JP4616477B2 - ウェーハ・マッピング・システム - Google Patents

ウェーハ・マッピング・システム Download PDF

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Publication number
JP4616477B2
JP4616477B2 JP2000576424A JP2000576424A JP4616477B2 JP 4616477 B2 JP4616477 B2 JP 4616477B2 JP 2000576424 A JP2000576424 A JP 2000576424A JP 2000576424 A JP2000576424 A JP 2000576424A JP 4616477 B2 JP4616477 B2 JP 4616477B2
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Prior art keywords
wafer
finger
receiver
port
port door
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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Japanese (ja)
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JP2002527897A5 (enExample
JP2002527897A (ja
Inventor
フレデリック ティー ローゼンクイスト
ブルース リチャードソン
ウィリアム ジェイ フォスナイト
アンソニー シー ボノラ
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クロッシング オートメーション インコーポレイテッド
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Publication of JP2002527897A5 publication Critical patent/JP2002527897A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000576424A 1998-10-15 1999-10-13 ウェーハ・マッピング・システム Expired - Lifetime JP4616477B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/173,710 1998-10-15
US09/173,710 US6188323B1 (en) 1998-10-15 1998-10-15 Wafer mapping system
PCT/US1999/021619 WO2000022589A1 (en) 1998-10-15 1999-10-13 Wafer mapping system

Publications (3)

Publication Number Publication Date
JP2002527897A JP2002527897A (ja) 2002-08-27
JP2002527897A5 JP2002527897A5 (enExample) 2006-11-30
JP4616477B2 true JP4616477B2 (ja) 2011-01-19

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ID=22633178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000576424A Expired - Lifetime JP4616477B2 (ja) 1998-10-15 1999-10-13 ウェーハ・マッピング・システム

Country Status (6)

Country Link
US (1) US6188323B1 (enExample)
EP (1) EP1121672A4 (enExample)
JP (1) JP4616477B2 (enExample)
KR (1) KR100589753B1 (enExample)
TW (1) TW445496B (enExample)
WO (1) WO2000022589A1 (enExample)

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JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
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CN101911277B (zh) * 2007-12-27 2012-04-04 朗姆研究公司 确定位置和偏移的装置和方法
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JP6510423B2 (ja) 2013-01-22 2019-05-08 ブルックス オートメーション インコーポレイテッド 基板搬送部
CN103217187B (zh) * 2013-03-01 2015-07-15 合肥京东方光电科技有限公司 识别实物在容器内的层号的设备及自动取出实物的系统
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JP6309756B2 (ja) * 2013-12-26 2018-04-11 川崎重工業株式会社 エンドエフェクタ装置
JP6248788B2 (ja) * 2014-04-28 2017-12-20 シンフォニアテクノロジー株式会社 ウエハマッピング装置およびそれを備えたロードポート
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JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP6697984B2 (ja) * 2016-08-31 2020-05-27 東京エレクトロン株式会社 基板処理方法及び基板処理システム
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Also Published As

Publication number Publication date
KR20010085928A (ko) 2001-09-07
EP1121672A1 (en) 2001-08-08
WO2000022589A1 (en) 2000-04-20
KR100589753B1 (ko) 2006-06-15
TW445496B (en) 2001-07-11
EP1121672A4 (en) 2009-05-06
JP2002527897A (ja) 2002-08-27
WO2000022589A9 (en) 2000-09-21
US6188323B1 (en) 2001-02-13

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