミック基板の製造方法。 - 前記第1の基材層に含まれるガラス材料の結晶化温度と前記第2の基材層に含まれるガラス材料の結晶化温度との差は、1℃以上かつ15℃以下であることを特徴とする、請求項1に記載の多層セラミック基板の製造方法。
- 前記第2の基材層は種結晶を含むことを特徴とする、請求項1または2に記載の多層セラミック基板の製造方法。
- 前記第1の基材層は種結晶を含み、前記第1の基材層に含まれる種結晶の添加率は、前記第2の基材層に含まれる種結晶の添加率よりも少ないことを特徴とする、請求項3に記載の多層セラミック基板の製造方法。
- 前記第1の基材層に含まれる種結晶の添加率と前記第2の基材層に含まれる種結晶の添加率との差は、0.04重量%以上かつ0.11重量%以下であることを特徴とする請求項4に記載の多層セラミック基板の製造方法。
- 前記未焼成の多層セラミック基板に備える複数の前記基材層の合計厚みの9割以上の厚みを占める前記基材層は、同一の材料からなることを特徴とする、請求項1ないし5のいずれかに記載の多層セラミック基板の製造方法。
- 前記第1の基材層に含まれるガラス材料と前記第2の基材層に含まれるガラス材料とは、互いに同じ組成であることを特徴とする、請求項1ないし6のいずれかに記載の多層セラミック基板の製造方法。
- 前記表面電極はAgを含むことを特徴とする、請求項1ないし請求項7のいずれかに記載の多層セラミック基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011510242A JP5354011B2 (ja) | 2009-04-21 | 2010-01-14 | 多層セラミック基板の製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009102572 | 2009-04-21 | ||
JP2009102572 | 2009-04-21 | ||
JP2011510242A JP5354011B2 (ja) | 2009-04-21 | 2010-01-14 | 多層セラミック基板の製造方法 |
PCT/JP2010/050322 WO2010122822A1 (ja) | 2009-04-21 | 2010-01-14 | 多層セラミック基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010122822A1 JPWO2010122822A1 (ja) | 2012-10-25 |
JP5354011B2 true JP5354011B2 (ja) | 2013-11-27 |
Family
ID=43010946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011510242A Expired - Fee Related JP5354011B2 (ja) | 2009-04-21 | 2010-01-14 | 多層セラミック基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8372227B2 (ja) |
JP (1) | JP5354011B2 (ja) |
WO (1) | WO2010122822A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017094335A1 (ja) * | 2015-11-30 | 2017-06-08 | 株式会社村田製作所 | 多層セラミック基板及び電子部品 |
WO2017199710A1 (ja) * | 2016-05-17 | 2017-11-23 | 株式会社村田製作所 | 多層セラミック基板及び電子装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001114556A (ja) * | 1999-10-20 | 2001-04-24 | Sumitomo Metal Electronics Devices Inc | ガラスセラミック基板の製造方法 |
JP2004281989A (ja) * | 2003-01-24 | 2004-10-07 | Kyocera Corp | ガラスセラミック配線基板の製造方法 |
JP2004288939A (ja) * | 2003-03-24 | 2004-10-14 | Kyocera Corp | 低温焼成多層セラミック配線基板の製法 |
JP2004327735A (ja) * | 2003-04-24 | 2004-11-18 | Kyocera Corp | 低温焼成多層セラミック配線基板の製法 |
JP2005039164A (ja) * | 2003-06-25 | 2005-02-10 | Kyocera Corp | ガラスセラミック配線基板の製造方法 |
Family Cites Families (13)
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US5176772A (en) * | 1989-10-05 | 1993-01-05 | Asahi Glass Company Ltd. | Process for fabricating a multilayer ceramic circuit board |
US5254191A (en) | 1990-10-04 | 1993-10-19 | E. I. Du Pont De Nemours And Company | Method for reducing shrinkage during firing of ceramic bodies |
DE69328390T2 (de) * | 1992-05-20 | 2000-12-07 | Matsushita Electric Industrial Co., Ltd. | Verfahren zur Herstellung eines mehrlagigen Substrats |
JPH05327218A (ja) * | 1992-05-22 | 1993-12-10 | Matsushita Electric Ind Co Ltd | 多層セラミック基板の製造方法 |
JPH06171976A (ja) | 1992-12-04 | 1994-06-21 | Sumitomo Metal Mining Co Ltd | 低温焼成基板用組成物 |
JP3199592B2 (ja) * | 1995-01-27 | 2001-08-20 | 株式会社日立製作所 | 多層印刷回路基板 |
JP3889856B2 (ja) * | 1997-06-30 | 2007-03-07 | 松下電器産業株式会社 | 突起電極付きプリント配線基板の製造方法 |
US6776861B2 (en) * | 2002-06-04 | 2004-08-17 | E. I. Du Pont De Nemours And Company | Tape composition and process for internally constrained sintering of low temperature co-fired ceramic |
US6606237B1 (en) * | 2002-06-27 | 2003-08-12 | Murata Manufacturing Co., Ltd. | Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same |
JP4606115B2 (ja) * | 2004-10-20 | 2011-01-05 | 京セラ株式会社 | 多層基板及びその製造方法 |
US7687137B2 (en) * | 2005-02-28 | 2010-03-30 | Kyocera Corporation | Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor |
WO2008126661A1 (ja) * | 2007-04-11 | 2008-10-23 | Murata Manufacturing Co., Ltd. | 多層セラミック基板およびその製造方法 |
TW200932081A (en) * | 2008-01-11 | 2009-07-16 | Murata Manufacturing Co | Multilayer ceramic substrate, method for manufacturing multilayer ceramic substrate and method for suppressing warpage of multilayer ceramic substrate |
-
2010
- 2010-01-14 JP JP2011510242A patent/JP5354011B2/ja not_active Expired - Fee Related
- 2010-01-14 WO PCT/JP2010/050322 patent/WO2010122822A1/ja active Application Filing
-
2011
- 2011-10-17 US US13/274,519 patent/US8372227B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001114556A (ja) * | 1999-10-20 | 2001-04-24 | Sumitomo Metal Electronics Devices Inc | ガラスセラミック基板の製造方法 |
JP2004281989A (ja) * | 2003-01-24 | 2004-10-07 | Kyocera Corp | ガラスセラミック配線基板の製造方法 |
JP2004288939A (ja) * | 2003-03-24 | 2004-10-14 | Kyocera Corp | 低温焼成多層セラミック配線基板の製法 |
JP2004327735A (ja) * | 2003-04-24 | 2004-11-18 | Kyocera Corp | 低温焼成多層セラミック配線基板の製法 |
JP2005039164A (ja) * | 2003-06-25 | 2005-02-10 | Kyocera Corp | ガラスセラミック配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20120267037A1 (en) | 2012-10-25 |
WO2010122822A1 (ja) | 2010-10-28 |
US8372227B2 (en) | 2013-02-12 |
JPWO2010122822A1 (ja) | 2012-10-25 |
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