JP4705784B2 - イメージセンサデバイスの製造方法 - Google Patents
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Description
グパッド領域と、を有する第1表面を有する。複数のワイヤは、ICボンディングパッドのそれぞれのパッド及びリードフレームボンディングパッドの該当するパッドにワイヤボンディングによって接続されて、ICとリードフレームとを電気的に接続する。複数のスタッドバンプはICの第1表面の上に配置され、そして透明カバーはICの能動領域を覆う形に配置され、そしてスタッドバンプの上に搭置される。このカバーは光を透過してICの能動領域に到達させることができる。成形用化合物はリードフレーム、ボンディングワイヤ、及びカバーの周辺部を覆うように形成される。
中央チップ取り付けフラグと、複数のボンディングパッドを有する外側ボンディングパッド領域と、を有するQFNタイプのリードフレームを設ける工程を含み、フラグは、リードフレームの厚さとほぼ同じの高さを有するボンド線を形成する周辺リングを有し、
チップ取り付け材料をフラグの上に、かつ周辺リングの内側に配置する工程と、
センサ集積回路(IC)をフラグにチップ取り付け材料で取り付ける工程と、を含み、ICは、能動領域と、複数のボンディングパッドを含む周辺ボンディングパッド領域と、を有する第1表面を有し、
ICボンディングパッドのそれぞれのパッド及びリードフレームボンディングパッドの該当するパッドを複数のワイヤでワイヤボンディングによって電気的に接続する工程と、
複数のスタッドバンプをICの第1表面の上に形成する工程と、
透明カバーをICの能動領域を覆うように配置して、カバーがスタッドバンプの上に搭置され、かつ光がカバーを透過してICの能動領域に到達することができるようにする工
程と、そして
成形用化合物をリードフレーム、ボンディングワイヤ、及びカバーの周辺部を覆うように形成する工程と、を含む。
中央チップ取り付けフラグと、複数のボンディングパッドを有する外側ボンディングパッド領域と、を有するQFNタイプのリードフレームを設ける工程を含み、フラグは、リードフレームの厚さとほぼ同じ高さを有するボンド線を形成する周辺リングを有し、
チップ取り付け材料をフラグの上に、かつ周辺リングの内側に配置する工程と、
センサ集積回路(IC)をフラグにチップ取り付け材料で取り付ける工程と、を含み、ICは、能動領域と、複数のボンディングパッドを含む周辺ボンディングパッド領域と、を有する第1表面を有し、
リードフレームを、フラグ下の中央位置に真空穴を有する段階的硬化ヒートブロックの上に搭載する工程と、
ICボンディングパッドのそれぞれのパッド及びリードフレームボンディングパッドの該当するパッドを複数のワイヤでワイヤボンディングによって電気的に接続する工程と、
透明化合物をICの能動領域を覆うように塗布する工程と、
透明カバーをICの能動領域を覆うように配置して、光がカバー及び化合物を透過してICの能動領域に到達することができるようにする工程と、そして
成形用化合物をリードフレーム、ボンディングワイヤ、及びカバーの周辺部を覆うように形成する工程と、を含む。
互接続を意味するために一般的に受け入れられている表現である。ワイヤをパッドに接合させるために最も多用される方法は、超音波併用熱圧着ボンディングまたは超音波ボンディングのいずれかを用いるものである。超音波ワイヤボンディングは振動及び荷重の組み合わせを利用してワイヤとボンディングパッドとの界面を摩擦することにより温度を局所的に上昇させ、この温度上昇によって分子が界面を通過して拡散し易くなる。超音波併用熱圧着ボンディングは振動に加えて熱を利用して材料の移動を促進する。
Claims (5)
- イメージセンサデバイスの製造方法であって:
中央チップ取付フラグ(14)と外側ボンディングパッド領域(16)を有するリードレス型クワッドフラットのリードフレーム(12)を提供するステップであって、前記外側ボンディングパッド領域(16)は、リードフレームボンディングパッド(18)を有することと;
前記中央チップ取付フラグ(14)上にチップ接着材料(24)を配置するステップと;
前記中央チップ取付フラグ(14)にセンサ集積回路(22)を、前記チップ接着材料(24)を用いて取付けるセンサ集積回路取付ステップであって、前記センサ集積回路(22)の第1表面は、能動領域(26)と周辺ボンディングパッド領域(28)を有し、前記周辺ボンディングパッド領域(28)は、集積回路ボンディングパッド(30)を有することと;
前記リードフレーム(12)を、硬化ヒートブロック(50)の上に搬送するステップであって、前記中央チップ取付フラグ(14)は、前記硬化ヒートブロック(50)の真空穴(52)を覆うように配置されることと;
前記真空穴(52)を介して真空荷重を加えることによって、前記チップ接着材料(24)を前記真空穴(52)に崩落させて硬化させ、その結果、前記チップ接着材料(24)から突出する突出バンプ(54)を形成する突出バンプ形成ステップと;
前記集積回路ボンディングパッド(30)と、該当する前記リードフレームボンディングパッド(18)とを、ワイヤ(32)によって電気的に接続するステップと;
前記能動領域(26)を覆うように透明カバー(36)を搭置する透明カバー搭置ステップであって、光は前記透明カバー(36)を透過して前記能動領域(26)に到達しうることと;
モールドキャビティを区画する上側の壁(62)を、前記透明カバー(36)に接触するように配置するステップと;
前記リードフレーム(12)と、前記ワイヤ(32)と、前記透明カバー(36)の周辺領域とを覆うように、成形用化合物(42)を形成する成形用化合物形成ステップと;
前記突出バンプ(54)を潰すことによって生じさせた荷重によって、前記透明カバー(36)が前記壁(62)に接触することを維持させるステップと
を備えることを特徴とする、イメージセンサデバイスの製造方法。 - 前記透明カバー搭置ステップの前に、前記第1表面の上にスタッドバンプ(34)を形成するステップを更に有し、前記透明カバー搭置ステップは、前記スタッドバンプ(34)の上に前記透明カバーを搭置する、請求項1記載の製造方法。
- 前記スタッドバンプ(34)は金を用いて形成される、請求項2記載の製造方法。
- 前記製造方法は更に:
前記透明カバー搭置ステップの前に、前記能動領域(26)を覆うように透明化合物(38)を塗布するステップであって、前記透明化合物(38)の厚さを、前記スタッドバンプ(34)の高さと同じように形成することと
を備える、請求項2記載の製造方法。 - 前記透明カバー(36)はガラス製である、請求項1記載の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/282,537 US6667543B1 (en) | 2002-10-29 | 2002-10-29 | Optical sensor package |
US10/282,537 | 2002-10-29 | ||
PCT/US2003/030866 WO2004040660A1 (en) | 2002-10-29 | 2003-09-30 | Optical sensor package |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006505126A JP2006505126A (ja) | 2006-02-09 |
JP2006505126A5 JP2006505126A5 (ja) | 2010-04-22 |
JP4705784B2 true JP4705784B2 (ja) | 2011-06-22 |
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US (2) | US6667543B1 (ja) |
JP (1) | JP4705784B2 (ja) |
KR (1) | KR101031394B1 (ja) |
CN (1) | CN100452441C (ja) |
AU (1) | AU2003275308A1 (ja) |
TW (1) | TWI233685B (ja) |
WO (1) | WO2004040660A1 (ja) |
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- 2003-09-30 JP JP2004548338A patent/JP4705784B2/ja not_active Expired - Fee Related
- 2003-09-30 KR KR1020057007422A patent/KR101031394B1/ko active IP Right Grant
- 2003-09-30 WO PCT/US2003/030866 patent/WO2004040660A1/en active Application Filing
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TWI233685B (en) | 2005-06-01 |
US6667543B1 (en) | 2003-12-23 |
TW200414476A (en) | 2004-08-01 |
AU2003275308A1 (en) | 2004-05-25 |
US20040080029A1 (en) | 2004-04-29 |
KR20050071637A (ko) | 2005-07-07 |
JP2006505126A (ja) | 2006-02-09 |
WO2004040660A1 (en) | 2004-05-13 |
CN1692501A (zh) | 2005-11-02 |
CN100452441C (zh) | 2009-01-14 |
US6958261B2 (en) | 2005-10-25 |
KR101031394B1 (ko) | 2011-04-26 |
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